1. General description
The 74AHC244; 74AHCT244 is a high-speed Si-gate CMOS device.
The 74AHC244; 74AHCT244 has octal non-inverting buffer/line drivers with 3-state
outputs. The 3-state outputs are controlled by the output enable inputs (nOE). A HIGH on
nOE causes the outputs to assume a high-impedance OFF-state.
2. Features
■Balanced propagation delays
■All inputs have a Schmitt-trigger action
■Inputs accepts voltages higher than VCC
■For 74AHC244 only: operates with CMOS input levels
■For 74AHCT244 only: operates with TTL input levels
■ESD protection:
◆HBM JESD22-A114E exceeds 2000 V
◆MM JESD22-A115-A exceeds 200 V
◆CDM JESD22-C101C exceeds 1000 V
■Multiple package options
■Specified from −40 °C to +85 °C and from −40 °C to +125 °C
3. Ordering information
74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
Rev. 05 — 20 December 2007 Product data sheet
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
74AHC244D −40 °C to +125 °C SO20 plastic small outline package; 20 leads;
body width 7.5 mm SOT163-1
74AHCT244D
74AHC244PW −40 °C to +125 °C TSSOP20 plastic thin shrink small outline package; 20 leads;
body width 4.4 mm SOT360-1
74AHCT244PW
74AHC244BQ −40 °C to +125 °C DHVQFN20 plastic dual-in-line compatible thermal enhanced
very thin quad flat package; no leads; 20 terminals;
body 2.5 ×4.5 ×0.85 mm
SOT764-1
74AHCT244BQ
74AHC_AHCT244_5 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 05 — 20 December 2007 2 of 16
NXP Semiconductors 74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
4. Functional diagram
Fig 1. Functional diagram
mna170
1A3
1A2
1A1
1A0
2
4
6
8
1
1Y0
1Y1
18
16
14
12
1Y2
1Y3
1OE
2A3
2A2
2A1
2A0
17
15
13
11
19
2Y0
2Y1
3
5
7
9
2Y2
2Y3
2OE
Fig 2. Logic symbol Fig 3. IEC logic symbol
mna874
8
6
4
2
1A0
1A1
1A2
1A3
1OE
18
16
1Y0
1Y1
1Y2
1Y3
14
12
1
11
13
15
17
2A0
2A1
2A2
2A3
2OE
3
5
2Y0
2Y1
2Y2
2Y3
7
9
19
12
14
2
4
6
8
18
16
1EN
mna873
3
5
11
13
15
17
9
7
19 EN
74AHC_AHCT244_5 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 05 — 20 December 2007 3 of 16
NXP Semiconductors 74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
5. Pinning information
5.1 Pinning
5.2 Pin description
(1) The die substrate is attached to this pad using
conductive die attach material. It can not be used as
a supply pin or input.
Fig 4. Pin configuration SO20, TSSOP20 Fig 5. Pin configuration DHVQFN20
74AHC244
74AHCT244
1OE VCC
1A0 2OE
2Y0 1Y0
1A1 2A0
2Y1 1Y1
1A2 2A1
2Y2 1Y2
1A3 2A2
2Y3 1Y3
GND 2A3
001aae258
1
2
3
4
5
6
7
8
9
10
12
11
14
13
16
15
18
17
20
19
001aah079
74AHC244
74AHCT244
Transparent top view
1Y3
GND(1)
1A3
2Y3
2A2
2Y2 1Y2
1A2 2A1
2Y1 1Y1
1A1 2A0
2Y0 1Y0
1A0 2OE
GND
2A3
1OE
VCC
912
8 13
7 14
6 15
5 16
4 17
3 18
2 19
10
11
1
20
terminal 1
index area
Table 2. Pin description
Symbol Pin Description
1OE 1 output enable input (active LOW)
1A[0:3] 2, 4, 6, 8 data input
2A[0:3] 17, 15, 13, 11 data input
1Y[0:3] 18, 16, 14, 12 data output
2Y[0:3] 3, 5, 7, 9 data output
GND 10 ground (0 V)
2OE 19 output enable input (active LOW)
VCC 20 supply voltage
74AHC_AHCT244_5 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 05 — 20 December 2007 4 of 16
NXP Semiconductors 74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
6. Functional description
[1] H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF-state.
7. Limiting values
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] Ptot derates linearly with 8 mW/K above 70 °C.
[3] Ptot derates linearly with 5.5 mW/K above 60 °C.
[4] Ptot derates linearly with 4.5 mW/K above 60 °C.
Table 3. Function table[1]
Control Input Output
nOE nAn nYn
LLL
HH
HXZ
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage −0.5 +7.0 V
VIinput voltage −0.5 +7.0 V
IIK input clamping current VI < −0.5 V [1] −20 - mA
IOK output clamping current VO<−0.5 V or VO>V
CC + 0.5 V [1] -±20 mA
IOoutput current VO = −0.5 V to (VCC + 0.5 V) - ±25 mA
ICC supply current - 75 mA
IGND ground current −75 - mA
Tstg storage temperature −65 +150 °C
Ptot total power dissipation Tamb = −40 °C to +125 °C
SO20 package [2] - 500 mW
TSSOP20 package [3] - 500 mW
DHVQFN20 package [4] - 500 mW
74AHC_AHCT244_5 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 05 — 20 December 2007 5 of 16
NXP Semiconductors 74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
8. Recommended operating conditions
9. Static characteristics
Table 5. Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 74AHC244 74AHCT244 Unit
Min Typ Max Min Typ Max
VCC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V
VIinput voltage 0 - 5.5 0 - 5.5 V
VOoutput voltage 0 - VCC 0- V
CC V
Tamb ambient temperature −40 +25 +125 −40 +25 +125 °C
∆t/∆V input transition rise
and fall rate VCC = 3.3 V ± 0.3 V - - 100 - - - ns/V
VCC = 5.0 V ± 0.5 V - - 20 - - 20 ns/V
Table 6. Static characteristics
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 25 °C−40 °C to +85 °C−40 °C to +125 °C Unit
Min Typ Max Min Max Min Max
For type 74AHC244
VIH HIGH-level
input voltage VCC = 2.0 V 1.5 - - 1.5 - 1.5 - V
VCC = 3.0 V 2.1 - - 2.1 - 2.1 - V
VCC = 5.5 V 3.85 - - 3.85 - 3.85 - V
VIL LOW-level
input voltage VCC = 2.0 V - - 0.5 - 0.5 - 0.5 V
VCC = 3.0 V - - 0.9 - 0.9 - 0.9 V
VCC = 5.5 V - - 1.65 - 1.65 - 1.65 V
VOH HIGH-level
output voltage VI= VIH or VIL
IO=−50 µA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V
IO=−50 µA; VCC = 3.0 V 2.9 3.0 - 2.9 - 2.9 - V
IO=−50 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V
IO=−4.0 mA; VCC = 3.0 V 2.58 - - 2.48 - 2.40 - V
IO=−8.0 mA; VCC = 4.5 V 3.94 - - 3.8 - 3.70 - V
VOL LOW-level
output voltage VI= VIH or VIL
IO= 50 µA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V
IO= 50 µA; VCC = 3.0 V - 0 0.1 - 0.1 - 0.1 V
IO= 50 µA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V
IO= 4.0 mA; VCC = 3.0 V - - 0.36 - 0.44 - 0.55 V
IO= 8.0 mA; VCC = 4.5 V - - 0.36 - 0.44 - 0.55 V
IOZ OFF-state
output current VI =V
IH or VIL;
VO=V
CC or GND;
VCC = 5.5 V
--±0.25 - ±2.5 - ±10.0 µA
IIinput leakage
current VI= 5.5 Vor GND;
VCC = 0 V to 5.5 V - - 0.1 - 1.0 - 2.0 µA
ICC supply current VI=V
CC or GND; IO = 0 A;
VCC = 5.5 V - - 4.0 - 40 - 80 µA
74AHC_AHCT244_5 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 05 — 20 December 2007 6 of 16
NXP Semiconductors 74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
CIinput
capacitance - 3.0 10 - 10 - 10 pF
COoutput
capacitance - 4.0 - - - - - pF
For type 74AHCT244
VIH HIGH-level
input voltage VCC = 4.5 V to 5.5 V 2.0 - - 2.0 - 2.0 - V
VIL LOW-level
input voltage VCC = 4.5 V to 5.5 V - - 0.8 - 0.8 - 0.8 V
VOH HIGH-level
output voltage VI= VIH or VIL; VCC = 4.5 V
IO=−50 µA 4.4 4.5 - 4.4 - 4.4 - V
IO=−8.0 mA 3.94 - - 3.8 - 3.70 - V
VOL LOW-level
output voltage VI= VIH or VIL; VCC = 4.5 V
IO= 50 µA - 0 0.1 - 0.1 - 0.1 V
IO= 8.0 mA - - 0.36 - 0.44 - 0.55 V
IOZ OFF-state
output current per input pin; VI =V
IH or VIL;
VCC = 5.5 V; IO=0 A
VO=V
CC or GND;
other pins at VCC or GND
--±0.25 - ±2.5 - ±10.0 µA
IIinput leakage
current VI= 5.5 Vor GND;
VCC = 0 V to 5.5 V - - 0.1 - 1.0 - 2.0 µA
ICC supply current VI=V
CC or GND; IO = 0 A;
VCC = 5.5 V - - 4.0 - 40 - 80 µA
∆ICC additional
supply current per input pin;
VI=V
CC −2.1 V; IO= 0 A;
other pins at VCC or GND;
VCC = 4.5 V to 5.5 V
- - 1.35 - 1.5 - 1.5 mA
CIinput
capacitance - 3 10 - 10 - 10 pF
COoutput
capacitance - 4.0 - - - - - pF
Table 6. Static characteristics
…continued
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 25 °C−40 °C to +85 °C−40 °C to +125 °C Unit
Min Typ Max Min Max Min Max
74AHC_AHCT244_5 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 05 — 20 December 2007 7 of 16
NXP Semiconductors 74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
10. Dynamic characteristics
Table 7. Dynamic characteristics
GND = 0 V. For test circuit see Figure 8.
Symbol Parameter Conditions 25 °C−40 °C to +85 °C−40 °C to +125 °C Unit
Min Typ[1] Max Min Max Min Max
For type 74AHC244
tpd propagation
delay nAn to nYn; see Figure 6 [2]
VCC = 3.0 V to 3.6 V
CL= 15 pF - 5.0 8.4 1.0 10.0 1.0 10.5 ns
CL= 50 pF - 7.0 11.9 1.0 13.5 1.0 15.0 ns
VCC = 4.5 V to 5.5 V
CL= 15 pF - 3.4 5.5 1.0 6.5 1.0 7.0 ns
CL= 50 pF 5.0 7.5 1.0 8.5 1.0 9.5 ns
ten enable time nOE to nYn; see Figure 7 [2]
VCC = 3.0 V to 3.6 V
CL= 15 pF - 6.5 10.6 1.0 12.5 1.0 13.5 ns
CL= 50 pF - 7.5 14.1 1.0 16.0 1.0 18.0 ns
VCC = 4.5 V to 5.5 V
CL= 15 pF - 4.0 7.3 1.0 8.5 1.0 9.5 ns
CL= 50 pF - 5.5 9.3 1.0 10.5 1.0 12.0 ns
tdis disable time nOE to nYn; see Figure 7 [2]
VCC = 3.0 V to 3.6 V
CL= 15 pF - 5.5 9.7 1.0 11.0 1.0 12.5 ns
CL= 50 pF - 10.0 14.0 1.0 16.0 1.0 17.5 ns
VCC = 4.5 V to 5.5 V
CL= 15 pF - 4.8 7.2 1.0 8.5 1.0 9.0 ns
CL= 50 pF - 7.0 9.2 1.0 10.5 1.0 11.5 ns
CPD power
dissipation
capacitance
CL= 50 pF; fi = 1 MHz;
VI= GND to VCC
[3] -10- - - - -pF
74AHC_AHCT244_5 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 05 — 20 December 2007 8 of 16
NXP Semiconductors 74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
[1] Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V).
[2] tpd is the same as tPLH and tPHL.
ten is the same as tPZL and tPZH.
tdis is the same as tPLZ and tPHZ.
[3] CPD is used to determine the dynamic power dissipation PD(µW).
PD=C
PD ×VCC2×fi+∑(CL×VCC2×fo) where:
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC = supply voltage in Volts.
11. Waveforms
For type 74AHCT244
tpd propagation
delay nAn to nYn; see Figure 6 [2]
VCC = 4.5 V to 5.5 V
CL= 15 pF - 3.5 7.4 1.0 8.5 1.0 9.5 ns
CL= 50 pF - 5.0 8.4 1.0 9.5 1.0 10.5 ns
ten enable time nOE to nYn; see Figure 7
VCC = 4.5 V to 5.5 V
CL= 15 pF - 3.5 10.4 1.0 12.0 1.0 13.0 ns
CL= 50 pF - 5.5 11.4 1.0 13.0 1.0 14.5 ns
tdis disable time nOE to nYn; see Figure 7 [2]
VCC = 4.5 V to 5.5 V
CL= 15 pF - 5.0 9.4 1.0 10.0 1.0 12.0 ns
CL= 50 pF - 7.0 11.4 1.0 13.0 1.0 14.5 ns
CPD power
dissipation
capacitance
per buffer;
CL=50pF;f=1 MHz;
VI= GND to VCC
[3] -12- - - - -pF
Table 7. Dynamic characteristics
…continued
GND = 0 V. For test circuit see Figure 8.
Symbol Parameter Conditions 25 °C−40 °C to +85 °C−40 °C to +125 °C Unit
Min Typ[1] Max Min Max Min Max
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 6. Propagation delay input (nAn) to output (nYn)
mna171
nAn input
nYn output
tPLH tPHL
GND
VI
VM
VM
VM
VM
VOH
VOL
74AHC_AHCT244_5 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 05 — 20 December 2007 9 of 16
NXP Semiconductors 74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7. enable and disable times
001aae014
tPLZ
tPHZ
outputs
disabled outputs
enabled
VY
VX
outputs
enabled
nYn output
LOW-to-OFF
OFF-to-LOW
nYn output
HIGH-to-OFF
OFF-to-HIGH
nOE input
VI
VOL
VOH
VCC
VM
GND
GND
tPZL
tPZH
VM
VM
Table 8. Measurement points
Type Input Output
VMVMVXVY
74AHC244 0.5VCC 0.5VCC VOL + 0.3 V VOH − 0.3 V
74AHCT244 1.5 V 0.5VCC VOL + 0.3 V VOH − 0.3 V
74AHC_AHCT244_5 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 05 — 20 December 2007 10 of 16
NXP Semiconductors 74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
Test data is given in Table 9.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator
CL = Load capacitance including jig and probe capacitance
RL = Load resistor
S1 = Test selection switch
Fig 8. Load circuitry for switching times
VMVM
tW
tW
10 %
90 %
0 V
VI
VI
negative
pulse
positive
pulse
0 V
VMVM
90 %
10 %
tf
tr
tr
tf
001aad983
DUT
VCC VCC
VIVO
RT
RLS1
CL
open
PULSE
GENERATOR
Table 9. Test data
Type Input Load S1 position
VItr, tfCLRLtPHL, tPLH tPZH, tPHZ tPZL, tPLZ
74AHC244 VCC 3.0 ns 15 pF, 50 pF 1 kΩopen GND VCC
74AHCT244 3.0 V 3.0 ns 15 pF, 50 pF 1 kΩopen GND VCC
74AHC_AHCT244_5 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 05 — 20 December 2007 11 of 16
NXP Semiconductors 74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
12. Package outline
Fig 9. Package outline SOT163-1 (SO20)
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
2.65 0.3
0.1 2.45
2.25 0.49
0.36 0.32
0.23 13.0
12.6 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT163-1
10
20
wM
bp
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013
pin 1 index
0.1 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.51
0.49 0.30
0.29 0.05
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
99-12-27
03-02-19
74AHC_AHCT244_5 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 05 — 20 December 2007 12 of 16
NXP Semiconductors 74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
Fig 10. Package outline SOT360-1 (TSSOP20)
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 6.6
6.4 4.5
4.3 0.65 6.6
6.2 0.4
0.3 0.5
0.2 8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1 MO-153 99-12-27
03-02-19
wM
bp
D
Z
e
0.25
110
20 11
pin 1 index
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
y
0 2.5 5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1
A
max.
1.1
74AHC_AHCT244_5 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 05 — 20 December 2007 13 of 16
NXP Semiconductors 74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
Fig 11. Package outline SOT764-1 (DHVQFN20)
terminal 1
index area
0.51
A1Eh
b
UNIT ye
0.2
c
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 4.6
4.4
Dh
3.15
2.85
y1
2.6
2.4 1.15
0.85
e1
3.5
0.30
0.18
0.05
0.00 0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT764-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT764-1
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
20 terminals; body 2.5 x 4.5 x 0.85 mm
A(1)
max.
AA1c
detail X
y
y1C
e
L
Eh
Dh
e
e1
b
29
19 12
11
10
1
20
X
D
E
C
BA
terminal 1
index area
AC
CB
vM
wM
E(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D(1)
02-10-17
03-01-27
74AHC_AHCT244_5 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 05 — 20 December 2007 14 of 16
NXP Semiconductors 74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
13. Abbreviations
14. Revision history
Table 10. Abbreviations
Acronym Description
CDM Charge Device Model
CMOS Complementary Metal Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
TTL Transistor-Transistor Logic
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74AHC_AHCT244_5 20071220 Product data sheet - 74AHC_AHCT244_4
Modifications: •The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•Legal texts have been adapted to the new company name where appropriate.
•Section 3: DHVQFN20 package added.
•Section 7: derating values added for DHVQFN20 package.
•Section 12: outline drawing added for DHVQFN20 package.
74AHC_AHCT244_4 20060210 Product data sheet - 74AHC_AHCT244_3
74AHC_AHCT244_3 19990928 Product specification - 74AHC_AHCT244_2
74AHC_AHCT244_2 19990224 Product specification - 74AHC_AHCT244_1
74AHC_AHCT244_1 19980921 Product specification - -
74AHC_AHCT244_5 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 05 — 20 December 2007 15 of 16
NXP Semiconductors 74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
15. Legal information
15.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
15.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors 74AHC244; 74AHCT244
Octal buffer/line driver; 3-state
© NXP B.V. 2007. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 20 December 2007
Document identifier: 74AHC_AHCT244_5
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
17. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Functional description . . . . . . . . . . . . . . . . . . . 4
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Recommended operating conditions. . . . . . . . 5
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
13 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14
14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14
15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
16 Contact information. . . . . . . . . . . . . . . . . . . . . 15
17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
