Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
HLMP-LM65, HLMP-LB65
Precision Optical Performance Green and Blue
New 4mm Standard Oval LEDs
Data Sheet
Description
This Precision Optical Performance Oval LEDs are specifi-
cally designed for full color/video and passenger infor-
mation signs. The oval shaped radiation pattern and high
luminous intensity ensure that these devices are excellent
for wide field of view outdoor applications where a wide
viewing angle and readability in sunlight are essential.
The package epoxy contains both UV-A and UV-B inhibi-
tors to reduce the effects of long term exposure to direct
sunlight.
Applications
x Full color signs
Features
x Well defined spatial radiation pattern
x High brightness material
x Available in green and blue color
Green InGaN 525nm
Blue InGaN 470nm
x Superior resistance to moisture
x Standoff Package
x Tinted and diffused
x Typical viewing angle 50° x100°
Package Dimensions
Notes:
All dimensions in millimeters (inches).
Tolerance is ± 0.20mm unless other specified
7.26 ± 0.20
0.286 ± 0.008
10.00 ± 0.50
0.394 ± 0.020
3.80 ± 0.20
0.1496 ± 0.008
1.25 ± 0.20
0.049 ± 0.008
Sq Typ.
2.54 ± 0.30
0.100 ± 0.012
1.0
0.039 3.00 ± 0.20
0.118 ± 0.008
MIN.
0.80
0.031 MAX. EPOXY MENISCUS
CATHODE LEAD
21.0
0.827 MIN.
NOTE:
1. MEASURED AT BASE OF LENS.
0.50 ± 0.10
0.020 ± 0.004
2
Device Selection Guide
Part Number
Color and Dominant
Wavelength Od (nm) Typ
Luminous Intensity
Iv (mcd) at 20 mA-Min [1]
Luminous Intensity
Iv (mcd) at 20 mA-Max [1]
HLMP-LM65-Z30xx Green 525 2400 5040
HLMP-LB65-RU0xx Blue 470 550 1150
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
Part Numbering System
Note: Please refer to AB 5337 for complete information about part numbering system
HLMP - L x 65 - x x x xx
Packaging Option
DD: Ammo packs
Color Bin Selection
0: Full Distribution
Maximum Intensity Bin
Refer to selection guide
Minimum Intensity Bin
Refer to Device Selection Guide.
Color
M: Green 525
B: Blue 470
Package
L: 4mm Standard Oval 50°x100°
ZZ: Flexi Ammopacks
3
Absolute Maximum Ratings
TJ = 25°C
Parameter Green/ Blue Unit
DC Forward Current [1] 30 mA
Peak Forward Current 100 [2] mA
Power Dissipation 114 mW
Reverse Voltage 5 (IR =10μA) V
LED Junction Temperature 110 °C
Operating Temperature Range -40 to +85 °C
Storage Temperature Range -40 to +100 °C
Notes:
1. Derate linearly as shown in Figure 2.
2. Duty Factor 10%, frequency 1KHz.
Electrical / Optical Characteristics
TJ = 25°C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Forward Voltage
Green
Blue
VF
2.8
2.8
3.2
3.2
3.8
3.8
VI
F = 20 mA
Reverse Voltage
Green
Blue
VR
5
5
VI
R = 10 μA
Dominant Wavelength [1]
Green
Blue
Od
520
460
525
470
540
480
nm IF = 20 mA
Peak Wavelength
Green
Blue
OPEAK
516
464
nm Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Thermal Resistance RTJ-PIN 240 °C/W LED Junction-to-Cathode lead
Luminous Efficacy [2]
Green
Blue
KV
530
65
lm/W Emitted Luminous Power/Emitted
Radiant Power
Luminous Efficiency [3]
Green
Blue
Ke
60
13
Luminous Flux/ Electrical Power
IF = 20 mA
Notes:
1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/KV where IV is the luminous intensity in candelas and KV
is the luminous efficacy in lumens/watt.
3. ηe = φV / IF x VF, where φV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
4
InGaN Green
Figure 1. Relative Intensity vs Wavelength Figure 2. Forward Current vs Forward Voltage
Figure 3. Relative Intensity vs Forward Current Figure 4. Maximum Forward Current vs Ambient Temperature
Figure 5. Relative dominant wavelength vs Forward Current
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630
WAVELENGTH - nm
RELATIVE INTENSITY
GREEN
BLUE
0
5
10
15
20
25
30
35
0 20 40 60 80 100
TA - AMBIENTTEMPERATURE - °C
IFmax - MAXIMUM FORWARD
CURRENT - mA
0
20
40
60
80
100
012345
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 20 40 60 80 100 120
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20mA)
BLUE
-10
-8
-6
-4
-2
0
2
4
6
8
10
0 20406080100
FORWARD CURRENT - mA
RELATIVE DOMINANT WAVELENGTH SHIFT - nm
GREEN
BLUE
GREEN
5
Figure 6. Radiation Pattern – Major Axis Figure 7. Radiation Pattern – Minor Axis
Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)
Bin
Intensity (mcd) at 20 mA
Min Max
R 550 660
S 660 800
T 800 960
U 960 1150
V 1150 1380
W 1380 1660
X 1660 1990
Y 1990 2400
Z 2400 2900
1 2900 3500
2 3500 4200
3 4200 5040
Tolerance for each bin limit isr 15%
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREE
NORMALIZED INTENSITY
GREEN
BLUE
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREE
NORMALIZED INTENSITY
GREE
BLUE
Figure 8. Relative Light Output vs Junction Temperature Figure 9. Relative Forward Voltage vs Junction Temperature
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
-40 -20 0 20 40 60 80 100 120
TJ - JUNCTION TEMPERATURE - °C
FORWARD VOLTAGE SHIFT-V
0.1
1
10
-40 -20 0 20 40 60 80 100 120
TJ - JUNCTION TEMPERATURE - °C
RELATIVE LIGHT OUTPUT
(NORMALIZED AT TJ =25°C)
BLUE
GREEN GREEN
BLUE
6
Avago Color Bin on CIE 1931 Chromaticity Diagram
0.000
0.200
0.400
0.600
0.800
1.000
0.000 0.200 0.400 0.600 0.800
X
Y
3
4
5
Blue
21
1234
5
Green
Blue Color Bin Table
Bin
Min
Dom
Max
Dom Xmin Ymin Xmax Ymax
1 460.0 464.0 0.1440 0.0297 0.1766 0.0966
0.1818 0.0904 0.1374 0.0374
2 464.0 468.0 0.1374 0.0374 0.1699 0.1062
0.1766 0.0966 0.1291 0.0495
3 468.0 472.0 0.1291 0.0495 0.1616 0.1209
0.1699 0.1062 0.1187 0.0671
4 472.0 476.0 0.1187 0.0671 0.1517 0.1423
0.1616 0.1209 0.1063 0.0945
5 476.0 480.0 0.1063 0.0945 0.1397 0.1728
0.1517 0.1423 0.0913 0.1327
Tolerance for each bin limit is r 0.5nm
Note:
1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago
representative for further information.
Green Color Bin Table
Bin
Min
Dom
Max
Dom Xmin Ymin Xmax Ymax
1 520.0 524.0 0.0743 0.8338 0.1856 0.6556
0.1650 0.6586 0.1060 0.8292
2 524.0 528.0 0.1060 0.8292 0.2068 0.6463
0.1856 0.6556 0.1387 0.8148
3 528.0 532.0 0.1387 0.8148 0.2273 0.6344
0.2068 0.6463 0.1702 0.7965
4 532.0 536.0 0.1702 0.7965 0.2469 0.6213
0.2273 0.6344 0.2003 0.7764
5 536.0 540.0 0.2003 0.7764 0.2659 0.6070
0.2469 0.6213 0.2296 0.7543
Tolerance for each bin limit is r 0.5nm
7
Precautions:
Lead Forming:
x The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
x For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
x If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
x Care must be taken during PCB assembly and
soldering process to prevent damage to the LED
component.
x LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat
source (soldering iron’s tip) to the body is 1.59mm.
Soldering the LED using soldering iron tip closer than
1.59mm might damage the LED.
1.59mm
x ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
x Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature 105°C Max. -
Preheat time 60 sec Max -
Peak temperature 260°C Max. 260°C Max.
Dwell time 5 sec Max. 5 sec Max
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
x Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensure that it is always conforming to recommended
soldering conditions.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
Avago Technologies LED Configuration
x Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
x At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
x If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
x Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
x Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information about
soldering and handling of high brightness TH LED lamps.
CATHODE
InGaN Device
8
Ammo Packs Drawing
6.35±1.30
0.25±0.0512
9.125±0.625
0.3593±0.025
18.00±0.50
0.7087±0.0197
12.70±0.30
0.50±0.0118
20.5±1.00
0.8071±0.0394
12.70±1.00
0.50±0.0394
VIEW A - A
0.70±0.20
0.276±0.0079
4.00±0.20
0.1575±0.0079
ØTYP.
CATHODE
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C ± 5°C
(maximum peak temperature = 260°C)
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
60 sec Max
TIME (sec)
260°C Max
105°C Max
TEMPERATURE (°C)
9
Packaging Box for Ammo Packs
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
LABEL ON THIS
SIDE OF BOX
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE
FACING UPWARDS.
ANODE LEAD LEAVES
THE BOX FIRST.
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AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAIN-
TENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS.
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Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-1148EN - February 10, 2010