MT55L128V32F1B-12 - Cypress Semiconductor Corp.

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

4Mb

ZBT® SRAM

FEATURES

• High frequency and 100 percent bus utilization

• Fast cycle times: 10ns, 11ns, and 12ns

• Single +3.3V ±5% power supply (VDD)

• Separate +3.3V or +2.5V isolated output buffer

supply (VDDQ)

• Advanced control logic for minimum control

signal interface

• Individual BYTE WRITE controls may be tied LOW

• Single R/W# (read/write) control pin

• CKE# pin to enable clock and suspend operations

• Three chip enables for simple depth expansion

• Clock-controlled and registered addresses, data

I/Os and control signals

• Internally self-timed, fully coherent WRITE

• Internally self-timed, registered outputs to

eliminate the need to control OE#

• SNOOZE MODE for reduced-power standby

• Common data inputs and data outputs

• Linear or interleaved burst modes

• Burst feature (optional)

• Pin/function compatibility with 2Mb, 8Mb, and

16Mb ZBT SRAM family

• 165-pin FBGA package

• 100-pin TSOP package

• 119-pin BGA package

• Automatic power-down

OPTIONS MARKING

• Timing (Access/Cycle/MHz)

7.5ns/10ns/100 MHz -10

8.5ns/11ns/90 MHz -11

9ns/12ns/83 MHz -12

• Configurations

3.3V I/O

256K x 18 MT55L256L18F1

128K x 32 MT55L128L32F1

128K x 36 MT55L128L36F1

2.5V I/O

256K x 18 MT55L256V18F1

128K x 32 MT55L128V32F1

128K x 36 MT55L128V36F1

• Package

100-pin TQFP T

165-pin FBGA F*

119-pin, 14mm x 22mm BGA B

• Operating Temperature Range

Commercial (0°C to +70°C) None

Industrial (-40°C to +85°C)** IT

Part Number Example:

MT55L256L18F1T-12

MT55L256L18F1, MT55L128L32F1,

MT55L128L36F1; MT55L256V18F1,

MT55L128V32F1, MT55L128V36F1

3.3V VDD, 3.3V or 2.5V I/O

* A Part Marking Guide for the FBGA devices can be found on Micron’s

Web site—http://www.micron.com/support/index.html.

** Industrial temperature range offered in specific speed grades and

configurations. Contact factory for more information.

NOTE: 1. JEDEC-standard MS-026 BHA (LQFP).

2. JEDEC-standard MS-028 BHA (PBGA).

100-Pin TQFP1

165-Pin FBGA

(Preliminary Package Data)

119-Pin BGA2

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

DQs

MODE

BWa#

BWb#

R/W#

CE#

CE2

CE2#

OE# READ LOGIC

128K x 8 x 4

(x32)

128K x 9 x 4

(x36)

MEMORY

ARRAY

INPUT

BWc#

BWd#

ADDRESS

WRITE REGISTRY

AND DATA COHERENCY

CONTROL LOGIC

17 15 17

BURST

LOGIC

SA0'

SA1'

D0 Q1

SA0

SA1

ADV/LD#

CLK

CKE#

WRITE

DRIVERS

WRITE ADDRESS

SA0, SA1, SA

NOTE: Functional block diagrams illustrate simplified device operation. See truth tables, pin descriptions and timing diagrams

for detailed information.

FUNCTIONAL BLOCK DIAGRAM

128K x 32/36

FUNCTIONAL BLOCK DIAGRAM

256K x 18

SA0, SA1, SA

MODE

BWa#

BWb#

R/W#

CE#

CE2

CE2#

OE# READ LOGIC

DQs

256K x 9 x 2

MEMORY

ARRAY

INPUT

ADDRESS

WRITE REGISTRY

AND DATA COHERENCY

CONTROL LOGIC

18 16 18

BURST

LOGIC

SA0'

SA1'

D0 Q1

SA0

SA1

ADV/LD#

CLK

CKE#

WRITE

DRIVERS

WRITE ADDRESS

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

GENERAL DESCRIPTION

The Micron® Zero Bus Turnaround™ (ZBT®) SRAM

family employs high-speed, low-power CMOS designs

using an advanced CMOS process.

Micron’s 4Mb ZBT SRAMs integrate a 256K x 18,

128K x 32, or 128K x 36 SRAM core with advanced

synchronous peripheral circuitry and a 2-bit burst

counter. These SRAMs are optimized for 100 percent

bus utilization, eliminating any turnaround cycles when

transitioning from READ to WRITE, or vice versa. All

synchronous inputs pass through registers controlled

by a positive-edge-triggered single clock input (CLK).

The synchronous inputs include all addresses, all data

inputs, chip enable (CE#), two additional chip enables

for easy depth expansion (CE2, CE2#), cycle start input

(ADV/LD#), synchronous clock enable (CKE#), byte

write enables (BWa#, BWb#, BWc#, and BWd#) and

read/write (R/W#).

Asynchronous inputs include the output enable

(OE#, which may be tied LOW for control signal mini-

mization), clock (CLK) and snooze enable (ZZ, which

may be tied LOW if unused). There is also a burst mode

pin (MODE) that selects between interleaved and linear

burst modes. MODE may be tied HIGH, LOW or left

unconnected if burst is unused. The flow-through data-

out (Q) is enabled by OE#. WRITE cycles can be from

one to four bytes wide as controlled by the write control

inputs.

All READ, WRITE and DESELECT cycles are initiated

by the ADV/LD# input. Subsequent burst addresses can

be internally generated as controlled by the burst

advance pin (ADV/LD#). Use of burst mode is optional.

It is allowable to give an address for each individual

READ and WRITE cycle. BURST cycles wrap around

after the fourth access from a base address.

To allow for continuous, 100 percent use of the data

bus, the flow-through ZBT SRAM uses a LATE WRITE

cycle. For example, if a WRITE cycle begins in clock cycle

one, the address is present on rising edge one. BYTE

WRITEs need to be asserted on the same cycle as the

address. The write data associated with the address is

required one cycle later, or on the rising edge of clock

cycle two.

Address and write control are registered on-chip to

simplify WRITE cycles. This allows self-timed WRITE

cycles. Individual byte enables allow individual bytes

to be written. During a BYTE WRITE cycle, BWa#

controls DQa pins; BWb# controls DQb pins; BWc#

controls DQc pins; and BWd# controls DQd pins. Cycle

types can only be defined when an address is loaded,

i.e., when ADV/LD# is LOW. Parity/ECC bits are only

available on the x18 and x36 versions.

Micron’s 4Mb ZBT SRAMs operate from a +3.3V VDD

power supply, and all inputs and outputs are LVTTL-

compatible. Users can choose either a 2.5V or 3.3V I/O

version. The device is ideally suited for systems requiring

high bandwidth and zero bus turnaround delays.

Please refer to Micron’s Web site (www.micron.com/

products/datasheets/zbtds.html) for the latest data

sheet.

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

PIN # x18 x32 x36

1NCNCDQc

2NCDQc DQc

3NCDQc DQc

4VDDQ

5VSS

6NCDQc DQc

7NCDQc DQc

8DQb DQc DQc

9DQb DQc DQc

10 VSS

11 VDDQ

12 DQb DQc DQc

13 DQb DQc DQc

14 VSS

15 VDD

16 VDD

17 VSS

18 DQb DQd DQd

19 DQb DQd DQd

20 VDDQ

21 VSS

22 DQb DQd DQd

23 DQb DQd DQd

24 DQb DQd DQd

25 NC DQd DQd

PIN # x18 x32 x36

51 NC NC DQa

52 NC DQa DQa

53 NC DQa DQa

54 VDDQ

55 VSS

56 NC DQa DQa

57 NC DQa DQa

58 DQa

59 DQa

60 VSS

61 VDDQ

62 DQa

63 DQa

64 ZZ

65 VDD

66 VSS

67 VSS

68 DQa DQb DQb

69 DQa DQb DQb

70 VDDQ

71 VSS

72 DQa DQb DQb

73 DQa DQb DQb

74 DQa DQb DQb

75 NC DQb DQb

PIN # x18 x32 x36

76 VSS

77 VDDQ

78 NC DQb DQb

79 NC DQb DQb

80 SA NC DQb

81 SA

82 SA

83 NF*

84 NF*

85 ADV/LD#

86 OE# (G#)

87 CKE#

88 R/W#

89 CLK

90 VSS

91 VDD

92 CE2#

93 BWa#

94 BWb#

95 NC BWc# BWc#

96 NC BWd# BWd#

97 CE2

98 CE#

99 SA

100 SA

26 VSS

27 VDDQ

28 NC DQd DQd

29 NC DQd DQd

30 NC NC DQd

31 MODE (LBO#)

32 SA

33 SA

34 SA

35 SA

36 SA1

37 SA0

38 DNU

39 DNU

40 VSS

41 VDD

42 DNU

43 DNU

44 SA

45 SA

46 SA

47 SA

48 SA

49 SA

50 SA

PIN # x18 x32 x36

TQFP PIN ASSIGNMENT TABLE

* Pins 83 and 84 are reserved for address expansion, 8Mb and 16Mb respectively.

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

PIN ASSIGNMENT (Top View)

100-Pin TQFP

NF**

ADV/LD#

OE# (G#)

CKE#

R/W#

CLK

CE2#

BWa#

BWb#

CE2

CE#

100

80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30

DQa

DNU

SA0

SA1

MODE

(LBO#)

DQb

x18

NF**

ADV/LD#

OE# (G#)

CKE#

R/W#

CLK

VSS

VDD

CE2#

BWa#

BWb#

BWc#

BWd#

CE2

CE#

100

80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30

NC/DQb*

DQb

VDDQ

VSS

DQb

VSS

VDDQ

DQb

VSS

VDD

DQa

VDDQ

VSS

DQa

VSS

VDDQ

DQa

NC/DQa*

DNU

VDD

VSS

DNU

SA0

SA1

MODE

(LBO#)

NC/DQc*

DQc

VDDQ

VSS

DQc

VSS

VDDQ

DQc

VSS

VDD

VSS

DQd

VDDQ

VSS

DQd

VSS

VDDQ

DQd

NC/DQd*

x32/x36

*No Connect (NC) is used on the x32 version. Parity (DQPx) is used on the x36 version.

**Pins 83 and 84 are reserved for address expansion, 8Mb and 16Mb respectively.

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

TQFP PIN DESCRIPTIONS

x18 x32/x36 SYMBOL TYPE DESCRIPTION

37 37 SA0 Input Synchronous Address Inputs: These inputs are registered

36 36 SA1 and must meet the setup and hold times around the rising

32-35, 44-50, 32-35, 44-50, SA edge of CLK. Pins 83 and 84 are reserved as address

80-82, 99, 100 81, 82, 99, 100 bits for the higher-density 8Mb and 16Mb ZBT SRAMs,

respectively. SA0 and SA1 are the two least significant bits

(LSB) of the address field and set the internal burst

counter if burst is desired.

93 93 BWa# Input Synchronous Byte Write Enables: These active LOW

94 94 BWb# inputs allow individual bytes to be written when a WRITE

–95 BWc# cycle is active and must meet the setup and hold times

–96 BWd# around the rising edge of CLK. BYTE WRITEs need to be

asserted on the same cycle as the address. BWa# controls

DQa pins; BWb# controls DQb pins; BWc# controls DQc

pins; BWd# controls DQd pins.

89 89 CLK Input Clock: This signal registers the address, data, chip enables,

byte write enables and burst control inputs on its rising

edge. All synchronous inputs must meet setup and hold

times around the clock’s rising edge.

98 98 CE# Input Synchronous Chip Enable: This active LOW input is used to

enable the device and is sampled only when a new

external address is loaded (ADV/LD# LOW).

92 92 CE2# Input Synchronous Chip Enable: This active LOW input is used to

enable the device and is sampled only when a new

external address is loaded (ADV/LD# LOW). This input can

be used for memory depth expansion.

97 97 CE2 Input Synchronous Chip Enable: This active HIGH input is used to

enable the device and is sampled only when a new

external address is loaded (ADV/LD# LOW). This input can

be used for memory depth expansion.

86 86 OE# Input Output Enable: This

active LOW, asynchronous input

(G#) enables the data I/O output drivers. G# is the JEDEC-

standard term for OE#.

85 85 ADV/LD# Input Synchronous Address Advance/Load: When HIGH, this

input is used to advance the internal burst counter,

controlling burst access after the external address is

loaded. When ADV/LD# is HIGH, R/W# is ignored. A LOW

on ADV/LD# clocks a new address at the CLK rising edge.

87 87 CKE# Input Synchronous Clock Enable: This active LOW input permits

CLK to propagate throughout the device. When CKE is

HIGH, the device ignores the CLK input and effectively

internally extends the previous CLK cycle. This input must

meet setup and hold times around the rising edge of CLK.

64 64 ZZ Input Snooze Enable: This active HIGH, asynchronous input

causes the device to enter a low-power standby mode in

which all data in the memory array is retained. When ZZ is

active, all other inputs are ignored.

(continued on next page)

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

TQFP PIN DESCRIPTIONS (continued)

x18 x32/x36 SYMBOL TYPE DESCRIPTION

88 88 R/W# Input Read/Write: This input determines the cycle type when

ADV/LD# is LOW and the only means for determining

READs and WRITEs. READ cycles may not be converted into

WRITEs (and vice versa) other than by loading a new

address. A LOW on this pin permits BYTE WRITE opera-

tions and must meet the setup and hold times around the

rising edge of CLK. Full bus-width WRITEs occur if all byte

write enables are LOW.

(a) 58, 59, 62, 63, (a) 52, 53, 56-59, DQa Input/ SRAM Data I/Os: Byte “a” is DQa pins; Byte “b” is DQb

68, 69, 72-74 62, 63 Output pins; Byte “c” is DQc pins; Byte “d” is DQd pins. Input data

(b) 8, 9, 12, 13, (b) 68, 69, 72-75, DQb must meet setup and hold times around the rising edge

18, 19, 22-24 78, 79 CLK.

12, 13

(d) 18, 19, 22-25, DQd

28, 29

N/A 51 NC/DQa NC/ No Connect/Data Bits: On the x32 version, these pins are

80 NC/DQb I/O no connect (NC) and can be left floating or connected to

1NC/DQc GND to minimize thermal impedance. On the x36 version,

30 NC/DQd these bits are DQs.

31 31 MODE Input Mode: This input selects the burst sequence. A LOW on

(LBO#) this pin selects linear burst. NC or HIGH on this pin selects

interleaved burst. Do not alter input state while device is

operating. LBO# is the JEDEC-standard term for MODE.

1-3, 6, 7, 25, N/A NC NC No Connect: These pins can be left floating or connected

28-30, 51-53, 56, to GND to minimize thermal impedance.

57, 75, 78, 79,

95, 96

83, 84 83, 84 NF –No Function: These pins are internally connected to the

die and will have the capacitance of input pins. It is

allowable to leave these pins unconnected or driven by

signals. Reserved for address expansion, pin 83 becomes

an SA at 8Mb density and pin 84 becomes an SA at 16Mb

density.

38, 39, 42, 43 38, 39, 42, 43 DNU –Do Not Use: These signals may either be unconnected or

wired to GND to minimize thermal impedance.

15, 16, 41, 65, 91 15, 16, 41, 65, 91 V

Supply Power Supply:

See DC Electrical Characteristics and

Operating Conditions for range.

4, 11, 20, 27, 4, 11, 20, 27, V

Q Supply Isolated Output Buffer Supply:

See DC Electrical

54, 61, 70, 77 54, 61, 70, 77 Characteristics and Operating Conditions for range.

5, 10, 14, 17, 21, 5, 10, 14, 17, 21, V

Supply Ground:

GND.

26, 40, 55, 60, 26, 40, 55, 60,

66, 67, 71, 76, 90 66, 67, 71, 76, 90

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

PIN LAYOUT (TOP VIEW)

165-PIN FBGA

CE#

CE2

DQb

DQPb

MODE

(LBO#)

BWb#

BWa#

DNU

CE2#

CLK

SA1

SA0

CKE#

R/W#

DNU

ADV/LD#

OE# (G#)

DQa

DQPa

DQa

TOP VIEW

3456789

10 11

CE#

CE2

DQc

DQd

NC/DQPc

DQc

DQd

NC/DQPd

MODE

(LBO#)

BWc#

BWd#

BWb#

BWa#

DNU

CE2#

CLK

SA1

SA0

CKE#

R/W#

DNU

ADV/LD#

OE# (G#)

DQb

DQa

NC/DQPb

DQb

DQa

NC/DQPa

TOP VIEW

3456789

10 11

x18 x32/x36

*No Connect (NC) is used on the x32 version. Parity (DQPx) is used on the x36 version.

NOTE: Pins 9A, and 9B reserved for address pin expansion; 8Mb, and 16Mb respectively.

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

FBGA PIN DESCRIPTIONS

x18 x32/x36 SYMBOL TYPE DESCRIPTION

6R 6R SA0 Input Synchronous Address Inputs: These inputs are registered and must

6P 6P SA1 meet the setup and hold times around the rising edge of CLK.

2A, 2B, 3P, 3R, 2A, 2B, 3P, 3R, SA

4P, 4R, 8P, 8R, 4P, 4R, 8P, 8R,

9P, 9R, 10A, 9P, 9R, 10A,

10B, 10P, 10B, 10P,

10R, 11A, 11R 10R, 11R

5B 5B BWa# Input Synchronous Byte Write Enables: These active LOW inputs allow

4A 5A BWb# individual bytes to be written and must meet the setup and hold

–4A BWc# times around the rising edge of CLK. A byte write enable is LOW

–4B BWd# for a WRITE cycle and HIGH for a READ cycle. For the x18 version,

BWa# controls DQas and DQPa; BWb# controls DQbs and DQPb. For

the x32 and x36 versions, BWa# controls DQas and DQPa; BWb#

controls DQbs and DQPb; BWc# controls DQcs and DQPc; BWd#

controls DQds and DQPd. Parity is only available on the x18 and x36

versions.

6B 6B CLK Input Clock: This signal registers the address, data, chip enable, byte write

enables, and burst control inputs on its rising edge. All synchronous

inputs must meet setup and hold times around the clock’s rising

edge.

3A 3A CE# Input Synchronous Chip Enable: This active LOW input is used to enable

the device. CE# is sampled only when a new external address is

loaded. (ADV/LD# LOW)

6A 6A CE2# Input Synchronous Chip Enable: This active LOW input is used to enable

the device and is sampled only when a new external address is

loaded.

7A 7A CKE# Input Synchronous Clock Enable: This active LOW input permits CLK to

propagate throughout the device. When CKE# is HIGH, the device

ignores the CLK input and effectively internally extends the

previous CLK cycle. This input must meet setup and hold times

around the rising edge of CLK.

11H 11H ZZ Input Snooze Enable: This active HIGH, asynchronous input causes the

device to enter a low-power standby mode in which all data in the

memory array is retained. When ZZ is active, all other inputs are

ignored.

7B 7B R/W# Input Read/Write: This input determines the cycle type when ADV/LD# is

LOW and is the only means for determining READs and WRITEs.

READ cycles may not be converted into WRITEs (and vice versa)

other than by loading a new address. A LOW on this pin permits

BYTE WRITE operations and must meet the setup and hold times

around the rising edge of CLK. Full bus-width WRITEs occur if all

byte write enables are LOW.

3B 3B CE2 Input Synchronous Chip Enable: This active HIGH input is used to enable

the device and is sampled only when a new external address is

loaded.

8B 8B OE#(G#) Input Output Enable: This active LOW, asynchronous input enables the

data I/O output drivers.

(continued on next page)

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

FBGA PIN DESCRIPTIONS (continued)

x18 x32/x36 SYMBOL TYPE DESCRIPTION

8A 8A ADV/LD# Input Synchronous Address Advance/Load: When HIGH, this input is

used to advance the internal burst counter, controlling burst

access after the external address is loaded. When ADV/LD# is

HIGH, R/W# is ingored. A LOW on ADV/LD# clocks a new

address at the CLK rising edge.

1R 1R MODE Input Mode: This input selects the burst sequence. A LOW on this input

(LB0#) selects “linear burst.” NC or HIGH on this input selects “interleaved

burst.” Do not alter input state while device is operating.

(a) 10J, 10K, (a) 10J, 10K, DQa Input/ SRAM Data I/Os: For the x18 version, Byte “a” is associated DQas;

10L, 10M, 11D, 10L, 10M, 11J, Output Byte “b” is associated with DQbs. For the x32 and x36 versions,

11E, 11F, 11G 11K, 11L, 11M Byte “a” is associated with DQas; Byte “b” is associated with DQbs;

(b) 1J, 1K, (b) 10D, 10E, DQb Byte “c” is associated with DQcs; Byte “d” is associated with DQds.

1L, 1M, 2D, 10F, 10G, 11D, Input data must meet setup and hold times around the rising edge

2E, 2F, 2G 11E, 11F, 11G of CLK.

1F, 1G, 2D,

2E, 2F, 2G

(d) 1J, 1K, 1L, DQd

1M, 2J, 2K,

2L, 2M

11C 11N NC/DQPa NC/ No Connect/Parity Data I/Os: On the x32 version, these are No

1N 11C NC/DQPb I/O Connect (NC). On the x18 version, Byte “a” parity is DQPa; Byte “b”

–1C NC/DQPc parity is DQPb. On the x36 version, Byte “a” parity is DQPa; Byte

–1N NC/DQPd “b” parity is DQPb; Byte “c” parity is DQPc; Byte “d” parity is DQPd.

2H, 4D, 2H, 4D, V

Supply Power Supply: See DC Electrical Characteristics and Operating

4E, 4F, 4G, 4E, 4F, 4G, Conditions for range.

4H, 4J, 4K, 4H, 4J, 4K,

4L, 4M, 4L, 4M,

8D, 8E, 8F, 8D, 8E, 8F,

8G, 8H, 8J, 8G, 8H, 8J,

8K, 8L, 8M 8K, 8L, 8M

3C, 3D, 3E, 3C, 3D, 3E, V

Q Supply Isolated Output Buffer Supply: See DC Electrical Characteristics and

3F, 3G, 3J, 3F, 3G, 3J, Operating Conditions for range.

3K, 3L, 3M, 3K, 3L, 3M,

3N, 9C, 9D, 3N, 9C, 9D,

9E, 9F, 9G, 9E, 9F, 9G,

9J, 9K, 9L, 9J, 9K, 9L,

9M, 9N 9M, 9N

(continued on next page)

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

FBGA PIN DESCRIPTIONS (continued)

x18 x32/x36 SYMBOL TYPE DESCRIPTION

1H, 4C, 4N, 5C, 1H, 4C, 4N, 5C, V

Supply Ground: GND.

5D, 5E 5F, 5D, 5E 5F,

5G, 5H, 5J, 5G, 5H, 5J,

5K, 5L, 5M, 5K, 5L, 5M,

6C,

6D,

6E,

6F, 6C,

6D,

6E,

6F,

6G, 6H, 6J, 6G, 6H, 6J,

6K, 6L, 6M, 6K, 6L, 6M,

7C, 7D, 7E, 7C, 7D, 7E,

7F, 7G, 7H, 7F, 7G, 7H,

7J, 7K, 7L, 7J, 7K, 7L,

7M, 7N, 8C, 8N 7M, 7N, 8C, 8N

5P, 5R, 7P, 7R 5P, 5R, 7P, 7R DNU –Do Not Use: These signals may either be unconnected or wired to

GND to improve package heat dissipation.

1A, 1B, 1C, 1A, 1B, 1P, N C –No Connect: These signals are not internally connected and may

1D, 1E, 1F, 2C, 2N, 2P, be connected to ground to improve package heat dissipation.

1G, 1P, 2C, 2R, 3H, 5N, Pins 9A, and 9B reserved for address pin expansion; 8Mb, and

2J, 2K, 2L, 6N, 9A, 9B, 16M b respectively.

2M, 2N, 2P, 9H, 10C, 10H,

2R, 3H, 4B, 10N, 11A,

5A, 5N, 6N, 11B, 11P

9A, 9B, 9H,

10C, 10D,

10E, 10F,

10G, 10H,

10N, 11B,

11J, 11K,

11L, 11M,

11N, 11P

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

PIN LAYOUT (TOP VIEW)

119-PIN BGA

x18 x32/x36

NOTE: 1. Pins 6B and 2B reserved for address pin expansion; 8Mb and 16Mb respectively.

2. No Connect (NC) is used on the x32 version. Parity (DQPx) is used on the x36 version.

3. Pin 3J does not have to be connected directly to VDD if the input voltage is ≥ VIH.

4. Pins 5J and 5R do not have to be connected directly to VSS if the input voltage is ≤ VIH.

DQc

DQd

CE2**

NF/DQPc*

DQc

DQd

NF/DQPd*

DNU

BWc#

BWd#

MODE (LBO#)

DNU

ADSP#

ADSC#

CE#

OE#

ADV#

GW#

CLK

BWE#

SA1

SA0

DNU

BWb#

BWa#

DD‡

DNU

NF/DQPb*

DQb

DQa

NF/DQPa*

DQb

DQa

TOP VIEW

234567

DQb

CE2**

DQb

DQPb

DNU

BWb#

MODE (LBO#)

DNU

ADSP#

ADSC#

CE#

OE#

ADV#

GW#

CLK

BWE#

SA1

SA0

DNU

BWa#

DD‡

DNU

DQPa

DQa

TOP VIEW

234567

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

BGA PIN DESCRIPTIONS

x18 x32/x36 SYMBOL TYPE DESCRIPTION

4P 4P SA0 Input Synchronous Address Inputs: These inputs are registered and

4N 4N SA1 must meet the setup and hold times around the rising edge

2A, 3A, 5A, 2A, 2C, 2R, S A of CLK.

6A, 3B, 5B, 3A, 3B, 3C,

2C, 3C, 5C, 3T, 4T, 5A,

6C, 2R, 6R, 5B, 5C, 5T,

2T, 3T, 5T, 6T 6A, 6C, 6R

5L 5L BWa# Input Synchronous Byte Write Enables: These active LOW inputs allow

3G 5G BWb# individual bytes to be written and must meet the setup and hold

–3G BWc# times around the rising edge of CLK. A byte write enable is LOW

–3L BWd# for a WRITE cycle and HIGH for a READ cycle. For the x18 version,

BWa# controls DQa’s and DQPa; BWb# controls DQb’s and DQPb.

For the x32 and x36 versions, BWa# controls DQa’s and DQPa;

BWb# controls DQb’s and DQPb; BWc# controls DQc’s and DQPc;

BWd# controls DQd’s and DQPd. Parity is only available on the x18

and x36 versions.

4M 4M CKE# Input Synchronous Clock Enable: This active LOW input permits CLK to

propagate throughout the device. When CKE# is HIGH, the

device ignores the CK input and effectively internally extends

the previous CLK cycle. This input must meet the setup and

hold times around the rising edge of CLK.

4H 4H R/W# Input Read/Write: This input determines the cycle type when ADV/

LD# is lOW and is the only means for determining READs and

WRITEs. READ cycles may not be converted into WRITEs (and

vice versa) other than by loading a new address. A LOW on this

pin permits BYTE WRITE operations must meet the setup and

hold times around the rising edge of CLK. Full bus-width

WRITEs occur if all byte write enables are LOW.

4K 4K CLK Input Clock: This signal registers the address, data, chip enable, byte write

enables and burst control inputs on its rising edge. All synchronous

inputs must meet setup and hold times around the clock’s rising

edge.

4E 4E CE# Input Synchronous Chip Enable: This active LOW input is used to enable

the device and conditions the internal use of ADSP#. CE# is sampled

only when a new external address is loaded.

6B 6B CE2# Input Synchronous Chip Enable: This active LOW input is used to enable

the device and is sampled only when a new external address is

loaded.

7T 7T ZZ Input Snooze Enable: This active HIGH, asynchronous input causes the

device to enter a low-power standby mode in which all data in the

memory array is retained. When ZZ is active, all other inputs are

ignored.

2B 2B CE2 Input Synchronous Chip Enable: This active HIGH input is used to enable

the device and is sampled only when a new external address is

loaded.

(continued on next page)

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

BGA PIN DESCRIPTIONS (continued)

x18 x32/x36 SYMBOL TYPE DESCRIPTION

4F 4F OE# Input Output Enable: This

active LOW, asynchronous input enables the

data I/O output drivers.

4B 4B ADV#/LD# Input Synchronous Address Advance/Load: When HIGH, this input is

used to advance the internal burst counter, controlling burst

access after the external addressis loaded. When ADV#/LD# is

HIGH, R/W# is ignored. A LOW on ADV#/LD# clocks a new

address at the CLK rising edge.

3R 3R MODE Input Mode: This input selects the burst sequence. A LOW on this

input selects “linear burst.” NC or HIGH on this input selects

“interleaved burst.” Do not alter input state while device is

operating.

4A, 4G 4A, 4G NF Input No Function: These pins are internally connected to the die and

will have the capacitance of input pins. It is allowable to leave

these pins unconnected or driven by signals. These pins are

reserved for address expansion; 4G becomes an SA at 8Mb

density and 4A becomes an SA at 16Mb density.

(a) 6F, 6H, 6L, (a) 6K, 6L, DQa Input/ SRAM Data I/Os: For the x18 version, Byte “a” is DQa’s; Byte “b”

6N, 7E, 7G, 6M, 6N, 7K, Output is DQb’s. For the x32 and x36 versions, Byte “a” is DQa’s;

7K, 7P 7L, 7N, 7P Byte “b” is DQb’s; Byte “c” is DQc’s; Byte “d” is DQd’s. Input

(b) 1D, 1H, (b) 6E, 6F, DQb data must meet setup and hold times around the rising edge of

1L, 1N, 2E, 6G, 6H, 7D, CLK.

2G, 2K, 2M 7E, 7G, 7H

1G, 1H, 2E,

2F, 2G, 2H

(d) 1K, 1L, DQd

1N, 1P, 2K,

2L, 2M, 2N

6D 6P NC/DQPa NC/ No Connect/Parity Data I/Os: On the x32 version, these are No

2P 6D NC/DQPb I/O Connect (NC). On the x18 version, Byte “a” parity is DQPa; Byte

–2D NC/DQPc “b” parity is DQPb. On the x36 version, Byte “a” parity is DQPa;

–2P NC/DQPd Byte “b” parity is DQPb; Byte “c” parity is DQPc; Byte “d” parity

is DQPd.

2J, 4C, 4J, 2J, 4C, 4J, V

Supply Power Supply: See DC Electrical Characteristics and Operating

4R, 5R, 6J 4R, 5R, 6J Conditions for range.

1A, 1F, 1J, 1A, 1F, 1J, V

Q Supply Isolated Output Buffer Supply: See DC Electrical Characteristics

1M, 1U, 7A, 1M, 1U, 7A, and Operating Conditions for range.

7F, 7J, 7M, 7F, 7J, 7M,

7U 7U

(continued on next page)

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

x18 x32/x36 SYMBOL TYPE DESCRIPTION

3D, 3E, 3F, 3D, 3E, 3F, V

Supply Ground: GND.

3H, 3K, 3L, 3H, 3K, 3M,

3M, 3N, 3P, 3N, 3P, 5D,

5D, 5E, 5F, 5E, 5F, 5H,

5G, 5H, 5K, 5K, 5M, 5N,

5M, 5N, 5P 5P

2U, 3U, 4U, 2U, 3U, 4U, DNU –Do Not Use: These signals may either be unconnected or wired

5U 5U to GND to improve package heat dissipation.

1B, 1C, 1E, 1B, 1C, 1R, N C –No Connect: These signals are not internally connected and

1G, 1K, 1P, 1T, 2T, 3J, may be connected to ground to improve package heat

1R, 1T, 2D, 4D, 4L, 5J, dissipation.

2F, 2H, 2L, 6T, 6U, 7B,

2N, 3J, 4D, 7C, 7R

4L, 4T, 5J,

6E, 6G, 6K,

6M, 6P, 6U,

7B, 7C, 7D,

7H, 7L, 7N,

BGA PIN DESCRIPTIONS (continued)

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

FUNCTION R/W# BWa# BWb# BWc# BWd#

READ H X X X X

WRITE Byte “a”LLHHH

WRITE Byte “b”LHLHH

WRITE Byte “c”LHHLH

WRITE Byte “d”LHHHL

WRITE All Bytes L L L L L

WRITE ABORT/NOP L H H H H

FUNCTION R/W# BWa# BWb#

READ H X X

WRITE Byte “a”LLH

WRITE Byte “b”LHL

WRITE All Bytes L L L

WRITE ABORT/NOP L H H

INTERLEAVED BURST ADDRESS TABLE (MODE = NC OR HIGH)

FIRST ADDRESS (EXTERNAL) SECOND ADDRESS (INTERNAL) THIRD ADDRESS (INTERNAL) FOURTH ADDRESS (INTERNAL)

X...X00 X...X01 X...X10 X...X11

X...X01 X...X00 X...X11 X...X10

X...X10 X...X11 X...X00 X...X01

X...X11 X...X10 X...X01 X...X00

LINEAR BURST ADDRESS TABLE (MODE = LOW)

FIRST ADDRESS (EXTERNAL) SECOND ADDRESS (INTERNAL) THIRD ADDRESS (INTERNAL) FOURTH ADDRESS (INTERNAL)

X...X00 X...X01 X...X10 X...X11

X...X01 X...X10 X...X11 X...X00

X...X10 X...X11 X...X00 X...X01

X...X11 X...X00 X...X01 X...X10

PARTIAL TRUTH TABLE FOR READ/WRITE COMMANDS (x18)

NOTE: Using R/W# and byte write(s), any one or more bytes may be

written.

NOTE: Using R/W# and byte write(s), any one or more bytes may be written.

PARTIAL TRUTH TABLE FOR READ/WRITE COMMANDS (x32/x36)

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

State Diagram for ZBT SRAM

DESELECT

BEGIN

READ

BURST

READ

BEGIN

WRITE

DS DS

BURST

WRITE

READ

WRITE

BURST

READ

WRITE

READ

BURSTBURST

READ

BURST

WRITE

KEY: COMMAND

READ

WRITE

BURST

OPERATION

DESELECT

New READ

New WRITE

BURST READ,

BURST WRITE or

CONTINUE DESELECT

BURSTREAD

WRITE

NOTE: 1. A STALL or IGNORE CLOCK EDGE cycle is not shown in the above diagram. This is because CKE# HIGH only blocks the

clock (CLK) input and does not change the state of the device.

2. States change on the rising edge of the clock (CLK).

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

TRUTH TABLE

(Notes 5-10)

OPERATION ADDRESS CE# CE2# CE2 ZZ ADV/ R/W# BWx OE# CKE# CLK DQ NOTES

USED LD#

DESELECT Cycle None H X X L L X X X L LÆH High-Z

DESELECT Cycle None X H X L L X X X L LÆH High-Z

DESELECT Cycle None X X L L L X X X L LÆH High-Z

CONTINUE DESELECT Cycle None X X X L H X X X L LÆH High-Z 1

READ Cycle External L L H L L H X L L LÆHQ

(Begin Burst)

READ Cycle Next X X X L H X X L L LÆH Q 1, 11

(Continue Burst)

NOP/DUMMY READ External L L H L L H X H L LÆH High-Z 2

(Begin Burst)

DUMMY READ Next X X X L H X X H L LÆH High-Z 1, 2,

(Continue Burst) 11

WRITE Cycle External L L H L L L L X L LÆHD 3

(Begin Burst)

WRITE Cycle Next X X X L H X L X L LÆH D 1, 3,

(Continue Burst) 11

NOP/WRITE ABORT None L L H L L L H X L LÆH High-Z 2, 3

(Begin Burst)

WRITE ABORT Next X X X L H X H X L LÆH High-Z 1, 2,

(Continue Burst) 3, 11

IGNORE CLOCK EDGE Current X X X L X X X X H LÆH–4

(Stall)

SNOOZE MODE None X X X H X X X X X X High-Z

NOTE: 1. CONTINUE BURST cycles, whether READ or WRITE, use the same control inputs. The type of cycle performed (READ or

WRITE) is chosen in the initial BEGIN BURST cycle. A CONTINUE DESELECT cycle can only be entered if a DESELECT cycle

is executed first.

2. DUMMY READ and WRITE ABORT cycles can be considered NOPs because the device performs no external operation.

A WRITE ABORT means a WRITE command is given, but no operation is performed.

3. OE# may be wired LOW to minimize the number of control signals to the SRAM. The device will automatically turn off

the output drivers during a WRITE cycle. Some users may use OE# when the bus turn-on and turn-off times do not

meet their requirements.

4. If an IGNORE CLOCK EDGE command occurs during a READ operation, the DQ bus will remain active (Low-Z). If it

occurs during a WRITE cycle, the bus will remain in High-Z. No WRITE operations will be performed during the IGNORE

CLOCK EDGE cycle.

5. X means “Don’t Care.” H means logic HIGH. L means logic LOW. BWx = H means all byte write signals (BWa#, BWb#,

BWc# and BWd#) are HIGH. BWx = L means one or more byte write signals are LOW.

6. BWa# enables WRITEs to Byte “a” (DQas); BWb# enables WRITEs to Byte “b” (DQbs); BWc# enables WRITEs to

Byte “c” (DQcs); BWd# enables WRITEs to Byte “d” (DQds).

7. All inputs except OE# and ZZ must meet setup and hold times around the rising edge (LOW to HIGH) of CLK.

8. Wait states are inserted by setting CKE# HIGH.

9. This device contains circuitry that will ensure that the outputs will be in High-Z during power-up.

10. The device incorporates a 2-bit burst counter. Address wraps to the initial address every fourth BURST cycle.

11. The address counter is incremented for all CONTINUE BURST cycles.

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

ABSOLUTE MAXIMUM RATINGS*

Voltage on VDD Supply

Relative to VSS ............................... -0.5V to +4.6V

Voltage on VDDQ Supply

Relative to VSS ..........................................-0.5V to VDD

VIN ........................................... -0.5V to VDDQ + 0.5V

Storage Temperature (plastic) ............-55°C to +150°C

Junction Temperature**................................... +150°C

Short Circuit Output Current...........................100mA

*Stresses greater than those listed under “Absolute

Maximum Ratings” may cause permanent damage to

the device. This is a stress rating only, and functional

operation of the device at these or any other conditions

above those indicated in the operational sections of

this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may

affect reliability.

**Junction temperature depends upon package type,

cycle time, loading, ambient temperature and airflow.

See Micron Technical Note TN-05-14 for more

information.

3.3V I/O DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS

(0°C ≤ TA ≤ +70°C; VDD, VDDQ = +3.3V ±0.165V unless otherwise noted)

DESCRIPTION CONDITIONS SYMBOL MIN MAX UNITS NOTES

Input High (Logic 1) Voltage VIH 2.0 VDD + 0.3 V 1, 2

Input High (Logic 1) Voltage DQ pins VIH 2.0 VDD + 0.3 V 1, 2

Input Low (Logic 0) Voltage VIL -0.3 0.8 V 1, 2

Input Leakage Current 0V ≤ VIN ≤ VDD ILI-1.0 1.0 µA 3

Output Leakage Current Output(s) disabled, ILO-1.0 1.0 µA

0V ≤ VIN ≤ VDD

Output High Voltage IOH = -4.0mA VOH 2.4 V 1, 4

Output Low Voltage IOL = 8.0mA VOL 0.4 V 1, 4

Supply Voltage VDD 3.135 3.465 V 1

Isolated Output Buffer Supply VDDQ 3.135 VDD V1, 5

NOTE: 1. All voltages referenced to VSS (GND).

2. Overshoot: VIH ≤ +4.6V for t ≤ tKHKH/2 for I ≤ 20mA

Undershoot: VIL ≥ -0.7V for t ≤ tKHKH/2 for I ≤ 20mA

Power-up: VIH ≤ +3.465V and VDD ≤ 3.135V for t ≤ 200ms

3. MODE pin has an internal pull-up, and input leakage = ±10µA.

4. The load used for VOH, VOL testing is shown in Figure 2. AC load current is higher than the shown DC values. AC I/O

curves are available upon request.

5. VDDQ should never exceed VDD. VDD and VDDQ can be externally wired together to the same power supply for 3.3V I/O

operation.

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

2.5V I/O DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS

(0°C ≤ TA ≤ +70°C; VDD = +3.3V ±0.165V; VDDQ = +2.5V +0.4V/-0.125V unless otherwise noted)

DESCRIPTION CONDITIONS SYMBOL MIN MAX UNITS NOTES

Input High (Logic 1) Voltage Data bus (DQx) V IHQ 1.7 VDDQ + 0.3 V 1, 2

Inputs VIH 1.7 VDD + 0.3 V 1, 2

Input Low (Logic 0) Voltage VIL -0.3 0.7 V 1, 2

Input Leakage Current 0V ≤ VIN ≤ VDD ILI-1.0 1.0 µA 3

Output Leakage Current Output(s) disabled, ILO-1.0 1.0 µA

0V ≤ VIN ≤ VDDQ (DQx)

Output High Voltage IOH = -2.0mA VOH 1.7 –V1

IOH = -1.0mA VOH 2.0 –V1

Output Low Voltage IOL = 2.0mA VOL –0.7 V 1

IOL = 1.0mA VOL –0.4 V 1

Supply Voltage VDD 3.135 3.6 V 1

Isolated Output Buffer Supply VDDQ 2.375 2.9 V 1

TQFP CAPACITANCE

DESCRIPTION CONDITIONS SYMBOL TYP MAX UNITS NOTES

Control Input Capacitance TA = 25°C; f = 1 MHz C I47pF4

Input/Output Capacitance (DQ) VDD = 3.3V CO4.5 5.5 pF 4

Address Capacitance CA47pF4

Clock Capacitance CCK 4.5 5.5 pF 4

NOTE: 1. All voltages referenced to VSS (GND).

2. Overshoot: VIH ≤ +4.6V for t ≤ tKHKH/2 for I ≤ 20mA

Undershoot: VIL ≥ -0.7V for t ≤ tKHKH/2 for I ≤ 20mA

Power-up: VIH ≤ +3.465V and VDD ≤ 3.135V for t ≤ 200ms

3. MODE pin has an internal pull-up, and input leakage = ±10µA.

4. This parameter is sampled.

5. Preliminary package data.

FBGA CAPACITANCE

DESCRIPTION CONDITIONS SYMBOL TYP MAX UNITS NOTES

Address/Control Input Capacitance CI2.5 3.5 pF 4, 5

Output Capacitance (Q) TA = 25°C; f = 1 MHz CO4 5 pF 4, 5

Clock Capacitance CCK 2.5 3.5 pF 4, 5

BGA CAPACITANCE

DESCRIPTION CONDITIONS SYMBOL TYP MAX UNITS NOTES

Address/Control Input Capacitance TA = 25°C; f = 1 MHz C I47pF4

Input/Output Capacitance (DQ) VDD = 3.3V CO4.5 5.5 pF 4

Address Capacitance CA47pF4

Clock Capacitance CCK 4.5 5.5 pF 4

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

IDD OPERATING CONDITIONS AND MAXIMUM LIMITS

(Note 1) (0°C ≤ TA ≤ +70°C; VDD = +3.3V ±0.165V unless otherwise noted)

DESCRIPTION CONDITIONS SYMBOL TYP -10 -11 -12 UNITS NOTES

Power Supply Device selected; All inputs ≤ VIL

Current: or ≥ VIH; Cycle time ≥ tKC (MIN); IDD 165 300 275 250 mA 2, 3, 4

Operating VDD = MAX; Outputs open

Power Supply Device selected; VDD = MAX;

Current: Idle CKE# ≥ VIH;IDD110 28 22 20 mA 2, 3, 4

All inputs ≤ VSS + 0.2 or ≥ VDD - 0.2;

Cycle time ≥ tKC (MIN)

CMOS Standby Device deselected; VDD = MAX;

All inputs ≤ VSS + 0.2 or ≥ VDD - 0.2; ISB20.5 10 10 10 mA 3, 4

All inputs static; CLK frequency = 0

TTL Standby Device deselected; VDD = MAX;

All inputs ≤ VIL or ≥ VIH;ISB36 252525mA3, 4

All inputs static; CLK frequency = 0

Clock Running Device deselected; VDD = MAX;

ADV/LD# ≥ VIH; All inputs ≤ VSS + 0.2 ISB437 65 65 60 mA 3, 4

or ≥ VDD - 0.2; Cycle time ≥ tKC (MIN)

SNOOZE MODE ZZ ≥ VIH ISB2Z0.5 10 10 10 mA 3, 4

MAX

NOTE: 1. VDDQ = +3.3V ±0.165V for 3.3V I/O configuration; VDDQ = +2.5V +0.4V/-0.125V for 2.5V I/O configuration.

2. IDD is specified with no output current and increases with faster cycle times. IDDQ increases with faster cycle times and

greater output loading.

3. “Device deselected” means device is in a deselected cycle as defined in the truth table. “Device selected” means device

is active (not in deselected mode).

4. Typical values are measured at 3.3V, 25°C and 12ns cycle time.

5. This parameter is sampled.

6. Preliminary package data.

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

NOTE: 1. This parameter is sampled.

2. Preliminary package data.

TQFP THERMAL RESISTANCE

DESCRIPTION CONDITIONS SYMBOL TYP UNITS NOTES

Thermal Resistance Test conditions follow standard test methods θJA 46 °C/W 1

(Junction to Ambient) and procedures for measuring thermal

Thermal Resistance impedance, per EIA/JESD51. θJC 2.8 °C/W 1

(Junction to Top of Case)

FBGA THERMAL RESISTANCE

DESCRIPTION CONDITIONS SYMBOL TYP UNITS NOTES

Junction to Ambient Test conditions follow standard test methods θJA 40 °C/W 1, 2

(Airflow of 1m/s) and procedures for measuring thermal

Junction to Case (Top) impedance, per EIA/JESD51. θJC 9°C/W 1, 2

Junction to Pins θJB 17 °C/W 1, 2

(Bottom)

BGA THERMAL RESISTANCE

DESCRIPTION CONDITIONS SYMBOL TYP UNITS NOTES

Junction to Ambient Test conditions follow standard test methods θJA 40 °C/W 1

(Airflow of 1m/s) and procedures for measuring thermal

Junction to Case (Top) impedance, per EIA/JESD51. θJC 9°C/W 1

Junction to Bumps θJB 17 °C/W 1

(Bottom)

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

NOTE: 1. Measured as HIGH above VIH and LOW below VIL.

2. Refer to Technical Note TN-55-01, “Designing with ZBT SRAMs,” for a more thorough discussion on these parameters.

3. This parameter is sampled.

4. This parameter is measured with the output loading shown in Figure 2 for 3.3V I/O and Figure 4 for 2.5V I/O.

5. Transition is measured ±200mV from steady state voltage.

6. OE# can be considered a “Don’t Care” during WRITEs; however, controlling OE# can help fine-tune a system for

turnaround timing.

7. This is a synchronous device. All addresses must meet the specified setup and hold times for all rising edges of CLK

when they are being registered into the device. All other synchronous inputs must meet the setup and hold times

with stable logic levels for all rising edges of clock (CLK) when the chip is enabled. Chip enable must be valid at each

rising edge of CLK when ADV/LD# is LOW to remain enabled.

8. Test conditions as specified with the output loading shown in Figure 1 for 3.3V I/O (VDDQ = +3.3V ±0.165V) and Figure

3 for 2.5V I/O (VDDQ = +2.5V +0.4V/-0.125V) unless otherwise noted.

9. A WRITE cycle is defined by R/W# LOW having been registered into the device at ADV/LD# LOW. A READ cycle is

defined by R/W# HIGH with ADV/LD# LOW. Both cases must meet setup and hold times.

AC ELECTRICAL CHARACTERISTICS

(Notes 6, 8, 9) (0°C ≤ TA ≤ +70°C; VDD = +3.3V ±0.165V)

-10 -11 -12

DESCRIPTION SYMBOL MIN MAX MIN MAX MIN MAX UNITS NOTES

Clock

Clock cycle time tKHKH 10 11 12 ns

Clock frequency fKF 100 90 83 MHz

Clock HIGH time tKHKL 2.5 3.0 3.0 ns 1

Clock LOW time tKLKH 2.5 3.0 3.0 ns 1

Output Times

Clock to output valid tKHQV 7.5 8.5 9.0 ns

Clock to output invalid tKHQX 3.0 3.0 3.0 ns 2

Clock to output in Low-Z tKHQX1 3.0 3.0 3.0 ns 2, 3, 4, 5

Clock to output in High-Z tKHQZ 5.0 5.0 5.0 ns 2, 3, 4, 5

OE# to output valid tGLQV 5.0 5.0 5.0 ns 6

OE# to output in Low-Z tGLQX 0 0 0 ns 2, 3, 4, 5

OE# to output in High-Z tGHQZ 5.0 5.0 5.0 ns 2, 3, 4, 5

Setup Times

Address tAVKH 2.0 2.2 2.5 ns 7

Clock enable (CKE#) tEVKH 2.0 2.2 2.5 ns 7

Control signals tCVKH 2.0 2.2 2.5 ns 7

Data-in tDVKH 2.0 2.2 2.5 ns 7

Hold Times

Address tKHAX 0.5 0.5 0.5 ns 7

Clock enable (CKE#) tKHEX 0.5 0.5 0.5 ns 7

Control signals tKHCX 0.5 0.5 0.5 ns 7

Data-in tKHDX 0.5 0.5 0.5 ns 7

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

Q50

V = 1.5V

Z = 50

Figure 1

Q351

317

5pF

+3.3V

Figure 2

3.3V I/O AC TEST CONDITIONS

Input pulse levels ...................................VSS to 3.3V

Input rise and fall times..................................... 1ns

Input timing reference levels .......................... 1.5V

Output reference levels ................................... 1.5V

Output load ............................. See Figures 1 and 2

LOAD DERATING CURVES

The Micron 256K x 18, 128K x 32, and 128K x 36 ZBT

SRAM timing is dependent upon the capacitive loading

on the outputs.

Consult the factory for copies of I/O current versus

voltage curves.

Q50Ω

V = 1.25V

Z = 50Ω

Figure 3

225Ω

5pF

+2.5V

Figure 4

2.5V I/O AC TEST CONDITIONS

Input pulse levels ...................................VSS to 2.5V

Input rise and fall times..................................... 1n s

Input timing reference levels ........................ 1.25V

Output reference levels ................................. 1.25V

Output load ............................. See Figures 3 and 4

3.3V I/O Output Load Equivalents 2.5V I/O Output Load Equivalents

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

SNOOZE MODE

SNOOZE MODE is a low-current, “power-down”

mode in which the device is deselected and current is

reduced to ISB2z. The duration of SNOOZE MODE is

dictated by the length of time the ZZ pin is in a HIGH

state. After the device enters SNOOZE MODE, all inputs

except ZZ become disabled and all outputs go to

High-Z.

The ZZ pin is an asynchronous, active HIGH input

that causes the device to enter SNOOZE MODE. When

the ZZ pin becomes a logic HIGH, ISB2z is guaranteed

after the time tZZI is met. Any READ or WRITE opera-

tion pending when the device enters SNOOZE MODE is

not guaranteed to complete successfully. Therefore,

SNOOZE MODE must not be initiated until valid pend-

ing operations are completed. Similarly, when exiting

SNOOZE MODE during tRZZ, only a DESELECT or

READ cycle should be given.

SNOOZE MODE ELECTRICAL CHARACTERISTICS

DESCRIPTION CONDITIONS SYMBOL MIN MAX UNITS NOTES

Current during SNOOZE MODE ZZ ≥ VIH ISB2Z 10 mA

Current during SNOOZE MODE ZZ ≥ VIH ISB2ZP 1mA

(P Version)

ZZ active to input ignored tZZ 0 tKHKH ns 1

ZZ inactive to input sampled tRZZ 0 tKHKH ns 1

ZZ active to snooze current tZZI tKHKH ns 1

ZZ inactive to exit snooze current tRZZI 0 ns 1

SNOOZE MODE WAVEFORM

tZZ

SUPPLY

CLK

tRZZ

ALL INPUTS

(except ZZ)

DON’T CARE

IISB2Z

tZZI

tRZZI

Outputs (Q)

High-Z

DESELECT

or READ Only

NOTE: 1. This parameter is sampled.

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

READ/WRITE TIMING

WRITE

D(A1)

123456789

CLK

tKHKH

tKLKH

tKHKL

CE#

tKHCX

tCVKH

R/W#

CKE#

tKHEX

tEVKH

BWx#

ADV/LD#

tKHAX

tAVKH

ADDRESS A1 A2 A3 A4 A5 A6 A7

tKHDX

tDVKH

COMMAND

tKHQX1

D(A1) D(A2) Q(A4)Q(A3)

D(A2+1)

tKHQX tKHQZ

tKHQV

WRITE

D(A2) BURST

WRITE

D(A2+1)

READ

Q(A3) READ

Q(A4) BURST

READ

Q(A4+1)

WRITE

D(A5) READ

Q(A6) WRITE

D(A7) DESELECT

OE#

tGLQV

tGLQX

tGHQZ

DON’T CARE UNDEFINED

D(A5)

tKHQX

Q(A4+1)

D(A7)Q(A6)

NOTE: 1. For this waveform, ZZ is tied LOW.

2. Burst sequence order is determined by MODE (0 = linear, 1 = interleaved). BURST operations are optional.

3. CE# represents three signals. When CE# = 0, it represents CE# = 0, CE2# = 0, CE2 = 1.

4. Data coherency is provided for all possible operations. If a READ is initiated, the most current data is used. The most

recent data may be from the input data register.

-10 -11 -12

SYM MIN MAX MIN MAX MIN MAX UNITS

tGHQZ 5.0 5.0 5.0 ns

tAVKH 2.0 2.2 2.5 ns

tEVKH 2.0 2.2 2.5 ns

tCVKH 2.0 2.2 2.5 ns

tDVKH 2.0 2.2 2.5 ns

tKHAX 0.5 0.5 0.5 ns

tKHEX 0.5 0.5 0.5 ns

tKHCX 0.5 0.5 0.5 ns

tKHDX 0.5 0.5 0.5 ns

READ/WRITE TIMING PARAMETERS

-10 -11 -12

SYM MIN MAX MIN MAX MIN MAX UNITS

tKHKH 10 11 12 ns

fKF 100 90 83 MHz

tKHKL 2.5 3.0 3.0 ns

tKLKH 2.5 3.0 3.0 ns

tKHQV 7.5 8.5 9.0 ns

tKHQX 3.0 3.0 3.0 ns

tKHQX1 3.0 3.0 3.0 ns

tKHQZ 5.0 5.0 5.0 ns

tGLQV 5.0 5.0 5.0 ns

tGLQX 0 0 0 ns

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

NOP, STALL, AND DESELECT CYCLES

READ

Q(A3)

45678910

A3 A4 A5

D(A4)

123

CLK

CE#

R/W#

CKE#

BWx#

ADV/LD#

ADDRESS

COMMAND

WRITE

D(A4) STALLWRITE

D(A1) READ

Q(A2) STALL NOP READ

Q(A5) DESELECT CONTINUE

DESELECT

DON’T CARE UNDEFINED

tKHQZ

A1 A2

Q(A2)D(A1) Q(A3)

tKHQX

Q(A5)

NOTE: 1. The IGNORE CLOCK EDGE or STALL cycle (clock 3) illustrates CKE# being used to create a “pause.” A WRITE is not

performed during this cycle.

2. For this waveform, ZZ and OE# are tied LOW.

3. CE# represents three signals. When CE# = 0, it represents CE# = 0, CE2# = 0, CE2 = 1.

4. Data coherency is provided for all possible operations. If a READ is initiated, the most current data is used. The most

recent data may be from the input data register.

NOP, STALL, AND DESELECT TIMING PARAMETERS

-10 -11 -12

SYM MIN MAX MIN MAX MIN MAX UNITS

tKHQX 3.0 3.0 3.0 ns

tKHQZ 5.0 5.0 5.0 ns

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

100-PIN PLASTIC TQFP (JEDEC LQFP)

14.00 ±0.10

20.10 ±0.10

0.62

22.10 +0.10

-0.15

16.00 +0.20

-0.05

PIN #1 ID

0.65

1.50 ±0.10

0.25

0.60 ±0.15 1.40 ±0.05

0.32 +0.06

-0.10

0.15 +0.03

-0.02

0.10 +0.10

-0.05

DETAIL A

1.00 (TYP)

GAGE PLANE

0.10

NOTE: 1. All dimensions in millimeters MAX or typical where noted.

MIN

2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

165-PIN FBGA

NOTE: 1. All dimensions in millimeters MAX or typical where noted.

MIN

10.00

14.00

15.00 ±0.10

1.00

TYP

1.00

TYP

5.00 ±0.05

13.00 ±0.10

PIN A1 ID

BALL A1

MOLD COMPOUND: EPOXY NOVOLAC

SUBSTRATE: PLASTIC LAMINATE

6.50 ±0.05

7.00 ±0.05

7.50 ±0.05

1.20 MAX

SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb

SOLDER BALL PAD: Ø .33mm

SOLDER BALL DIAMETER REFERS

TO POST REFLOW CONDITION. THE

PRE-REFLOW DIAMETER IS Ø 0.40

SEATING PLANE

0.85 ±0.075 0.12 C

165X Ø 0.45

BALL A11

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

7.62

20.32

19.94 ±0.10

11.94 ±0.10

1.27 (TYP)

0.60 ±0.10

2.40 MAX

0.90 ±0.10

14.00 ±0.10

22.00 ±0.20

A1 CORNER

(dimension applies to a

noncollapsed solder ball)

Substrate material:

BT resin laminate

0.15

SEATING PLANE

0.75 ±0.15

NOTE: 1. All dimensions in millimeters MAX or typical where noted.

MIN

2. Solder ball land pad is 0.6mm.

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900

E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992

Micron is a registered trademark adn the Micron logo and M logo are trademarks of Micron Technology, Inc.

ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc., and the architecture is supported by

Micron Technology, Inc., and Motorola, Inc.

119-PIN BGA

• Operating Temperature Range

Commercial (0°C to +70°C)None

4Mb: 256K x 18, 128K x 32/36 Flow-Through ZBT SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

4Mb: 256K x 18, 128K x 32/36

FLOW-THROUGH ZBT SRAM

REVISION HISTORY

Removed note "Not Recommended for New Designs," Rev. 6/01 ................................................................June 7/01

Added Industrial Temperature note and references, Rev. 3/01, FINAL.....................................................March 6/01

Added 119-pin PBGA package, Rev. 1/01, FINAL ................................................................................. January 10/01

Removed FBGA Part Marking Guide, REV 8/00-A, FINAL .................................................................... August/22/00

Changed FBGA capacitance values, REV 8/00, FINAL............................................................................. August/7/00

CI; TYP 2.5pF from 4pF; MAX. 3.5pF from 5pF

CO; TYP 4pF from 6pF; MAX. 5pF from 7pF

CCK; TYP 2.5pF from 5pF; MAX. 3.5pF from 6pF

Added FBGA Part Marking Guide, Rev. 7/00, Preliminary .......................................................................... July 12/00

Added revision history

Added 165-pin FBGA package, Rev. 6/00, Preliminary ............................................................................... May 23/00

Removed all “Smart ZBT” references