CM1454-08CP - ON Semiconductor - Datasheet.Directory

April, 2011 − Rev. 3

1Publication Order Number:

CM1454/D

CM1454

Data Port EMI Filter Array

with ESD Protection

Description

The CM1454 is an EMI filter array with ESD protection in a CSP

form factor for the data port of a mobile handset. The CM1454−08 is

configured in an 8 channel format and combines both

resistor−capacitor (R−C) and inductor−capacitor (L−C) filters in the

chip. There are five C−R−C filters with component values of 30 pF −

100 W − 30 pF which are used for the microphone and data ports.

There are also three C−L−C filters with values of 80 pF − 3 nH − 80 pF

which are designed for the stereo speaker port.

The CM1454’s C−RC filters have a cut−off frequency of 60 MHz

and an attenuation of better than 35 dB over the 800 MHz to 2.7 GHz

frequency range. The C−L−C filters have a cut−off frequency of

21 MHz with an attenuation of 40 dB at 1 GHz. The parts integrate

ESD protection diodes on every pin that provide a very high level of

protection for sensitive electronic components against possible

electrostatic discharge (ESD). The ESD protection diodes connected

to the filter ports are designed and characterized to safely dissipate

ESD strikes of ±15 kV, which is beyond the Level 4 requirement of the

IEC61000−4−2 international standard. In accordance with

MIL−STD−883 (Method 3015) specification for Human Body Model

(HBM) ESD, the pins are also protected for contact discharges at

greater than ±30 kV.

The CM1454 incorporates OptiGuardt which results in improved

reliability at assembly. The CM1454 is available in a space saving, low

profile Chip Scale Package with RoHS compliant lead−free finishing.

Features

•OptiGuardtCoated for Improved Reliability

•Eight Channels of EMI Filtering

•Three C−L−C Filters with ESD Protection for Stereo Speaker Port

•Five C−R−C Filters with ESD Protection for Microphone and Data

Ports

•±15 kV ESD Protection on Each Channel

(IEC 61000−4−2 Level 4, Contact Discharge)

•±30 kV ESD Protection on Each Channel (HBM)

•Chip Scale Package (CSP) Features Extremely Low Parasitic

Inductance for Optimum Filter and ESD Performance

•20−Bump, 3.960 mm x 1.586 mm Footprint CSP

•These Devices are Pb−Free and are RoHS Compliant

Applications

•Combination I/O Data Port that has I/Os for Data,

Microphone and Speaker

•I/O Port Protection for Mobile Handsets, Notebook

Computers, PDAs, etc.

•EMI Filtering for Data Ports in Cell Phones, PDAs or

Notebook Computers

•Wireless Handsets

•Handheld PCs / PDAs

MARKING DIAGRAM

Device Package Shipping†

ORDERING INFORMATION

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CM1454−08CP CSP−20

(Pb−Free)

3500/Tape & Reel

N548 = CM1454−08CP

N548

CM1454−08

20−Bump CSP Package

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

WLCSP20

CP SUFFIX

CASE 567BY

CM1454

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ELECTRICAL SCHEMATIC

Figure 1. CM1454 Schematic Diagram of R−C and L−C Filter Arrays with ESD

CM1454

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PACKAGE / PINOUT DIAGRAMS

Bottom View

(Bumps Up View)

Top View

(Bumps Down View)

CM1454−08CP

20−Bump CSP

C1 C2

A1 A2

C3 C4

A3 A4

Orientation

Marking

Orientation

Marking +

123 56748

C5 C6

A5 A6

C7 C8

A7 A8

Table 1. PIN DESCRIPTIONS

Pin Number Pin Description Pin Number Pin Description

A1 Filter #1 (Microphone) C1 Filter #1

A2 Filter #2 (Microphone) C2 Filter #2

A3 Filter #3 (Stereo Headphone) C3 Filter #3

A4 Filter #4 (Left Speaker) C4 Filter #4

A5 Filter #5 (Right Speaker) C5 Filter #5

A6 Filter #6 (Accessory ID) C6 Filter #6

A7 Filter #7 (Data) C7 Filter #7

A8 Filter #8 (Data) C8 Filter #8

B1−B4 GND

SPECIFICATIONS

Table 2. ABSOLUTE MAXIMUM RATINGS

Parameter Rating Units

Storage Temperature Range −65 to +150 °C

DC current per Inductor 30 mA

DC Package Power Rating 0.5 W

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

Table 3. STANDARD OPERATING CONDITIONS

Parameter Rating Units

Operating Temperature Range −40 to +85 °C

CM1454

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Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)

Symbol Parameter Conditions Min Typ Max Units

R Resistance 80 100 120 W

C1Capacitance 2.5 V dc; 1 MHz, 30 mV ac 24 30 36 pF

L Inductance 3.0 nH

REEquivalent Series Resistance of Inductor 0.25 W

C2Capacitance 0 V dc, 1 MHz, 30 mV ac; 100 125 150 pF

2.5 V dc, 1 MHz, 30 mV ac; 64 80 96 pF

fRC Cut−off Frequency

ZSOURCE = 50 W, ZLOAD = 50 W

60 MHz

fLC Cut−off Frequency

ZSOURCE = 50 W, ZLOAD = 50 W

21 MHz

VST Stand−off Voltage I = 10 mA6.0 V

ILEAK Diode Leakage Current VIN = 3.3 V 0.1 1.0 mA

VSIG Signal Clamp Voltage

Positive Clamp

Negative Clamp

ILOAD = 10 mA

ILOAD = −10 mA

5.6

−1.5

6.8

−0.8

9.0

−0.4

VESD In−system ESD Withstand Voltage

a) Human Body Model, MIL−STD−883, Method 3015

b) Contact Discharge per IEC 61000−4−2 Level 4

(Notes 2 and 3)

±30

±15

RDYN Dynamic Resistance

Positive

Negative

2.3

0.9

1. TA = 25°C unless otherwise specified.

2. ESD applied to input and output pins with respect to GND, one at a time.

3. Unused pins are left open.

PERFORMANCE INFORMATION

Diode Characteristics (nominal conditions unless specified otherwise)

Figure 2. Typical Diode Capacitance vs. Input Voltage

(normalized to 2.5 VDC)

CM1454

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PERFORMANCE INFORMATION (Cont’d)

Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)

Figure 3. Attenuation Curve for CM1454 RC Filters: 1, 2, 6, 7, and 8

Figure 4. Attenuation Curve for CM1454 RC Filters: 3, 4, and 5

CM1454

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APPLICATION INFORMATION

Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS

Parameter Value

Pad Size on PCB 0.240 mm

Pad Shape Round

Pad Definition Non−Solder Mask defined pads

Solder Mask Opening 0.290 mm Round

Solder Stencil Thickness 0.125 − 0.150 mm

Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round

Solder Flux Ratio 50/50 by volume

Solder Paste Type No Clean

Pad Protective Finish OSP (Entek Cu Plus 106A)

Tolerance − Edge To Corner Ball ±50 mm

Solder Ball Side Coplanarity ±20 mm

Maximum Dwell Time Above Liquidous 60 seconds

Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C

Non−Solder Mask Defined Pad

0.240 mm DIA.

Solder Stencil Opening

0.300 mm DIA.

Solder Mask Opening

0.290 mm DIA.

Figure 5. Recommended Non−Solder Mask Defined Pad Illustration

Figure 6. Lead−free (SnAgCu) Solder Ball Reflow Profile

200

250

150

100

0 1:00.0 2:00.0 3:00.0 4:00.0

Time (minutes)

Temperature (5C)

CM1454

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PACKAGE DIMENSIONS

WLCSP20, 3.96x1.59

CASE 567BY−01

ISSUE O

SEATING

PLANE

0.05 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

DIM

MIN MAX

0.56

MILLIMETERS

D3.96 BSC

b0.29 0.35

eD 0.50 BSC

0.72

ÈÈ

PIN A1

REFERENCE

A0.05 BC

0.03 C

0.05 C

20X b

456

0.05 C

0.21 0.27

1.59 BSC

eE 0.435 BSC

0.25

20X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.50

0.87

0.44

0.05 C

2X TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

A2 0.42 REF

RECOMMENDED

PACKAGE

OUTLINE

123 789

PITCH

10 11 12

eD/2

ÉÉÉÉÉÉÉÉÉÉ

OptiGuard Option

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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PUBLICATION ORDERING INFORMATION

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Phone: 421 33 790 2910

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Phone: 81−3−5773−3850

CM1454/D

OptiGuardt is a trademark of Semiconductor Components Industries, LLC.

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