Ultralow Quiescent Current,
150 mA, CMOS Linear Regulators
Data Sheet
ADP160/ADP161/ADP162/ADP163
Rev. E
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FEATURES
Ultralow quiescent current
IQ = 560 nA with 0 µA load
IQ = 860 nA with 1 µA load
Stable with 1 µF ceramic input and output capacitors
Maximum output current: 150 mA
Input voltage range: 2.2 V to 5.5 V
Low shutdown current: <50 nA typical
Low dropout voltage: 195 mV @ 150 mA load
Initial accuracy: ±1%
Accuracy over line, load, and temperature: ±3.5%
15 fixed output voltage options: 1.2 V to 4.2 V
Adjustable output available
PSRR performance of 72 dB @ 100 Hz
Current limit and thermal overload protection
Logic-control enable
Integrated output discharge resistor
5-lead TSOT package
4-ball, 0.5 mm pitch WLCSP
APPLICATIONS
Mobile phones
Digital cameras and audio devices
Portable and battery-powered equipment
Post dc-to-dc regulation
Portable medical devices
TYPICAL APPLICATION CIRCUITS
NC = NO CONNECT
ADP160/ADP162
1
2
3
5
4
1µF
1µF
VOUT = 1.8VVIN = 2.3V VOUT
NC
VIN
GND
EN
OFF ON
08628-001
Figure 1. 5-Lead TSOT ADP160/ADP162 with Fixed Output Voltage, 1.8 V
1
2
3
5
4
1µF
1µF
VOUT = 3.2VVIN = 4.2V VOUT
ADJ
VIN
GND
EN
OFF ON
ADP161/ADP163
R1
R2
08628-002
Figure 2. 5-Lead TSOT ADP161/ADP163 with Adjustable Output Voltage, 3.2 V
VIN VOUT
1 2
EN GND
1µF1µF
V
OUT
= 2.8V
V
IN
= 3.3V
TOP VIEW
(Not t o Scal e)
ADP160/ADP162
A
B
OFF ON
08628-003
Figure 3. 4-Ball WLCSP ADP160/ADP162 with Fixed Output Voltage, 2.8 V
GENERAL DESCRIPTION
The ADP160/ADP161/ADP162/ADP163 are ultralow quiescent
current, low dropout, linear regulators that operate from 2.2 V
to 5.5 V and provide up to 150 mA of output current. The low
195 mV dropout voltage at 150 mA load improves efficiency and
allows operation over a wide input voltage range.
The ADP16x are specifically designed for stable operation with a
tiny 1 µF ± 30% ceramic input and output capacitors to meet
the requirements of high performance, space-constrained
applications.
The ADP160 is available in 15 fixed output voltage options,
ranging from 1.2 V to 4.2 V. The ADP160/ADP161 also include
a switched resistor to discharge the output automatically when
the LDO is disabled. The ADP162 is identical to the ADP160
but does not include the output discharge function.
The ADP161and ADP163 are available as adjustable output voltage
regulators. They are only available in a 5-lead TSOT package.
The ADP163 is identical to the ADP161 but does not include
the output discharge function.
Short-circuit and thermal overload protection circuits prevent
damage in adverse conditions. The ADP160 and ADP162 are
available in a tiny 5-lead TSOT and a 4-ball, 0.5 mm pitch
WLCSP package for the smallest footprint solution to meet a
variety of portable power applications.
ADP160/ADP161/ADP162/ADP163 Data Sheet
Rev. E | Page 2 of 24
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Typical Application Circuits ............................................................ 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Input and Output Capacitor, Recommended Specifications .. 4
Absolute Maximum Ratings ............................................................ 5
Thermal Data ................................................................................ 5
Thermal Resistance ...................................................................... 5
ESD Caution .................................................................................. 5
Pin Configurations and Function Descriptions ........................... 6
Typical Performance Characteristics ..............................................8
Theory of Operation ...................................................................... 12
Applications Information .............................................................. 14
Capacitor Selection .................................................................... 14
Enable Feature ............................................................................ 15
Current Limit and Thermal Overload Protection ................. 15
Thermal Considerations ............................................................ 16
PCB Layout Considerations ...................................................... 18
Outline Dimensions ....................................................................... 20
Ordering Guide .......................................................................... 21
REVISION HISTORY
4/12—Rev. D to Rev. E
Updated Outline Dimensions ........................................................ 20
Changes to Ordering Guide ........................................................... 21
1/12—Rev. C to Rev. D
Changes to Ordering Guide .......................................................... 21
1/11—Rev. B to Rev. C
Changes to Figure 15 and Figure 16 ............................................... 9
11/10—Rev. A to Rev. B
Changes to Theory of Operation .................................................. 13
Changes to Ordering Guide .......................................................... 20
8/10—Rev. 0 to Rev. A
Added ADP162/ADP163 .............................................. Throughout
Changes to Figure 17 and Figure 18 ............................................... 9
Changes to Figure 19, Figure 20, and Figure 23 ......................... 10
Added Figure 21 and Figure 22 (Renumbered Sequentially) ... 10
Added Figure 32 and Figure 33..................................................... 12
Changes to Ordering Guide .......................................................... 20
6/10—Revision 0: Initial Version
Data Sheet ADP160/ADP161/ADP162/ADP163
Rev. E | Page 3 of 24
SPECIFICATIONS
VIN = (VOUT + 0.5 V) or 2.2 V, whichever is greater; EN = VIN, IOUT = 10 mA, CIN = COUT = 1 µF, TA = 25°C, unless otherwise noted.
Table 1.
Parameter Symbol Conditions Min Typ Max Unit
INPUT VOLTAGE RANGE VIN TJ = −40°C to +125°C 2.2 5.5 V
OPERATING SUPPLY CURRENT IGND IOUT = 0 µA 560 1250 nA
IOUT = 0 µA, TJ = −40°C to +125°C 2.3 µA
I
OUT
= 1 µA
860
1800
nA
IOUT = 1 µA, TJ = −40°C to +125°C 2.8 µA
IOUT = 100 µA 2.6 4.5 µA
IOUT = 100 µA, TJ = −40°C to +125°C 5.8 µA
IOUT = 10 mA 11 µA
IOUT = 10 mA, TJ = −40°C to +125°C 19 µA
IOUT = 150 mA 42 µA
IOUT = 150 mA, TJ = −40°C to +125°C 65 µA
SHUTDOWN CURRENT IGND-SD EN = GND 50 nA
EN = GND, T
J
= −40°C to +125°C
1
µA
OUTPUT VOLTAGE ACCURACY
VOUT IOUT = 10 mA −1 +1 %
0 µA < IOUT < 150 mA, VIN = (VOUT + 0.5 V) to 5.5 V −2 +2 %
0 µA < IOUT < 150 mA, VIN = (VOUT + 0.5 V) to 5.5 V,
TJ = −40°C to +125°C
−3.5 +3.5 %
ADJUSTABLE-OUTPUT VOLTAGE
ACCURACY (ADP161/ADP163)1
VADJ IOUT = 10 mA 0.99 1.0 1.01 V
0 µA < IOUT < 150 mA, VIN = (VOUT + 0.5 V) to 5.5 V 0.98 1.02 V
0 µA < IOUT < 150 mA, VIN = (VOUT + 0.5 V) to 5.5 V,
TJ = −40°C to +125°C
0.97 1.03 V
REGULATION
Line Regulation ∆VOUT/∆VIN VIN = (VOUT + 0.5 V) to 5.5 V, TJ = −40°C to +125°C −0.1 +0.1 %/V
Load Regulation2 ∆VOUT/∆IOUT IOUT = 100 μA to 150 mA 0.004 %/mA
IOUT = 100 μA to 150 mA, TJ = −40°C to +125°C 0.01 %/mA
DROPOUT VOLTAGE3 VOUT = 3.3 V
4-Ball WLCSP VDROPOUT IOUT = 10 mA 7 mV
IOUT = 10 mA, TJ = −40°C to +125°C 13 mV
IOUT = 150 mA 105 mV
IOUT = 150 mA, TJ = −40°C to +125°C 195 mV
5-Lead TSOT IOUT = 10 mA 8 mV
IOUT = 10 mA, TJ = −40°C to +125°C 15 mV
I
OUT
= 150 mA
120
mV
IOUT = 150 mA, TJ = −40°C to +125°C 225 mV
ADJ INPUT BIAS CURRENT (ADP161/ADP163)
ADJ
I-BIAS
2.2 V ≤ V
IN
≤ 5.5 V, ADJ connected to VOUT
10
nA
ACTIVE PULL-DOWN RESISTANCE
(ADP160/ADP161)
TSHUTDOWN VOUT = 2.8 V, RLOAD = ∞ 300 600 Ω
START-UP TIME4 TSTART-UP VOUT = 3.3 V 1100 µs
CURRENT LIMIT THRESHOLD5 ILIMIT 220 320 500 mA
THERMAL SHUTDOWN
Thermal Shutdown Threshold TSSD TJ rising 150 °C
Thermal Shutdown Hysteresis TSSD-HYS 15 °C
EN INPUT
En Input Logic High
V
IH
2.2 V ≤ V
IN
≤ 5.5 V
1.2
V
EN Input Logic Low VIL 2.2 V ≤ VIN ≤ 5.5 V 0.4 V
EN Input Leakage Current VI-LEAKAGE EN = VIN or GND 0.1 µA
EN = VIN or GND, TJ = −40°C to +125°C 1 µA
ADP160/ADP161/ADP162/ADP163 Data Sheet
Rev. E | Page 4 of 24
Parameter Symbol Conditions Min Typ Max Unit
UNDERVOLTAGE LOCKOUT UVLO
Input Voltage Rising UVLORISE 2.19 V
Input Voltage Falling UVLOFAL L 1.60 V
Hysteresis UVLOHYS 100 mV
OUTPUT NOISE OUTNOISE 10 Hz to 100 kHz, VIN = 5 V, VOUT = 3.3 V 105 µV
rms
10 Hz to 100 kHz, VIN = 5 V, VOUT = 2.5 V 100 µV
rms
10 Hz to 100 kHz, VIN = 5 V, VOUT = 1.2 V 80 µV
rms
POWER SUPPLY REJECTION RATIO
PSRR
100 Hz, V
IN
= 5 V, V
OUT
= 3.3 V
60
dB
100 Hz, VIN = 5 V, VOUT = 2.5 V 65 dB
100 Hz, VIN = 5 V, VOUT = 1.2 V 72 dB
1 kHz, VIN = 5 V, VOUT = 3.3 V 50 dB
1 kHz, VIN = 5 V, VOUT = 2.5 V 50 dB
1 kHz, V
IN
= 5 V, V
OUT
= 1.2 V
62
dB
1 Accuracy when VOUT is connected directly to ADJ. When the VOUT voltage is set by external feedback resistors, the absolute accuracy in adjust mode depends on the
tolerances of resistors used.
2 Based on an end-point calculation using 0 μA and 150 mA loads.
3 Dropout voltage is defined as the input-to-output voltage differential when the input voltage is set to the nominal output voltage. This applies only for output
voltages above 2.2 V.
4 Start-up time is defined as the time between the rising edge of EN to VOUT being at 90% of its nominal value.
5 Current limit threshold is defined as the current at which the output voltage drops to 90% of the specified typical value. For example, the current limit for a 3.0 V
output voltage is defined as the current that causes the output voltage to drop to 90% of 3.0 V or 2.7 V.
INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS
Table 2.
Parameter Symbol Conditions Min Typ Max Unit
MINIMUM INPUT AND OUTPUT CAPACITANCE1 CMIN TA = −40°C to +125°C 0.7 µF
CAPACITOR ESR RESR TA = −40°C to +125°C 0.001 0.2 Ω
1 The minimum input and output capacitance should be greater than 0.7 µF over the full range of operating conditions. The full range of operating conditions in the
application must be considered during device selection to ensure that the minimum capacitance specification is met. X7R and X5R type capacitors are recommended;
however, Y5V and Z5U capacitors are not recommended for use with any LDO.
Data Sheet ADP160/ADP161/ADP162/ADP163
Rev. E | Page 5 of 24
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
VIN to GND −0.3 V to +6.5 V
VOUT to GND −0.3 V to VIN
EN to GND −0.3 V to VIN
Storage Temperature Range −65°C to +150°C
Operating Junction Temperature Range −40°C to +125°C
Operating Ambient Temperature Range −40°C to +125°C
Soldering Conditions JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings only apply individually; they do not
apply in combination. The ADP16x can be damaged when the
junction temperature limits are exceeded. Monitoring ambient
temperature does not guarantee that TJ is within the specified
temperature limits. In applications with high power dissipation
and poor thermal resistance, the maximum ambient temperature
may have to be derated.
In applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits. The junction temperature (TJ) of
the device is dependent on the ambient temperature (TA), the
power dissipation of the device (PD), and the junction-to-ambient
thermal resistance of the package (θJA).
Maximum junction temperature (TJ) is calculated from the ambient
temperature (TA) and power dissipation (PD) using the formula
TJ = TA + (PD × θJA)
Junction-to-ambient thermal resistance (θJA) of the package is
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on the
application and board layout. In applications where high maximum
power dissipation exists, close attention to thermal board design
is required. The value of θJA may vary, depending on PCB material,
layout, and environmental conditions. The specified values of
θJA are based on a 4-layer, 4 inches × 3 inches, circuit board. Refer
to JESD 51-7 and JESD 51-9 for detailed information on the
board construction. For additional information, see the AN-617
Application Note, MicroCSP™ Wafer Level Chip Scale Package.
ΨJB is the junction to board thermal characterization parameter
with units of °C/W. ΨJB of the package is based on modeling and
calculation using a 4-layer board. The JESD51-12, Guidelines for
Reporting and Using Electronic Package Thermal Information,
states that thermal characterization parameters are not the same
as thermal resistances. ΨJB measures the component power flowing
through multiple thermal paths rather than a single path as in
thermal resistance, θJB. Therefore, ΨJB thermal paths include
convection from the top of the package as well as radiation from
the package, factors that make ΨJB more useful in real-world
applications. Maximum junction temperature (TJ) is calculated
from the board temperature (TB) and power dissipation (PD)
using the formula
TJ = TB + (PD × ΨJB)
Refer to JESD51-8 and JESD51-12 for more detailed information
about ΨJB.
THERMAL RESISTANCE
θJA and ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type θJA ΨJB Unit
5-Lead TSOT 170 43 °C/W
4-Ball, 0.4 mm Pitch WLCSP 260 58 °C/W
ESD CAUTION
ADP160/ADP161/ADP162/ADP163 Data Sheet
Rev. E | Page 6 of 24
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
NC = NO CONNECT
ADP160/
ADP162
TOP VIEW
(Not t o Scal e)
1
2
3
5
4
VOUT
NC
VIN
GND
EN
08628-004
Figure 4. 5-Lead TSOT, Fixed Output Pin Configuration, ADP160/ADP162
Table 5. 5-Lead TSOT Pin Function Descriptions, ADP160/ADP162
Pin No. Mnemonic Description
1
VIN
Regulator Input Supply. Bypass VIN to GND with a 1 µF or greater capacitor.
2 GND Ground.
3 EN Enable Input. Drive EN high to turn on the regulator; drive EN low to turn off the regulator. For automatic startup,
connect EN to VIN.
4 NC No Connect. This pin is not connected internally.
5 VOUT Regulated Output Voltage. Bypass VOUT to GND with a 1 µF or greater capacitor.
ADP161/
ADP163
TOP VIEW
(Not t o Scal e)
1
2
3
5
4
VOUT
ADJ
VIN
GND
EN
08628-005
Figure 5. 5-Lead TSOT, Adjustable Output Pin Configuration, ADP161/ADP163
Table 6. 5-Lead TSOT Pin Function Descriptions, ADP161/ADP163
Pin No. Mnemonic Description
1 VIN Regulator Input Supply. Bypass VIN to GND with a 1 µF or greater capacitor.
2 GND Ground.
3 EN
Enable Input. Drive EN high to turn on the regulator; drive EN low to turn off the regulator. For automatic startup,
connect EN to VIN.
4 ADJ Output Voltage Adjust Pin. Connect the midpoint of the voltage divider between VOUT and GND to this pin to set
the output voltage.
5 VOUT Regulated Output Voltage. Bypass VOUT to GND with a 1 µF or greater capacitor.
Data Sheet ADP160/ADP161/ADP162/ADP163
Rev. E | Page 7 of 24
1 2
A
B
TOP VIEW
(Not t o Scal e)
ADP160/
ADP162
VIN VOUT
EN GND
08628-006
Figure 6. 4-Ball WLCSP Pin Configuration, ADP160/ADP162
Table 7. 4-Ball WLCSP Pin Function Descriptions, ADP160/ADP162
Pin No. Mnemonic Description
A1 VIN Regulator Input Supply. Bypass VIN to GND with a 1 µF or greater capacitor.
B1 EN Enable Input. Drive EN high to turn on the regulator; drive EN low to turn off the regulator. For automatic
startup, connect EN to VIN.
A2 VOUT Regulated Output Voltage. Bypass VOUT to GND with a 1 µF or greater capacitor.
B2 GND Ground.
ADP160/ADP161/ADP162/ADP163 Data Sheet
Rev. E | Page 8 of 24
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 3.8 V, VOUT = 3.3 V, IOUT = 1 mA, CIN = COUT = 1 µF, TA = 25°C, unless otherwise noted.
3.35
3.25
3.26
3.27
3.28
3.29
3.30
3.31
3.32
3.33
3.34
–40 –5 25 85 125
VOUT (V)
JUNCTION T E M P E RATURE (°C)
LOAD = 1µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 150mA
08628-007
Figure 7. Output Voltage (VOUT) vs. Junction Temperature
3.35
3.25
3.27
3.29
3.31
3.33
3.26
3.28
3.30
3.32
3.34
0.001 0.01 10001001010.1
V
OUT
(V)
I
LOAD
(mA)
08628-008
Figure 8. Output Voltage (VOUT) vs. Load Current (ILOAD)
3.35
3.25
3.27
3.29
3.31
3.33
3.26
3.28
3.30
3.32
3.34
3.7 5.55.35.14.94.74.54.34.1
3.9
VOUT (V)
VIN (V)
LOAD = 1µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 150mA
08628-009
Figure 9. Output Voltage (VOUT) vs. Input Voltage (VIN)
100
0.1
1
10
–40 –5 25 85 125
GROUND CURRENT ( µA)
JUNCTION T E M P E RATURE (°C)
LOAD = 1µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 150mA
NO LOAD
08628-010
Figure 10. Ground Current vs. Junction Temperature
100
0.1
1
10
0.001 0.01 10001001010.1
GROUND CURRENT ( µA)
I
LOAD
(mA)
08628-011
Figure 11. Ground Current vs. Load Current (ILOAD)
100
0.1
1
10
3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5
GROUND CURRENT ( µA)
VIN (V)
08628-012
LOAD = 1µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 150mA
NO LOAD
Figure 12. Ground Current vs. Input Voltage (VIN)
Data Sheet ADP160/ADP161/ADP162/ADP163
Rev. E | Page 9 of 24
0.18
0
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
–40 –5 25 85 125
SHUT DOWN CURRENT (µ A)
TEMPERATURE (°C)
VIN = 2.9V
VIN = 3.2V
VIN = 3.8V
VIN = 4.1V
VIN = 4.7V
VIN = 5.5V
08628-013
Figure 13. Shutdown Current vs. Temperature at Various Input Voltages
250
200
150
100
50
0110 100 1000
DROPOUT VOLTAGE (mV)
I
LOAD
(mA)
08628-014
V
OUT
= 2V
V
OUT
= 3.3V
Figure 14. Dropout Voltage vs. Load Current (ILOAD)
3.35
3.30
3.25
3.20
3.15
3.10
3.05
3.003.1 3.2 3.3 3.4 3.5 3.6
VOUT (V)
VIN (V)
LOAD = 1mA
LOAD = 5mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 250mA
08628-015
Figure 15. Output Voltage (VOUT) vs. Input Voltage (VIN) in Dropout
140
120
100
80
60
40
20
0
3.1 3.2 3.3 3.4 3.5 3.6
GROUND CURRENT ( µA)
VIN (V)
LOAD = 1mA
LOAD = 5mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 150mA
08628-016
Figure 16. Ground Current vs. Input Voltage (VIN) in Dropout
0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
10 100 10M1M100k10k1k
PSRR ( dB)
FRE QUENCY (Hz )
LOAD = 150mA
LOAD = 100mA
LOAD = 10mA
LOAD = 1mA
LOAD = 100µA
08628-017
Figure 17. Power Supply Rejection Ratio vs. Frequency, VOUT = 1.2 V, VIN = 2.2 V
0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
10 100 10M1M100k10k1k
PSRR ( dB)
FRE QUENCY (Hz )
LOAD = 150mA
LOAD = 100mA
LOAD = 10mA
LOAD = 1mA
LOAD = 100µA
08628-018
Figure 18. Power Supply Rejection Ratio vs. Frequency, VOUT = 2.5 V, VIN = 3.5 V
ADP160/ADP161/ADP162/ADP163 Data Sheet
Rev. E | Page 10 of 24
0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
10 100 10M1M100k10k1k
PSRR ( dB)
FRE QUENCY (Hz )
LOAD = 150mA
LOAD = 100mA
LOAD = 10mA
LOAD = 1mA
LOAD = 100µA
08628-019
Figure 19. Power Supply Rejection Ratio vs. Frequency, VOUT = 3.3 V, VIN = 4.3 V
0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
10 100 10M1M100k10k1k
PSRR ( dB)
FRE QUENCY (Hz )
LOAD = 3.3V /150mA
LOAD = 2.5V /150mA
LOAD = 1.2V /150mA
LOAD = 3.3V /1mA
LOAD = 2.5V /1mA
LOAD = 1.2V /1mA
08628-020
Figure 20. Power Supply Rejection Ratio vs. Frequency
Various Output Voltages and Load Currents, VIN − VOUT = 1 V
0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
10 100 10M1M100k10k1k
PSRR ( dB)
FRE QUENCY (Hz )
LOAD = 150mA
LOAD = 100mA
LOAD = 10mA
LOAD = 1mA
LOAD = 100µA
08628-051
Figure 21. Power Supply Rejection Ratio vs. Frequency
Various Output Voltages and Load Currents, VOUT = 2.5 V, VIN = 3.0 V
0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
10 100 10M1M100k10k1k
PSRR ( dB)
FRE QUENCY (Hz )
LOAD = 150mA
LOAD = 100mA
LOAD = 10mA
LOAD = 1mA
LOAD = 100µA
08628-052
Figure 22. Power Supply Rejection Ratio vs. Frequency
Various Output Voltages and Load Currents, VOUT = 3.3 V, VIN = 3.8 V
0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
10 100 10M1M100k10k1k
PSRR ( dB)
FRE QUENCY (Hz )
LOAD = 150mA
LOAD = 100mA
LOAD = 10mA
LOAD = 1mA
LOAD = 100µA
08628-021
Figure 23. Adjustable ADP161 Power Supply Rejection Ratio vs. Frequency,
VOUT = 3.3 V, VIN = 4.3 V
1k
1
10
100
0.001 0.01 10001001010.1
NOISE (µV rms)
LOAD CURRENT ( mA)
VOUT = 3.3V
VOUT = 2.5V
VOUT = 1.2V
ADJ 3.3V
08628-022
Figure 24. Output Noise vs. Load Current and Output Voltage,
VIN = 5 V, COUT = 1 µF
Data Sheet ADP160/ADP161/ADP162/ADP163
Rev. E | Page 11 of 24
10
0.1
1
10 100k10k1k100
NOISE (µV/ Hz)
FRE QUENCY (Hz )
V
OUT
= 1.2V
V
OUT
= 3.3V
V
OUT
= 2.5V
08628-023
Figure 25. Output Noise Spectral Density, VIN = 5 V, ILOAD = 10 mA, COUT = 1 µF
CH1 100mA Ω CH2 200mV M200µs A CH1 62mA
T 10.40%
1
2
T
LOAD CURRENT
V
OUT
08628-024
Figure 26. Load Transient Response, CIN, COUT = 1 µF, ILOAD = 1 mA to 150 mA,
200 ns Rise Time, CH1 = Load Current, CH2 = VOUT
CH1 20mA Ω CH2 5mV M200µs A CH1 24mA
T 10.40%
1
2
T
LOAD CURRENT
V
OUT
08628-025
Figure 27. Load Transient Response, CIN, COUT = 1 μF, ILOAD = 1 mA to 50 mA,
200 ns Rise Time, CH1 = Load Current, CH2 = VOUT
CH1 1V Ω CH2 20mV M200µs A CH1 4.34V
T 10.20%
1
2
T
V
IN
V
OUT
08628-026
Figure 28. Line Transient Response, VIN = 4 V to 5 V, CIN = COUT = 1 μF,
ILOAD = 150 mA, CH1 = VIN, CH2 = VOUT
CH1 1V Ω CH2 20mV M200µs A CH1 4.56V
T 10.20%
1
2
T
V
IN
V
OUT
08628-027
Figure 29. Line Transient Response, VIN = 4 V to 5 V, CIN, = 1 μF, COUT = 10 μF,
ILOAD = 150 mA, CH1 = VIN, CH2 = VOUT
ADP160/ADP161/ADP162/ADP163 Data Sheet
Rev. E | Page 12 of 24
THEORY OF OPERATION
The ADP16x are ultralow quiescent current, low dropout linear
regulators that operate from 2.2 V to 5.5 V and can provide up to
150 mA of output current. Drawing only 560 nA (typical) at no
load and a low 42 µA of quiescent current (typical) at full load
makes the ADP16x ideal for battery-operated portable equip-
ment. Shutdown current consumption is typically 50 nA.
Using new innovative design techniques, the ADP16x provide
ultralow quiescent current and superior transient performance
for digital and RF applications. The ADP16x are also optimized
for use with small 1 µF ceramic capacitors.
REFERENCE
SHO RT CIRCUI T,
UVL O, AND
THERMAL
PROTECT
SHUTDOWN
R1
R2
VOUTVIN
GND
EN
R3
08628-028
ADP160
Figure 30. Internal Block Diagram, Fixed Output with Output Discharge Function
REFERENCE
SHO RT CIRCUI T,
UVL O, AND
THERMAL
PROTECT
SHUTDOWN
VOUT
ADJ
VIN
GND
EN
R1
08628-030
ADP161
Figure 31. Internal Block Diagram, Adjustable Output with Output Discharge
Function
08628-053
REFERENCE
SHO RT CIRCUI T,
UVL O, AND
THERMAL
PROTECT
SHUTDOWN
VOUTVIN
GND
EN
R1
R2
ADP162
Figure 32. Internal Block Diagram, Fixed Output with Output Discharge Function
08628-054
REFERENCE
SHO RT CIRCUI T,
UVL O, AND
THERMAL
PROTECT
SHUTDOWN
VOUT
ADJ
VIN
GND
EN
ADP163
Figure 33. Internal Block Diagram, Adjustable Output with Output Discharge
Function
Internally, the ADP16x consists of a reference, an error amplifier, a
feedback voltage divider, and a PMOS pass transistor. Output
current is delivered via the PMOS pass device, which is controlled
by the error amplifier. The error amplifier compares the reference
voltage with the feedback voltage from the output and amplifies
the difference. If the feedback voltage is lower than the reference
voltage, the gate of the PMOS device is pulled lower, allowing
more current to pass and increasing the output voltage. If the
feedback voltage is higher than the reference voltage, the gate
of the PMOS device is pulled higher, allowing less current to pass
and decreasing the output voltage.
The adjustable ADP161/ADP163 have an output voltage range
of 1.0 V to 4.2 V. The output voltage is set by the ratio of two
external resistors, as shown in Figure 2. The device servos the
output to maintain the voltage at the ADJ pin at 1.0 V refe-
renced to ground. The current in R1 is then equal to 1.0 V/R2,
and the current in R1 is the current in R2 plus the ADJ pin bias
current. The ADJ pin bias current, 10 nA at 25°C, flows through
R1 into the ADJ pin.
The output voltage can be calculated using the equation:
VOUT = 1.0 V(1 + R1/R2) + (ADJI-BIAS)(R1)
The value of R1 should be less than 200 kΩ to minimize errors in
the output voltage caused by the ADJ pin bias current. For example,
when R1 and R2 each equal 200 kΩ, the output voltage is 2.0 V.
The output voltage error introduced by the ADJ pin bias current
is 2 mV or 0.05%, assuming a typical ADJ pin bias current of
10 nA at 25°C.
Data Sheet ADP160/ADP161/ADP162/ADP163
Rev. E | Page 13 of 24
To minimize quiescent current in the ADP161 and ADP163
Analog Devices, Inc., recommends using high values of
resistance for R1 and R2. Using a value of 1 MΩ for R2 keeps
the total, no load quiescent current below 2 µA. Note however,
that high value of resistance introduces a small output voltage
error. For example, assuming R1 and R2 are 1 MΩ, the output
voltage is 2 V. Taking into account the nominal ADJ pin bias
current of 10 nA, the output voltage error is 0.25%.
Note that in shutdown, the output is turned off and the divider
current is zero.
The ADP160/ADP161 also include an output discharge resistor to
force the output voltage to zero when the LDO is disabled. This
ensures that the output of the LDO is always in a well-defined state,
whether it is enabled or not. The ADP162/ADP163 do not
include the output discharge function.
The ADP160/ADP162 are available in 15 output voltage options,
ranging from 1.2 V to 4.2 V. The ADP16x use the EN pin to enable
and disable the VOUT pin under normal operating conditions.
When EN is high, VOUT turns on, and when EN is low, VOUT
turns off. For automatic startup, EN can be tied to VIN.
ADP160/ADP161/ADP162/ADP163 Data Sheet
Rev. E | Page 14 of 24
APPLICATIONS INFORMATION
CAPACITOR SELECTION
Output Capacitor
The ADP16x are designed for operation with small, space-
saving ceramic capacitors, but function with most commonly
used capacitors as long as care is taken with regard to the
effective series resistance (ESR) value. The ESR of the output
capacitor affects stability of the LDO control loop. A minimum
of 1 µF capacitance with an ESR of 1 Ω or less is recommended
to ensure stability of the ADP16x. Transient response to
changes in load current is also affected by output capacitance.
Using a larger value of output capacitance improves the transient
response of the ADP16x to large changes in load current. Figure 34
and Figure 35 show the transient responses for output
capacitance values of 1 µF and 10 µF, respectively.
CH1 100mA Ω CH2 200mV M200µs A CH1 62mA
T 10.40%
1
2
T
LOAD CURRENT
V
OUT
08628-032
Figure 34. Output Transient Response, COUT = 1 µF,
CH1 = Load Current, CH2 = VOUT
CH1 100mA Ω CH2 200mV M200µs A CH1 74mA
T 10.00%
1
2
T
LOAD CURRENT
V
OUT
08628-033
Figure 35. Output Transient Response, COUT = 10 µF,
CH1 = Load Current, CH2 = VOUT
Input Bypass Capacitor
Connecting a 1 µF capacitor from VIN to GND reduces the circuit
sensitivity to the printed circuit board (PCB) layout, especially
when long input traces or high source impedance are encountered.
If greater than 1 µF of output capacitance is required, the input
capacitor should be increased to match it.
Input and Output Capacitor Properties
Any good quality ceramic capacitors can be used with the
ADP16x, as long as they meet the minimum capacitance and
maximum ESR requirements. Ceramic capacitors are manufactured
with a variety of dielectrics, each with different behavior over
temperature and applied voltage. Capacitors must have a dielectric
adequate to ensure the minimum capacitance over the necessary
temperature range and dc bias conditions. X5R or X7R dielectrics
with a voltage rating of 6.3 V or 10 V are recommended. Y5V
and Z5U dielectrics are not recommended due to their poor
temperature and dc bias characteristics.
Figure 36 depicts the capacitance vs. voltage bias characteristic
of a 0402, 1 µF, 10 V, X5R capacitor. The voltage stability of a
capacitor is strongly influenced by the capacitor size and voltage
rating. In general, a capacitor in a larger package or higher voltage
rating exhibits better stability. The temperature variation of the X5R
dielectric is about ±15% over the −40°C to +85°C temperature
range and is not a function of package or voltage rating.
1.2
1.0
0.8
0.6
0.4
0.2
00246810
CAPACI TANCE (µ F)
VOLTAGE
08628-034
Figure 36. Capacitance vs. Voltage Characteristic
Use Equation 1 to determine the worst-case capacitance accounting
for capacitor variation over temperature, component tolerance,
and voltage.
CEFF = CBIAS × (1 − TEMPCO) × (1 − TOL) (1)
where:
CBIAS is the effective capacitance at the operating voltage.
TEMPCO is the worst-case capacitor temperature coefficient.
TOL is the worst-case component tolerance.
In this example, the worst-case temperature coefficient (TEMPCO)
over −40°C to +85°C is assumed to be 15% for an X5R dielectric.
The tolerance of the capacitor (TOL) is assumed to be 10%, and
CBIAS is 0.94 µF at 1.8 V, as shown in Figure 36.
Substituting these values in Equation 1 yields
CEFF = 0.94 μF × (1 − 0.15) × (1 − 0.1) = 0.719 µF
Therefore, the capacitor chosen in this example meets
the minimum capacitance requirement of the LDO over
temperature and tolerance at the chosen output voltage.
Data Sheet ADP160/ADP161/ADP162/ADP163
Rev. E | Page 15 of 24
To guarantee the performance of the ADP16x, it is imperative
that the effects of dc bias, temperature, and tolerances on the
behavior of the capacitors are evaluated for each.
ENABLE FEATURE
The ADP16x use the EN pin to enable and disable the VOUT
pin under normal operating conditions. As shown in Figure 37,
when a rising voltage on EN crosses the active threshold, VOUT
turns on. When a falling voltage on EN crosses the inactive
threshold, VOUT turns off.
4.5
3.5
2.5
4.0
3.0
2.0
1.5
0.5
1.0
0
0.5 0.7 0.9 1.1 1.3 1.5
V
OUT
(V)
EN VOLTAGE (V)
08628-035
Figure 37. Typical EN Pin Operation
As shown in Figure 37, the EN pin has hysteresis built in. This
prevents on/off oscillations that can occur due to noise on the
EN pin as it passes through the threshold points.
The EN pin active/inactive thresholds are derived from the VIN
voltage. Therefore, these thresholds vary with changing input
voltage. Figure 38 shows typical EN active/inactive thresholds
when the input voltage varies from 2.2 V to 5.5 V.
1.1
1.0
0.9
0.8
0.7
0.6
0.52.0 2.5 3.0 3.5
EN RI S E
EN F ALL
4.0 4.5 5.0
EN VOLTAGE (V)
INPUT VOLTAGE (V)
08628-036
Figure 38. Typical EN Pin Thresholds vs. Input Voltage
The start-up behavior of the ADP16x is shown in Figure 39.
The shutdown behavior of the ADP160/ADP161 is shown in
Figure 40.
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0045004000350030002500200015001000500
1.2V
2.5V
3.3V
EN VOLTAGE/V
OUT
(V)
TIME (µs)
EN
08628-037
Figure 39. Typical Start-Up Behavior (ADP16x)
4.5
3.5
4.0
3.0
2.5
2.0
1.5
1.0
0.5
001000800600400200
1.2V
4.2V
EN VOLTAGE/V
OUT
(V)
TIME (µs)
EN
08628-038
C
OUT
= 1µF
Figure 40. Typical Shutdown Behavior, No Load (ADP160/ADP161)
CURRENT LIMIT AND THERMAL OVERLOAD
PROTECTION
The ADP16x are protected against damage due to excessive
power dissipation by current and thermal overload protection
circuits. The ADP16x are designed to current limit when the
output load reaches 320 mA (typical). When the output load
exceeds 320 mA, the output voltage is reduced to maintain a
constant current limit.
Thermal overload protection is included, which limits the junction
temperature to a maximum of 150°C (typical). Under extreme
conditions (that is, high ambient temperature and power dissipation),
when the junction temperature starts to rise above 150°C, the
output is turned off, reducing the output current to zero. When
the junction temperature drops below 135°C, the output is turned
on again and the output current is restored to its nominal value.
ADP160/ADP161/ADP162/ADP163 Data Sheet
Rev. E | Page 16 of 24
Consider the case where a hard short from OUT to ground
occurs. At first, the ADP16x current limit so that only 320 mA
is conducted into the short. If self-heating of the junction is
great enough to cause its temperature to rise above 150°C,
thermal shutdown activates, turning off the output and
reducing the output current to zero. As the junction tempera-
ture cools and drops below 135°C, the output turns on and
conducts 320 mA into the short, again causing the junction
temperature to rise above 150°C. This thermal oscillation
between 135°C and 150°C causes a current oscillation between
320 mA and 0 mA that continues as long as the short remains
at the output.
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For reliable
operation, device power dissipation must be externally limited
so junction temperatures do not exceed 125°C.
THERMAL CONSIDERATIONS
In most applications, the ADP16x do not dissipate much heat due
to their high efficiency. However, in applications with high ambient
temperature and high supply voltage to output voltage differential,
the heat dissipated in the package is large enough that it can cause
the junction temperature of the die to exceed the maximum
junction temperature of 125°C.
When the junction temperature exceeds 150°C, the converter enters
thermal shutdown. It recovers only after the junction temperature
has decreased below 135°C to prevent any permanent damage.
Therefore, thermal analysis for the chosen application is very
important to guarantee reliable performance over all conditions.
The junction temperature of the die is the sum of the ambient
temperature of the environment and the temperature rise of the
package due to the power dissipation, as shown in Equation 2.
To guarantee reliable operation, the junction temperature of
the ADP16x must not exceed 125°C. To ensure the junction
temperature stays below this maximum value, the user needs to
be aware of the parameters that contribute to junction temperature
changes. These parameters include ambient temperature, power
dissipation in the power device, and thermal resistances between
the junction and ambient air (θJA). The θJA number is dependent
on the package assembly compounds that are used and the amount
of copper used to solder the package GND pins to the PCB.
Table 8 shows the typical θJA values of the 5-lead TSOT and the
4-ball WLCSP for various PCB copper sizes. Table 9 shows the
typical ΨJB value of the 5-lead TSOT and 4-ball WLCSP.
Table 8. Typical θJA Values
θJA (°C/W)
Copper Size (mm2) TSOT WLCSP
01 170 260
50 152 159
100 146 157
300 134 153
500
131
151
1 Device soldered to minimum size pin traces.
Table 9. Typical ΨJB Values
ΨJB (°C/W)
TSOT WLCSP
42.8 58.4
The junction temperature of the ADP16x can be calculated
from the following equation:
TJ = TA + (PD × θJA) (2)
where:
TA is the ambient temperature.
PD is the power dissipation in the die, given by
PD = [(VIN − VOUT) × ILOAD] + (VIN × IGND) (3)
where:
ILOAD is the load current.
IGND is the ground current.
VIN and VOUT are input and output voltages, respectively.
Power dissipation due to ground current is quite small and can be
ignored. Therefore, the junction temperature equation simplifies to
the following:
TJ = TA + {[(VIN − VOUT) × ILOAD] × θJA} (4)
As shown in Equation 4, for a given ambient temperature, input-
to-output voltage differential, and continuous load current, there
exists a minimum copper size requirement for the PCB to ensure
the junction temperature does not rise above 125°C. Figure 41 to
Figure 48 show the junction temperature calculations for the
different ambient temperatures, load currents, VIN-to-VOUT
differentials, and areas of PCB copper.
In the case where the board temperature is known, use the
thermal characterization parameter, ΨJB, to estimate the junction
temperature rise (see Figure 49 and Figure 50). Maximum
junction temperature (TJ) is calculated from the board
temperature (TB) and power dissipation (PD) using the
following formula:
TJ = TB + (PD × ΨJB) (5)
The typical value of ΨJB is 58°C/W for the 4-ball WLCSP package
and 43°C/W for the 5-lead TSOT package.
140
120
100
80
60
40
20
0
0.3 4.84.33.83.32.82.31.81.30.8 V
IN
– V
OUT
(V)
JUNCTION T E M P E RATURE, T
J
(° C)
MAXIMUM JUNCT ION TEMP E RATURE
I
LOAD
= 1mA
I
LOAD
= 10mA
I
LOAD
= 50mA
I
LOAD
= 100mA
I
LOAD
= 150mA
I
LOAD
= 200mA
08628-039
Figure 41. 500 mm2 of PCB Copper, WLCSP, TA = 25°C
Data Sheet ADP160/ADP161/ADP162/ADP163
Rev. E | Page 17 of 24
140
120
100
80
60
40
20
0
0.3 4.84.33.83.32.82.31.81.30.8 V
IN
– V
OUT
(V)
JUNCTION T E M P E RATURE, T
J
(° C)
MAXIMUM JUNCT ION TEMP E RATURE
I
LOAD
= 1mA
I
LOAD
= 10mA
I
LOAD
= 50mA
I
LOAD
= 100mA
I
LOAD
= 150mA
I
LOAD
= 200mA
08628-040
Figure 42. 100 mm2 of PCB Copper, WLCSP, TA = 50°C
140
120
100
80
60
40
20
0
0.3 4.84.33.83.32.82.31.81.30.8 V
IN
– V
OUT
(V)
JUNCTION T E M P E RATURE, T
J
(° C)
I
LOAD
= 1mA
I
LOAD
= 10mA
I
LOAD
= 50mA
I
LOAD
= 100mA
I
LOAD
= 150mA
I
LOAD
= 200mA
MAXIMUM JUNCT ION TEMP E RATURE
08628-041
Figure 43. 500 mm2 of PCB Copper, WLCSP, TA = 85°C
140
120
100
80
60
40
20
0
0.3 4.84.33.83.32.82.31.81.30.8 V
IN
– V
OUT
(V)
JUNCTION T E M P E RATURE, T
J
(° C)
I
LOAD
= 1mA
I
LOAD
= 10mA
I
LOAD
= 50mA
I
LOAD
= 100mA
I
LOAD
= 150mA
I
LOAD
= 200mA
MAXIMUM JUNCT ION TEMP E RATURE
08628-042
Figure 44. 100 mm2 of PCB Copper, WLCSP, TA = 50°C
140
120
100
80
60
40
20
0
0.3 4.84.33.83.32.82.31.81.30.8 V
IN
– V
OUT
(V)
JUNCTION T E M P E RATURE, T
J
(° C)
I
LOAD
= 1mA
I
LOAD
= 10mA
I
LOAD
= 50mA
I
LOAD
= 100mA
I
LOAD
= 150mA
I
LOAD
= 200mA
MAXIMUM JUNCT ION TEMP E RATURE
08628-043
Figure 45. 500 mm2 of PCB Copper, TSOT, TA = 25°C
140
120
100
80
60
40
20
0
0.3 4.84.33.83.32.82.31.81.30.8 V
IN
– V
OUT
(V)
JUNCTION T E M P E RATURE, T
J
(° C)
I
LOAD
= 1mA
I
LOAD
= 10mA
I
LOAD
= 50mA
I
LOAD
= 100mA
I
LOAD
= 150mA
I
LOAD
= 200mA
MAXIMUM JUNCT ION TEMP E RATURE
08628-044
Figure 46. 100 mm2 of PCB Copper, TSOT, TA = 25°C
140
120
100
80
60
40
20
0
0.3 4.84.33.83.32.82.31.81.30.8 V
IN
– V
OUT
(V)
JUNCTION T E M P E RATURE, T
J
(° C)
I
LOAD
= 1mA
I
LOAD
= 10mA
I
LOAD
= 50mA
I
LOAD
= 100mA
I
LOAD
= 150mA
I
LOAD
= 200mA
MAXIMUM JUNCT ION TEMP E RATURE
08628-045
Figure 47. 500 mm2 of PCB Copper, TSOT, TA = 50°C
ADP160/ADP161/ADP162/ADP163 Data Sheet
Rev. E | Page 18 of 24
140
120
100
80
60
40
20
0
0.3 4.84.33.83.32.82.31.81.30.8 V
IN
– V
OUT
(V)
JUNCTION T E M P E RATURE, T
J
(° C)
I
LOAD
= 1mA
I
LOAD
= 10mA
I
LOAD
= 50mA
I
LOAD
= 100mA
I
LOAD
= 150mA
I
LOAD
= 200mA
MAXIMUM JUNCT ION TEMP E RATURE
08628-046
Figure 48. 100 mm2 of PCB Copper, TSOT, TA = 50°C
140
120
100
80
60
40
20
0
0.3 4.84.33.83.32.82.31.81.30.8 V
IN
– V
OUT
(V)
JUNCTION T E M P E RATURE, T
J
(° C)
I
LOAD
= 1mA
I
LOAD
= 10mA
I
LOAD
= 50mA
I
LOAD
= 100mA
I
LOAD
= 150mA
I
LOAD
= 200mA
MAXIMUM JUNCT ION TEMP E RATURE
08628-047
Figure 49. WLCSP, TA = 85°C
140
120
100
80
60
40
20
0
0.3 4.84.33.83.32.82.31.81.30.8 V
IN
– V
OUT
(V)
JUNCTION T E M P E RATURE, T
J
(° C)
I
LOAD
= 1mA
I
LOAD
= 10mA
I
LOAD
= 50mA
I
LOAD
= 100mA
I
LOAD
= 150mA
I
LOAD
= 200mA
MAXIMUM JUNCT ION TEMP E RATURE
08628-048
Figure 50. TSOT, TA = 85°C
PCB LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP16x. However,
as listed in Table 8, a point of diminishing returns is reached
eventually, beyond which an increase in the copper size does
not yield significant heat dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUT and GND pins. Use of 0402 or 0603 size capacitors and
resistors achieves the smallest possible footprint solution on
boards where area is limited.
Data Sheet ADP160/ADP161/ADP162/ADP163
Rev. E | Page 19 of 24
08628-049
Figure 51. Example of 5-Lead TSOT PCB Layout
08628-050
Figure 52. Example of 4-Ball WLCSP PCB Layout
ADP160/ADP161/ADP162/ADP163 Data Sheet
Rev. E | Page 20 of 24
OUTLINE DIMENSIONS
100708-A
*COM P LIANT TO JE DE C S TANDARDS MO-193-AB WITH
THE E X CE P TIO N OF P ACKAGE HEIGHT AND THICKNESS .
1.60 BSC 2.80 BS C
1.90
BSC
0.95 BSC
0.20
0.08
0.60
0.45
0.30
8°
4°
0°
0.50
0.30
0.10 MAX
*1.00 MAX
*0.90 MAX
0.70 MIN
2.90 BS C
5 4
1 2 3
SEATING
PLANE
Figure 53. 5-Lead Thin Small Outline Transistor Package [TSOT]
(UJ-5)
Dimensions shown in millimeters
1.000
0.965 S Q
0.925
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SI DE DOWN)
A
12
B
BALLA1
IDENTIFIER
0.50
REF
0.640
0.595
0.550 END VIEW
0.340
0.320
0.300
0.370
0.355
0.340
SEATING
PLANE 0.270
0.240
0.210
COPLANARITY
0.03
04-17-2012-A
Figure 54. 4-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-4-1)
Dimensions shown in millimeters
Data Sheet ADP160/ADP161/ADP162/ADP163
Rev. E | Page 21 of 24
ORDERING GUIDE
Model
1
Temperature Range
Output Voltage (V)
Package Description
Package Option
Branding
ADP160ACBZ-1.2-R7 −40°C to +125°C 1.2 4-Ball WLCSP CB-4-1 5K
ADP160ACBZ-1.5-R7 −40°C to +125°C 1.5 4-Ball WLCSP CB-4-1 5L
ADP160ACBZ-1.8-R7 −40°C to +125°C 1.8 4-Ball WLCSP CB-4-1 5N
ADP160ACBZ-2.1-R7 −40°C to +125°C 2.1 4-Ball WLCSP CB-4-1 5P
ADP160ACBZ-2.3-R7 −40°C to +125°C 2.3 4-Ball WLCSP CB-4-1 AH
ADP160ACBZ-2.5-R7 −40°C to +125°C 2.5 4-Ball WLCSP CB-4-1 5Q
ADP160ACBZ-2.7-R7 −40°C to +125°C 2.7 4-Ball WLCSP CB-4-1 AM
ADP160ACBZ-2.75-R7 −40°C to +125°C 2.75 4-Ball WLCSP CB-4-1 5R
ADP160ACBZ-2.8-R7 −40°C to +125°C 2.8 4-Ball WLCSP CB-4-1 5S
ADP160ACBZ-2.85-R7 −40°C to +125°C 2.85 4-Ball WLCSP CB-4-1 5T
ADP160ACBZ-3.0-R7 −40°C to +125°C 3.0 4-Ball WLCSP CB-4-1 5U
ADP160ACBZ-3.3-R7 −40°C to +125°C 3.3 4-Ball WLCSP CB-4-1 5V
ADP160ACBZ-4.2-R7
−40°C to +125°C
4.2
4-Ball WLCSP
CB-4-1
6U
ADP160AUJZ-1.2-R7 −40°C to +125°C 1.2 5-Lead TSOT UJ-5 LDQ
ADP160AUJZ-1.5-R7 −40°C to +125°C 1.5 5-Lead TSOT UJ-5 LDR
ADP160AUJZ-1.8-R7 −40°C to +125°C 1.8 5-Lead TSOT UJ-5 LE0
ADP160AUJZ-2.3-R7 −40°C to +125°C 2.3 5-Lead TSOT UJ-5 LLP
ADP160AUJZ-2.5-R7 −40°C to +125°C 2.5 5-Lead TSOT UJ-5 LFZ
ADP160AUJZ-2.7-R7 −40°C to +125°C 2.7 5-Lead TSOT UJ-5 LJF
ADP160AUJZ-2.8-R7 −40°C to +125°C 2.8 5-Lead TSOT UJ-5 LG0
ADP160AUJZ-3.0-R7 −40°C to +125°C 3.0 5-Lead TSOT UJ-5 Y2U
ADP160AUJZ-3.3-R7 −40°C to +125°C 3.3 5-Lead TSOT UJ-5 LG1
ADP160AUJZ-4.2-R7 −40°C to +125°C 4.2 5-Lead TSOT UJ-5 LGY
ADP161AUJZ-R7 −40°C to +125°C Adjustable 5-Lead TSOT UJ-5 LHW
ADP162ACBZ-1.2-R7 −40°C to +125°C 1.2 4-Ball WLCSP CB-4-1 70
ADP162ACBZ-1.8-R7 −40°C to +125°C 1.8 4-Ball WLCSP CB-4-1 71
ADP162ACBZ-2.1-R7 −40°C to +125°C 2.1 4-Ball WLCSP CB-4-1 72
ADP162ACBZ-2.8-R7 −40°C to +125°C 2.8 4-Ball WLCSP CB-4-1 73
ADP162ACBZ-3.0-R7 −40°C to +125°C 3.0 4-Ball WLCSP CB-4-1 74
ADP162ACBZ-4.2-R7 −40°C to +125°C 4.2 4-Ball WLCSP CB-4-1 75
ADP162AUJZ-1.5-R7 −40°C to +125°C 1.5 5-Lead TSOT UJ-5 LH9
ADP162AUJZ-1.8-R7 −40°C to +125°C 1.8 5-Lead TSOT UJ-5 LLN
ADP162AUJZ-2.3-R7 −40°C to +125°C 2.3 5-Lead TSOT UJ-5 LLQ
ADP162AUJZ-2.5-R7 −40°C to +125°C 2.5 5-Lead TSOT UJ-5 LHB
ADP162AUJZ-2.7-R7 −40°C to +125°C 2.7 5-Lead TSOT UJ-5 LJK
ADP162AUJZ-2.8-R7 −40°C to +125°C 2.8 5-Lead TSOT UJ-5 LHC
ADP162AUJZ-3.0-R7 −40°C to +125°C 3.0 5-Lead TSOT UJ-5 LHD
ADP162AUJZ-3.3-R7 −40°C to +125°C 3.3 5-Lead TSOT UJ-5 LHE
ADP162AUJZ-4.2-R7 −40°C to +125°C 4.2 5-Lead TSOT UJ-5 LHF
ADP163AUJZ-R7 −40°C to +125°C Adjustable 5-Lead TSOT UJ-5 LHG
ADP160UJZ-REDYKIT Evaluation Board Kit
ADP162UJZ-REDYKIT Evaluation Board Kit
ADP161UJ-EVALZ Evaluation Board
ADP163UJ-EVALZ Evaluation Board
1 Z = RoHS Compliant Part.
ADP160/ADP161/ADP162/ADP163 Data Sheet
Rev. E | Page 22 of 24
NOTES
Data Sheet ADP160/ADP161/ADP162/ADP163
Rev. E | Page 23 of 24
NOTES
