CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-1760-2400-102
REV.
0.1
SUBJECT
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
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CUSTOMER’S CODE
PAN1760
PANASONIC’S CODE
ENW89847A1KF
DATE
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Power Electronics R&D Center
Wireless Connectivity
Panasonic Industrial Devices Europe GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
Specification for Production
Applicant / Manufacturer
Hardware
Panasonic Industrial Devices Europe GmbH
Zeppelinstrasse 19
21337 Lüneburg
Germany
Applicant / Manufacturer
Software
Toshiba
Software Version
Please refer to chapter 21
By purchase of any of products described in this document the customer accepts the
document's validity and declares their agreement and understanding of its contents and
recommendations. Panasonic reserves the right to make changes as required without
notification.
CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-1760-2400-102
REV.
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SUBJECT
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
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DATE
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TABLE OF CONTENTS
1. Scope of this Document ................................................................................................ 4
2. Key Features ................................................................................................................. 4
3. Bluetooth Low Energy ................................................................................................... 5
4. Applications for the Module ........................................................................................... 5
5. Description for the Module ............................................................................................. 5
6. Detailed Description ...................................................................................................... 6
6.1. PAN1760 Terminal Layout ................................................................................... 6
7. PAN1760 Block Diagram ............................................................................................... 8
8. GPIO Function List ........................................................................................................ 9
9. Test Conditions ........................................................................................................... 10
10. General Device Requirements and Operation ............................................................. 10
10.1. Absolute Maximum Ratings ................................................................................ 10
10.2. Recommended Operating Conditions ................................................................. 10
10.3. Power up sequence ........................................................................................... 11
10.4. PAN1760 Current Consumption ......................................................................... 11
11. Bluetooth RF Performance .......................................................................................... 12
11.1. PAN1760 Bluetooth Characteristics ................................................................... 12
11.2. PAN1760 Bluetooth Characteristics ................................................................... 12
11.3. PAN1760 Spurious Emission ............................................................................. 12
12. Soldering Temperature-Time Profile (for reflow soldering) ........................................... 13
12.1. For lead solder ................................................................................................... 13
12.2. For leadfree solder ............................................................................................. 13
13. PAN1760 Module Dimension ...................................................................................... 14
14. PAN1760 FootPrint of the Module ............................................................................... 15
15. Case Marking .............................................................................................................. 16
15.1. Example for Marking .......................................................................................... 16
15.2. Marking Definition .............................................................................................. 16
16. Mechanical Requirements ........................................................................................... 16
17. Development of Applications ....................................................................................... 17
18. Reliability Tests ........................................................................................................... 17
19. Cautions ...................................................................................................................... 17
19.1. Design Notes ..................................................................................................... 17
19.2. Installation Notes ................................................................................................ 18
19.3. Usage Conditions Notes ..................................................................................... 18
19.4. Storage Notes .................................................................................................... 19
19.5. Safety Cautions .................................................................................................. 19
19.6. Other cautions .................................................................................................... 19
20. Packaging ................................................................................................................... 21
20.1. PAN1760 Tape Dimension ................................................................................. 21
CLASSIFICATION
PRODUCT SPECIFICATION
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20.2. Packing in Tape ................................................................................................. 22
20.3. Component Direction ......................................................................................... 22
20.4. Reel Dimension .................................................................................................. 23
20.5. Label for Package .............................................................................................. 24
20.6. Total Package .................................................................................................... 24
21. Ordering Information ................................................................................................... 25
22. RoHS and REACH Declaration ................................................................................... 26
23. Data Sheet Status ....................................................................................................... 27
24. History for this Document ............................................................................................ 27
25. Related Documents ..................................................................................................... 27
26. Radiation Pattern of Antenna ...................................................................................... 28
27. General Information ..................................................................................................... 30
28. Regulatory Information ................................................................................................ 30
28.1. FCC Notice ........................................................................................................ 30
28.2. Caution .............................................................................................................. 30
28.3. Labeling Requirements ...................................................................................... 31
28.4. Antenna Warning ............................................................................................... 31
28.5. Approved Antenna List ....................................................................................... 31
28.6. RF Exposure PAN1760 ...................................................................................... 31
29. Industry Canada Certification ...................................................................................... 32
29.1. IC Notice ............................................................................................................ 32
29.2. Labeling Requirements ...................................................................................... 32
30. Bluetooth Certification ................................................................................................. 32
31. European R&TTE Declaration of Conformity ............................................................... 33
32. Life Support Policy ...................................................................................................... 33
CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-1760-2400-102
REV.
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SUBJECT
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
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1. SCOPE OF THIS DOCUMENT
This product specification applies to Panasonic’s, Class 2, Bluetooth®
1
low energy single mode module,
series number: PAN1760
2. KEY FEATURES
Same form factor and footprint as PAN1026
Bluetooth 4.0 (LE) embedded GATT profile with high level API commands, compatible to
Toshiba reference BLE profiles
Surface mount type 15.6 x 8.7 x 1.8 mm³
Tx power 0 dBm, Rx sensitivity -91 dBm
Compliant to BT 4.0 (extension to 4.1 under development)
32kB on-chip RAM for applications
512kBit eeprom to download user program during start up
Operation as host-less, stand alone
Standard SIG BLE and “SPP over BLE” profiles available
Temperature Range from -40°C to +85°C
UART, I2C , GPIO (10 in/out), Wake-Up control pins, ADC(4 CH)
1
Bluetooth is a registered trademark of the Bluetooth Special Interest Group.
CLASSIFICATION
PRODUCT SPECIFICATION
No.
DS-1760-2400-102
REV.
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SUBJECT
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SINGLE MODE MODULE
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3. BLUETOOTH LOW ENERGY
Bluetooth Low Energy (BLE), part of Bluetooth Ver. 4.0, specifies two types of implementation: Single mode
and dual mode. Single mode devices implement the low energy specification and consume just a fraction of
the power of classic Bluetooth, allowing the short-range wireless standard to extend to coin cell battery
applications for the first time. Dual mode devices combine low energy with the power of classic Bluetooth and
are likely to become a de facto feature in almost all new Bluetooth enabled cellular phones and computers.
Single mode Bluetooth 4.0 Low Energy is not backwards compatible with previous Bluetooth standards. Dual
mode Bluetooth 4.0 Low Energy is backwards compatible and well suited for gateway applications, but is not
practical for low power devices.
4. APPLICATIONS FOR THE MODULE
All Embedded Wireless Applications
Wearable Devices
Health Care, Medical Diagnostic Systems
Mobile phone accessories
Industrial Measurement and Diagnostics
Devices where Power Consumption is critical
5. DESCRIPTION FOR THE MODULE
The PAN1760 is a short-range, Class 2, BLE single mode module for implementing Bluetooth functionality
into various electronic devices. A block diagram can be found in chapter 7.
The PAN1760 is a cost-effective, low-power, true system-on-chip (SoC) for Bluetooth low energy
applications. It enables robust BLE master or slave nodes to be built with very low total bill-of-material costs.
The PAN1760 combines an excellent RF transceiver programmable EEPROM memory, 32-KB RAM, and
many other powerful supporting features and peripherals. The PAN1760 is suitable for systems where very
low power consumption is required. Very low-power sleep modes are available. Short transition times
between operating modes further enable low power consumption.
Panasonic offers Bluetooth low energy protocol stacks and applications from Toshiba. The
Bluetooth low energy protocol stack from Toshiba, is a flexible and cost-effective single-mode Bluetooth low
energy solution.
Please contact your local sales office for further details on additional options and services:
www.panasonic.com/rfmodules for the US,
http://industrial.panasonic.com/eu/i/29606/wireless_modules/wireless_modules.html for EU
or write an e-mail to wireless@eu.panasonic.com.
CLASSIFICATION
PRODUCT SPECIFICATION
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REV.
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SINGLE MODE MODULE
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6. DETAILED DESCRIPTION
6.1. PAN1760 TERMINAL LAYOUT
Top View, Application PCB
F2 F3 F4 F5
E1 E2 E3 E4 E5 E6 E7 E8 E9
D1 D2 D3 D4 D5 D6 D7 D8
C1 C2 C3 C4 C5 C6 C7 C8
B1 B2 B3 B4 B5 B6 B7 B8 B9
A2 A3 A4 A5 A6 A7 A8A1
1.0
8.70 mm
0.6
5.0
0.6
1.35 1.35
1.2
F9
1.2
F7F1 F8
D9
C9
A9
15.6 mm
F6 F11
A11
F12
A12
2.4
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No
Pin Name
Pin Type
Description
A1
GND
Ground Pin
Connect to Ground
A2
NC
Not Connected
A3
Reset
Digital Input
Reset, active-low
A4
VCC
Power
2V – 3.6V analog/digital power supply connection
A5
VCC
Power
2V – 3.6V analog/digital power supply connection
A6
VCC
Power
2V – 3.6V analog/digital power supply connection
A7
GND
Ground Pin
Connect to Ground
A8
NC
Not Connected
A9
GND
Ground Pin
Connect to Ground
A11
GND
Ground Pin
Connect to Ground
A12
GND
Ground Pin
Connect to Ground
B1
NC
Not Connected
B2
GPIO14
Digital I/O
B3
GPIO11
Digital I/O
B4
NC
Not Connected
B5
NC
Not Connected
B6
NC
Not Connected
B7
NC
Not Connected
B8
NC
Not Connected
B9
NC
Not Connected
C1
NC
Not Connected
C2
GPIO15
Digital I/O
C3
GPIO12
Digital I/O
C4
NC
Not Connected
C5
NC
Not Connected
C6
GPIO9
Digital I/O
C7
GPIO10
Digital I/O
C8
GND
Ground Pin
Connect to Ground
C9
GND
Ground Pin
Connect to Ground
D1
NC
Not Connected
D2
NC
Not Connected
D3
GPIO1
Digital I/O
D4
GPIO0
Digital I/O
D5
NC
Not Connected
D6
GPIO13
Digital I/O
D7
GND
Ground Pin
Connect to Ground
D8
GND
Ground Pin
Connect to Ground
D9
NC
PAN1760 Not Connected/Placeholder for Antenna
E1
SDA
Digital I/O
Connected to internal EEPROM
E2
SCL
Digital I/O
Connected to internal EEPROM
E3
NC
Not Connected
E4
NC
Not Connected
E5
SLPXOIN
Clock In
32.768 KHz sleep clock input
E6
UART_RXD
Digital In
E7
GPIO2
Digital I/O
E8
GND
Ground Pin
Connect to Ground
E9
GND
Ground Pin
Connect to Ground
F1
GND
Ground Pin
Connect to Ground
F2
EEPROM_WP
Digital In
EEPROM write protect /active low
F3
NC
Not Connected
F4
NC
Not Connected
F5
UART_CTS
Digital In
Can be configured to UART2_RXD
F6
SLPXOOUT
Clock Out
32.768 KHz sleep clock output
F7
UART_TXD
Digital Out
F8
UART_RTS
Digital I/O
Can be configured to UART2_TXD
F9
GND
Ground Pin
Connect to Ground
F11
GND
Ground Pin
Connect to Ground
F12
GND
Ground Pin
Connect to Ground
CLASSIFICATION
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7. PAN1760 BLOCK DIAGRAM
PAN1760
Toshiba
S ingle M ode B luetooth
LS I
TC35667
E E P R O M
C rystal
26 M H z
Filter
V C C /VSS
S low C lo ck 32.768 kH z
U A R T
G P IO
W ake U p Input
W ake U p O utp u t
I2 C A nte nn a
RF Block
26MHz
X’tal
Filter
ClockGen/
Clock
Management
RF PLL Power
Management
Controller
32kHz
SiOSC
VDD
1.8～3.6V
1.2V
TC35667
Baseband
Block
UART
2ch
HOST
I/F
SPI/
I2C PWM
外部メモリ
I/F
GPIO ADC
4ch
Modem ARM7
TDMI-STM
Mask
ROM
RAM
(BackUp)
Selector
1.5V
1.2V
Ref VDD
32kHz
X’tal
Level
Detector
LDO
DCDC
External
memory
External
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8. GPIO FUNCTION LIST
GPIO pins are assigned to UART or serial memory. About the details refer to firmware
specification.
Pin
Analog input
Function 1
Function 2
Function 3
Function 4
Function 5
GPIO0
-
GPIO1
Digital I/O
WakeUp
Input
-
-
-
GPIO1
ADC0 Input
GPIO
Digital I/O
-
-
-
-
GPIO2
ADC1 Input
GPIO
Digital I/O
PWM0
Output
-
-
-
GPIO3_TEST
-
GPIO
Digital I/O
UART1-TX
Output
-
SPI-DOUT
Output
UART2-TX
Output
GPIO4
-
GPIO
Digital I/O
UART1-RX
Input
-
SPI-DIN
Input
UART2-RX
Input
GPIO5_Bmode
-
GPIO
Digital I/O
UART1-RTSX
Output
UART2-TX
Output
SPI-SCS
Output
UART1-TX
Output
GPIO6
-
GPIO
Digital I/O
UART1-CTSX
Input
UART2-RX
Input
SPI-SCLK
Output
UART1-RX
Input
GPIO7
-
GPIO
Digital I/O
-
I2C-SCL
Output
SPI-DOUT
Output
-
GPIO8
-
GPIO
Digital I/O
-
I2C-SDA
I/O
SPI-DIN
Input
-
GPIO9
-
GPIO
Digital I/O
PWM1
Output
I2C-SCL
Output
-
-
GPIO10
-
GPIO
Digital I/O
PWM2
Output
I2C-SDA
I/O
-
-
GPIO11～14
-
GPIO
Digital I/O
-
-
-
-
GPIO15
ADC2 Input
GPIO
Digital I/O
-
-
-
-
Pin name
Basic
example
Example of UART1
+ UART2 + I2C
Example of
SPI + I2C
Example of
UART + SPI +
I2C
GPIO0
Wake Up
Wake Up
Wake Up
Wake Up
GPIO1
ADC- AIN0
ADC- AIN0
ADC- AIN0
ADC- AIN0
GPIO2
ADC-AIN1 /
PWM0
ADC-AIN1 /
PWM0
ADC-AIN1 /
PWM0
ADC-AIN1 /
PWM0
GPIO3
UART1-TX
UART1-TX
SPI-DOUT
UART1-TX
GPIO4
UART1-RX
UART1-RX
SPI-DIN
UART1-RX
GPIO5
UART1-
RTSX
UART2-TX
SPI-SCS
SPI-SCS
GPIO6
UART1-
CTSX
UART2-RX
SPI-SCLK
SPI-SCLK
GPIO7
I2C-SCL
I2C-SCL
I2C-SCL
SPI-DOUT
GPIO8
I2C-SDA
I2C-SDA
I2C-SDA
SPI-DIN
GPIO9
PWM1
PWM1
PWM1
I2C-SCL
GPIO10
PWM2
PWM2
PWM2
I2C-SDA
GPIO11-14
-
-
-
-
GPIO15
ADC-AIN2
ADC-AIN2
ADC-AIN2
ADC-AIN2
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9. TEST CONDITIONS
Measurements shall be made under operating free-air temperature range unless otherwise specified.
Temperature 25 ± 10°C
Humidity 40 to 85%RH
Supply Voltage 3.3V
10. GENERAL DEVICE REQUIREMENTS AND OPERATION
All specifications are over temperature and process, unless indicated otherwise.
10.1. ABSOLUTE MAXIMUM RATINGS
No
See 2
Value
Unit
Ratings Over Operating Free-Air Temperature Range
1
Supply voltage
All supply pins must have the same voltage
–0.3 to 3.9
V
2
Voltage on any digital pin
–0.3 to
VDD+0.3 <3,9
V
3
Operating ambient temperature range
–40 to 85
°C
4
Storage temperature range
–40 to 125
°C
5
Bluetooth RF inputs
10
dBm
6
ESD:
All pads, according to human-body model, JEDEC STD 22, method A114
According to charged-device model, JEDEC STD 22, method C101
1000
500
V
10.2. RECOMMENDED OPERATING CONDITIONS
No
Rating
Min
Max
Unit
1
Power supply voltage
2
3.6
V
2
Maximum ambient operating temperature
-40
85
C
2
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the
device. These are stress ratings only and functional operation of the device at these or any other conditions
beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability.
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10.3. POWER UP SEQUENCE
When the power is turned on, set reset signal to low (RESET=Low). After OSC is stable,
release reset (RESET=High).
Crystal oscillator stabilizing time is about 2 msec, so define release time after sufficient
evaluation.
When the power is turned off, set reset signal to low (RESET=Low).
10.4. PAN1760 CURRENT CONSUMPTION
The current consumption is dependent on the user scenario and the setup and timing in the
low power modes. The total power consumption can be optimized by adjusting the scan
windows and intervals.
VDD power supply
Reset signal
DCDC / LDO output
Power off
OSC boot timer
Operation
Power on
voltage
detection
RC delay
Reference clock
Stable
Unstable
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11. BLUETOOTH RF PERFORMANCE
11.1. PAN1760 BLUETOOTH CHARACTERISTICS
No
Characteristics
Condition
Min
Typ
Max
BT Spec
Unit
1
Operation frequency range
2402
2480
MHz
2
Channel spacing
2
MHz
3
Output Power
Maximum setting, measured at single
ended 50ohm.
4
dBm
Minimum setting, measured at single
ended 50ohm.
-24
dBm
4
Sensitivity, High Gain Mode
High-gain mode
-93.0
-70
dBm
Standard mode
-92.5
-70
11.2. PAN1760 BLUETOOTH CHARACTERISTICS
No
Characteristics
Condition
Min
Typ
Max
BT Spec
Unit
1
Operation frequency range
2402
2480
MHz
2
Channel spacing
2
MHz
3
Output power
0
dBm
4
Sensitivity, High Gain Mode
High-gain mode
-93.0
-70
dBm
4
Sensitivity, High Gain Mode
Standard mode
-92.5
-70
dBm
11.3. PAN1760 SPURIOUS EMISSION
No
Characteristics
Condition
Typ
Max
Unit
1
Spurious emissions
Conducted measurement with a 50-Ω single-ended load.
Complies with EN 300 328, EN 300 440 class 2, FCC
CFR47, Part 15 and ARIB STD-T-66
-41
dBm
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12. SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING)
12.1. FOR LEAD SOLDER
Recommended temp. profile
for reflow soldering
Temp.[°C]
Time [s]
235°C max.
220 5°C
200°C
150 10°C
90 30s
10 1s
30 +20/-10s
12.2. FOR LEADFREE SOLDER
Our used temp. profile
for reflow soldering
Temp.[°C]
Time [s]
230°C -250°C max.
220°C
150°C – 190°C
90 30s
30 +20/-10s
Reflow permissible cycle: 2
Opposite side reflow is prohibited due to module weight.
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13. PAN1760 MODULE DIMENSION
No.
Item
Dimension
Tolerance
Remark
1
Width
8.70
0.30
2
Length
15.60
0.30
3
Height
1.80
0.20
With case
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14. PAN1760 FOOTPRINT OF THE MODULE
All dimensions are in millimeters.
The outer dimensions have a tolerance of 0.3mm.
Top view, Application PCB
F2 F3 F4 F5
E1 E2 E3 E4 E5 E6 E7 E8 E9
D1 D2 D3 D4 D5 D6 D7 D8
C1 C2 C3 C4 C5 C6 C7 C8
B1 B2 B3 B4 B5 B6 B7 B8 B9
A2 A3 A4 A5 A6 A7 A8A1
1.0
8.70 mm
0.6
5.0
0.6
1.35 1.35
1.2
F9
1.2
F7F1 F8
D9
C9
A9
15.6 mm
F6 F11
A11
F12
A12
2.4
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15. CASE MARKING
1
2
3
15.1. EXAMPLE FOR MARKING
15.2. MARKING DEFINITION
(1) Pin1 marking
(2) 2D code (Serial number)
(3) Marking:
PAN1760 (Model Name), HW/SW (Hardware/Software version)
ENW89847A1KF (Part Number, refer to chapter 21 Ordering Information)
Lot code (YearYear, WeekWeek, Day, LotLot)
ES (Engineering Sample marking)
Note: For available Software Versions, refer to [1] PAN1760ETU Design-Guide.
and chapter 21 Ordering Information.
16. MECHANICAL REQUIREMENTS
No.
Item
Limit
Condition
1
Solderability
More than 75% of the soldering area shall be
coated by solder
Reflow soldering with
recommendable temperature profile
2
Resistance to soldering
heat
It shall be satisfied electrical requirements and not
be mechanical damage
See chapter 12.2
No.
Remark
1
Marking for Pin 1 (Circle 0,15 mm)
2
2D-Code, for internal usage only and
can be change without any notice
3
Marking definition see below
P A N 1 7 6 0 H W / S W
E N W 8 9 8 4 7 A x K F
Y Y W W D L L
F C C I D : T 7 V 1 7 6 0
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17. DEVELOPMENT OF APPLICATIONS
For development support please refer to [1] PAN1760ETU Design-Guide.
18. RELIABILITY TESTS
The measurement should be done after being exposed to room temperature and humidity for 1 hour.
No.
Item
Limit
Condition
1
Vibration test
Electrical parameter should be in
specification
a) Freq.:10~50Hz,Amplitude:1.5mm
a) 20min. / cycle,1hrs. each of XYZ axis
b) Freq.:30~100Hz, 6G
b) 20min. / cycle,1hrs. each of XYZ axis
2
Shock test
the same as above
Dropped onto hard wood from height of 50cm for 3 times
3
Heat cycle test
the same as above
-40°C for 30min. and +85°C for 30min.;
each temperature 300 cycles
4
Moisture test
the same as above
+60°C, 90% RH, 300h
5
Low temp. test
the same as above
-40°C, 300h
6
High temp. test
the same as above
+85°C, 300h
19. CAUTIONS
Failure to follow the guidelines set forth in this document may result in degrading of the product’s functions
and damage to the product.
19.1. DESIGN NOTES
(1) Follow the conditions written in this specification, especially the control signals of
this module.
(2) The supply voltage has to be free of AC ripple voltage (for example from a battery
or a low noise regulator output). For noisy supply voltages, provide a decoupling
circuit (for example a ferrite in series connection and a bypass capacitor to ground
of at least 47uF directly at the module).
(3) This product should not be mechanically stressed when installed.
(4) Keep this product away from heat. Heat is the major cause of decreasing the life
of these products.
(5) Avoid assembly and use of the target equipment in conditions where the products'
temperature may exceed the maximum tolerance.
(6) The supply voltage should not be exceedingly high or reversed. It should not carry
noise and/or spikes.
(7) Keep this product away from other high frequency circuits.
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19.2. INSTALLATION NOTES
(1) Reflow soldering is possible twice based on the conditions in chapter 15.
Set up the temperature at the soldering portion of this product according to this
reflow profile.
(2) Carefully position the products so that their heat will not burn into printed circuit
boards or affect the other components that are susceptible to heat.
(3) Carefully locate these products so that their temperatures will not increase due to
the effects of heat generated by neighboring components.
(4) If a vinyl-covered wire comes into contact with the products, then the cover will
melt and generate toxic gas, damaging the insulation. Never allow contact between
the cover and these products to occur.
(5) This product should not be mechanically stressed or vibrated when reflowed.
(6) To repair the board by hand soldering, follow the conditions set forth in this
chapter.
(7) Do not wash this product.
(8) Refer to the recommended pattern when designing a board.
(9) Pressing on parts of the metal cover or fastening objects to the metal will cause
damage to the unit.
(10) For more details on LGA (Land Grid Arrey) soldering processes refer to the
application note.
19.3. USAGE CONDITIONS NOTES
(1) Take measures to protect the unit against static electricity.
If pulses or other transient loads (a large load applied in a short time) are applied
to the products, check and evaluate their operation befor assembly on the final
products.
(2) Do not use dropped products.
(3) Do not touch, damage or soil the pins.
(4) Follow the recommended condition ratings about the power supply applied to this
product.
(5) Electrode peeling strength: Do not add pressure of more than 4.9N when soldered
on PCB.
(6) Pressing on parts of the metal cover or fastening objects to the metal cover will
cause damage.
(7) These products are intended for general purpose and standard use in general
electronic equipment, such as home appliances, office equipment, information and
communication equipment.
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19.4. STORAGE NOTES
(1) The module should not be stressed mechanically during storage.
(2) Do not store these products in the following conditions or the performance
characteristics of the product, such as RF performance will be adversely affected:
Storage in salty air or in an environment with a high concentration of corrosive gas,
such as Cl2, H2S, NH3, SO2, or NOX
Storage in direct sunlight
Storage in an environment where the temperature may be outside the range of 5°C
to 35°C range, or where the humidity may be outside the 45 to 85% range.
Storage of the products for more than one year after the date of delivery Storage
period: Please check the adhesive strength of the embossed tape and soldering
after 6 months of storage.
(3) Keep this product away from water, poisonous gas and corrosive gas.
(4) This product should not be stressed or shocked when transported.
(5) Follow the specification when stacking packed crates (max. 10).
19.5. SAFETY CAUTIONS
These specifications are intended to preserve the quality assurance of products and
individual components.
Before use, check and evaluate the operation when mounted on your products. Abide by
these specifications, without deviation when using the products. These products may short-
circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated
when a short circuit occurs, then provide the following failsafe functions, as a minimum.
(1) Ensure the safety of the whole system by installing a protection circuit and a
protection device.
(2) Ensure the safety of the whole system by installing a redundant circuit or another
system to prevent a single fault causing an unsafe status.
19.6. OTHER CAUTIONS
(1) This specification sheet is copyrighted. Please do not disclose it to a third party.
(2) Please do not use the products for other purposes than those listed.
(3) Be sure to provide an appropriate fail-safe function on your product to prevent an
additional damage that may be caused by the abnormal function or the failure of
the product.
(4) This product has been manufactured without any ozone chemical controlled under
the Montreal Protocol.
(5) These products are not intended for other uses, other than under the special
conditions shown below. Before using these products under such special
conditions, check their performance and reliability under the said special conditions
carefully to determine whether or not they can be used in such a manner.
In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places
where liquid may splash.
In direct sunlight, outdoors, or in a dusty environment
In an environment where condensation occurs.
In an environment with a high concentration of harmful gas (e.g. salty air, HCl,
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Cl2, SO2, H2S, NH3, and NOX)
(6) If an abnormal voltage is applied due to a problem occurring in other components
or circuits, replace these products with new products because they may not be
able to provide normal performance even if their electronic characteristics and
appearances appear satisfactory.
(7) When you have any question or uncertainty, contact Panasonic.
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www.pideu.panasonic.de
20. PACKAGING
If the product has mass production status, indicated in chapter 23, we will deliver the module in the package
which are described below.
20.1. PAN1760 TAPE DIMENSION
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www.pideu.panasonic.de
20.2. PACKING IN TAPE
100730-PAN1720.vsd
trailer (empty)
1 x circumference /
hub
(min 160mm)
component
packed area
standard
1500pcs
leader (empty)
minimum 10 pitch Top cover tape more
than 1 x
circumference plus
100mm to avoid
fixing of tape end on
sealed modules.
Direction of unreeling (for customer)
Empty spaces in component packed area shall be less than two per reel and those spaces
shall not be consecutive.
Top cover tape shall not be found on reel holes and shall not stick out from reel.
20.3. COMPONENT DIRECTION
100730-PAN1720.vsd
Direction of
unreeling
(for customer)
Pin 1 Marking
(Top Side)
Pin 1 Marking
(Bottom Side)
Square Pin, all the
others are round.
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20.5. LABEL FOR PACKAGE
The picture shows an example from similar product.
PAN1315
Customer Code ENW89818C2JF
105 mm
51 mm
(1T) Lot code [YYWWDLL] Example from above:
YY year printed 08
WW normal calendar week printed 01
D day printed 5 (Friday)
L line identifier, if more as one printed 1
L lot identifier per day printed 1
(1P) Customer Order Code, if any, otherwise company name will be printed
(2P) Panasonic Order Code: ENW89847A1KF
(9D) Date code as [YYWW]
(Q) Quantity [XXXX], variable max. 1500
(HW/SW) Hardware /Software Release
Hardware 01 Indicates the HW revision.
Software 01 Indicates the SW revision.
20.6. TOTAL PACKAGE
barcode
label
moisture-sensitive print
(already exist on barrier bag) barcode
label
desiccant 1) 2)
moisture indicator
barrier bag
sealed
inner carton box
size 340 x 340 x 41 mm³
1) quantity of desiccant according
to calculation
2) optional: desiccant placed into
the corner of the barrier bag
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21. ORDERING INFORMATION
Ordering part number
Description
MOQ (1)
ENW89847A1KF (2)
PAN1760
CLASS 2 Bluetooth single mode Module according BT-4.0.
Bluetooth® smart device
1500
Notes:
(1) Abbreviation for Minimum Order Quantity (MOQ). The standard MOQ for mass production is 1500
pieces, fewer only on customer demand. Samples for evaluation c an be de livered at any quantit y
via the distribution channels.
(2) Samples are available on customer demand
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22. ROHS AND REACH DECLARATION
Hereby we declare to our best present knowledge based on declaration of our suppliers that this product
follows th elatest official RoHS and REACH Directive.
For the most updated one, please refer to [3].
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23. DATA SHEET STATUS
This data sheet contains the preliminary specification.
Panasonic reserves the right to make changes at any time without notice in order to improve design and
supply the best possible product.
Please consult the most recently issued data sheet before initiating or completing a design.
24. HISTORY FOR THIS DOCUMENT
Revision
Date
Modification / Remarks
0.1
January 2015
1st preliminary version.
25. RELATED DOCUMENTS
For an update, please search in the suitable homepage.
[1] PAN1760ETU Design-Guide
http://www.pideu.panasonic.de
[2] Application Note Land Grid Array
http://www.pideu.panasonic.de/pdf/184ext.pdf
[3] REACH and RoHS Certificate
http://www.pideu.panasonic.de/pdf/182ext2.jpg
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26. RADIATION PATTERN OF ANTENNA
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27. GENERAL INFORMATION
© Panasonic Industrial Devices Europe GmbH 2012.
All rights reserved.
This product description does not lodge the claim to be complete and free of mistakes.
Please contact the related product manager in every case.
If we deliver ES samples to the customer, these samples have the status Engineering Samples.
This means, the design of this product is not yet concluded. Engineering Samples may be
partially or fully functional, and there may be differences to be published Data Sheet.
Engineering Samples are not qualified and are not to be used for reliability testing or series
production.
Disclaimer:
Customer acknowledges that samples may deviate from the Data Sheet and may bear defects
due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular,
Panasonic disclaims liability for damages caused by
the use of the Engineering Sample other than for Evaluation Purposes, particularly the
installation or integration in an other product to be sold by Customer,
deviation or lapse in function of Engineering Sample,
improper use of Engineering Samples.
Panasonic disclaimes any liability for consequential and incidental damages.
In case of any questions, please contact your local sales partner or the related product
manager.
28. REGULATORY INFORMATION
28.1. FCC NOTICE
The devices PAN1760, for details refer to Chapter 21, including the antennas, which are
listed in 28.5, complies with Part 15 of the FCC Rules. The device meets the requirements for
modular transmitter approval as detailed in FCC public Notice DA00-1407.transmitter
Operation is subject to the following two conditions: (1) This device may not cause harmful
interference, and (2) This device must accept any interference received, including
interference that may cause undesired operation.
28.2. CAUTION
The FCC requires the user to be notified that any changes or modifications made to this
device that are not expressly approved by Panasonic Industrial Devices Europe GmbH may
void the user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
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Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for help
28.3. LABELING REQUIREMENTS
The Original Equipment Manufacturer (OEM) must ensure that FCC labeling requirements
are met. This includes a clearly visible label on the outside of the OEM enclosure specifying
the appropriate Panasonic FCC identifier for this product as well as the FCC Notice above.
The FCC identifier is FCC ID: T7V1760. This FCC identifier is valid for all PAN1760 modules,
for details, see the Chapter 21. Ordering Information.
In any case the end product must be labelled exterior with
"Contains FCC ID: T7V1670"
28.4. ANTENNA WARNING
For the related part number of PAN1760 refer to Chapter 21. Ordering Information.
This devices are tested with a standard SMA connector and with the antennas listed below.
When integrated in the OEMs product, these fixed antennas require installation preventing
end-users from replacing them with non-approved antennas. Any antenna not in the following
table must be tested to comply with FCC Section 15.203 for unique antenna connectors and
Section 15.247 for emissions. The FCC identifier for this device with the antenna listed in item
1 are the same (FCC ID: T7V1760).
28.5. APPROVED ANTENNA LIST
Note: We are able to qualify your antenna and will add to this list as that process is completed.
Item
Part Number
Manufacturer
Frequency Band
Type
Gain (dBi)
2
ANT2012
Yageo
2.4GHz
Chip-Antenna
+2.72
28.6. RF EXPOSURE PAN1760
To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM)
must ensure that the approved antenna in the previous table must be installed.
The preceding statement must be included as a CAUTION statement in manuals for products
operating with the approved antennas in the previous table to alert users on FCC RF
Exposure compliance.
Any notification to the end user of installation or removal instructions about the integrated
radio module is not allowed.
The radiated output power of PAN1760 with mounted ceramic antenna
(FCC ID: T7V1760) is far below the FCC radio frequency exposure limits. Nevertheless, the
PAN1760 shall be used in such a manner that the potential for human contact during normal
operation is minimized.
End users may not be provided with the module installation instructions. OEM integrators and
end users must be provided with transmitter operating conditions for satisfying RF exposure
compliance.
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29. INDUSTRY CANADA CERTIFICATION
PAN1760 is licensed to meet the regulatory requirements of Industry Canada (IC),
license: IC: 216Q-1760
Manufacturers of mobile, fixed or portable devices incorporating this module are advised to
clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits.
Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca.
This device has been designed to operate with the antennas listed in Table 20 above, having
a maximum gain of 0.9 dBi. Antennas not included in this list or having a gain greater than 0.9
dBi are strictly prohibited for use with this device. The required antenna impedance is 50
ohms. The antenna used for this transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
Due to the model size the IC identifier is displayed in the installation instruction only and can
not be displayed on the modules label due to the limited size (8.7x15.6mm).
29.1. IC NOTICE
The devices PAN1760, for details refer to Chapter 21, including the antennas, which are
listed in 28.5, complies with Canada RSS-GEN Rules. The device meets the requirements for
modular transmitter approval as detailed in RSS-GEN.
Operation is subject to the following two conditions: (1) This device may not cause harmful
interference, and (2) This device must accept any interference received, including
interference that may cause undesired operation.
29.2. LABELING REQUIREMENTS
The Original Equipment Manufacturer (OEM) must ensure that IC labelling requirements are
met. This includes a clearly visible label on the outside of the OEM enclosure specifying the
appropriate Panasonic IC identifier for this product as well as the IC Notice above. The IC
identifier is 216Q-1760. This IC identifier is valid for all PAN1760 modules, for details, see the
Chapter 21. Ordering Information.
In any case the end product must be labelled exterior with
"Contains IC: 216Q-1760"
30. BLUETOOTH CERTIFICATION
The Design is listed as Controller Subsystem with QDID:
https://www.bluetooth.org/tpg/EPL_Detail.cfm?ProductID=22941
The module is listed as EPL based on Toshibas QDID.
To create an EPL, two Subsystems e.g. QDID: and QDID: (software stack) need to be
combined.
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31. EUROPEAN R&TTE DECLARATION OF CONFORMITY
As a result of the conformity assessment procedure described in Annex III of the Directive
1999/5/EC, the end-customer equipment should be labelled as follows:
PAN1760 and their versions in the specified reference design can be used in the following
countries: Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France,
Germany, Greece, Hungary, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Poland,
Portugal, Slovakia, Slovenia, Spain, Sweden, The Netherlands, the United Kingdom,
Switzerland, and Norway.
32. LIFE SUPPORT POLICY
This Panasonic product is not designed for use in life support appliances, devices, or systems
where malfunction can reasonably be expected to result in a significant personal injury to the
user, or as a critical component in any life support device or system whose failure to perform
can be reasonably expected to cause the failure of the life support device or system, or to affect
its safety or effectiveness. Panasonic customers using or selling these products for use in such
applications do so at their own risk and agree to fully indemnify Panasonic for any damages
resulting.
