10 9 8 7 6 5 4 3 2 1 8.00 5.48 CONTACT HEIGHT | P- 4.67 REF. > |. 4.48 __> HOUSING yon ; [ SN 2.5038 t 1 |B | \OREr. 110 < WORKING vec 5.98 Rev. D 2004/06/28 6.00 Pe00 | | | Feo7zorye. 350 g a 9 TT ia | NOTE: 4AMATERIAL: HOUSING: HIGH TEMPERATURE THERMOPLASTIC,COLOR:BLACK 8.00 TERMINAL: COPPER ALLOY . 2.FINISH: CONTACT AREA: 0.75 MICRON GOLD MIN OVER 1.25 MICRON NICKEL MIN. SOLDER AREA: GOLD FLASH (0.075~0.125 MICRON) OVER 1.25 MICRON NICKEL MIN. REST AREA: 1.25 MICRON NICKEL MIN. | 3.COPLANARITY: 0.1 MAX AMONG THESE SOLDER TAILS. 1.00 ~] 0.30 +| 4,PRODUCT SPECIFICATION: PS-47286-001 fe 20.05 - 5.96 5.RECOMMENDED WORKING DEFLECTION RANGE:0.6-1.00 MM PITCH | | 150 RECOMMENDED PCB LAYOUT | TOLERANCE:+/-0.05 {HOHE G|t "| ineal n=l = Met = R0.25 sc ez DIMENSION STYLE SCALE DESIGN UNITS SS=| \CUAY UNLESS SPECIFIED) MM ONLY si | metrIC |OCISEORAIHE Sexe mm INCH DRAWN BY DATE TITLE SR Rlz\W-0 [ZpLAces|e---[--- SUN 2005/07/29 2.0MM PITCH 4 CIRCUITS Ww 3 PLACES|t--- _|4+--- [CHECKED BY DATE 0.7MM CONTACT WIDTH Eg gelV RSE = fons mor} __BATTERY CONNECTOR tO, t-- 7 BRS)" ANGULAR 2 > WENNY CHEN 2006/07/07 rKolgx MOLEX INCORPORATED 3 3 a e MATERIAL NO. DOCUMENT NO. SHEET NO, 22 DRAFT WHERE APPLICABLE] 472861001 _| SD-47286-001 OF 1 tu Ow =e > WITKIN? DIRE ONS SIZE | THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX D w INCORPORATED AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION b_frame_A3_P_AM_T 9 8 6 5 | 4 | 3 | 2 1