LMV712MMX/NOPB - NATIONAL SEMICONDUCTOR

RF Signal IN OUT

U1 GSM PA

VPC

Directional Coupler

Input

Coupled Load

Output

C4 BIAS

VCC

GSM

ANTENNA

RLOAD

OUT

VCC

V-

Shut Down Ramp

Up/Down

V+

Schottky Diode

Detector

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LMV712-N

LMV712-N-Q1

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

LMV712-N, LMV712-N-Q1 Low Power, Low Noise, High Output, RRIO Dual Operational

Amplifier With Independent Shutdown

1 Features

1• Available In Automotive AEC-Q100 Grade 1

Version (LMV712-N Only)

• 5-MHz GBP

• Slew Rate: 5 V/µs

• Low Noise: 20 nV/√Hz

• Supply Current: 1.22 mA/Channel

• VOS< 3 mV Maximum

• Ensured 2.7-V and 5-V Specifications

• Temperature Range: –40°C to 125°C

• Rail-to-Rail Inputs and Outputs

• Unity Gain Stable

• Small Package: 10-Pin DSBGA, 10-Pin WSON,

and 10-Pin VSSOP

• 1.5-µA Shutdown ICC

• 2.2-µs Turnon

2 Applications

• Power Amplifier Control Loops

• Cellular Phones

• Portable Equipment

• Wireless LAN

• Radio Systems

• Cordless Phones

3 Description

The LMV712-N devices are high-performance

BiCMOS operational amplifiers intended for

applications requiring rail-to-rail inputs combined with

speed and low noise. They offer a bandwidth of

5 MHz and a slew rate of 5 V/µs, and can handle

capacitive loads of up to 200 pF without oscillation.

The LMV712-N is ensured to operate from 2.7 V to

5.5 V and offers two independent shutdown pins. This

feature allows disabling of each device separately

and reduces the supply current to less than 1 µA

typical. The output voltage rapidly ramps up smoothly

with no glitch as the amplifier comes out of the

shutdown mode.

The LMV712-N with the shutdown feature is offered

in space-saving 10-pin DSBGA and 10-pin WSON

packages. It is also offered in 10-pin VSSOP

package. These packages are designed to meet the

demands of small size, low power, and low cost

required by cellular phones and similar battery-

operated portable electronics.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

LMV712-N DSBGA (10) 1.75 mm × 2.25 mm

WSON (10) 3.00 mm × 3.00 mm

LMV712-N,

LMV712-N-Q1 VSSOP (10) 3.00 mm × 3.00 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Power Amplifier Control Loop

LMV712-N

LMV712-N-Q1

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: LMV712-N LMV712-N-Q1

Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 6

6.1 Absolute Maximum Ratings ...................................... 6

6.2 ESD Ratings.............................................................. 6

6.3 Recommended Operating Conditions....................... 6

6.4 Thermal Information.................................................. 6

6.5 Electrical Characteristics – 2.7 V.............................. 7

6.6 Electrical Characteristics – 5 V................................. 9

6.7 Typical Characteristics............................................ 11

7 Detailed Description............................................ 16

7.1 Overview................................................................. 16

7.2 Functional Block Diagram....................................... 16

7.3 Feature Description ................................................ 16

7.4 Device Functional Modes ....................................... 17

8 Application and Implementation ........................ 19

8.1 Application Information............................................ 19

8.2 Typical Applications ................................................ 19

9 Power Supply Recommendations...................... 22

10 Layout................................................................... 22

10.1 Layout Guidelines ................................................. 22

10.2 Layout Example .................................................... 22

11 Device and Documentation Support................. 23

11.1 Related Links ........................................................ 23

11.2 Receiving Notification of Documentation Updates 23

11.3 Community Resources.......................................... 23

11.4 Trademarks........................................................... 23

11.5 Electrostatic Discharge Caution............................ 23

11.6 Glossary................................................................ 23

12 Mechanical, Packaging, and Orderable

Information........................................................... 23

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision I (January 2014) to Revision J Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section.................................................................................................. 1

• Deleted Soldering specification from Absolute Maximum Ratings table................................................................................ 6

• Changed Thermal Resistance values in Thermal Information table From: 196 To: 84.1 (DSBGA), From: 53.4 To: 70

(WSON), and From: 235 To: 176.8 (VSSOP) ........................................................................................................................ 6

Changes from Revision H (February 2013) to Revision I Page

• Added -Q1 part....................................................................................................................................................................... 1

Changes from Revision G (February 2013) to Revision H Page

• Changed layout of National Semiconductor Data Sheet to TI format .................................................................................... 1

V+

OUTB

-INB

+INB

SDB

OUTA

+INA

-INA

SDA

V-

LMV712-N

LMV712-N-Q1

www.ti.com

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

Product Folder Links: LMV712-N LMV712-N-Q1

(1) I = Input, O = Output, P = Power

5 Pin Configuration and Functions

YPA Package

10-Pin DSBGA

Top View

Pin Functions: DSBGA Package

PIN TYPE(1) DESCRIPTION

NO. NAME

A1 OUTA O Channel A output

A2 V+ P Positive supply input

A3 OUTB O Channel B output

B1 –INA I Channel A inverting input

B3 –INB I Channel B inverting input

C1 +INA I Channel A noninverting input

C3 +INB I Channel A noninverting input

D1 SDA I Channel A shutdown

D2 V– P Negative supply input

D3 SDB I Channel B shutdown

OUT A

-IN A

+IN A

V-

SD A

V+

OUT B

-IN B

+IN B

SD B

LMV712-N

LMV712-N-Q1

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: LMV712-N LMV712-N-Q1

(1) G = Ground, I = Input, O = Output, P = Power

NGY Package

10-Pin WSON

Top View

Pin Functions: WSON Package

PIN TYPE(1) DESCRIPTION

NO. NAME

1 OUT A O Channel A output

2 –IN A I Channel A inverting input

3 +IN A I Channel A noninverting input

4 V–P Positive supply input

5 SD A I Channel A shutdown

6 SD B I Channel B shutdown

7 +IN B I Channel B noninverting input

8 –IN A I Channel B inverting input

9 OUT B O Channel B output

10 V+P Positive supply input

11 Thermal Pad G Connect thermal pad to V–or leave floating

OUT A

-IN A

+IN A

V-

SD A

V+

OUT B

-IN B

+IN B

SD B

LMV712-N

LMV712-N-Q1

www.ti.com

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

Product Folder Links: LMV712-N LMV712-N-Q1

(1) I = Input, O = Output, P = Power

DGS Package

10-Pin VSSOP

Top View

Pin Functions: VSSOP Package

PIN TYPE(1) DESCRIPTION

NO. NAME

1 OUT A O Channel A output

2 –IN A I Channel A inverting input

3 +IN A I Channel A noninverting input

4 V–P Negative supply input

5 SD A I Channel A shutdown

6 SD B I Channel B shutdown

7 +IN B I Channel B noninverting input

8 –IN A I Channel B inverting input

9 OUT B O Channel B output

10 V+P Positive supply input

LMV712-N

LMV712-N-Q1

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: LMV712-N LMV712-N-Q1

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for availability and

specifications.

(3) Shorting circuit output to either V+or V−adversely affects reliability.

(4) The maximum power dissipation is a function of TJ(MAX) and RθJA. The maximum allowable power dissipation at any ambient

temperature is PD= (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)

MIN MAX UNIT

Differential input voltage ±Supply voltage

Voltage at input or output pin (V+) + 0.4 (V–) – 0.4 V

Supply voltage (V+– V–) 6 V

V+, V–Output short circuit See(3)

Current at input pin ±10 mA

Current at output pin ±50 mA

TJMAX Junction temperature(4) 150 °C

Tstg Storage temperature –65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings VALUE UNIT

V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1500 V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±150

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT

Supply voltage 2.7 5.5 V

Operating temperature LMV712 –40 85 °C

LMV712-Q1 –40 125 °C

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1) LMV712-N, LMV712-N-Q1

UNITYPA (DSBGA) NGY (WSON) DGS (VSSOP)

10 PINS 10 PINS 10 PINS

RθJA Junction-to-ambient thermal resistance 84.1 70 176.8 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 0.6 74.7 67.5 °C/W

RθJB Junction-to-board thermal resistance 21.4 43.7 97.2 °C/W

ψJT Junction-to-top characterization parameter 2.2 2 9.4 °C/W

ψJB Junction-to-board characterization parameter 21.3 43.7 95.8 °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance — 11.8 — °C/W

LMV712-N

LMV712-N-Q1

www.ti.com

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

Product Folder Links: LMV712-N LMV712-N-Q1

(1) All limits are ensured by testing or statistical analysis.

(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary

over time and also depend on the application and configuration. The typical values are not tested and are not ensured on shipped

production material.

6.5 Electrical Characteristics – 2.7 V

All limits ensured for V+= 2.7 V, V −= 0 V, VCM = 1.35 V, TA= 25°C, and RL> 1 mΩ(unless otherwise noted)

PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT

VOS

Input offset voltage

(WSON and VSSOP) VCM = 0.85 V and

VCM = 1.85 V

TA= 25°C 0.4 3

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 3.2

Input offset voltage

(DSBGA only) VCM = 0.85 V and

VCM = 1.85 V

TA= 25°C 3 7

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 9

IBInput bias current LMV712 TA= 25°C 5.5 115

−40°C ≤TJ≤85°C 130

LMV712-Q1 TA= 25°C 5.5

−40°C ≤TJ≤125°C 3740

CMRR Common mode rejection

ratio 0 V ≤VCM ≤2.7 V TA= 25°C 50 75 dB

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 45

PSRR Power supply rejection ratio

2.7 V ≤V+≤5 V,

VCM = 0.85 V

TA= 25°C 70 90

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 68

2.7 V ≤V+≤5 V,

VCM = 1.85 V

TA= 25°C 70 90

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 68

CMVR Common mode voltage For CMRR ≥50 dB V- −0.2 −0.3 V

V+ 3 2.9

ISC Output short circuit current

Sourcing

VO= 0 V

TA= 25°C 15 25

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 12

Sinking

VO= 2.7 V

TA= 25°C 25 50

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 22

VOOutput swing

RL= 10 kΩto

1.35 V

TA= 25°C 2.62 2.68

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 2.6

TA= 25°C 0.01 0.12

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 0.15

RL= 600 Ωto

1.35 V

TA= 25°C 2.52 2.55

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 2.5

TA= 25°C 0.05 0.23

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 0.3

VO(SD) Output voltage in shutdown 10 200 mV

ISSupply current per channel

On mode TA= 25°C 1.22 1.7 mA

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 1.9

Shutdown mode TA= 25°C 0.12 1.5 µA

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 2

LMV712-N

LMV712-N-Q1

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: LMV712-N LMV712-N-Q1

Electrical Characteristics – 2.7 V (continued)

All limits ensured for V+= 2.7 V, V −= 0 V, VCM = 1.35 V, TA= 25°C, and RL> 1 mΩ(unless otherwise noted)

PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT

(3) Number specified is the slower of the positive and negative slew rates.

AVOL Large signal voltage gain

LMV712 Sourcing

RL= 10 kΩ

VO= 1.35 V

to 2.3 V

TA= 25°C 80 115

−40°C ≤TJ≤85°C 76

LMV712-Q1 TA= 25°C 115

−40°C ≤TJ≤125°C 69

LMV712 Sinking

RL= 10 kΩ

VO= 0.4 V

to 1.35 V

TA= 25°C 80 113

−40°C ≤TJ≤85°C 76

LMV712-Q1 TA= 25°C 113

−40°C ≤TJ≤125°C 69

LMV712 Sourcing

RL= 600 Ω

VO= 1.35 V

to 2.2 V

TA= 25°C 80 97

−40°C ≤TJ≤85°C 76

LMV712-Q1 TA= 25°C 97

−40°C ≤TJ≤125°C 64

LMV712 Sinking

RL= 600 Ω

VO= 0.5 V

to 1.35 V

TA= 25°C 80 100

−40°C ≤TJ≤85°C 76

LMV712-Q1 TA= 25°C 100

−40°C ≤TJ≤125°C 62

VSD Shutdown pin voltage On mode 2.4 2.0 V

Shutdown mode 1 0.8

GBWP Gain-bandwidth product 5 MHz

SR Slew rate(3) 5 V/µs

φmPhase margin 60 °

enInput referred voltage noise f = 1 kHz 20 nV/√Hz

TON

Turnon time from shutdown TA= 25°C 2.2 4

µs

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 4.6

DSBGA turnon time from

shutdown

TA= 25°C 6

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 8

LMV712-N

LMV712-N-Q1

www.ti.com

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

Product Folder Links: LMV712-N LMV712-N-Q1

(1) All limits are ensured by testing or statistical analysis.

(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary

over time and also depend on the application and configuration. The typical values are not tested and are not ensured on shipped

production material.

6.6 Electrical Characteristics – 5 V

All limits ensured for V+= 5 V, V −= 0 V, VCM = 2.5 V, TA= 25°C, and RL> 1 mΩ(unless otherwise noted)

PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT

VOS

Input offset voltage

(WSON and VSSOP) VCM = 0.85 V and

VCM = 1.85 V

TA= 25°C 0.4 3

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 3.2

Input offset voltage

(DSBGA only) VCM = 0.85 V and

VCM = 1.85 V

TA= 25°C 3 7

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 9

IBInput bias current LMV712 TA= 25°C 5.5 115 pA−40°C ≤TJ≤85°C 130

LMV712-Q1 −40°C ≤TJ≤125°C 3600

CMRR Common mode rejection

ratio 0 V ≤VCM ≤5 V TA= 25°C 50 80 dB

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 45

PSRR Power supply rejection

ratio

2.7 V ≤V+≤5 V,

VCM = 0.85 V

TA= 25°C 70 90

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 68

2.7 V ≤V+≤5 V,

VCM = 1.85 V

TA= 25°C 70 90

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 68

CMVR Common mode voltage For CMRR ≥50 dB V- −0.2 −0.3 V

V+ 5.3 5.2

ISC Output short circuit current

Sourcing

VO= 0 V

TA= 25°C 20 35

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 18

Sinking

VO= 5 V

TA= 25°C 25 50

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 21

VOOutput swing

RL= 10 kΩto 2.5 V TA= 25°C 4.92 4.98

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 4.9

TA= 25°C 0.01 0.12

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 0.15

RL= 600 Ωto 2.5 V TA= 25°C 4.82 4.85

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 4.8

TA= 25°C 0.05 0.23

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 0.3

VO(SD) Output voltage in shutdown 10 200 mV

ISSupply current per channel

On mode TA= 25°C 1.17 1.7 mA

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 1.9

Shutdown mode TA= 25°C 0.12 1.5 µA

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 2

LMV712-N

LMV712-N-Q1

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: LMV712-N LMV712-N-Q1

Electrical Characteristics – 5 V (continued)

All limits ensured for V+= 5 V, V −= 0 V, VCM = 2.5 V, TA= 25°C, and RL> 1 mΩ(unless otherwise noted)

PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT

(3) Number specified is the slower of the positive and negative slew rates.

AVOL Large signal voltage gain

LMV712 Sourcing

RL= 10 kΩ

VO= 2.5 V to 4.6 V

TA= 25°C 80 130

−40°C ≤TJ≤85°C 76

LMV712-Q1 TA= 25°C 130

−40°C ≤TJ≤125°C 69

LMV712 Sinking

RL= 10 kΩ

VO= 0.4 V to 2.5 V

TA= 25°C 80 130

−40°C ≤TJ≤85°C 76

LMV712-Q1 TA= 25°C 130

−40°C ≤TJ≤125°C 69

LMV712 Sourcing

RL= 600 Ω

VO= 2.5 V to 4.6 V

TA= 25°C 80 110

−40°C ≤TJ≤85°C 76

LMV712-Q1 TA= 25°C 110

−40°C ≤TJ≤125°C 69

LMV712 Sinking

RL= 600 Ω

VO= 0.4 V to 2.5 V

TA= 25°C 80 107

−40°C ≤TJ≤85°C 76

LMV712-Q1 TA= 25°C 107

−40°C ≤TJ≤125°C 69

VSD Shutdown pin voltage On mode 4.5 3.5 V

Shutdown mode 1.5 0.8

GBWP Gain-bandwidth product 5 MHz

SR Slew rate(3) 5 V/µs

φmPhase margin 60 °

enInput referred voltage

noise f = 1 kHz 20 nV/√Hz

TON

Turnon time for shutdown TA= 25°C 1.6 4

µs

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 4.6

DSBGA turnon time for

shutdown

TA= 25°C 6

−40°C ≤TJ≤85°C (LMV712) or

−40°C ≤TJ≤125°C (LMV712-Q1) 8

2.7 3.0 3.5 4.0 4.5 5.0

100

140

160

VOUT FROM V+ (mV)

VS (V)

120 85°C

25°C

-40°C

2.7 3.0 3.5 4.0 4.5 5.0

100

VOUT FROM GND (mV)

VS (V)

85°C 25°C

-40°C

0 1 2 3 4 5

-1200

-1000

-800

-600

-400

-200

VOS (µV)

VCM (V)

-40°C

25°C

85°C

01 2 4 5

VCM (V)

0.01

0.1

100

IBIAS (pA)

+85°C

+70°C

+50°C

+25°C

0°C

-25°C

-40°C

2.7 3.0 3.5 4.0 4.5 5.0

0.5

0.7

0.9

1.1

1.3

1.5

IS (mA)

SUPPLY VOLTAGE (V)

85°C

25°C

-40°C

2.7 3.0 3.5 4.0 4.5 5.0

0.2

0.3

0.4

0.5

0.6

IS (µA)

SUPPLY VOLTAGE (V)

LMV712-N

LMV712-N-Q1

www.ti.com

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

Product Folder Links: LMV712-N LMV712-N-Q1

6.7 Typical Characteristics

TA= 25°C, VS= 5 V, and single supply (unless otherwise noted)

Figure 1. Supply Current Per Channel vs Supply Voltage Figure 2. Supply Current vs Supply Voltage (Shutdown)

Figure 3. VOS vs VCM Figure 4. IBvs VCM Over Temperature

RL= 600 Ω

Figure 5. Output Positive Swing vs Supply Voltage

RL= 600 Ω

Figure 6. Output Negative Swing vs Supply Voltage

100

PSRR (dB)

10 100 1k 10k 100k

FREQUENCY (Hz)

NEGATIVE

POSITIVE

PSRR (dB)

100

10 100 1k 10k 100k

FREQUENCY (Hz)

NEGATIVE

POSITIVE

0 1 2 3 4 5

-10

ISINK (mA)

VOUT (V)

85°C

25°C

-40°C

-0.3 0.2 0.7 1.2 1.7 2.2 2.7

VOUT (V)

-10

ISINK (mA)

85°C

25°C

-40°C

-0.3 0.2 0.7 1.2 1.7 2.2 2.7

VOUT FROM V+ (V)

ISOURCE (mA)

85°C

25°C

-40°C

85°C

25°C -40°C

0 1 2 3 4 5

ISOURCE (mA)

VOUT (V)

LMV712-N

LMV712-N-Q1

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: LMV712-N LMV712-N-Q1

Typical Characteristics (continued)

TA= 25°C, VS= 5 V, and single supply (unless otherwise noted)

VS= 2.7 V

Figure 7. Sourcing Current vs Output Voltage

VS= 5 V

Figure 8. Sourcing Current vs Output Voltage

VS= 2.7 V

Figure 9. Sinking Current vs Output Voltage

VS= 5V

Figure 10. Sinking Current vs Output Voltage

VS= 2.7 V

Figure 11. PSRR vs Frequency

VS= 5 V

Figure 12. PSRR vs Frequency

1k 10k 100k 1M 10M

-20

-10

GAIN (dB)

PHASE (Deg)

VS = 2.7V

CL = 100pF

CL = 1000pF

CL = 0pF

CL = 1000pF

FREQUENCY (Hz)

1k 10k 100k 1M 10M

-20

-10

GAIN (dB)

PHASE (Deg)

VS = 5V

CL = 100pF

CL = 0pF

CL = 100pF

CL = 1000pF

CL = 0pF

CL = 1000pF

PHASE (Deg)

1k 10k 100k 1M 10M

-20

-10

GAIN (dB)

FREQUENCY (Hz)

RL = 600:

VS = 5V

RL = 10k:

RL = 600:

RL = 10k:

1k 10k 100k 1M 10M

-20

-10

GAIN (dB)

PHASE (Deg)

600:

10k:

VS = 2.7V

FREQUENCY (Hz)

100

CMRR (dB)

10 100 1k 10k 100k

FREQUENCY (Hz)

VS = 2.7V

dVCM = 0.2V TO 1.2V

100

CMRR (dB)

10 100 1k 10k 100k

FREQUENCY (Hz)

VS = 5V

dVCM = 2V TO 3V

LMV712-N

LMV712-N-Q1

www.ti.com

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

Product Folder Links: LMV712-N LMV712-N-Q1

Typical Characteristics (continued)

TA= 25°C, VS= 5 V, and single supply (unless otherwise noted)

Figure 13. CMRR vs Frequency Figure 14. CMRR vs Frequency

Figure 15. Open Loop Frequency Response vs RLFigure 16. Open Loop Frequency Response vs RL

Figure 17. Open Loop Frequency Response vs CLFigure 18. Open Loop Frequency Response vs CL

INPUT

TIME (500ns/div)

OUTPUT (50mV/div)

INPUT

TIME (500ns/div)

OUTPUT (50mV/div)

INPUT

TIME (500ns/div)

OUTPUT (1V/div)

INPUT

TIME (500ns/div)

OUTPUT (1V/div)

110 100 10k 100k

FREQUENCY (Hz)

100

1000

Hz)

INPUT VOLTAGE NOISE (nV/

VS = 2.7V

VCM = 1.35V

VSD = 2.7V

110 100 10k 100k

FREQUENCY (Hz)

100

1000

Hz)

INPUT VOLTAGE NOISE (nV/

VS = 5V

VCM = 2.5V

VSD = 5V

LMV712-N

LMV712-N-Q1

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: LMV712-N LMV712-N-Q1

Typical Characteristics (continued)

TA= 25°C, VS= 5 V, and single supply (unless otherwise noted)

Figure 19. Voltage Noise vs Frequency Figure 20. Voltage Noise vs Frequency

VS= 2.7 V

Figure 21. Non-Inverting Large Signal Pulse Response

VS= 5 V

Figure 22. Non-Inverting Large Signal Pulse Response

VS= 2.7 V

Figure 23. Non-Inverting Small Signal Pulse Response

VS= 5 V

Figure 24. Non-Inverting Small Signal Pulse Response

TIME (2µs/div)

OUTPUT

VOLTAGE SHUTDOWN

PULSE

(2V/div)

0 1 2 3 4 5

CDIFF (pF)

VCM (V)

CCM TO GROUND

FMEAS = 1MHz

FOLLOWER CONFIG

VOUT FOLLOWS VIN (VCM)

INPUT

TIME (500ns/div)

OUTPUT (50mV/div)

INPUT

TIME (500ns/div)

OUTPUT (50mV/div)

INPUT

TIME (500ns/div)

OUTPUT (1V/div)

INPUT

TIME (500ns/div)

OUTPUT (1V/div)

LMV712-N

LMV712-N-Q1

www.ti.com

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

Product Folder Links: LMV712-N LMV712-N-Q1

Typical Characteristics (continued)

TA= 25°C, VS= 5 V, and single supply (unless otherwise noted)

VS= 2.7 V

Figure 25. Inverting Large Signal Pulse Response

VS= 5 V

Figure 26. Inverting Large Signal Pulse Response

VS= 2.7 V

Figure 27. Inverting Small Signal Pulse Response

VS= 5 V

Figure 28. Inverting Small Signal Pulse Response

VS= 5 V

Figure 29. Turnon Time Response

VS= 5 V

Figure 30. Input Common Mode Capacitance vs VCM

CLASS AB

CONTROL

BIAS

CONTROL

MP3 MP4

MP1 MP2 MN2

MN4

MN3

MN1

Q2 Q1

Q3 Q4

Q5 Q6

OUT

IN+

V-

IN-

INVBIAS

VBIAS

V+

LMV712-N

LMV712-N-Q1

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: LMV712-N LMV712-N-Q1

7 Detailed Description

7.1 Overview

The LMV712-N features low voltage, low power, and rail-to-rail output operational amplifiers designed for low-

voltage portable applications.

7.2 Functional Block Diagram

7.3 Feature Description

Rail-to-rail input is achieved by using in parallel, one NMOS differential pair (MN1 and MN2) and one PMOS

differential pair (MP1 and MP2). When the common mode input voltage (VCM) is near V+, the NMOS pair is on

and the PMOS pair is off. When VCM is near V−, the NMOS pair is off and the PMOS pair is on. When VCM is

between V+and V−, internal logic decides how much current each differential pair receives. This special logic

ensures stable and low distortion amplifier operation within the entire common mode voltage range.

Because both input stages have their own offset voltage (VOS) characteristic, the offset voltage of the LMV712-N

becomes a function of VCM. VOS has a crossover point at 1.4 V above V−(see Figure 3). Caution must be taken

in situations where input signal amplitude is comparable to VOS value or the design requires high accuracy. In

these situations, it is necessary for the input signal to avoid the crossover point.

The current coming out of the input differential pairs gets mirrored through two folded cascode stages (Q1, Q2,

Q3, Q4) into the class AB control block. This circuitry generates voltage gain, defines the dominant pole of the op

amp and limits the maximum current flowing at the output stage. MN3 introduces a voltage level shift and acts as

a high impedance to low impedance buffer.

TIME (2µs/div)

OUTPUT

VOLTAGE SHUTDOWN

PULSE

(2V/div)

LMV712-N

LMV712-N-Q1

www.ti.com

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

Product Folder Links: LMV712-N LMV712-N-Q1

Feature Description (continued)

The output stage is composed of a PMOS and a NPN transistor in a common source or emitter configuration,

delivering a rail-to-rail output excursion.

The MN4 transistor ensures that the LMV712-N output remains near V−when the amplifier is in shutdown mode.

7.4 Device Functional Modes

7.4.1 Shutdown Pin

The LMV712-N offers independent shutdown pins for the dual amplifiers. When the shutdown pin is tied low, the

respective amplifier shuts down and the supply current is reduced to less than 1 µA. In shutdown mode, the

output level of the amplifier stays at V−. In a 2.7-V operation, when a voltage from 1.5 V to 2.7 V is applied to the

shutdown pin, the amplifier is enabled. As the amplifier is coming out of the shutdown mode, the output

waveform ramps up without any glitch.

Figure 31. Output Recovery from Shutdown

A glitch-free output waveform is highly desirable in many applications, one of which is power amplifier control

loops. In this application, the LMV712-N is used to drive the power amplifier's power control. If the LMV712-N did

not have a smooth output ramp during turn on, it would directly cause the power amplifier to produce a glitch at

its output. This adversely affects the performance of the system.

To enable the amplifier, the shutdown pin must be pulled high. It must not be left floating in the event that any

leakage current may inadvertently turn off the amplifier.

7.4.2 Capacitive Load Tolerance

The LMV712-N can directly drive 200 pF in unity-gain without oscillation. The unity-gain follower is the most

sensitive configuration to capacitive loading. Direct capacitive loading reduces the phase margin of amplifiers.

The combination of the amplifier's output impedance and the capacitive load induces phase lag. This results in

either an underdamped pulse response or oscillation. To drive a heavier capacitive load, TI recommends the

circuit in Figure 32.

VOUT

VIN

RISO

VOUT

VIN

RISO

LMV712-N

LMV712-N-Q1

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: LMV712-N LMV712-N-Q1

Device Functional Modes (continued)

Figure 32. Driving Heavy Capacitive Loads

In Figure 32, the isolation resistor RISO and the load capacitor CLform a pole to increase stability by adding more

phase margin to the overall system. The desired performance depends on the value of RISO. The bigger the RISO

resistor value, the more stable VOUT is. But the DC accuracy is degraded when the RISO gets bigger. If there were

a load resistor in the application, the output voltage would be divided by RISO and the load resistor.

Figure 33 is an improvement to the one in Figure 32 because it provides DC accuracy as well as AC stability. In

Figure 33, RFprovides the DC accuracy by using feed-forward techniques to connect VIN to RL. CFand RISO

serve to counteract the loss of phase margin by feeding the high frequency component of the output signal back

to the inverting input of the amplifier, thereby preserving phase margin in the overall feedback loop. Increased

capacitive drive is possible by increasing the value of CF. This in turn slows down the pulse response.

Figure 33. Enhanced DC Accuracy

7.4.3 Latchup

CMOS devices tend to be susceptible to latchup due to their internal parasitic SCR (silicon controlled rectifier)

effects. The input and output pins look similar to the gate of the SCR. There is a minimum current required to

trigger the SCR gate lead. The LMV712-N is designed to withstand 150-mA surge current on all the pins. Some

resistive method must be used to isolate any capacitance from supplying excess current to the pins. In addition,

like an SCR, there is a minimum holding current for any latchup mode. Limiting current to the supply pins also

inhibits latchup susceptibility.

ICHARGE

RSENSE 0.2

2 kŸ

Load 10 kŸ

VOUT

2N3906

V+

SENSE 3

OUT Charge Charge

R R

V I 1 I

x : x

LMV712-N

LMV712-N-Q1

www.ti.com

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

Product Folder Links: LMV712-N LMV712-N-Q1

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The LMV712-N devices are dual op amps derived from the LMV711 single op amp. Figure 34 contains a

simplified schematic of one channel of the LMV712-N.

8.2 Typical Applications

8.2.1 High-Side Current-Sensing

Figure 34. High-Side, Current-Sensing Schematic

8.2.1.1 Design Requirements

The high-side, current-sensing circuit (Figure 34) is commonly used in a battery charger to monitor charging

current to prevent over charging. A sense resistor RSENSE is connected to the battery directly. This system

requires an op amp with rail-to-rail input. The LMV712-N is ideal for this application because its common-mode

input range goes up to the rail.

8.2.1.2 Detailed Design Procedure

As seen in (Figure 34), the ICHARGE current flowing through sense resistor RSENSE develops a voltage drop equal

to VSENSE. The voltage at the negative sense point is now less than the positive sense point by an amount

proportional to the VSENSE voltage.

The low-bias currents of the LMV712-N causes little voltage drop through R2, so the negative input of the

LMV712-N amplifier is at essentially the same potential as the negative sense input.

The LMV712-N detects this voltage error between its inputs and servo the transistor base to conduct more

current through Q1, increasing the voltage drop across R1until the LMV712-N inverting input matches the

noninverting input. At this point, the voltage drop across R1now matches VSENSE.

VIN

10 k

Reset 2N2945

R5C110 k

10 k

V+

1N914A

LMV71x

(A2)

LMV71x

(A1)

10 k

V+

1 2 3 4 5

VOUT (V)

ILOAD (A)

VOUT (V)

C003

LMV712-N

LMV712-N-Q1

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: LMV712-N LMV712-N-Q1

Typical Applications (continued)

IG, a current proportional to ICHARGE, flows according to Equation 1.

IG= VRSENSE / R1=(RSENSE × ICHARGE ) / R1(1)

IGalso flows through the gain resistor R3developing a voltage drop equal to Equation 2.

V3= IG× R3=(VRSENSE / R1) × R3=((RSENSE × ICHARGE ) / R2) × R3(2)

VOUT = (RSENSE × ICHARGE ) × G

where

• G = R3/ R1(3)

The other channel of the LMV712-N may be used to buffer the voltage across R3 to drive the following stages.

8.2.1.3 Application Curve

Figure 35. High-Side Current-Sensing Results

8.2.2 Peak Detector

Figure 36. Peak Detector Schematic

8.2.2.1 Design Requirements

A peak detector outputs a DC voltage equal to the peak value of the applied AC signal. Peak detectors are used

in many applications, such as test equipment, measurement instrumentation, ultrasonic alarm systems, and so

forth. Figure 36 shows the schematic diagram of a peak detector using LMV712-N. This peak detector basically

consists of a clipper, a parallel RC network, and a voltage follower.

RF Signal IN OUT

U1 GSM PA

VPC

Directional Coupler

Input

Coupled Load

Output

C4 BIAS

VCC

GSM

ANTENNA

RLOAD

OUT

VCC

V-

Shut Down Ramp

Up/Down

V+

Schottky Diode

Detector

LMV712-N

LMV712-N-Q1

www.ti.com

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

Product Folder Links: LMV712-N LMV712-N-Q1

Typical Applications (continued)

8.2.2.2 Detailed Design Procedure

An AC voltage source applied to VIN charges capacitor C1 to the peak of the input. Diode D1 conducts positive

half cycles, charging C1 to the waveform peak. Including D1 inside the feedback loop of the amplifier removes

the voltage drop of D1 and allows an accurate peak detection of VIN on C1. When the input waveform falls below

the DC peak stored on C1, D1 is reverse biased. The low input bias current of A1 and the reverse biasing of D1

limits current leakage from C1. As a result, C1 retains the peak value even as the waveform drops to zero. A2

further isolates the peak value on C1 while completing the peak detector circuit by operating as a voltage

follower and reporting the peak voltage of C1 at its output.

R5 and C1 are properly selected so that the capacitor is charged rapidly to VIN. During the holding period, the

capacitor slowly discharge through C1, through leakage of the capacitor and the reverse-biased diode, or op amp

bias currents. In any cases the discharging time constant is much larger than the charge time constant. And the

capacitor can hold its voltage long enough to minimize the output ripple.

Resistors R2 and R3 limit the current into the inverting input of A1 and the noninverting input of A2 when power

is disconnected from the circuit. The discharging current from C1 during power off may damage the input circuitry

of the op amps.

The peak detector is reset by applying a positive pulse to the reset transistor. The charge on the capacitor is

dumped into ground, and the detector is ready for another cycle.

The maximum input voltage to this detector must be less than (V+– VD), where VDis the forward voltage drop of

the diode. Otherwise, the input voltage must be scaled down before applying to the circuit.

8.2.3 GSM Power Amplifier Control Loop

Figure 37. GSM Power Amplifier Control Loop Schematic

8.2.3.1 Design Requirements

The control loop in Figure 37 controls the output power level of a GSM mobile phones. The control loop is used

to avoid intermodulation of base station receivers, to prevent intermodulation with other mobile phones, and to

minimize power consumption depending on the distance between mobile and base station.

GND

C4C3

GND

V+

+INB

-INB

OUTB

V+

SDB

SDA

V-

+INA

-INA

OUTA

VOUT

VIN

ShutDown

VOUT

ShutDown

VIN

V-

GND

R2C1

LMV712-N

LMV712-N-Q1

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: LMV712-N LMV712-N-Q1

Typical Applications (continued)

8.2.3.2 Detailed Design Procedure

There are four critical sections in the GSM Power Amplifier Control Loop. The class-C RFpower amplifier

provides amplification of the RFsignal. A directional coupler couples small amount of RFenergy from the output

of the RFP. A. to an envelope detector diode. The detector diode senses the signal level and rectifies it to a DC

level to indicate the signal strength at the antenna. An op amp is used as an error amplifier to process the diode

voltage and ramping voltage. This loop control the power amplifier gain through the op amp and forces the

detector diode voltage and ramping voltage to be equal. Power control is accomplished by changing the ramping

voltage.

The LMV712-N is well suited as an error amplifier in this application. The LMV712-N has an extra shutdown pin

to switch the op amp to shutdown mode. In shutdown mode, the LMV712-N consumes very low current.

Therefore, the power amplifier can be turned off to save battery life. The LMV712-N output is tri-stated when in

shutdown.

9 Power Supply Recommendations

For proper operation, the power supplies must be properly decoupled. For decoupling the supply lines, TI

recommends that 10-nF capacitors be placed as close as possible to the power supply pins of the operational

amplifier. For single supply, place a capacitor between V+and V–supply leads. For dual supplies, place one

capacitor between V+and ground, and one capacitor between V–and ground.

10 Layout

10.1 Layout Guidelines

To properly bypass the power supply, several locations on a printed circuit board must be considered. A 6.8 µF

or greater tantalum capacitor must be placed at the point where the power supply for the amplifier is introduced

onto the board. Another 0.1-µF ceramic capacitor must be placed as close as possible to the power supply pin of

the amplifier. If the amplifier is operated in a single power supply, only the V+pin requires bypassing with a 0.1-

µF capacitor. If the amplifier is operated in a dual power supply, both V+and V–pins must be bypassed.

It is good practice to use a ground plane on a printed circuit board to provide all components with a low inductive

ground connection.

Surface mount components in 0805 size or smaller are recommended in the LMV712-N application circuits.

Designers can take advantage of the DSBGA, WSON, and VSSOP miniature sizes to condense board layout to

save space and reduce stray capacitance.

10.2 Layout Example

Figure 38. Sample Layout of VSSOP

LMV712-N

LMV712-N-Q1

www.ti.com

SNOS534J –FEBRUARY 2001–REVISED NOVEMBER 2016

Product Folder Links: LMV712-N LMV712-N-Q1

11 Device and Documentation Support

11.1 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 1. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL

DOCUMENTS TOOLS &

SOFTWARE SUPPORT &

COMMUNITY

LMV712-N Click here Click here Click here Click here Click here

LMV712-N-Q1 Click here Click here Click here Click here Click here

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LMV712LD/NOPB ACTIVE WSON NGY 10 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 85 A62

LMV712LDX/NOPB ACTIVE WSON NGY 10 4500 RoHS & Green SN Level-3-260C-168 HR -40 to 85 A62

LMV712MM NRND VSSOP DGS 10 1000 Non-RoHS &

Non-Green Call TI Call TI -40 to 85 A61

LMV712MM/NOPB ACTIVE VSSOP DGS 10 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 A61

LMV712MMX/NOPB ACTIVE VSSOP DGS 10 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 A61

LMV712Q1MM/NOPB ACTIVE VSSOP DGS 10 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 AUA

LMV712Q1MMX/NOPB ACTIVE VSSOP DGS 10 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 AUA

LMV712TL/NOPB ACTIVE DSBGA YPA 10 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 AU2A

LMV712TLX/NOPB ACTIVE DSBGA YPA 10 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 AU2A

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 2

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF LMV712-N, LMV712-N-Q1 :

•Catalog: LMV712-N

•Automotive: LMV712-N-Q1

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LMV712LD/NOPB WSON NGY 10 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1

LMV712LDX/NOPB WSON NGY 10 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1

LMV712MM VSSOP DGS 10 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LMV712MM/NOPB VSSOP DGS 10 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LMV712MMX/NOPB VSSOP DGS 10 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LMV712Q1MM/NOPB VSSOP DGS 10 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LMV712Q1MMX/NOPB VSSOP DGS 10 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LMV712TL/NOPB DSBGA YPA 10 250 178.0 8.4 1.68 2.13 0.76 4.0 8.0 Q1

LMV712TLX/NOPB DSBGA YPA 10 3000 178.0 8.4 1.68 2.13 0.76 4.0 8.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LMV712LD/NOPB WSON NGY 10 1000 210.0 185.0 35.0

LMV712LDX/NOPB WSON NGY 10 4500 367.0 367.0 35.0

LMV712MM VSSOP DGS 10 1000 210.0 185.0 35.0

LMV712MM/NOPB VSSOP DGS 10 1000 210.0 185.0 35.0

LMV712MMX/NOPB VSSOP DGS 10 3500 367.0 367.0 35.0

LMV712Q1MM/NOPB VSSOP DGS 10 1000 210.0 185.0 35.0

LMV712Q1MMX/NOPB VSSOP DGS 10 3500 367.0 367.0 35.0

LMV712TL/NOPB DSBGA YPA 10 250 210.0 185.0 35.0

LMV712TLX/NOPB DSBGA YPA 10 3000 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Sep-2019

Pack Materials-Page 2

MECHANICAL DATA

NGY0010A

www.ti.com

LDA10A (Rev B)

MECHANICAL DATA

YPA0010

www.ti.com

TLP10XXX (Rev D)

. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.

B. This drawing is subject to change without notice.

4215069/A 12/12

NOTES:

0.600

±0.075

D: Max =

E: Max =

2.048 mm, Min =

1.565 mm, Min =

1.987 mm

1.504 mm

www.ti.com

PACKAGE OUTLINE

TYP

5.05

4.75

1.1 MAX

8X 0.5

10X 0.27

0.17

0.15

0.05

TYP

0.23

0.13

0 - 8

0.25

GAGE PLANE

0.7

0.4

NOTE 3

3.1

2.9

NOTE 4

3.1

2.9

4221984/A 05/2015

VSSOP - 1.1 mm max heightDGS0010A

SMALL OUTLINE PACKAGE

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.

5. Reference JEDEC registration MO-187, variation BA.

110

0.1 C A B

PIN 1 ID

AREA

SEATING PLANE

0.1 C

SEE DETAIL A

DETAIL A

TYPICAL

SCALE 3.200

www.ti.com

EXAMPLE BOARD LAYOUT

(4.4)

0.05 MAX

ALL AROUND 0.05 MIN

ALL AROUND

10X (1.45)

10X (0.3)

8X (0.5)

(R )

TYP

0.05

4221984/A 05/2015

VSSOP - 1.1 mm max heightDGS0010A

SMALL OUTLINE PACKAGE

SYMM

LAND PATTERN EXAMPLE

SCALE:10X

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

NOT TO SCALE

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

www.ti.com

EXAMPLE STENCIL DESIGN

(4.4)

8X (0.5)

10X (0.3)

10X (1.45)

(R ) TYP0.05

4221984/A 05/2015

VSSOP - 1.1 mm max heightDGS0010A

SMALL OUTLINE PACKAGE

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:10X

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE

DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”

AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY

IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD

PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate

TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable

standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you

permission to use these resources only for development of an application that uses the TI products described in the resource. Other

reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third

party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,

damages, costs, losses, and liabilities arising out of your use of these resources.

TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on

ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable

warranties or warranty disclaimers for TI products.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265