Approval sheet
Ultra High Q & Low ESR Series (RF)
Page 9 of 12 ASC_ Ultra HQ Low ESR (RF)_014M_AS Jul. 2012
10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No.
Item Test Conditions Requirements
1.
Visual and
Mechanical
--- * No remarkable defect.
* Dimensions to conform to individual specification sheet.
2.
Capacitance * Shall not exceed the limits given in the detailed spec.
3.
Q/ D.F.
(Dissipation
Factor)
1.0±0.2Vrms, 1MHz±10%
At 25°C ambient temperature. * Cap≥30pF, Q≥1000; Cap<30pF,Q≥400+20C
4.
Dielectric
Strength
* To apply voltage:
≤100V, ≥250% of rated voltage.
250V, ≥200% of rated voltage.
* Duration: 1 to 5 sec.
* Charge and discharge current less than 50mA.
* No evidence of damage or flash over during test.
5.
Insulation
Resistance
To apply rated voltage for max. 120 sec. ≥10GΩ
6.
Temperature
Coefficient
With no electrical load.
Operating temperature: -55~125°C at 25°C
* Capacitance change: within ±30ppm/°C;
0201Cap≥22pF, within ±60ppm/°C
7.
Adhesive
Strength of
Termination
* Pressurizing force:
0201: 2N
0402 & 0603: 5N
>0603: 10N
* Test time: 10±1 sec.
* No remarkable damage or removal of the terminations.
8.
Vibration
Resistance
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
9.
Solderability * Solder temperature: 235±5°C
* Dipping time: 2±0.5 sec.
95% min. coverage of all metalized area.
10.
Bending Test
* The middle part of substrate shall be pressurized by means
of the pressurizing rod at a rate of about 1 mm per second until
the deflection becomes 1 mm and then the pressure shall be
maintained for 5±1 sec.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±5.0% or ±0.5pF whichever is larger.
(This capacitance change means the change of capacitance under
specified flexure of substrate from the cap
the test.)
11.
Resistance to
Soldering Heat
* Solder temperature: 260±5°C
* Dipping time: 10±1 sec
* Preheating: 120 to 150°C for 1 minute before immerse the
capacitor in a eutectic solder.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±2.5% or ±0.25pF whichever is larger.
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* 25% max. leaching on each edge.
12.
Temperature
Cycle
* Conduct the five cycles according to the temperatures and
time.
Step
Temp. (°C) Time (min.)
1 Min. operating temp. +0/-3 30±3
2 Room temp. 2~3
3 Max. operating temp. +3/-0 30±3
4 Room temp. 2~3
* Measurement to be made after keeping at room temp. for
24±2 hrs.
remarkable damage.
:within ±2.5% or ±0.25pF whichever is larger.
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.