CM1454 Data Port EMI Filter Array with ESD Protection Description The CM1454 is an EMI filter array with ESD protection in a CSP form factor for the data port of a mobile handset. The CM1454-08 is configured in an 8 channel format and combines both resistor-capacitor (R-C) and inductor-capacitor (L-C) filters in the chip. There are five C-R-C filters with component values of 30 pF - 100 W - 30 pF which are used for the microphone and data ports. There are also three C-L-C filters with values of 80 pF - 3 nH - 80 pF which are designed for the stereo speaker port. The CM1454's C-RC filters have a cut-off frequency of 60 MHz and an attenuation of better than 35 dB over the 800 MHz to 2.7 GHz frequency range. The C-L-C filters have a cut-off frequency of 21 MHz with an attenuation of 40 dB at 1 GHz. The parts integrate ESD protection diodes on every pin that provide a very high level of protection for sensitive electronic components against possible electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of 15 kV, which is beyond the Level 4 requirement of the IEC61000-4-2 international standard. In accordance with MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are also protected for contact discharges at greater than 30 kV. The CM1454 incorporates OptiGuardt which results in improved reliability at assembly. The CM1454 is available in a space saving, low profile Chip Scale Package with RoHS compliant lead-free finishing. Features * * * * * * * * * OptiGuardtCoated for Improved Reliability Eight Channels of EMI Filtering Three C-L-C Filters with ESD Protection for Stereo Speaker Port Five C-R-C Filters with ESD Protection for Microphone and Data Ports 15 kV ESD Protection on Each Channel (IEC 61000-4-2 Level 4, Contact Discharge) 30 kV ESD Protection on Each Channel (HBM) Chip Scale Package (CSP) Features Extremely Low Parasitic Inductance for Optimum Filter and ESD Performance 20-Bump, 3.960 mm x 1.586 mm Footprint CSP These Devices are Pb-Free and are RoHS Compliant Applications http://onsemi.com WLCSP20 CP SUFFIX CASE 567BY MARKING DIAGRAM N548 CM1454-08 20-Bump CSP Package N548 = CM1454-08CP ORDERING INFORMATION Device Package Shipping CM1454-08CP CSP-20 (Pb-Free) 3500/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. * Combination I/O Data Port that has I/Os for Data, * EMI Filtering for Data Ports in Cell Phones, PDAs or * * Wireless Handsets * Handheld PCs / PDAs Microphone and Speaker I/O Port Protection for Mobile Handsets, Notebook Computers, PDAs, etc. (c) Semiconductor Components Industries, LLC, 2011 April, 2011 - Rev. 3 Notebook Computers 1 Publication Order Number: CM1454/D CM1454 ELECTRICAL SCHEMATIC Figure 1. CM1454 Schematic Diagram of R-C and L-C Filter Arrays with ESD http://onsemi.com 2 CM1454 PACKAGE / PINOUT DIAGRAMS Top View (Bumps Down View) Orientation Marking + A 1 2 4 3 5 6 Bottom View (Bumps Up View) 7 8 C1 B Orientation Marking C C2 B1 A1 A1 C3 C4 C5 B2 A2 A3 C6 B3 A4 A5 C7 C8 B4 A6 A7 A8 CM1454-08CP 20-Bump CSP Table 1. PIN DESCRIPTIONS Pin Number Pin Description Pin Number Pin Description A1 Filter #1 (Microphone) C1 Filter #1 A2 Filter #2 (Microphone) C2 Filter #2 A3 Filter #3 (Stereo Headphone) C3 Filter #3 A4 Filter #4 (Left Speaker) C4 Filter #4 A5 Filter #5 (Right Speaker) C5 Filter #5 A6 Filter #6 (Accessory ID) C6 Filter #6 A7 Filter #7 (Data) C7 Filter #7 A8 Filter #8 (Data) C8 Filter #8 B1-B4 GND SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units -65 to +150 C DC current per Inductor 30 mA DC Package Power Rating 0.5 W Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range http://onsemi.com 3 Rating Units -40 to +85 C CM1454 Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter R Resistance C1 Capacitance L Conditions 2.5 V dc; 1 MHz, 30 mV ac Min Typ Max Units 80 100 120 W 24 30 36 pF Inductance 3.0 nH RE Equivalent Series Resistance of Inductor 0.25 W C2 Capacitance fRC Cut-off Frequency ZSOURCE = 50 W, ZLOAD = 50 W 60 MHz fLC Cut-off Frequency ZSOURCE = 50 W, ZLOAD = 50 W 21 MHz VST Stand-off Voltage I = 10 mA 6.0 V ILEAK Diode Leakage Current VIN = 3.3 V 0.1 1.0 VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10 mA ILOAD = -10 mA 6.8 -0.8 9.0 -0.4 VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 RDYN Dynamic Resistance Positive Negative 0 V dc, 1 MHz, 30 mV ac; 100 125 150 2.5 V dc, 1 MHz, 30 mV ac; 64 80 96 (Notes 2 and 3) 5.6 -1.5 PERFORMANCE INFORMATION Diode Characteristics (nominal conditions unless specified otherwise) Figure 2. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5 VDC) http://onsemi.com 4 pF mA V kV 30 15 2.3 0.9 1. TA = 25C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. 3. Unused pins are left open. pF W CM1454 PERFORMANCE INFORMATION (Cont'd) Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) Figure 3. Attenuation Curve for CM1454 RC Filters: 1, 2, 6, 7, and 8 Figure 4. Attenuation Curve for CM1454 RC Filters: 3, 4, and 5 http://onsemi.com 5 CM1454 APPLICATION INFORMATION Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS Parameter Value Pad Size on PCB 0.240 mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290 mm Round Solder Stencil Thickness 0.125 - 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance - Edge To Corner Ball 50 mm Solder Ball Side Coplanarity 20 mm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste 260C Non-Solder Mask Defined Pad 0.240 mm DIA. Solder Stencil Opening 0.300 mm DIA. Solder Mask Opening 0.290 mm DIA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Temperature (5C) 250 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile http://onsemi.com 6 CM1454 PACKAGE DIMENSIONS WLCSP20, 3.96x1.59 CASE 567BY-01 ISSUE O PIN A1 REFERENCE 2X D EE EE A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. E DIM A A1 A2 b D E eD eE 0.05 C 2X TOP VIEW 0.05 C OptiGuard Option 0.05 C EEEEEEEEEE A2 MILLIMETERS MIN MAX 0.56 0.72 0.21 0.27 0.42 REF 0.29 0.35 3.96 BSC 1.59 BSC 0.50 BSC 0.435 BSC A 0.05 C NOTE 3 A1 C SIDE VIEW SEATING PLANE eD/2 eD b 20X 0.05 C A B 0.03 C eE C B A 1 2 3 4 5 6 7 8 9 10 11 12 BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* PACKAGE OUTLINE A1 0.87 0.44 20X 0.50 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. OptiGuardt is a trademark of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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