MK2304S-2ILFT - Integrated Circuit Systems, Inc.

MK2304-2

MDS 2304-2 C 1Revision 050306

Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com

ZERO DELAY, LOW SKEW BUFFER

Description

The MK2304-2 is a low jitter, low skew, high

performance Phase Lock Loop (PLL) based zero delay

buffer for high speed applications. Based on ICS’

proprietary low jitter PLL techniques, the device

provides four low skew outputs at speeds up to 133

MHz at 3.3 V. The MK2304-2 includes a bank of two

outputs running at 1/2X. In the zero delay mode, the

rising edge of the input clock is aligned with the rising

edges of all 4 outputs. Compared to competitive CMOS

devices, the MK2304-2 has the lowest jitter.

The MK2304-2 PLL enters a power-down state when

there are no rising edges on the REF input. In this

mode, all outputs are tri-stated and the PLL is turned

off, resulting in leass than 25 µA of current draw.

ICS manufactures the largest variety of clock

generators and buffers and is the largest clock supplier

in the world.

Features

•Packaged in 8 pin SOIC

•Zero input-output delay

•Two 1X outputs plus two 1/2X outputs

•Output to output skew is less than 200 ps

•Output clocks up from 10 MHz to 133 MHz at 3.3 V

•Ability to generate 2X the input

•Full CMOS outputs with 18 mA output drive

capability at TTL levels at 3.3 V

•Spread SmartTM technology works with spread

spectrum clock generators

•Advanced, low power, sub micron CMOS process

•Operating voltage of 3.3 V

•Available in industial temperature operation

•Available in Pb (lead) free package

•Low Standby Current

Block Diagram

CLKA2

CLKB1

CLKB2

CLKA1

PLL

FBIN

CLKIN

VDD

GND

BANK

ZERO DELAY, LOW SKEW BUFFER

MDS 2304-2 C 2Revision 050306

Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com

MK2304-2

Pin Assignment Feedback Configuration Table

Pin Descriptions

External Components

The Mk2304-2 requires a minimum number of external components for proper operation. Decoupling

capacitors of 0.1µF should be connected between VDD and GND, as close to the part as possible. A 33Ω

series terminating resistor should be used on each clock output to reduce reflections.

REF

CLKA1

CLKA2

VDD

GND

CLKB2

CLKB1

FBK1

8 Pin (150 mil) SOIC

Feedback From CLKA1:A2 CLKB1:B2

Bank A CLKIN CLKIN/2

Bank B 2XCLKIN CLKIN

Number

Name

Type

Pin Description

1 REF Input Clock input. Connect to input clock source, 5 V tolerant input.

2 CLKA1 Output Clock A1 output.

3 CLKA2 Output Clock A2 output.

4 GND Power Connect to ground.

5 CLKB1 Output Clock B1 output.

6 CLKB1 Output Clock B2 output.

7 VDD Power 3.3V Power Supply.

8 FBK Input PLL feedback input

ZERO DELAY, LOW SKEW BUFFER

MDS 2304-2 C 3Revision 050306

Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com

MK2304-2

Absolute Maximum Ratings

Stresses above the ratings listed below can cause permanent damage to the MK2304-2. These ratings,

which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of

the device at these or any other conditions above those indicated in the operational sections of the

specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can

affect product reliability. Electrical parameters are guaranteed only over the recommended operating

temperature range.

Recommended Operation Conditions

DC Electrical Characteristics

VDD=3.3 V ±10%, Amb temp -40° C to 85° C

Item Rating

Supply Voltage, VDD 7 V

All Inputs and Outputs -0.5 V to VDD+0.5 V

Ambient Operating Temperature (commercial) 0 to +70 °C

Ambient Operating Temperature (industrial) -40 to +85 °C

Storage Temperature -65 to +150 °C

Junction Temperature 125 °C

Soldering Temperature 260 °C

Parameter Min. Typ. Max. Units

Ambient Operating Temperature (commercial) 0 +70 °C

Ambient Operating Temperature (industrial) -40 +85 °C

Power Supply Voltage (measured in respect to GND) +3.0 +3.6 V

Parameter Symbol Conditions Min. Typ. Max. Units

Operating Voltage VDD 3.0 3.6 V

Input High Voltage VIH 2V

Input Low Voltage VIL 0.8 V

Output High Voltage VOH IOH = -8 mA 2.4 V

Output Low Voltage VOL IOL = 8 mA 0.4 V

Operating Supply Current

100 MHz, CLKIN

IDD No Load 45 mA

Stand by Supply Current

0 MHz, CLKIN

IDD No Load 12 25 uA

Short Circuit Current IOS Each output TBD mA

Input Capacitance CIN FBIN 7 pF

Power-up Time 50 ms

ZERO DELAY, LOW SKEW BUFFER

MDS 2304-2 C 4Revision 050306

Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com

MK2304-2

AC Electrical Characteristics

VDD = 3.3V ±10%, Ambient Temperature -40° C to 85° C

Thermal Characteristics

Parameter Symbol Conditions Min. Typ. Max. Units

Output Frequency FBIN to CLKA1,

30 pF Load

10 100 MHz

Output Frequency FBIN to CLKA1,

15 pf Load

10 133 MHz

Output Rise Time tOR 0.8 to 2.0 V, CL=30 pF 2.2 ns

Output Rise Time tOR 0.8 to 2.0 V, CL=15 pF 1.5 ns

Output Fall Time tOF 0.8 to 2.0 V, CL=30 pF 2.2 ns

Output Fall Time tOF 0.8 to 2.0 V, CL=15 pF 1.5 ns

Output Clock Duty Cycle At 1.4 V, CL=30 pf 40 50 60 %

Output Clock Duty Cycle At 1.4 V, CL=15 pf 45 50 65 %

Device-to-Device skew, equally

loaded

Rising edges at VDD/2 500 ps

Output-to-Output skew, equally

loaded, On same bank

Rising edges at VDD/2 200 ps

Skew from Output Bank A to

Output Bank B

All outputs equally

loaded

400 ps

Delay CLKIN Rising Edge to

FBIN Rising Edge

Measured at VDD/2 ±250 ps

Cycle-to-Cycle Jitter 30 pF loads

66.67 MHz outputs

400 ps

15 pF loads

66.67 MHz outputs

375 ps

PLL Lock Time tLOCK Stable power supply,

valid clocks on CLKIN,

FBIN

1ms

Parameter Symbol Conditions Min. Typ. Max. Units

Thermal Resistance Junction to

Ambient

θJA Still air 120 °C/W

θJA 1 m/s air flow 115 °C/W

θJA 3 m/s air flow 105 °C/W

Thermal Resistance Junction to Case θJC 58 °C/W

ZERO DELAY, LOW SKEW BUFFER

MDS 2304-2 C 5Revision 050306

Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com

MK2304-2

Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Narrow Body)

Package dimensions are kept current with JEDEC Publication No. 95

Ordering Information

Parts that are ordered with a "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.

While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS)

assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result

from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial

applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary

environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any

circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or

critical medical instruments.

Part / Order Number Marking Shipping Packaging Package Temperature

MK2304S-2 2304S-02 Tubes 8-pin SOIC 0 to 70° C

MK2304S-2T 2304S-02 Tape and Reel 8-pin SOIC 0 to 70° C

MK2304S-2I 2304S02I Tubes 8-pin SOIC -40° C to 85° C

MK2304S-2IT 2304S02I Tape and Reel 8-pin SOIC -40° C to 85° C

MK2304S-2LF 2304S02L Tubes 8-pin SOIC 0 to 70° C

MK2304S-2LFT 2304S02L Tape and Reel 8-pin SOIC 0 to 70° C

MK2304S-2ILF 2304S2IL Tubes 8-pin SOIC -40° C to 85° C

MK2304S-2ILFT 2304S2IL Tape and Reel 8-pin SOIC -40° C to 85° C

INDEX

AREA

1 2

SEATING

PLANE

- C -

.10 (.004) C

h x 45

*For reference only. Controlling dimensions are in mm.

Millimeters Inches*

Symbol Min Max Min Max

A 1.35 1.75 .0532 .0688

A1 0.10 0.25 .0040 .0098

B 0.330.51.013.020

C 0.19 0.25 .0075 .0098

D 4.80 5.00 .1890 .1968

E 3.80 4.00 .1497 .1574

e 1.27 BASIC 0.050 BASIC

H 5.80 6.20 .2284 .2440

h 0.250.50.010.020

L 0.401.27.016.050

α0°8°0°8°