Approval sheet
Ultra High Q & Low ESR Series (RF)
Page 1 of 12 ASC_ Ultra HQ Low ESR (RF)_014M_AS Jul. 2012
*Contents in this sheet are subject to change without prior notice.
MULTILAYER CERAMIC CAPACITORS
Microwave Series (RF)
0201 to 0805 Sizes (6.3V to 250V)
NP0 Dielectric
RoHS Compliance
Approval sheet
Ultra High Q & Low ESR Series (RF)
Page 2 of 12 ASC_ Ultra HQ Low ESR (RF)_014M_AS Jul. 2012
1. INTRODUCTION
MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve
miniaturization, high density and high efficiency, ceramic condensers are used.
WTC RF series MLCC is used at high frequencies generally have a small temperature coefficient of capacitance,
typical within the ±30ppm/°C required for NP0 (C0G) classification and have excellent conductivity internal electrode.
Thus, WTC RF series MLCC will be with the feature of low ESR and high Q characteristics.
4. HOW TO ORDER
RF 15 N 100 J 500 C T
Series
RF=Ultra High Q
& Low ESR
Size
03=0201 (0603)
15=0402 (1005)
18=0603 (1608)
21=0805 (2012)
Dielectric
N=NP0
Capacitance
Two significant
digits followed by
no. of zeros. And
R is in place of
decimal point.
eg.:
0R5=0.5pF
1R0=1.0pF
100=10x10
0
=10pF
Tolerance
A=±0.05pF
B0.1pF
C0.25pF
D0.5pF
F1%
G2%
J5%
Rated voltage
Two significant
digits followed by
no. of zeros. And
R is in place of
decimal point.
6R3=6.3 VDC
100=10 VDC
250=25 VDC
500=50 VDC
101=100 VDC
251=250 VDC
Termination
C=Cu/Ni/Sn
Packaging
T=7” reeled
G= 13” reeled
2. FEATURES
a. High Q and low ESR performance at high frequency.
b. Ultra low capacitance to 0.1pF.
c. Can offer high precision tolerance to ±0.05pF.
d. Quality improvement of telephone calls for low
power loss and better performance.
3. APPLICATIONS
a. Telecommunication products & equipments: Mobile
phone, WLAN, Base station.
b. RF module: Power amplifier, VCO.
c. Tuners.
Approval sheet
Ultra High Q & Low ESR Series (RF)
Page 3 of 12 ASC_ Ultra HQ Low ESR (RF)_014M_AS Jul. 2012
5. EXTERNAL DIMENSIONS
6. GENERAL ELECTRICAL DATA
Dielectric NP0
Size 0201, 0402, 0603, 0805
Capacitance* 0201: 0.1pF to 33pF; 0402: 0.1pF to 22pF; 0603: 0.3pF to 47pF; 0805: 0.3pF to 100pF
Capacitance tolerance Cap5pF: A (±0.05pF ), B (±0.1pF), C (±0.25pF)
5pF<Cap<10pF: B (±0.1pF), C (±0.25pF), D (±0.5pF)
Cap10pF: F (±1%), G (±2%), J (±5%)
Rated voltage (WVDC) 6.3V, 10V, 25V, 50V, 100V, 250V
Q* Cap30pF, Q1000; Cap<30pF,Q400+20C
Insulation resistance at Ur 10G
Operating temperature -55 to +125°C
Capacitance change ±30ppm/°C; 0201Cap22pF, ±60ppm/°C
Termination Ni/Sn (lead-free termination)
* Measured at the conditions of 25°C ambient temperature and 30~70% related humidity.
Apply 1.0±0.2Vrms, 1.0MHz±10% for Cap1000pF and 1.0±0.2Vrms, 1.0kHz±10% for Cap>1000pF.
T
W
L
M
B
M
B
Fig. 1 The outline of MLCC
Size
Inch (mm)
L (mm) W (mm) T (mm)/Symbol
Remark
M
B
(mm)
0201 (0603)
0.60±0.03
0.30±0.03
0.30±0.03
L
# 0.15±0.05
0402 (1005)
1.00±0.05
0.50±0.05
0.50±0.05
N
# 0.25+0.05/-0.10
0603 (1608)
1.60±0.10
0.80±0.10
0.80±0.07
S
0.40±0.15
0805 (2012)
2.00±0.20
1.25±0.20
0.85±0.10
T
0.50±0.20
# Reflow soldering only is recommended.
Approval sheet
Ultra High Q & Low ESR Series (RF)
Page 4 of 12 ASC_ Ultra HQ Low ESR (RF)_014M_AS Jul. 2012
7. CAPACITANCE RANGE
DIELECTRIC NP0
SIZE 0201 0402
RATED VOLTAGE (VDC)
6.3 10 25 50 100 Tolerance
0.1pF (0R1)
L
L
L
N
N
B
0.2pF (0R2)
L
L
L
N
N
A, B
0.3pF (0R3)
L
L
L
N
N
A, B
0.4pF (0R4)
L
L
L
N
N
A, B
0.5pF (0R5)
L
L
L
N
N
A, B, C
0.6pF (0R6)
L
L
L
N
N
A, B, C
0.7pF (0R7)
L
L
L
N
N
A, B, C
0.8pF (0R8)
L
L
L
N
N
A, B, C
0.9pF (0R9)
L
L
L
N
N
A, B, C
1.0pF (1R0)
L
L
L
N
N
A, B, C
1.
1
pF (1R
1
)
L
L
L
N
N
A, B,
C
1.
2
pF (1R
2
)
L
L
L
N
N
A, B, C
1.
3
pF (1R
3
)
L
L
L
N
N
A, B, C
1.
4
pF (1R
4
)
L
L
L
N
N
A, B, C
1.5pF (1R5)
L
L
L
N
N
A, B, C
1.
6
pF (1R
6
)
L
L
L
N
N
A, B, C
1.
7
pF (1R
7
)
L
L
L
N
N
A, B, C
1.8pF (1R8)
L
L
L
N
N
A, B, C
1.
9
pF (1R
9
)
L
L
L
N
N
A, B,
C
2
.
0
pF (
2
R
0
)
L
L
L
N
N
A, B, C
2
.
1
pF (
2
R
1
)
L
L
L
N
N
A, B, C
2
.
2
pF (
2
R
2
)
L
L
L
N
N
A, B, C
2
.
3
pF (
2
R
3
)
L
L
L
N
N
A, B, C
2
.
4
pF (
2
R
4
)
L
L
L
N
N
A, B, C
2
.5pF (
2
R5)
L
L
L
N
N
A, B, C
2
.
6
pF (
2
R
6
)
L
L
L
N
N
A, B, C
2
.
7
pF (
2
R
7
)
L
L
L
N
N
A, B,
C
2
.8pF (
2
R8)
L
L
L
N
N
A, B, C
2
.
9
pF (
2
R
9
)
L
L
L
N
N
A, B, C
3
.
0
pF (
3
R
0
)
L
L
L
N
N
A, B, C
3
.
1
pF (
3
R
1
)
L
L
L
N
N
A, B, C
3
.
2
pF (
3
R
2
)
L
L
L
N
N
A, B, C
3
.
3
pF (
3
R
3
)
L
L
L
N
N
A, B, C
3
.
4
pF (
3
R
4
)
L
L
L
N
N
A, B, C
3
.5pF (
3
R5)
L
L
L
N
N
A, B,
C
3
.
6
pF (
3
R
6
)
L
L
L
N
N
A, B, C
3
.
7
pF (
3
R
7
)
L
L
L
N
N
A, B, C
3
.8pF (
3
R8)
L
L
L
N
N
A, B, C
3
.
9
pF (
3
R
9
)
L
L
L
N
N
A, B, C
4
.
0
pF (
4
R
0
)
L
L
L
N
N
A, B, C
4
.
1
pF (
4
R
1
)
L
L
L
N
N
A, B, C
4
.
2
pF (
4
R
2
)
L
L
L
N
N
A, B, C
4
.
3
pF (
4
R
3
)
L
L
L
N
N
A, B,
C
4
.
4
pF (
4
R
4
)
L
L
L
N
N
A, B, C
4
.5pF (
4
R5)
L
L
L
N
N
A, B, C
4
.
6
pF (
4
R
6
)
L
L
L
N
N
A, B, C
4.7pF (4R7)
L
L
L
N
N
A, B, C
4.
8pF (4R8
)
L
L
L
N
N
A, B, C
4.9pF (4R9
)
L
L
L
N
N
A, B, C
5.0pF (5R0
)
L
L
L
N
N
A, B, C
5.1pF (5R1
)
L
L
L
N
N
B, C,
D
5.2pF (5R2
)
L
L
L
N
N
B, C, D
5.3pF (5R3
)
L
L
L
N
N
B, C, D
5.4pF (5R4
)
L
L
L
N
N
B, C, D
5.5pF (5R5
)
L
L
L
N
N
B, C, D
5.6pF (5R6
)
L
L
L
N
N
B, C, D
5.7pF (5R7
)
L
L
L
N
N
B, C, D
5.8pF (5R8
)
L
L
L
N
N
B, C, D
5.9pF (5R9
)
L
L
L
N
N
B, C,
D
Capacitance
6.0pF (6R0
)
L
L
L
N
N
B, C, D
Approval sheet
Ultra High Q & Low ESR Series (RF)
Page 5 of 12 ASC_ Ultra HQ Low ESR (RF)_014M_AS Jul. 2012
DIELECTRIC NP0
SIZE 0201 0402
RATED VOLTAGE (VDC)
6.3 10 25 50 100 Tolerance
6.1pF (6R1
)
L
L
L
N
N
B, C, D
6.2pF (6R2
)
L
L
L
N
N
B, C, D
6.3pF (6R3
)
L
L
L
N
N
B, C, D
6.4pF (6R4
)
L
L
L
N
N
B, C, D
6.5pF (6R5
)
L
L
L
N
N
B, C, D
6.6pF (6R6
)
L
L
L
N
N
B, C, D
6.7pF (6R7
)
L
L
L
N
N
B, C, D
6.8pF (6R8
)
L
L
L
N
N
B, C, D
6.9pF (6R9
)
L
L
L
N
N
B, C, D
7.0pF (7R0
)
L
L
L
N
N
B, C, D
7.1pF (7R1
)
L
L
L
N
N
B, C, D
7.2pF (7R2
)
L
L
L
N
N
B, C, D
7.3pF (7R3
)
L
L
L
N
N
B, C, D
7.4pF (7R4
)
L
L
L
N
N
B, C, D
7.5pF (7R5
)
L
L
L
N
N
B, C, D
7.6pF (7R6
)
L
L
L
N
N
B, C, D
7.7pF (7R7
)
L
L
L
N
N
B, C, D
7.8pF (7R8
)
L
L
L
N
N
B, C, D
7.9pF (7R9
)
L
L
L
N
N
B, C, D
8.0pF (8R0
)
L
L
L
N
N
B, C, D
8.1pF (8R1
)
L
L
L
N
N
B, C, D
8.2pF (8R2
)
L
L
L
N
N
B, C, D
8.3pF (8R3
)
L
L
L
N
N
B, C, D
8.4pF (8R4
)
L
L
L
N
N
B, C, D
8.5pF (8R5
)
L
L
L
N
N
B, C, D
8.6pF (8R6
)
L
L
L
N
N
B, C, D
8.7pF (8R7
)
L
L
L
N
N
B, C, D
8.8pF (8R8
)
L
L
L
N
N
B, C, D
8.9pF (8R9
)
L
L
L
N
N
B, C, D
9.0pF (9R0
)
L
L
L
N
N
B, C, D
9.
1pF (
9R
1
)
L
L
L
N
N
B, C, D
9.
2pF (
9R
2
)
L
L
L
N
N
B, C, D
9.
3pF (
9R
3
)
L
L
L
N
N
B, C, D
9.
4pF (
9R
4
)
L
L
L
N
N
B, C, D
9.
5pF (
9R
5
)
L
L
L
N
N
B, C, D
9.
6pF (
9R
6
)
L
L
L
N
N
B, C, D
9.
7pF (
9R
7
)
L
L
L
N
N
B, C, D
9.
8pF (
9R
8
)
L
L
L
N
N
B, C, D
9.
9pF (
9R
9
)
L
L
L
N
N
B, C, D
10pF (100)
L
L
L
N
N
F, G, J
11pF (110)
L
L
L
N
F, G, J
12pF (120)
L
L
L
N
F, G, J
13pF (130)
L
L
L
N
F, G, J
15pF (150)
L
L
L
N
F, G, J
16pF (
160)
L
L
L
N
F, G, J
18pF (180)
L
L
L
N
F, G, J
20pF (200)
L
L
L
N
F, G, J
22pF (220)
L
L
N
F, G, J
24pF (240)
L
L
F, G, J
27pF (270)
L
L
F, G, J
30pF (300)
L
L
F, G, J
33pF (330)
L
L
F, G, J
36pF (360)
F, G, J
39pF (
390)
F, G, J
43pF (430)
F, G, J
47pF (470)
F, G, J
56
pF (
56
0)
F, G, J
68
pF (
68
0)
F, G, J
82
pF (
82
0)
F, G, J
Capacitance
100
pF (
101
)
F, G, J
1. The letter in cell is expressed the symbol of product thickness.
2. WTC provide E96 (IEC-63) product range with which capacitance10pF.
3. For more information about products with special capacitance or other data, please contact WTC local representative.
Approval sheet
Ultra High Q & Low ESR Series (RF)
Page 6 of 12 ASC_ Ultra HQ Low ESR (RF)_014M_AS Jul. 2012
DIELECTRIC NP0
SIZE 0603 0805
RATED VOLTAGE (VDC)
50 100 250 50 100 250 Tolerance
0.1pF (0R1)
0.2pF (0R2)
0.3pF (0R3)
S S S T T T A, B
0.4pF (0R4)
S S S T T T A, B
0.5pF (0R5)
S S S T T T A, B, C
0.6pF (0R6)
S S S T T T A, B, C
0.7pF (0R7)
S S S T T T A, B, C
0.8pF (0R8)
S S S T T T A, B, C
0.9pF (0R9)
S S S T T T A, B, C
1.0pF (1R0)
S S S T T T A, B, C
1.2pF (1R2)
S S S T T T A, B, C
1.5pF (1R5)
S S S T T T A, B, C
1.8pF (1R8)
S S S T T T A, B, C
2.2pF (2R2)
S S S T T T A, B, C
2.7pF (2R7)
S S S T T T A, B, C
3.3pF (3R3)
S S S T T T A, B, C
3.9pF (3R9)
S S S T T T A, B, C
4.7pF (4R7)
S S S T T T A, B, C
5.6pF (5R6)
S S S T T T B, C, D
6.8pF (6R8)
S S S T T T B, C, D
8.2pF (8R2)
S S S T T T B, C, D
10pF (100)
S S S T T T F, G, J
11pF (110)
S S S T T T F, G, J
12pF (120)
S S S T T T F, G, J
13pF (130)
S S S T T T F, G, J
15pF (150)
S S S T T T F, G, J
16pF (160)
S S S T T T F, G, J
18pF (180)
S S S T T T F, G, J
20pF (200)
S S S T T T F, G, J
22pF (220)
S S S T T T F, G, J
24pF (240)
S S S T T T F, G, J
27pF (270)
S S S T T T F, G, J
30pF (300)
S S S T T T F, G, J
33pF (330)
S S S T T T F, G, J
36pF (360)
S S S T T T F, G, J
39pF (390)
S S S T T T F, G, J
43pF (430)
S S S T T T F, G, J
47pF (470)
S S S T T T F, G, J
56pF (560)
T T T F, G, J
68pF (680)
T T T F, G, J
82pF (820)
T T T F, G, J
Capacitance
100pF (101)
T T T F, G, J
1. The letter in cell is expressed the symbol of product thickness.
2. WTC provide E96 (IEC-63) product range with which capacitance10pF.
3. For more information about products with special capacitance or other data, please contact WTC local representative.
8. PACKAGING DIMENSION AND QUANTITY
Paper tape
Size Thickness (mm)/Symbol 7” reel 13” reel
0201 (0603) 0.30±0.03 L 15k 70k
0402 (1005) 0.50±0.05 N 10k 50k
0603 (1608) 0.80±0.07 S 4k 15k
0805 (2012) 0.85±0.10 T 4k 15k Unit: pieces
Approval sheet
Ultra High Q & Low ESR Series (RF)
Page 7 of 12 ASC_ Ultra HQ Low ESR (RF)_014M_AS Jul. 2012
9. ELECTRICAL CHARACTERISTICS
RF15, NP0, 50V
0.01
0.1
1
100 1,000 10,000
Frequency (MHz)
ESR (Ω)
6.8pF
3.3pF
1.5pF
1pF
Fig. 2 ESR vs. Frequency
RF15, NP0, 50V
1
10
100
1000
10000
100 1,000 10,000
Frequency (MHz)
Q
6.8pF
1pF
1.5pF
Fig. 3 Q vs. Frequency
RF15, NP0, 50V
1
10
100
1000
10000
100000
1 10 100 1,000 10,000
Frequency (MHz)
IZI (Ω)
1pF
1.5pF
3.3pF
6.8pF
Fig. 4 Impedance vs. Frequency
Approval sheet
Ultra High Q & Low ESR Series (RF)
Page 8 of 12 ASC_ Ultra HQ Low ESR (RF)_014M_AS Jul. 2012
RF03, NP0, 25V
0
5
10
15
20
25
30
0.1 1 10 100
Capacitance (pF)
Self resonance frequency (GHz)
Measured data (<8.5GHz)
Simulation data
Fig. 5 Self resonance frequency vs. Capacitance (0201 size)
RF15, NP0, 50V
0
5
10
15
20
25
0.1 1 10 100
Capacitance (pF)
Self resonance frequency (GHz)
Measured data (<8.5GHz)
Simulation data
Fig. 6 Self resonance frequency vs. Capacitance (0402 size)
RF03, NP0, 25V Comparison
-100
-80
-60
-40
-20
0
0.1 1 10
Frequency (GHz)
S11 (dB)
2 p F
1 p F
0. 5p F
Fig. 7 S11 vs. frequency. (0201 size)
RF03, NP0, 25V Comparison
-100
-80
-60
-40
-20
0
0.1 1 10
Frequency (GHz)
S21 (dB)
2 p F
1 p F
0 .5 pF
Fig. 9 S21 vs. frequency. (0201 size)
RF15, NP0, 50V Comparison
-100
-80
-60
-40
-20
0
0.1 1 10
Frequency (GHz)
S11 (dB)
2p F
1 pF
0.5 pF
Fig. 8 S11 vs. frequency. (0402 size)
RF15, NP0, 50V Comparison
-100
-80
-60
-40
-20
0
0.1 1 10
Frequency (GHz)
S21 (dB)
2 p F
1p F
0. 5p F
Fig. 10 S21 vs. frequency. (0402 size)
Approval sheet
Ultra High Q & Low ESR Series (RF)
Page 9 of 12 ASC_ Ultra HQ Low ESR (RF)_014M_AS Jul. 2012
10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No.
Item Test Conditions Requirements
1.
Visual and
Mechanical
--- * No remarkable defect.
* Dimensions to conform to individual specification sheet.
2.
Capacitance * Shall not exceed the limits given in the detailed spec.
3.
Q/ D.F.
(Dissipation
Factor)
1.0±0.2Vrms, 1MHz±10%
At 25°C ambient temperature. * Cap30pF, Q1000; Cap<30pF,Q400+20C
4.
Dielectric
Strength
* To apply voltage:
100V, 250% of rated voltage.
250V, 200% of rated voltage.
* Duration: 1 to 5 sec.
* Charge and discharge current less than 50mA.
* No evidence of damage or flash over during test.
5.
Insulation
Resistance
To apply rated voltage for max. 120 sec. 10G
6.
Temperature
Coefficient
With no electrical load.
Operating temperature: -55~125°C at 2C
* Capacitance change: within ±30ppm/°C;
0201Cap22pF, within ±60ppm/°C
7.
Adhesive
Strength of
Termination
* Pressurizing force
0201: 2N
0402 & 0603: 5N
>0603: 10N
* Test time: 10±1 sec.
* No remarkable damage or removal of the terminations.
8.
Vibration
Resistance
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
9.
Solderability * Solder temperature: 235±5°C
* Dipping time:0.5 sec.
95% min. coverage of all metalized area.
10.
Bending Test
* The middle part of substrate shall be pressurized by means
of the pressurizing rod at a rate of about 1 mm per second until
the deflection becomes 1 mm and then the pressure shall be
maintained for 5±1 sec.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±5.0% or ±0.5pF whichever is larger.
(This capacitance change means the change of capacitance under
specified flexure of substrate from the cap
acitance measured before
the test.)
11.
Resistance to
Soldering Heat
* Solder temperature: 260±5°C
* Dipping time: 10±1 sec
* Preheating: 120 to 150°C for 1 minute before immerse the
capacitor in a eutectic solder.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±2.5% or ±0.25pF whichever is larger.
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* 25% max. leaching on each edge.
12.
Temperature
Cycle
* Conduct the five cycles according to the temperatures and
time.
Step
Temp. (°C) Time (min.)
1 Min. operating temp. +0/-3 30±3
2 Room temp. 2~3
3 Max. operating temp. +3/-0 30±3
4 Room temp. 2~3
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No
remarkable damage.
* Cap change
within ±2.5 or ±0.25pF whichever is larger.
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
Approval sheet
Ultra High Q & Low ESR Series (RF)
Page 10 of 12 ASC_ Ultra HQ Low ESR (RF)_014M_AS Jul. 2012
No.
Item Test Condition Requirements
13.
Humidity
(Damp Heat)
Steady State
* Test temp.: 40±2°C
* Humidity: 90~95% RH
* Test time: 500+24/-0hrs.
* Measurement to be made after keeping
at room temp. for 24±2 hrs.
* No remarkable damage.
* Cap change: within ±5.0% or ±0.5pF whichever is larger.
* Q/D.F. value: Cap30pF, Q350;
10pFCap<30pF, Q275+2.5C
Cap<10pF; Q200+10C
* I.R.: 1G.
14.
Humidity
(Damp Heat)
Load
* Test temp.: 40±2°C
* Humidity: 90~95%RH
* Test time: 500+24/-0 hrs.
* To apply voltagerated voltage
* Measurement to be made after keeping
at room temp. for 24±2 hrs.
* No remarkable damage.
* Cap change: within ±7.5% or ±0.75pF whichever is larger.
* Q/D.F. value: Cap30pF, Q200;
Cap<30pF, Q100+10/3C
* I.R.: 500M.
15.
High
Temperature
Load
(Endurance)
* Test temp.: 125±3°C
* To apply voltage: 200% of rated voltage.
* Test time: 1000+24/-0 hrs.
* Measurement to be made after keeping
at room temp. for 24±2 hrs.
* No remarkable damage.
* Cap change: within ±3.0% or ±0.3pF whichever is larger.
* Q/D.F. value: Cap30pF, Q350
10pFCap<30pF, Q275+2.5C
Cap<10pF, Q200+10C
* I.R.: 1G.
The ESR should be measured at room
temperature and tested at frequency 1±0.1
GHz.
0201, 0402 0603 0805
0.5pFCap1pF:< 350m
0.3pFCap1pF:< 1500m
0.3pFCap1pF: < 1500m
1pF<Cap5pF:< 300m
1pF<Cap10pF:< 250m
1pF<Cap10pF: < 250m
5pF<Cap22pF:< 250m
10pF<Cap47pF:< 200m
Cap>10pF: < 200m
16.
ESR
The ESR should be measured at room
temperature and tested at frequency
500±50 MHz.
0201, 22pFCap33pF: < 300m
APPENDIXES
Tape & reel dimensions
Fig. 12 The dimension of reel
Fig. 11 The dimension of paper tape
Size 0201, 0402, 0603, 0805
Reel size
7” 13”
C 13.0+0.5/-0.2 13.0+0.5/-0.2
W
1
8.4+1.5/-0 8.4+1.5/-0
A 178.0±1.0 330.0±1.0
N 60.0+1.0/-0 100±1.0
Size 0201 0402 0603 0805
Thickness
L N S T
A
0
0.37±0.03
0.62±0.05
1.00
+0.05/-0.1
1.50±0.10
B
0
0.67±0.03
1.12±0.05
1.80±0.10
2.30±0.10
T 0.42±0.03
0.60±0.05
0.95±0.05
0.95±0.05
K
0
- - - -
W 8.00±0.10
8.00±0.10
8.00±0.10
8.00±0.10
P
0
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
10xP
0
40.0±0.10
40.0±0.10
40.0±0.20
40.0±0.20
P
1
2.00±0.05
2.00±0.05
4.00±0.10
4.00±0.10
P
2
2.00±0.05
2.00±0.05
2.00±0.05
2.00±0.05
D
0
1.55±0.05
1.55±0.05
1.55±0.05
1.55±0.05
D
1
- - - -
E 1.75±0.05
1.75±0.05
1.75±0.05
1.75±0.05
F 3.50±0.05
3.50±0.05
3.50±0.05
3.50±0.05
Approval sheet
Ultra High Q & Low ESR Series (RF)
Page 11 of 12 ASC_ Ultra HQ Low ESR (RF)_014M_AS Jul. 2012
Description of customer label
Constructions
Storage and handling conditions
(1) To store products at 5 to 40°C ambient temperature and 20 to 70%. related humidity conditions.
(2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life
extension is needed.
Cautions: a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability.
Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide,
chlorine, ammonia gas etc.)
b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low
reliability.
c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by
direct sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under
direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture.
No. Name NP0
1
Ceramic material BaTiO
3
based
2
Inner electrode Cu
3
Inner layer Cu
4
Middle layer Ni
5
Termination
Outer layer Sn (Matt)
Fig. 13 The construction of MLCC
a. Customer name
b. WTC order series and item number
c. Customer P/O
d. Customer P/N
e. Description of product
f. Quantity
g. Bar code including quantity & WTC P/N or customer
h. WTC P/N
i. Shipping date
j. Order bar code including series and item numbers
k. Serial number of label
Approval sheet
Ultra High Q & Low ESR Series (RF)
Page 12 of 12 ASC_ Ultra HQ Low ESR (RF)_014M_AS Jul. 2012
Recommended soldering conditions
The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable
against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and
concentration of N
2
within oven are recommended.
Fig. 14 Recommended reflow soldering profile for SMT process
with SnAgCu series solder paste.
4
/ sec max
Over 60sec at least by
natural cooling
4
/ sec max
Over 60sec at least by
natural cooling
Fig. 15 Recommended wave soldering profile for SMT process
with SnAgCu series solder.