Industrial and Multi-Market
Data Sheet
Revision 1.0, 2011-08-01
Final
ESD0P2RF Series
Bi-directional Ultra-low Capacitance ESD / Transient Protection Diode
ESD0P2RF-02LS
ESD0P2RF-02LRH
TVS Diodes
Transient Voltage Suppressor Diodes
Edition 2011-08-01
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2011 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
ESD0P2RF Series
Final Data Sheet 3 Revision 1.0, 2011-08-01
Trademarks of Infineon Technologies AG
AURIX™, BlueMoon™, C166™, CanPAK™, CIPOS™, CIPURSE™, COMNEON™, EconoPACK™, CoolMOS™,
CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,
EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™,
MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PRIMARION™,
PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™,
SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™,
TRENCHSTOP™, TriCore™, X-GOLD™, X-PMU™, XMM™, XPOSYS™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™
of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc.,
OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc.
RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc.
SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden
Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA.
UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™
of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of
Diodes Zetex Limited.
Last Trademarks Update 2010-10-26
Revision History
Page or Item Subjects (major cha nges since previous revision)
Revision 1.0, 2011-08-01 Page Nr.8 Package name corrected (mismatch)
ESD0P2RF Series
Table of Contents
Final Data Sheet 4 Revision 1.0, 2011-08-01
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Predefined Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1 Bi-directional Ultra-low Capacitance ESD / Transient Protection Diode . . . . . . . . . . . . . . . . . . . . 8
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
1.2 Application Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2 Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1 Electrical Characteristics at TA=25°C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.2 Typical Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5 Ordering Information Scheme (Examples) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.1 PG-TSLP-2-17 (mm) [5] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.1 PG-TSSLP-2-1 (mm) [5] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table of Contents
ESD0P2RF Series
List of Figures
Final Data Sheet 5 Revision 1.0, 2011-08-01
Figure 2-1 Pin Configuration and Schematic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 3-1 Definitions of electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 3-2 Reverse current: IR = f(VR), TA = parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 3-3 Line capacitance: CL = f(VR), f = 1 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 3-4 Line capacitance: CL = f(f), VR = parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 3-5 Line capacitance: CL = f(TA), VR = parameter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 3-6 IEC61000-4-2 VCL = f(t), 8 kV positiv pulse from pin 1 to pin 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 3-7 IEC61000-4-2 VCL = f(t), 8 kV negativ pulse from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 3-8 IEC61000-4-2 VCL = f(t), 15 kV positiv pulse from pin 1 to pin 2. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 3-9 IEC61000-4-2 VCL = f(t), 15 kV negativ pulse from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 3-10 Clamping voltage : ITLP = f(VTLP) [4]. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 4-1 Single line, bi-directional ESD / Transient protection [1], [2], [3] . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 5-1 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 6-1 PG-TSLP-2-17: Package overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 6-2 PG-TSLP-2-17: Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 6-3 PG-TSLP-2-17: Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 6-4 PG-TSLP-2-17: Marking (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 7-1 PG-TSSLP-2-1: Package overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 7-2 PG-TSSLP-2-1: Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 7-3 PG-TSSLP-2-1: Packing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 7-4 PG-TSSLP-2-1: Marking (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
List of Figures
ESD0P2RF Series
List of Tables
Final Data Sheet 6 Revision 1.0, 2011-08-01
Table 2-1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 3-1 Maximum Ratings at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 3-2 DC Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 3-3 RF Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 3-4 ESD Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
List of Tables
ESD0P2RF Series
Predefined Names
Final Data Sheet 7 Revision 1.0, 2011-08-01
Predefined Names
-----------------------------------------------------------------------------
Definition of “Predefined Names”
Frequently used expressions, such as component names, file names, tools releases, version numbers, proprietary
variables and software links, can be used in a similar way as user variables. However, they must be listed in a
special table and not in the standard file “Variables”.
Correct Usage
Steps:
1. Insert all expressions into the left column of the above table.
2. Insert an initial Cross-Reference into the right column of the same row. The initial Cross-Reference is
necessary to ensure that a single ID is used in all your documents using the “Predefined_Names.fm” file
(Example: X-GOLD has the unique ID = CHDGHJGH).
3. Insert a Cross-Reference (Element “CrossReference”) into your document to the Element Identifier of the
“Predefined_Names.fm” file. Set the output format of the Cross-Reference to “Variable” (example: X-GOLD).
Notes
1. All documents in a project (such as XMM) and within a book should use the same file “Predefined Names”.
This allows copying content between different documents. For this reason, local versions of “Predefined
Names” must not be produced.
2. New definitions must be inserted in a new row. Never change existing definitions, as they might be used in
other documents.
3. This file does not need to be included in your book, but it must be in the fm sub-folder of your document.
4. You can sort the above table with FrameMaker only if the initial cross-refere nce in the right co lumn has bee n
properly inserte d. Otherwise, the table may only be sort ed by hand, as the cross-refer ences to your document
would get lost.
Name Initial Cross-Reference
X-GOLD X-GOLD
XMM XMM
ESD0P2RF Series
Bi-directional Ultra-low Capacitance ESD / Transient Protection Diode
Final Data Sheet 8 Revision 1.0, 2011-08-01
1 Bi-directional Ultra-low Capacitance ESD / Transient Protection
Diode
1.1 Features
• ESD / transient protection of RF signal lines according to:
– IEC61000-4-2 (ESD): ±20 kV (contact)
– IEC61000-4-4 (EFT): 40 A (5/50 ns)
– IEC61000-4-5 (surge): 3 A (8/20 μs)
• Maximum working voltage: VRWM ±5.3 V
• Extremely low capacitance: CL = 0.2 pF (typical)
• Low clamping voltage: VCL = 29 V at IPP = 16 A (typical)
• Very low reverse current IR < 1 nA typ.
• Very small form factor down to 0.62 x 0.32 x 0.31 mm3
• Pb-free (RoHS compliant) and halogen free package
1.2 Application Examples
• ESD protection of sensitive RF signal lines, Bluetooth Class 2, Automated Meter Reading
• RF antenna protection, frontend module, GPS, mobile TV, FM radio, UWB
2 Product Description
Figure 2-1 Pin Configuration and Schematic Diagram
Table 2-1 Ordering Information
Type Package Configuration Marking code
ESD0P2RF-02LS PG-TSSLP-2-1 1 line, bi-directional T
ESD0P2RF-02LRH PG-TSLP-2-17 1 line, bi-directional T
a) Pin configuration
PG-TS(S)LP-2_Dual_Diode_Serie_PinConf_and_SchematicDiag.vsd
b) Schematic diagram
TSLP-2
TSSLP-2
Pin 1 Pin 2
Pin 1 Pin 2 Pin 1
Pin 2
Pin 1 marking
(lasered)
ESD0P2RF Series
Characteristics
Final Data Sheet 9 Revision 1.0, 2011-08-01
3 Characteristics
3.1 Electrical Characteristics at TA=25°C, unless otherwise specified
Figure 3-1 Definitions of electrical characteristics
Table 3-1 Maximum Ratings at TA = 25 °C, unless otherwise specified
Parameter Symbol Values Unit
Min. Typ. Max.
ESD contact discharge1)
1) VESD according to IEC61000-4-2
VESD ––20kV
Peak pulse current (tp = 8/20 μs)2)
2) IPP according to IEC61000-4-5
IPP ––3A
Operating temperature range TOP -55 – 125 °C
Storage temperature Tstg -65 – 150 °C
Table 3-2 DC Characteristics at TA = 25 °C, unless otherwise specified
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Reverse working voltage VRWM –5.3 – 5.3 V
Breakdown voltage VBR 7––VIR = 1 mA,
from pin 1 to pin 2,
from pin 2 to pin 1
Reverse current IR–<150nAVR = 5.3 V
Diode_Charac teristic_C urve_B i- directional .v sd
I
I
RWM
V
RWM
V
CL
I
PP
I
BR
V
BR
I
RWM
V
RWM
V
CL
I
PP
I
BR
V
BR V
R
DYN
R
DYN
Dynamic resistance
R
DYN
V
BR
Breakdown voltage
V
RWM
Reverse working voltage maximum
V
CL
Clamping voltage
I
PP
Peak pulse current
ESD0P2RF Series
Characteristics
Final Data Sheet 10 Revision 1.0, 2011-08-01
Table 3-3 RF Characteristics at TA = 25 °C, unless otherwise specified
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Diode capacitance CL– 0.23 0.4 pF VR = 0 V, f = 1 MHz
–0.20.4pF
VR = 0 V, f = 1 GHz
Table 3-4 ESD Characteristics at TA = 25 °C, unless otherwise specified
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Clamping voltage1) VCL –29–VIpp = 16 A
–38–V
Ipp = 30 A
Dynamic resistance1)
1)Please refer to Application Note AN210 [4]. TLP parameter: Z0 = 50 Ω , tp = 100ns, tr = 300ps, averaging
window: t1 = 30 ns to t2 = 60 ns, extraction of dynamic resistance using least squares fit of TLP charactertistics
between IPP1 = 10 A and IPP2 = 40 A.
RDYN –1–Ω
Series inductance LS– 0.2 – nH ESD0P2RF-02LS
– 0.4 – nH ESD0P2RF-02LRH
ESD0P2RF Series
Characteristics
Final Data Sheet 11 Revision 1.0, 2011-08-01
3.2 Typical Characteristics at TA = 25 °C, unless otherwise specified
Figure 3-2 Reverse current: IR = f(VR), TA = parameter
Figure 3-3 Line capacitance: CL = f(VR), f = 1 MHz
10-12
10-11
10-10
10-9
10-8
10-7
0 1 2 3 4 5 6
IR [A]
VR [V]
+25°C
+85°C
+125°C
0
0.1
0.2
0.3
0.4
0 1 2 3 4 5 6
CL [pF]
VR [V]
ESD0P2RF Series
Characteristics
Final Data Sheet 12 Revision 1.0, 2011-08-01
Figure 3-4 Line capacitance: CL = f(f), VR = parameter
Figure 3-5 Line capacitance: CL = f(TA), VR = parameter
0.2
0.21
0.22
0.23
0.24
0.25
0.26
0 500 1000 1500 2000 2500 3000
CL [pF]
f [MHz]
0V
3.3V
5.3V
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-50 -25 0 25 50 75 100 125
CL [pF]
TA [°C]
0V
3.3V
5.3V
ESD0P2RF Series
Characteristics
Final Data Sheet 13 Revision 1.0, 2011-08-01
Figure 3-6 IEC61000-4-2 VCL = f(t), 8 kV positiv pulse from pin 1 to pin 2
Figure 3-7 IEC61000-4-2 VCL = f(t), 8 kV negativ pulse from pin 1 to pin 2
-20
0
20
40
60
80
100
120
-100 0 100 200 300 400 500 600 700 800 900
VCL [V]
tp [ns]
VCL-max-peak = 112 [V]
VCL-30ns-peak = 24.8 [V]
-120
-100
-80
-60
-40
-20
0
20
-100 0 100 200 300 400 500 600 700 800 900
VCL [V]
tp [ns]
VCL-max-peak = -116 [V]
VCL-30ns-peak = -25.0 [V]
ESD0P2RF Series
Characteristics
Final Data Sheet 14 Revision 1.0, 2011-08-01
Figure 3-8 IEC61000-4-2 VCL = f(t), 15 kV positiv pulse from pin 1 to pin 2
Figure 3-9 IEC61000-4-2 VCL = f(t), 15 kV negativ pulse from pin 1 to pin 2
-20
0
20
40
60
80
100
120
140
160
180
-100 0 100 200 300 400 500 600 700 800 900
VCL [V]
tp [ns]
VCL-max-peak = 162 [V]
VCL-30ns-peak = 37.4 [V]
-180
-160
-140
-120
-100
-80
-60
-40
-20
0
20
-100 0 100 200 300 400 500 600 700 800 900
VCL [V]
tp [ns]
VCL-max-peak = -169 [V]
VCL-30ns-peak = -37.6 [V]
ESD0P2RF Series
Characteristics
Final Data Sheet 15 Revision 1.0, 2011-08-01
Figure 3-10 Clamping voltage : ITLP = f(VTLP) [4]
0
10
20
30
40
0 5 10 15 20 25 30 35 40 45 50 55 60
0
5
10
15
20
ITLP [A]
Equivalent VIEC [kV]
VTLP [V]
ESD0P2RF-02xx
RDYN
RDYN=1.0Ω
ESD0P2RF Series
Application Information
Final Data Sheet 16 Revision 1.0, 2011-08-01
4 Application Information
Figure 4-1 Single line, bi-directional ESD / Transient protection [1], [2], [3]
A pplication_ES D0P2RF -02x x.vs d
ESD
sensitive
device
1
2
Connector
Protected signal line
The protection diode should be placed very close to the location
where the ESD or other transients can occur to keep loops and
inductances as small as possible .
Pin 2 (or pin 1) should be connected directly to a ground plane on
the board .
I/ O
ESD0P2RF Series
Ordering Information Scheme (Examples)
Final Data Sheet 17 Revision 1.0, 2011-08-01
5 Ordering Information Scheme (Examples)
Figure 5-1 Ordering information scheme
ESD 5V3 U- XX YY
P ackage o r App li cat io n
XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins)
YY = Package family:
LS = TSSLP
LRH = TSLP
S = SOT363
U = SC74
XX = Application family:
LC = Low Clamp
HDMI
Uni- / Bi-directional or Rail to Rail protection
M aximu m wo rkin g vol t age V
RWM
in V: (i.e.: 5V3 = 5.3V)
ESD 0P1 RF - XX YY
Package
XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins)
YY = Package family:
LS = TSSLP
LRH = TSLP
For Radio Frequency Applications
Line Capacitance C
L
in pF: (i.e.: 0P1 = 0.1pF)
n U
Number of protected lines (i.e.: 1 = 1 line; 4 = 4 lines)
Capacitance: Standard (>10pF), Low (<10pF), Ultra-low (<1pF)
ESD0P2RF Series
Package Information
Final Data Sheet 18 Revision 1.0, 2011-08-01
6 Package Information
6.1 PG-TSLP-2-17 (mm) [5]
Figure 6-1 PG-TSLP-2-17: Package overview
Figure 6-2 PG-TSLP-2-17: Footprint
Figure 6-3 PG-TSLP-2-17: Packing
Figure 6-4 PG-TSLP-2-17: Marking (example)
TSLP27PO V02
±0.05
0.6
1
2
±0.05
0.65
±0.035
0.25
1)
1
±0.05
0.05 MAX.
+0.01
0.39-0.03
1) Dimension applies to plated terminal
Cathode
marking
1)
±0.035
0.5
Bottom viewTop view
TSLP-2-7-FP V01
0.45
0.275 0.275
0.375
0.925
Copper Solder mask Stencil apertures
0.35
1
0.6
0.35
0.3
ESD0P2RF Series
Package Information
Final Data Sheet 19 Revision 1.0, 2011-08-01
7 Package Information
7.1 PG-TSSLP-2-1 (mm) [5]
Figure 7-1 PG-TSSLP-2-1: Package overview
Figure 7-2 PG-TSSLP-2-1: Footprint
Figure 7-3 PG-TSSLP-2-1: Packing
Figure 7-4 PG-TSSLP-2-1: Marking (example)
TSSLP-2-1,-2-PO V05
±0.035
0.32
1
2
±0.025
0.355
±0.025
0.2
1)
0.62
±0.035
+0.01
0.31-0.02
1) Dimension applies to plated terminal
Cathode
marking
1)
±0.025
0.26
Bottom viewTop view
0.27
0.19
0.19
0.19
Copper Solder mask Stencil apertures
0.57
0.24
0.62
0.32
0.24
0.14
TSSLP-2-1,-2-FP V02
Ex
4
Ey
0.35
Cathode
marking
8
ESD0P2RF Series
References
Final Data Sheet 20 Revision 1.0, 2011-08-01
References
[1] Infineon AG - Application Note AN167: ESD Protection for Broadband LNA BGA728L7 for Portable and
Mobile TV Applications
[2] Infineon AG - Application Note AN178: ESD Protection for RF Antennas using Infineon ESD0P4RFL and
ESD0P2RF-xx
[3] Infineon AG - Application Note AN200: Low Cost FM Radio LNA using BFR340F for Mobile Phone
Applications
[4] Infineon AG - Application Note AN210: Effective ESD Protection Design at System Level using VF-TLP
Characterization Methodology
[5] Infineon AG - Recommendations for PCB Assembly of Infineon TSLP and TSSLP Packages
ESD0P2RF Series
Terminology
Final Data Sheet 21 Revision 1.0, 2011-08-01
Terminology
CLLine capacitance
EFT Electrical Fast Transient
ESD Electrostatic Discharge
GPS Global Positioning System
IEC International Electrotechnical Commission
IPP Peak pulse current
IRReverse current
LNA Low Noise Amplifier
RDYN Dynamic resistance
RoHS Restriction of Hazardous Substances Directive
TAAmbient temperature
TLP Transmission Line Pulse
TOP Operation temperature
tpPulse duration
trPulse rise time
Tstg Storage temperature
UWB Ultra Wideband
VBR Breakdown voltage
VCL Reverse clamping voltage
VESD Electrostatic discharge voltage
VRReverse voltage
VRWM Maximum Reverse Working Voltage
Published by Infineon Technologies AG
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