Integrated 500 mA Load Switch with Quad Signal Switch ADP1190A Data Sheet FEATURES FUNCTIONAL BLOCK DIAGRAM Low input voltage range: 1.4 V to 3.6 V Load switch Low RDSON_L of 65 m at 3.6 V 500 mA continuous operating current 4 SPST normally open signal switches RDSON_S of 3 at 1.8 V Internal charge pump for constant signal switch RDSON Output discharge resistance (RDIS): 215 at the output side of the load switch and each analog signal switch output Built-in level shift for control logic that can operate by a 1.2 V logic Ultralow shutdown current: 0.7 A Ultrasmall 1.2 mm x 1.6 mm x 0.5 mm, 12-ball, 0.4 mm pitch WLCSP APPLICATIONS S1 T1 S2 T2 S3 T3 S4 T4 CHARGE PUMP OFF Mobile phones SIM card disconnect switches Digital cameras and audio devices Portable and battery-powered equipment EN 5ms DEBOUNCE GND ON ADP1190A LOAD SWITCH 11539-001 OUT IN Figure 1. GENERAL DESCRIPTION The ADP1190A is an integrated high-side load switch with four signal switches designed for operation from 1.4 V to 3.6 V. This load switch provides power domain isolation for extended power battery life. The load switch is a low on-resistance P-channel MOSFET that supports up to 500 mA of continuous load current and minimizes power loss. Integrated with the load switch are four normally open, 3 single pole, single throw (SPST) signal switches controlled by the charge pump. Rev. 0 Beyond its excellent operating performance, the ADP1190A occupies minimal printed circuit board (PCB) space with an area less than 1.92 mm2 and a height of 0.50 mm. The ADP1190A is available in an ultrasmall 1.2 mm x 1.6 mm x 0.5 mm, 12-ball, 0.4 mm pitch WLCSP. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 (c)2013 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com ADP1190A Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Pin Configuration and Function Descriptions..............................5 Applications ....................................................................................... 1 Typical Performance Characteristics ..............................................6 Functional Block Diagram .............................................................. 1 Theory of Operation .........................................................................9 General Description ......................................................................... 1 Outline Dimensions ....................................................................... 11 Revision History ............................................................................... 2 Ordering Guide .......................................................................... 11 Specifications..................................................................................... 3 Absolute Maximum Ratings ............................................................ 4 Thermal Data ................................................................................ 4 Thermal Resistance ...................................................................... 4 ESD Caution .................................................................................. 4 REVISION HISTORY 9/13--Revision 0: Initial Version Rev. 0 | Page 2 of 12 Data Sheet ADP1190A SPECIFICATIONS VIN = 1.8 V, VEN = VIN, ILOAD = 200 mA, CIN = COUT = 1 F, TA = 25C, unless otherwise noted. Table 1. Parameter INPUT VOLTAGE RANGE EN INPUT EN Input Threshold Symbol VIN Test Conditions/Comments TJ = -40C to +85C Min 1.4 VEN_TH Logic High Voltage Logic Low Voltage CURRENT Shutdown Current VIH VIL 1.4 V < VIN < 1.8 V, TJ = -40C to +85C (active low) 1.8 V VIN 3.6 V, TJ = -40C to +85C (active low) 1.4 V VIN 3.6 V 1.4 V VIN 3.6 V (chip enable) 0.35 0.45 1.2 IOFF Max 3.6 Unit V 1.2 1.2 V V V V 0.35 0.2 A A A LOAD SWITCH, VIN TO VOUT RESISTANCE RDSON_L VIN = 3.6 V, ILOAD = 200 mA, EN = GND VIN = 2.5 V, ILOAD = 200 mA, EN = GND VIN = 1.8 V, ILOAD = 200 mA, EN = GND, TJ = -40C to +85C 65 80 100 m m m SIGNAL SWITCH RESISTANCE RDSON_S Maximum value of analog input sweep VIN = 3.6 V, ILOAD = 10 mA, EN = GND VIN = 2.5 V, ILOAD = 10 mA, EN = GND VIN = 1.8 V, ILOAD = 10 mA, EN = GND VIN = 3.6 V, ILOAD = 10 mA, EN = GND VIN = 1.8 V, ILOAD = 10 mA, EN = GND 3 3 3 0.2 0.2 10 215 pF 50 MHz 5 2 ms s Analog Switch Off Current IA_OFF RDS Flatness EN = VIN or open EN = VIN or open, TJ = -40C to +85C Into S1, EN = VIN Typ SIGNAL SWITCH INPUT CAPACITANCE OUTPUT DISCHARGE RESISTANCE CIN RDIS -3 dB BANDWIDTH VOUT TIME Turn-On Delay Time Turn-Off Delay Time BW-3 dB At the output side of the load switch and each analog signal switch output, T1, T2, T3, and T4 VIN = 3.3 V, RLOAD = 50 , CLOAD = 5 pF tON_DLY tOFF_DLY ILOAD = 200 mA, EN = GND, CLOAD = 0. 1 F VIN = 3.6 V, ILOAD = 200 mA, EN = 1.5 V, CLOAD = 0.1 F 0.7 2 Timing Diagram EN tON_DLY tOFF_DLY 11539-002 90% 10% VOUT Figure 2. Timing Diagram Rev. 0 | Page 3 of 12 200 ADP1190A Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. Parameter VIN to GND VOUT to GND Sx to GND Tx to GND EN to GND Continuous Load Switch Current TA = 25C TA = 85C Continuous Diode Current Storage Temperature Range Junction Temperature Operating Temperature Range Junction Temperature Range Ambient Temperature Range Soldering Conditions Rating -0.3 V to +4.0 V -0.3 V to VIN -0.3 V to +4.0 V -0.3 V to +4.0 V -0.3 V to +4.0 V 1 A 500 mA -50 mA -65C to +150C 150C -40C to +125C -40C to +85C JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL DATA Absolute maximum ratings apply individually only, not in combination. The ADP1190A can be damaged when the junction temperature limits are exceeded. Monitoring ambient temperature does not guarantee that the junction temperature (TJ) is within the specified temperature limits. In applications with high power dissipation and poor thermal resistance, the maximum ambient temperature may need to be derated. In applications with moderate power dissipation and low PCB thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within specification limits. The TJ of the device is dependent on the ambient temperature (TA), the power dissipation of the device (PD), and the junction-to-ambient thermal resistance of the package (JA). The junction-to-ambient thermal resistance (JA) of the package is based on modeling and calculation using a 4-layer board. The junction-to-ambient thermal resistance is highly dependent on the application and board layout. In applications where high maximum power dissipation exists, close attention to thermal board design is required. The value of JA can vary, depending on PCB material, layout, and environmental conditions. The specified value of JA is based on a 4-layer, 4 inch x 3 inch circuit board. See JESD51-7 and JESD51-9 for detailed information on the board construction. For additional information, see the AN-617 Application Note, Wafer Level Chip Scale Package. JB is the junction-to-board thermal characterization parameter with units of C/W. JB of the package is based on modeling and calculation using a 4-layer board. JESD51-12, Guidelines for Reporting and Using Electronic Package Thermal Information, states that thermal characterization parameters are not the same as thermal resistances. JB measures the component power flowing through multiple thermal paths rather than through a single path as in thermal resistance (JB). Therefore, JB thermal paths include convection from the top of the package as well as radiation from the package, factors that make JB more useful in real-world applications. Maximum TJ is calculated from the board temperature (TB) and PD using the formula TJ = TB + (PD x JB) See JESD51-8 and JESD51-12 for more detailed information about JB. THERMAL RESISTANCE JA and JB are specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 3. Thermal Resistance Package Type 12-Ball WLCSP ESD CAUTION Maximum TJ is calculated from TA and PD using the formula TJ = TA + (PD x JA) Rev. 0 | Page 4 of 12 JA 130 JB 29.2 Unit C/W Data Sheet ADP1190A PIN CONFIGURATION AND FUNCTION DESCRIPTIONS ADP1190A 1 2 3 GND T1 S1 EN T2 S2 IN T3 S3 OUT T4 S4 A B C TOP VIEW (BALL SIDE DOWN) Not to Scale 11539-003 D Figure 3. Pin Configuration Table 4. Pin Function Descriptions Pin No. A1 B1 C1 D1 A2 B2 C2 D2 A3 B3 C3 D3 Mnemonic GND EN IN OUT T1 T2 T3 T4 S1 S2 S3 S4 Description Ground. Enable Input, Active Low. Input Voltage. Load Switch Output Voltage. Channel 1 Analog Switch. Connect Pin A2 to the SIM card socket (has active discharge). Channel 2 Analog Switch. Connect Pin B2 to the SIM card socket (has active discharge). Channel 3 Analog Switch. Connect Pin C2 to the SIM card socket (has active discharge). Channel 4 Analog Switch. Connect Pin D2 to the SIM card socket (has active discharge). Channel 1 Analog Switch. Connect Pin A3 to the microcontroller. Channel 2 Analog Switch. Connect Pin B3 to the microcontroller. Channel 3 Analog Switch. Connect Pin C3 to the microcontroller. Channel 4 Analog Switch. Connect Pin D3 to the microcontroller. Rev. 0 | Page 5 of 12 ADP1190A Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 70 0.12 60 0.1 0.08 0.06 0.04 0.02 0 1.2 5mA 10mA 50mA 100mA 250mA 500mA 1.6 2.0 2.8 2.4 3.6 3.2 VIN (V) 1.4V 1.5V 1.6V 1.8V 2.0V 2.4V 2.8V 3.0V 3.3V 3.6V 50 40 30 20 10 0 10 100 1000 ILOAD (mA) Figure 4. Load Switch RDSON vs. Input Voltage (VIN) for Different Load Currents 11539-007 LOAD SWITCH VOLTAGE DROP (mV) 0.14 11539-004 LOAD SWITCH RDSON () VIN = 1.8 V, VEN = VIN, ILOAD = 200 mA, CIN = COUT = 1 F, TA = 25C, unless otherwise noted. Figure 7. Load Switch Voltage Drop vs. Load Current (ILOAD) for Different Input Voltages 0.12 4.5 4.0 SIGNAL SWITCH RDSON () 0.08 0.06 0.02 0 -60 -40 3.5 3.0 2.5 2.0 1.4V 1.6V 1.5 1.8V 1.0 2.2V 3.6V 0.5 -20 0 20 40 60 80 100 TEMPERATURE (C) 0 0 0.4 1.2 0.8 1.6 2 2.4 2.8 3.2 3.6 SIGNAL SWITCH VOLTAGE (V) Figure 5. Load Switch RDSON vs. Temperature for Different Load Currents, VIN = 1.8 V 11539-008 0.04 10mA 50mA 100mA 250mA 500mA 11539-005 LOAD SWITCH RDSON () 0.10 Figure 8. Signal Switch RDSON vs. Signal Switch Voltage, Different Input Voltages 0.10 4.5 4.0 SIGNAL SWITCH RDSON () 0.06 0.04 0 -60 -40 3.5 3.0 2.5 2.0 1.5 1.0 -40C -5C +25C +55C +85C 0.5 -20 0 20 40 TEMPERATURE (C) 60 80 100 0 0.1 0.3 0.5 0.7 0.9 1.1 SIGNAL SWITCH VOLTAGE (V) Figure 6. Load Switch RDSON vs. Temperature for Different Load Currents, VIN = 3.6 V Rev. 0 | Page 6 of 12 1.3 1.5 11539-009 0.02 10mA 50mA 100mA 250mA 500mA 11539-006 LOAD SWITCH RDSON () 0.08 Figure 9. Signal Switch RDSON vs. Signal Switch Voltage for Various Temperatures, VIN = 1.4 V Data Sheet ADP1190A 30 4.5 4.0 3.0 2.5 2.0 1.5 1.0 -40C -5C +25C +55C +85C 20 15 10 5 0.5 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 SIGNAL SWITCH VOLTAGE (V) 0 -60 11539-010 0 0.1 10mA 50mA 100mA 250mA 500mA -40 -20 0 20 40 60 80 100 TEMPERATURE (C) Figure 10. Signal Switch RDSON vs. Signal Switch Voltage for Various Temperatures, VIN = 1.8 V 11539-013 GROUND CURRENT (A) SIGNAL SWITCH RDSON () 25 3.5 Figure 13. Ground Current vs. Temperature for Different Load Currents, VIN = 1.8 V 4.5 30 4.0 3.0 2.5 2.0 1.0 -40C -5C +25C +55C +85C 15 10 5 0.5 0.6 1.1 1.6 2.1 2.6 3.1 3.6 SIGNAL SWITCH VOLTAGE (V) 0 -60 11539-011 0 0.1 -20 0 20 40 60 80 100 Figure 14. Ground Current vs. Temperature for Different Load Currents, VIN = 3.6 V 25 30 25 GROUND CURRENT (A) 20 15 10 5mA 10mA 50mA 100mA 250mA 500mA 5 1.6 2.0 20 15 10 -40C -5C +25C +55C +85C 5 2.4 VIN (V) 2.8 3.2 3.6 0 1.2 11539-012 GROUND CURRENT (A) -40 TEMPERATURE (C) Figure 11. Signal Switch RDSON vs. Signal Switch Voltage for Various Temperatures, VIN = 3.6 V 0 1.2 10mA 50mA 100mA 250mA 500mA 1.6 2.0 2.4 VIN (V) Figure 12. Ground Current vs. Input Voltage (VIN) for Different Load Currents Rev. 0 | Page 7 of 12 2.8 3.2 3.6 11539-015 1.5 20 11539-014 GROUND CURRENT (A) SIGNAL SWITCH RDSON () 25 3.5 Figure 15. No Load Ground Current vs. Input Voltage (VIN) for Various Temperatures ADP1190A Data Sheet 700 T SHUTDOWN CURRENT(nA) 600 EN 1.4V 1.5V 1.6V 1.8V 2.0V 2.4V 2.8V 3.0V 3.3V 3.6V 500 400 300 200 1 100 VOUT -40 -20 0 20 40 60 80 100 TEMPERATURE (C) CH1 1.0V BW CH3 2.0V BW 11539-016 -100 -60 M2.0ms T 10.40% A CH1 40.0mV 11539-019 3 0 Figure 19. Enable Debounce Behavior, VIN = 1.8 V Figure 16. Shutdown Current vs. Temperature for Different Input Voltages T T EN EN 1 T1 2 1 VOUT VOUT CH2 1.0V BW M1.0ms T 10.80% A CH1 880mV 11539-017 CH1 2.0V BW CH3 1.0V BW CH1 1.0V BW CH3 2.0V BW T EN 1 T1 2 VOUT M1.0ms T 65.40% A CH2 1.08V 11539-018 3 CH2 2.0V BW A CH1 1.08V Figure 20. Enable Debounce Behavior, VIN = 3.6 V Figure 17. Typical Turn-On Delay Time, VIN = 1.8 V, 50 mA Load CH1 2.0V BW CH3 2.0V BW M2.0ms T 10.00% Figure 18. Typical Turn-On Delay Time, VIN = 3.6 V, 100 mA Load Rev. 0 | Page 8 of 12 11539-020 3 3 Data Sheet ADP1190A THEORY OF OPERATION The ADP1190A is a high-side load switch integrated with four signal switches. The load switch and signal switches are turned on by a low signal on the EN pin. When the device is disabled, the T1 to T4 pins are actively pulled down with a nominal resistance of 215 . There is a 5 ms debounce counter on EN for use with a mechanical EN switch. That is, hold EN low for 5 ms before the device is enabled. If EN transitions high before this timeout, the counter is reset and starts a new 5 ms count. The signal paths are N-channel MOSFETs with 3 on resistance. Break-before-make logic control ensures that the active pull-down is off before the signal path is enabled. The ADP1190A also has an internal charge pump that provides a regulated voltage at the gates of the N-channel MOSFETs, resulting in a more stable signal switch on resistance over different input voltages and temperature. S1 T1 S2 T2 S3 T3 S4 T4 CHARGE PUMP OFF EN 5ms DEBOUNCE GND ON IN ADP1190A Figure 21. Block Diagram with ESD Protection Devices Rev. 0 | Page 9 of 12 11539-021 OUT LOAD SWITCH ADP1190A Data Sheet CONNECTOR MICROCONTROLLER S1 SIM CARD T1 I/O S2 T2 I/O S3 T3 RST S4 T4 CLK CHARGE PUMP IN GND OUT VCC ADP1190A LOAD SWITCH 11539-022 VIN = 1.4V TO 3.6V GND 5ms DEBOUNCE Figure 22. Typical Application Diagram Sx 50 VS VOUT Tx 50 NETWORK ANALYZER 11539-023 EN Figure 23. Bandwidth Measurement Setup Rev. 0 | Page 10 of 12 Data Sheet ADP1190A OUTLINE DIMENSIONS 1.24 1.20 1.16 BOTTOM VIEW (BALL SIDE UP) 3 2 1 A BALL A1 IDENTIFIER 1.64 1.60 1.56 1.20 REF B C D 0.40 BSC TOP VIEW (BALL SIDE DOWN) 0.330 0.300 0.270 END VIEW 0.80 REF COPLANARITY 0.04 SEATING PLANE 0.300 0.260 0.220 0.230 0.200 0.170 02-22-2013-A 0.560 0.500 0.440 Figure 24. 12-Ball Wafer Level Chip Scale Package [WLCSP] (CB-12-10) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADP1190AACBZ-R7 1 Temperature Range -40C to +85C Package Description 12-Ball Wafer Level Chip Scale Package [WLCSP] Z = RoHS Compliant Part. Rev. 0 | Page 11 of 12 Package Option CB-12-10 Branding LNW ADP1190A Data Sheet NOTES (c)2013 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D11539-0-9/13(0) Rev. 0 | Page 12 of 12