Polyimide Film
.005
(.13)
RTV Sealed Tape Sealed
RTV
Seal
To order: Add 3M to end of par t #
To order: Add RTV to end of part #
Note: RTV not available with HCS or HCIS Insulators
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Page 34 Products shown covered by patents issued and/or pending. Specifications subject to change without notice. inch/(mm)
Low Insertion Force
Peel-A-Way®PGA Sockets
Features:
• Disposable carriers peel away after
soldering.
• Peel-A-Way®tabs and full grid wafer
supplied on all Peel-A-Way®PGA sockets.
• Maximum air flow under PGA for greater
cooling.
• Better flux rinse and cleaning.
• Allows inspection of solder joints on both
sides of PCB.
• Lowest profile with use of type -210
terminal.
• Peel-A-Way®disposable socket terminal
carrier available in any configuration shown
or custom designed to meet your
specifications.
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Ber yllium Copper (C17200)
ASTM-B-194
Solder Preform:
63% Tin, 37% Lead
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Body Material:
KS/KIS - Polyimide Film
-269˚C to 400˚C (-452˚F to 752˚F)
Peel-A-Way®Low Insertion Force PGA Sockets
How To Order
1 KS 068 -85 T G
Footprint Dash #
If Applicable*
Terminal Plating
G - Gold
T - Tin-Lead
Contact Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types
Body Type
KS - 2.5 oz.(70.85 g) avg. insertion force
KIS - 1 oz.(28.34 g) avg. insertion force
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
Polyimide Film
Polyimide Film
Peel away
after soldering
to PCB.
PCB
Solder fillets visible both sides
for inspection and cleaning.
Sealant Options
Peel-A-Way®covered by patent rights issued and/or pending.
How To Use:
1. Place socket in PCB.
2. Send PCB and socket through soldering operation.
3. Peel away polyimide film carr ier.
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