1
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
NMC-H Series
FEATURES
• HIGH VOLTAGE 200Vdc ~ 5KVdc
• NPO AND X7R DIELECTRICS
• CASE SIZES FROM 0603 ~ 2225
• NICKEL BARRIER TERMINATION AND EXCELLENT
MECHANICAL STRENGTH
Multilayer Ceramic Chip Capacitors
SPECIFICATIONS NPO X7R
Operating Temperature Range -55°C ~ +125°C -55°C ~ +125°C
Temperature Characteristic ±30ppm ±15%
Dissipation Factor < 0.1% < 2.5%
Insulation Resistance
> 500MegΩ or 500MegΩ-μF whichever is less
Test Method: Voltage rating < 500V measured after 1 minute at rated voltage,
Voltage rating > 500V measured after 1 minute at 500V
Capacitance Range 2.0pF ~ 0.039μF 150pF ~ 0.47μF
Capacitance Tolerance ±0.1pF(B), ±0.25pF(C), ±0.5pF(D)
±1%(F), ±2%(G), ±5%(J), ±10%(K), ±20(M) ±5%(J), ±10%(K), ±20(M)
Rated Voltage 200Vdc ~ 5KVdc 200Vdc ~ 3KVdc
Dielectric Withstanding Voltage
Working Voltage 200 & 250Vdc x 1.5 + 100Vdc for 5 seconds
Working Voltage 500Vdc x 1.5 for 5 seconds
Working Voltage greater than 500Vdc x 1.2 for 5 seconds
Test Conditions (C & DF) C < 1000pF = 1MHz, 1Vrms @ 25°C
C < 1000pF = 1KHz, 1Vrms @ 25°C 1KHz, 1Vrms @ 25°C
NMC-H 1206 NPO 102 J 1KV TRP or TRPLP 2K F
RoHS compliant
Non-Std or Optional Reel Quantity
Tape & Reel (Embossed Plastic Carrier)
Tape & Reel (Punched carrier)
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF, fi rst 2 digits are
signifi cant, 3rd digit is no. of zeros, “R” indicates
decimal for under 10pF
Temperature Characteristic
Size Code (see chart)
Series
PART NUMBER SYSTEM
CONSTRUCTION
PP
L
W
T
100% Sn over Ni barrier
*See Part Number System for Details
RoHS
Compliant
Includes all homogeneous materials
2
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
NMC-H NPO Series
Multilayer Ceramic Chip Capacitors
NPO-HIGH VOLTAGE SIZE CHART (mm)
EIA Case Size 0603 0805 1206 1210
Length (L) 1.6 ± 0.10 2.0 ± 0.15 3.2 ± 0.15 3.2 ± 0.30
Width (W) 0.80 ± 0.10 1.25 ± 0.10 1.6 ± 0.20 2.5 ± 0.20
Thickness (T) 0.90 max. 1.45 max. 1.80 max. 2.60 max.
Termination Width (P) 0.25 ~ 0.65 0.25 ~ 0.75 0.25 ~ 0.80 0.25 ~ 1.00
Capacitance Working Voltage (Vdc)
200 250 500 200 250 500 1K 2K 3K 200 250 500
2.0pF ~ 8.2pF
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
0.001μF
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0068
0.0082
3
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
NMC-H NPO Series
Multilayer Ceramic Chip Capacitors
EIA Case Size 1808 1812 1825 2220 2225
Length (L) 4.6 ± 0.40 4.6 ± 0.30 4.6 ± 0.30 5.7 ±0.40 5.70 ± 0,40
Width (W) 2.0 ± 0.30 3.2 ± 0.30 6.35 ± 0.40 5.00 ± 0.40 6.35 ± 0.40
Thickness (T) 2.20 max. 3.00 max. 3.00 max. 3.00 max. 3.00 max.
Termination Width (P) 0.25 ~ 0.75 0.25 ~ 0.75 0.3 ~ 1.05 0.30 ~ 1.10 0.30 ~ 1.10
Capacitance Working Voltage (Vdc)
1K 2K 3K 1K 2K 3K 250 500 1K 5K 250 500 1K
2.0pF ~ 8.2pF
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
0.001μF
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.01μF
0.012
0.015
0.018
0.022
0.027
0.033
0.039
NPO-HIGH VOLTAGE SIZE CHART (mm)
4
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
NMC-H X7R Series
Multilayer Ceramic Chip Capacitors
X7R-HIGH VOLTAGE SIZE CHART (mm)
EIA Case Size 0805 1206 1210
Length (L) 2.0 ± 0.1 3.2 ± 0.15 3.2 ± 0.2
Width (W) 1.25 ± 0.1 1.6 ± 0.15 2.5 ± 0.2
Thickness (T) 1.45 max. 1.80 max. 2.20 max.
Termination Width (P) 0.25 ~ 0.75 0.25 ~ 0.75 0.25 ~ 0.75
Capacitance Working Voltage (Vdc)
200 250 500 630 250 500 630 1K 2K 200 250 500 630 1K
150
180
220
270
330
390
470
560
680
820
0.001μF
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.01μF
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.1μF
0.12
0.15
0.18
0.22
0.27
0.33
0.47
5
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
EIA Case Size 1808 1812 2220 2225
Length (L) 4.6 ± 0.4 4.6 ± 0.4 5.7 ±0.40 5.70 ± 0,40
Width (W) 2.0 ± 0.3 3.2 ± 0.3 5.00 ± 0.40 6.35 ± 0.40
Thickness (T) 2.20 max. 2.20 max. 3.00 max. 3.00 max.
Termination Width (P) 0.30 min. 0.30 min. 0.30 ~ 1.10 0.30 ~ 1.10
Capacitance Working Voltage (Vdc)
500 1K 2K 3K 200 250 500 1K 2K 3K 250 500 1K 2K 250 500 1K
150
180
220
270
330
390
470
560
680
820
0.001μF
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.01μF
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.1μF
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1.0μF
1.5
2.2
NMC-H X7R Series
Multilayer Ceramic Chip Capacitors
X7R-HIGH VOLTAGE SIZE CHART (mm)
6
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
Taping Specifi cations
EMBOSSED PLASTIC CARRIER TAPE DIMENSIONS (mm)
REEL DIMENSIONS (mm)
7 INCH REEL QUANTITIES*
*Quantity dependent on chip thickness. Contact NIC for reel
quantities on larger diameter reels.
Notes:
1. Specifi cations are in compliance with EIA RS481-1-A
“Taping of surface Mount Components for Automatic Placement”
2. Dimensions Ao (max.) equals component width dimension plus 0.5mm
3. Dimension Bo (max.) equals component length dimension plus 0.5mm
PUNCHED CARRIER TAPE DIMENSIONS (mm)
Type AoBoWF E P1 P0D0
T1
max.
T2
max.
Mounting
Hole
01005 0.25 ± 0.04 0.45 ± 0.04
8.0 ± 0.3 3.5 ± 0.05 1.75 ± 0.1
2.0 ± 0.05
4.0 ± 0.1 1.5
+0.1/-0.0
0.27 0.36
Angular
Punch
Hole
0201 0.37 ± 0.03 0.67 ± 0.05 0.45 0.80
0402 0.65 ± 0.05 1.15 ± 0.05
1.1 1.4
0603 1.1 ± 0.2 1.9 ± 0.2
4.0 ± 0.100805 1.65 ± 0.2 2.4 ± 0.2
1206 2.0 ± 0.2 3.6 ± 0.2
Size 01005 0201 0402 0603 0805 1206 1210 1808 1812
Tape Size 8mm 8mm 8mm 8mm 8mm 8mm 8mm 12mm 12mm
Min. Qty
Per Reel 20,000 20,000 10,000 4,000 4,000 4,000 2,000 1,000 1,000
Max. Qty
Per Reel 20,000 20,000 10,000 4,000 5,000 5,000 5,000 3,000 2,000
Multilayer Ceramic Chip Capacitors
Reel Diameter (A) B C D T max.
7” (178 ± 2.0)
13 ± 0.5
50 min.
21 ± 1.0
8.4 +1.0/-0
(1812 case size
12.4 +2.0/-0)
10” (250 ± 2.0) 100 ± 1.0
13” (330 ± 2.0) 100 ± 1.0
C
B
T
A
REEL
D
Tape Size W F E P0P2D K max. T max. P
8mm 8.0 ± 0.2 3.5 ± 0.05 1.75 ± 0.10 4.0 ± 0.1 2.0 ± 0.5 1.5 +0.1
-0.0 3.0 2.0 4.0 ± 0.1
12mm 12 ± 0.2 5.5 ± 0.05 4.5 8.0 ± 0.1
Parts with a thickness of >1mm will be taped on embossed
plastic carrier. Parts with a thickness of less then 1mm
will be taped on paper carrier
CARRIER TAPE MATERIAL
EMBOSSED PLASTIC CARRIER TAPE
K
T
DP
o
W
F
A
o
P
B
o
E
P
2
See notes 2 & 3 regarding dimensions
Ao and Bo
t2
t1
DP
o
W
F
A
o
P1
Component
Pitch
B
o
E
PUNCHED CARRIER TAPE
