POL YFUSE (R) OLYFUSE WICKMANN SMD TType ype ype,, 6V Specifications Approvals Packaging A cULus Recognition TUV Materials Features Terminals: This product line enables installation in limited space applications. These devices offer wide range in hold currents from 0.35 amps to 1.50 amps and voltages 6 volts . The SMD1206 product line is suitable for high density circuit board applications in computers, cellular phone and general electronics. WebLinks Data Sheet www.wickmann.com/products/SMD1206.pdf Dimensions (mm) Dimensions (mm) Model SMD1206P035TS SMD1206P050TS SMD1206P075TS SMD1206P100TS SMD1206P150TS 1.80 1.80 1.80 1.80 1.80 0.45 0.45 0.45 0.75 1.45 40 40 40 40 40 0.75 1.00 1.50 1.80 3.00 Hold current: maximum current device will pass without tripping in 20C still air. Trip current: minimum current at which the device will trip in 20C still air. Maximum voltage device can withstand without damage at rated current (I max) Maximum fault current device can withstand without damage at rated voltage (Vmax) Order Information Qty. WebSite: www.wickmann.com OrderNumber Model * Europe Tel: +49 (2302) 662-107 E-mail: sales@wickmann.com 0.75 0.75 1.25 1.25 2.25 0.10 0.10 0.10 0.10 0.10 E Min Max 0.10 @ 8.00 0.10 @ 8.00 0.20 @ 8.00 0.30 @ 8.00 1.00 @ 8.00 0.20 0.20 0.20 0.20 0.20 packaging quantity tape Resistance R min.() RI max.() 6V 6V 6V 6V 6V 1.50 1.50 1.50 1.50 1.50 D Min Permissible continuous operating current is 100 % at ambient temperature of 2200C ((68 68 F). 100% 68F). Model I hold V max. dc I max. I Trip max. time to trip Pd max. (A) (A) (sec. @ A) (W) 0.35A 0.50A 0.75A 1.00A 1.50A 3.50 3.50 3.50 3.50 3.50 C Min Max 4,000 4,000 3,000 3,000 2,000 NOTE: I hold = I trip = Vmax = I max = 3.00 3.00 3.00 3.00 3.00 B Min Max Solder-plated copper (Solder Material: 63/37 SnPb) Gold-plated copper on request Max. Device Surface TTemperature emperature in TTripped ripped State 125C Operating / Storage TTemperature emperature -40C to +85C (consider de-rating) Humidity Ageing +85C, 85% R.H., 1000 hours, 5% typical resistance change Vibration MIL-VTD-883C, Method 2007.1, Condition A, no change Thermal Shock MIL-STD-202F, Method 107G +85C to -40C 20 times, -30% typical resistance change Lead Solderability Meets EIA Specification RS186-9E, ANSI/J-STD-002, Category 3 Solvent Resistance MIL-STD-202, Method 215, no change Marking "P", Part Code, identification, lot number 0.45 0.45 0.45 0.45 0.45 SMD1206P035TS SMD1206P050TS SMD1206P075TS SMD1206P100TS SMD1206P150TS 030305 Solder pad Layout (mm) A Min Max Tape and reel O 178 mm 0.6 0.6 0.6 0.6 0.8 0.300 0.150 0.100 0.055 0.040 1.200 0.700 0.290 0.210 0.120 Approvals TUV formerly No. 727 cURus SMD1206 * * * * * * * * * * Pd = Power dissipated from device when in the tripped state at 20C still air. R min= Minimum resistance of device in initial (un-soldered) state. R 1max= Maximum resistance of device at 20C measured one hour after tripping for 20 sec. Caution: Operation beyond the specified rating may result in damage and possible arcing and flame. Caution:Operation Specifications are subject to change without notice Packaging * Americas Tel: +1 (404) 699-7820 E-mail: service@wickmannusa.com * Asia Tel: +852 26 14-1108 E-mail: sales@wickmann.com.hk POL YFUSE (R) OLYFUSE WICKMANN SMD1206 A: B: C: D: E: SMD1206P035TS SMD1206P050TS SMD1206P075TS SMD1206P100TS SMD1206P150TS Thermal Derating Chart Model SMD1206P035TS SMD1206P050TS SMD1206P075TS SMD1206P100TS SMD1206P150TS 030305 WebSite: www.wickmann.com Ambient Operation TTemperature emperature - Ihold (A) -40C -20C 0C 23C 40C 50C 60C 70C 85C 0.50 0.71 1.14 1.45 2.18 0.45 0.64 1.01 1.31 1.94 0.40 0.57 0.88 1.15 1.72 0.35 0.50 0.75 1.00 1.50 0.30 0.42 0.65 0.84 1.28 0.27 0.39 0.59 0.77 1.17 0.24 0.35 0.54 0.69 1.06 0.21 0.31 0.49 0.61 0.96 0.15 0.25 0.41 0.48 0.77 * Europe Tel: +49 (2302) 662-107 E-mail: sales@wickmann.com * Americas Tel: +1 (404) 699-7820 E-mail: service@wickmannusa.com * Asia Tel: +852 26 14-1108 E-mail: sales@wickmann.com.hk