74LVC1G19GN - NXP - Datasheet.Directory

1. General description

The 74LVC1G19 is a 1-of-2 decoder/demultiplexer with a common output enable. This

device buffers the data on input A and passes it to the outputs 1Y (true) and 2Y

(complem e nt ) whe n th e en ab le (E ) input signal is LOW.

Inputs can be driven from either 3.3 V or 5 V devices. The s e fe at ur es al low th e use of

these devices in a mix ed 3.3 Vand 5 V environment.

This device is fully specified for partial power-down applications using IOFF. The IOFF

circuitry disables the outpu t, preventing the damaging ba ckflow current through the device

when it is powered down.

2. Features and benefits

Wide supply voltage range from 1.65 V to 5.5 V

5 V tolerant inputs for interfacing with 5 V logic

High noise immunity

Complies with JEDEC standard:

JESD8-7 (1.65 V to 1.95 V)

JESD8-5 (2.3 V to 2. 7 V)

JESD8B/JESD36 (2.7 V to 3.6 V)

ESD protection:

HBM JESD22-A114F exceeds 2000 V

MM JESD22-A115-A exceeds 200 V

24 mA output drive (VCC =3.0V)

CMOS low power consumption

Latch-up performance exceeds 250 mA

Direct interface with TTL levels

Inputs accept voltages up to 5 V

Multiple package options

Specified from 40 Cto+85 C and 40 C to +125 C.

74LVC1G19

1-of-2 decoder/demultiplexer

Rev. 6 — 6 December 2011 Product data sheet

Product data sheet Rev. 6 — 6 December 2011 2 of 18

NXP Semiconductors 74LVC1G19

1-of-2 decoder/demultiplexer

3. Ordering information

4. Marking

[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.

5. Functional diagram

Tabl e 1. Ordering information

Type number Package

Temperature range Name Description Version

74LVC1G19GW 40 Cto+125C SC-88 plastic surface-mounted package; 6 leads SOT363

74LVC1G19GV 40 Cto+125C TSOP6 plastic surface-mounted package (TSOP6); 6 leads SOT457

74LVC1G19GM 40 Cto+125C XSON6 plastic extremely thin small outline package; no leads;

6 terminals; body 1 1.45 0.5 mm SOT886

74LVC1G19GF 40 C to +125 C XSON6 plastic extremely thin small outline package; no leads;

6 terminals; body 1 10.5 mm SOT891

74LVC1G19GN 40 C to +125 C XSON6 extremely thin small outline package; no leads;

6 terminals; body 0.9 1.0 0.35 mm SOT1115

74LVC1G19GS 40 C to +125 C XSON6 extremely thin small outline package; no leads;

6 terminals; body 1.0 1.0 0.35 mm SOT1202

Table 2. Marking

Type number Marking code[1]

74LVC1G19GW VY

74LVC1G19GV V19

74LVC1G19GM VY

74LVC1G19GF VY

74LVC1G19GN VY

74LVC1G19GS VY

Fig 1. Logic symbol

mnb126

Product data sheet Rev. 6 — 6 December 2011 3 of 18

NXP Semiconductors 74LVC1G19

1-of-2 decoder/demultiplexer

6. Pinning information

6.1 Pinning

6.2 Pin description

7. Functional description

[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care

Fig 2. Pin configuration SOT363

and SOT457 Fig 3. Pin configuration SOT886 Fig 4. Pin configuration SOT891,

SOT1115 and SOT 1202

74LVC1G19

A1Y

GND

E2Y

001aab986

VCC

74LVC1G19

GND

001aab985

VCC

Transparent top view

74LVC1G19

GND

001aaf974

VCC

Transparent top view

Table 3. Pin description

Symbol Pin Description

A 1 data input

GND 2 ground (0 V)

E 3 enable input (active LOW)

2Y 4 data output

VCC 5 supply voltage

1Y 6 data output

Table 4. Function table[1]

Input Output

E A 1Y 2Y

LLLH

LHHL

HXHH

Product data sheet Rev. 6 — 6 December 2011 4 of 18

NXP Semiconductors 74LVC1G19

1-of-2 decoder/demultiplexer

8. Limiting values

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

[2] When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation.

[3] For SC-88 and SC-74A packages: above 87.5 C th e value of Ptot derates linearly with 4.0 mW/K.

For XSON6 package: above 118 C the value of Ptot derates linearly with 7.8 mW/K.

9. Recommended operating conditions

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Max Unit

VCC supply voltage 0.5 +6.5 V

IIK input clamping current VI < 0 V 50 - mA

VIinput voltage [1] 0.5 +6.5 V

IOK output clamping current VO > VCC or VO < 0 V - 50 mA

VOoutput voltage Active mode [1][2] 0.5 VCC + 0.5 V

Power-down mode [1][2] 0.5 +6.5 V

IOoutput current VO = 0 V to VCC -50 mA

ICC supply current - 100 mA

IGND ground current 100 - mA

Ptot total power dissipation Tamb = 40 C to +125 C[3] - 250 mW

Tstg storage temperature 65 +150 C

Table 6. Recommended operating conditions

Symbol Parameter Conditions Min Typ Max Unit

VCC supply voltage 1.65 - 5.5 V

VIinput voltage 0 - 5.5 V

VOoutput voltage Active mode 0 - VCC V

Power-down mode; VCC =0V 0 - 5.5 V

Tamb ambient temperature 40 - +125 C

t/V input transition rise and fall rate VCC = 1.65 V to 2.7 V - - 20 ns/V

VCC = 2.7 V to 5.5 V - - 10 ns/V

Product data sheet Rev. 6 — 6 December 2011 5 of 18

NXP Semiconductors 74LVC1G19

1-of-2 decoder/demultiplexer

10. Static characteristics

Table 7. Static characteristics

At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Typ[1] Max Unit

Tamb =40 C to +85 C

VIH HIGH-level input voltage VCC = 1.65 V to 1.95 V 0.65 VCC -- V

VCC = 2.3 V to 2.7 V 1.7 - - V

VCC = 2.7 V to 3.6 V 2.0 - - V

VCC = 4.5 V to 5.5 V 0.7 VCC -- V

VIL LOW-level input voltage VCC = 1.65 V to 1.95 V - - 0.35 VCC V

VCC = 2.3 V to 2.7 V - - 0.7 V

VCC = 2.7 V to 3.6 V - - 0.8 V

VCC = 4.5 V to 5.5 V - - 0.3 VCC V

VOH HIGH-level output voltage VI=V

IH or VIL

IO=100 A; VCC = 1.65 V to 5.5 V VCC 0.1 - - V

IO=4mA; V

CC = 1.65 V 1.2 1.54 - V

IO=8mA; V

CC = 2.3 V 1.9 2.15 - V

IO=12 mA; VCC = 2.7 V 2.2 2.50 - V

IO=24 mA; VCC = 3.0 V 2.3 2.62 - V

IO=32 mA; VCC = 4.5 V 3.8 4.11 - V

VOL LOW-level output voltage VI=V

IH or VIL

IO=100A; VCC = 1.65 V to 5.5 V - - 0.10 V

IO=4mA; V

CC = 1.65 V - 0.07 0.45 V

IO=8mA; V

CC = 2.3 V - 0.12 0.30 V

IO=12mA; V

CC = 2.7 V - 0.17 0.40 V

IO=24mA; V

CC = 3.0 V - 0.33 0.55 V

IO=32mA; V

CC = 4.5 V - 0.39 0.55 V

IIinput leakage current VI= 5.5 V or GND; VCC =0Vto5.5V - 0.1 5A

IOFF power-off leakage current VCC = 0 V; VIor VO=5.5V - 0.1 10 A

ICC supply current VI= 5.5 V or GND;

VCC =1.65Vto5.5V; I

O=0A -0.110A

ICC additional supply current per pin; VCC = 2.3 V to 5.5 V ;

VI=V

CC 0.6 V; IO=0 A -5500A

CIinput capacitance VCC = 3.3 V; VI = GND to VCC -2.5-pF

Product data sheet Rev. 6 — 6 December 2011 6 of 18

NXP Semiconductors 74LVC1G19

1-of-2 decoder/demultiplexer

[1] All typical values are measured at VCC = 3.3 V and Tamb =25C.

Tamb =40 C to +125 C

VIH HIGH-level input voltage VCC = 1.65 V to 1.95 V 0.65 VCC -- V

VCC = 2.3 V to 2.7 V 1.7 - - V

VCC = 2.7 V to 3.6 V 2.0 - - V

VCC = 4.5 V to 5.5 V 0.7 VCC -- V

VIL LOW-level input voltage VCC = 1.65 V to 1.95 V - - 0.35 VCC V

VCC = 2.3 V to 2.7 V - - 0.7 V

VCC = 2.7 V to 3.6 V - - 0.8 V

VCC = 4.5 V to 5.5 V - - 0.3 VCC V

VOH HIGH-level output voltage VI=V

IH or VIL

IO=100 A; VCC = 1.65 V to 5.5 V VCC 0.1 - - V

IO=4mA; V

CC = 1.65 V 0.95 - - V

IO=8mA; V

CC = 2.3 V 1.7 - - V

IO=12 mA; VCC = 2.7 V 1.9 - - V

IO=24 mA; VCC = 3.0 V 2.0 - - V

IO=32 mA; VCC = 4.5 V 3.4 - - V

VOL LOW-level output voltage VI=V

IH or VIL

IO=100A; VCC = 1.65 V to 5.5 V - - 0.10 V

IO=4mA; V

CC = 1.65 V - - 0.70 V

IO=8mA; V

CC = 2.3 V - - 0.45 V

IO=12mA; V

CC = 2.7 V - - 0.60 V

IO=24mA; V

CC = 3.0 V - - 0.80 V

IO=32mA; V

CC = 4.5 V - - 0.80 V

IIinput leakage current VI= 5.5 V or GND; VCC =0Vto5.5V - - 20 A

IOFF power-off leakage current VCC = 0 V; VIor VO=5.5V - - 20 A

ICC supply current VI= 5.5 V or GND;

VCC =1.65Vto5.5V; I

O=0A --40A

ICC additional supply current per pin; VCC = 2.3 V to 5.5 V ;

VI=V

CC 0.6 V; IO=0 A - - 5000 A

Table 7. Static characteristics …continued

At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Typ[1] Max Unit

Product data sheet Rev. 6 — 6 December 2011 7 of 18

NXP Semiconductors 74LVC1G19

1-of-2 decoder/demultiplexer

11. Dynamic characteristics

[1] Typical values are measured at Tamb =25C and VCC = 1.8 V, 2.5 V, 2.7 V, 3.3 V and 5.0 V respectively.

[2] tpd is the same as tPLH and tPHL.

[3] CPD is used to determine the dynamic power dissipation (PDin W).

PD=C

PD VCC2fiN+(CLVCC2fo) where:

fi= input frequency in MHz;

fo= output frequency in MHz;

CL= output load capacitance in pF;

VCC = supply voltage in V;

N = number of inputs switching;

(CLVCC2fo) = sum of outputs.

12. AC waveforms

Table 8. Dynamic characteristics

Vo ltages are referenced to GND (ground = 0 V). For test circuit see Figure 6.

Symbol Parameter Conditions 40 C to +85 C40 C to +125 CUnit

Min Typ[1] Max Min Max

tpd propagation delay A, E to nY; see Figure 5 [2]

VCC = 1.65 V to 1.95 V 1.0 4.0 10.5 1.0 13.1 ns

VCC = 2.3 V to 2.7 V 0.5 2.5 6.2 0.5 7.7 ns

VCC = 2.7 V 1.0 2.8 6.5 1.0 8.1 ns

VCC = 3.0 V to 3.6 V 0.5 2.5 5.2 0.5 6.0 ns

VCC = 4.5 V to 5.5 V 0.5 1.8 3.9 0.5 5.0 ns

CPD power dissipation

capacitance VI = GND to VCC; VCC = 3.3 V [3] - 18.9 - - - pF

Measurement points are given in Table 9.

VOL and VOH are typical output voltage levels that occur with the output load.

Fig 5. The input A, E to output nY propagation delays

mnb127

A, E input

nY output

tPHL tPLH

GND

VMVM

VOH

VOL

Product data sheet Rev. 6 — 6 December 2011 8 of 18

NXP Semiconductors 74LVC1G19

1-of-2 decoder/demultiplexer

Table 9. Measurement points

Supply voltage Input Output

VCC VMVM

1.65 V to 1.95 V 0.5 VCC 0.5 VCC

2.3 V to 2.7 V 0.5 VCC 0.5 VCC

2.7V 1.5V 1.5V

3.0V to 3.6V 1.5V 1.5V

4.5 V to 5.5 V 0.5 VCC 0.5 VCC

Test data is given in Table 10.

Definitions for test circuit:

RL = Load resistance.

CL = Load capacitance including jig and probe capacitance.

RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.

VEXT = External voltage for measuring switching times.

Fig 6. Test circuit for measuring switching times

VEXT

VCC

VIVO

mna616

DUT

Table 10. Test data

Supply voltage Input Load VEXT

VCC VItr=t

fCLRLtPLH, tPHL

1.65 V to 1.95 V VCC  2.0ns 30pF 1kopen

2.3 V to 2.7 V VCC  2.0ns 30pF 500open

2.7V 2.7V  2.5ns 50pF 500open

3.0V to 3.6V 2.7V  2.5ns 50pF 500open

4.5 V to 5.5 V VCC  2.5ns 50pF 500open

Product data sheet Rev. 6 — 6 December 2011 9 of 18

NXP Semiconductors 74LVC1G19

1-of-2 decoder/demultiplexer

13. Package outline

Fig 7. Package outline SOT363 (SC-88)

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT363 SC-88

wBM

pin 1

index A

detail X

vMA

0 1 2 mm

scale

132

456

Plastic surface-mounted package; 6 leads SOT363

UNIT A1

max bpcDEe1HELpQywv

mm 0.1 0.30

0.20 2.2

1.8

0.25

0.10 1.35

1.15 0.65

1.3 2.2

2.0 0.2 0.10.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15 0.25

0.15

1.1

0.8

04-11-08

06-03-16

Product data sheet Rev. 6 — 6 December 2011 10 of 18

NXP Semiconductors 74LVC1G19

1-of-2 decoder/demultiplexer

Fig 8. Package outline SOT457 (TSOP6)

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT457 SC-74

wBM

pin 1

index A

detail X

vMA

scale

132

0 1 2 mm

Plastic surface-mounted package (TSOP6); 6 leads SOT457

UNIT A1bpcDEHELpQywv

mm 0.1

0.013 0.40

0.25 3.1

2.7

0.26

0.10 1.7

1.3

0.95 3.0

2.5 0.2 0.10.2

DIMENSIONS (mm are the original dimensions)

0.6

0.2 0.33

0.23

1.1

0.9

05-11-07

06-03-16

Product data sheet Rev. 6 — 6 December 2011 11 of 18

NXP Semiconductors 74LVC1G19

1-of-2 decoder/demultiplexer

Fig 9. Package outline SOT886 (XSON6)

terminal 1

index area

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT886 MO-252

SOT886

04-07-15

04-07-22

DIMENSIONS (mm are the original dimensions)

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm

0 1 2 mm

scale

Notes

1. Including plating thickness.

2. Can be visible in some manufacturing processes.

UNIT

mm 0.25

0.17 1.5

1.4 0.35

0.27

max b E

1.05

0.95

Dee

0.40

0.32

0.50.6

A(1)

max

0.5 0.04

6×

(2)

4×

(2)

Product data sheet Rev. 6 — 6 December 2011 12 of 18

NXP Semiconductors 74LVC1G19

1-of-2 decoder/demultiplexer

Fig 10. Package outline SOT891 (XSON6)

terminal 1

index area

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT891

05-04-06

07-05-15

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm

0 1 2 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

mm 0.20

0.12 1.05

0.95 0.35

0.27

max b E

1.05

0.95

Dee

0.40

0.32

0.350.55

max

0.5 0.04

6×

(1)

4×

(1)

Note

1. Can be visible in some manufacturing processes.

Product data sheet Rev. 6 — 6 December 2011 13 of 18

NXP Semiconductors 74LVC1G19

1-of-2 decoder/demultiplexer

Fig 11. Package outline SOT1115 (XSON6)

References

Outline

version European

projection Issue date

IEC JEDEC JEITA

SOT1115

sot1115_po

10-04-02

10-04-07

Unit

mm max

nom

min

0.35 0.04 0.95

0.90

0.85

1.05

1.00

0.95 0.55 0.3 0.40

0.35

0.32

A(1)

Dimensions

Note

1. Including plating thickness.

2. Visible depending upon used manufacturing technology.

XSON6: extremely thin small outline package; no leads;

6 terminals; body 0.9 x 1.0 x 0.35 mm SOT1115

A1b

0.20

0.15

0.12

DEee

0.35

0.30

0.27

0 0.5 1 mm

scale

terminal 1

index area

(4×)(2)

e1e1

321

6 5 4

(6×)(2) A1A

Product data sheet Rev. 6 — 6 December 2011 14 of 18

NXP Semiconductors 74LVC1G19

1-of-2 decoder/demultiplexer

Fig 12. Package outline SOT1202 (XSON6)

References

Outline

version European

projection Issue date

IEC JEDEC JEITA

SOT1202

sot1202_po

10-04-02

10-04-06

Unit

mm max

nom

min

0.35 0.04 1.05

1.00

0.95

1.05

1.00

0.95 0.55 0.35 0.40

0.35

0.32

A(1)

Dimensions

Note

1. Including plating thickness.

2. Visible depending upon used manufacturing technology.

XSON6: extremely thin small outline package; no leads;

6 terminals; body 1.0 x 1.0 x 0.35 mm SOT1202

A1b

0.20

0.15

0.12

DEee

0.35

0.30

0.27

0 0.5 1 mm

scale

terminal 1

index area

(4×)(2)

e1e1

123

6 5 4

(6×)(2)

Product data sheet Rev. 6 — 6 December 2011 15 of 18

NXP Semiconductors 74LVC1G19

1-of-2 decoder/demultiplexer

14. Abbreviations

15. Revision history

Table 11. Abbreviations

Acronym Description

CMOS Complementary Metal Oxide Semiconductor

DUT Device Under Test

ESD ElectroS tatic Discharge

HBM Human Body Model

MM Machine Model

TTL Transistor-Transistor Lo gic

Table 12. Revision history

Document ID Release date Data sheet st atu s Change notice Supersedes

74LVC1G19 v.6 20111206 Product data sheet - 74LVC1G19 v.5

Modifications: •Legal pages updated.

74LVC1G19 v.5 20100805 Product data sheet - 74LVC1G19 v.4

74LVC1G19 v.4 20070827 Product data sheet - 74LVC1G19 v.3

74LVC1G19 v.3 20070221 Product data sheet - 74LVC1G19 v.2

74LVC1G19 v.2 20041018 Product specification - 74LVC1G19 v.1

74LVC1G19 v.1 20030901 Product specification - -

Product data sheet Rev. 6 — 6 December 2011 16 of 18

NXP Semiconductors 74LVC1G19

1-of-2 decoder/demultiplexer

16. Legal information

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[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

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the products or of the application or use by cu stomer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress rating s only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from competent authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data fro m the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 6 — 6 December 2011 17 of 18

NXP Semiconductors 74LVC1G19

1-of-2 decoder/demultiplexer

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors prod uct is automotive qualified,

the product is not suitable for automotive use. It i s neit her qua lified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from custome r design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specif ications.

16.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

17. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors 74LVC1G19

1-of-2 decoder/demultiplexer

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 6 December 2011

Document identifier: 74LVC1G19

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

18. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Functional description . . . . . . . . . . . . . . . . . . . 3

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

9 Recommended operating conditions. . . . . . . . 4

10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5

11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7

12 AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 7

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15

15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15

16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16

16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16

16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16

16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17

17 Contact information. . . . . . . . . . . . . . . . . . . . . 17

18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18