BPX 81
NPN-Silizium-Fototransistor
Silicon NPN Phototransistor
2001-02-21 1
Wesentliche Merkmale
Speziell geeignet für Anwendungen im Bereich
von 440 nm bis 1070 nm
Hohe Linearität
Einstellige Zeilenbauform aus klarem Epoxy
Gruppiert lieferbar
Anwendungen
Computer-Blitzlichtgeräte
Miniaturlichtschranken für Gleich- und
Wechsellichtbetrieb
Industrieelektronik
„Messen/Steuern/Regeln“
Typ
Type Bestellnummer
Ordering Code
BPX 81 Q62702-P20
BPX 81-2/3 Q62702-P3583
BPX 81-3 Q62702-P43-S3
BPX 81-3/4 Q62702-P3584
BPX 81-4 Q62702-P43-S4
Features
Especially suitable for applications from
440 nm to 1070 nm
High linearity
One-digit array package of transparent epoxy
Available in groups
Applications
Computer-controlled flashes
Miniature photointerrupters
Industrial electronics
For control and drive circuits
2001-02-21 2
BPX 81
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range Top; Tstg 40 + 80 °C
Löttemperatur bei Tauchlötung
Lötstelle 2 mm vom Gehäuse, Lötzeit t 3 s
Dip soldering temperature 2 mm distance
from case bottom, soldering time t 3 s
TS230 °C
Löttemperatur bei Kolbenlötung
Lötstelle 2 mm vom Gehäuse, Lötzeit t 5 s
Iron soldering temperature 2 mm distance
from case bottom, soldering time t 5 s
TS300 °C
Kollektor-Emitterspannung
Collector-emitter voltage VCE 32 V
Kollektorstrom
Collector current IC50 mA
Kollektorspitzenstrom, τ < 10 µs
Collector surge current ICS 200 mA
Verlustleistung, TA = 25 °C
Total power dissipation Ptot 90 mW
Wärmewiderstand
Thermal resistance RthJA 750 K/W
BPX 81
2001-02-21 3
Kennwerte (TA = 25 °C, λ = 950 nm)
Characteristics
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Wellenlänge der max. Fotoempfindlichkeit
Wavelength of max. sensitivity λS max 850 nm
Spektraler Bereich der Fotoempfindlichkeit
S = 10% von Smax
Spectral range of sensitivity
S = 10% of Smax
λ440 1070 nm
Bestrahlungsempfindl iche Fläche
Radiant sensitive area A0.17 mm2
Abmessung der Chipfläche
Dimensions of chip area L × B
L × W0.6 ×0.6 mm × mm
Abstand Chipoberfläche zu Gehäuseoberfläche
Distance chip front to case surface H1.3 1.9 mm
Halbwinkel
Half angle ϕ±18 Grad
deg.
Kapazität
Capacitance
VCE = 0 V, f = 1 MHz, E = 0
CCE 6pF
Dunkelstrom
Dark current
VCE = 25 V, E = 0
ICEO 25 (200) nA
2001-02-21 4
BPX 81
Die Fototransistoren werden nach ihrer Fotoempfindlichkeit gruppiert und mit arabischen Ziffern
gekennzeichnet.
The phototransistors are grouped according to their spectral sensitivity and distinguished by
arabian figures.
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
-2 -3 -4
Fotostrom, λ = 950 nm
Photocurrent
Ee = 0.5 mW/cm2, VCE = 5 V
Ev = 1000 Ix, Normlicht/standard light A,
VCE = 5 V
IPCE
IPCE
0.25 0.50
1.4 0.40 0.80
2.2 0.63
3.4 mA
mA
Anstiegszeit/Abfallzeit
Rise and fall time
IC = 1 mA, VCC = 5 V, RL = 1 k
tr, tf5.5 6 8 µs
Kollektor-Emitter-Sättigungsspannung
Collector-emitter saturation voltage
IC = IPCEmin1) × 0.3
Ee = 0.5 mW/cm2
VCEsat 150 150 150 mV
1) IPCEmin ist der minimale Fotostrom der jeweiligen Gruppe.
1) IPCEmin is the min. phot oc urrent of the spe c ifie d group.
BPX 81
2001-02-21 5
Relati ve Sp ectral Sensi ti vi ty
Srel = f (λ)
Photocurrent
IPCE/IPCE25o = f (TA), VCE = 5 V
Directional Chara cter i sti cs
Srel = f (ϕ)
Photocurrent
IPCE = f (Ee), VCE = 5 V
Collector-Emitter Cap aci tance
CCE = f (VCE), f = 1 MHz, E = 0
Total Powe r Dissip ation
Ptot = f (TA)
Dark Current
ICEO = f (VCE), E = 0
2001-02-21 6
BPX 81
Maßzeichnung
Package Outlines
Maße werden wi e fo lgt angegeben: m m (inc h) / Dim ensions are specified as follo w s: m m (inc h).
Published by OSRAM Opto Semiconductors GmbH & Co. OHG
Wernerwerkstrasse 2, D-93049 Regensburg
© All Rights Reserved.
Attention please!
The inform at ion describe s the type of component and sha ll not be c ons idered as assur ed characteris tics .
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recyc ling operat ors known t o you. We can also help y ou get in touch wit h your near est sales offic e.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critica l component is a co mponent usedin a l ife-support devi ce or system whose failure can re asonably be expec ted
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life sup port device s or syst ems ar e int ended (a ) to b e imp lanted in t he hu man body , or ( b) to supp ort a nd/or main tain
and sust ain human life. If th ey fail , it is rea so nable to assum e th at the health of the user may be endangered.
GEOY6021
2.4 (0.094)
2.1 (0.083)
0.7 (0.028)
0.6 (0.024)
Collector (BPX 81)
Cathode (LD 261)
2.54 (0.100) spacing
1.5 (0.059)
2.1 (0.083)
2.7 (0.106)
2.5 (0.098)
3.2 (0.126)
3.6 (0.142)
3.0 (0.118)
3.5 (0.138)
1.9 (0.075)
1.7 (0.067)
position
Chip
0.25 (0.010)
0.15 (0.006)
1.4 (0.055)
1.0 (0.039)
A
A
0.4
0.5 (0.020)
0.4 (0.016)
Radiant sensitive area
(0.4 x 0.4)
Detaching area for tools, flash not true to size.1)
...0