© Semiconductor Components Industries, LLC, 2008
August, 2008 Rev. 18
1Publication Order Number:
MC34064/D
MC34064, MC33064,
NCV33064
Undervoltage Sensing
Circuit
The MC34064 is an undervoltage sensing circuit specifically
designed for use as a reset controller in microprocessorbased
systems. It offers the designer an economical solution for low voltage
detection with a single external resistor. The MC34064 features a
trimmedinpackage bandgap reference, and a comparator with
precise thresholds and built-in hysteresis to prevent erratic reset
operation. The open collector reset output is capable of sinking in
excess of 10 mA, and operation is guaranteed down to 1.0 V input with
low standby current. The MC devices are packaged in 3pin TO-92,
micro size TSOP5, 8pin SOIC8 and Micro8t surface mount
packages. The NCV device is packaged in SOIC8 and TO92.
Applications include direct monitoring of the 5.0 V MPU/logic
power supply used in appliance, automotive, consumer and industrial
equipment.
Features
TrimmedInPackage Temperature Compensated Reference
Comparator Threshold of 4.6 V at 25°C
Precise Comparator Thresholds Guaranteed Over Temperature
Comparator Hysteresis Prevents Erratic Reset
Reset Output Capable of Sinking in Excess of 10 mA
Internal Clamp Diode for Discharging Delay Capacitor
Guaranteed Reset Operation with 1.0 V Input
Low Standby Current
Economical TO92, TSOP5, SOIC8 and Micro8 Surface Mount
Packages
NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
PbFree Packages are Available
1.2 Vref
Reset
GND
Input
=Sink Only
Positive True Logic
This device contains 21 active transistors.
Figure 1. Representative Block Diagram
http://onsemi.com
Pin 1. Reset
2. Input
3. Ground
TO92
P SUFFIX
CASE 29
8
1
(Top View)
3
1N.C.
Ground
N.C.
N.C.
2
4
8
7
6
5N.C.
N.C.
Input
Reset
8
1
PIN CONNECTIONS
ORDERING INFORMATION
SOIC8
D SUFFIX
CASE 751
Micro8
DM SUFFIX
CASE 846A
TSOP5
SN SUFFIX
CASE 483
1
5
Pin 1. Ground
2. Input
3. Reset
4. NC
5. NC
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
See general marking information in the device marking
section on page 7 of this data sheet.
DEVICE MARKING INFORMATION
123
12
BENT LEAD
TAPE & REEL
AMMO PACK
STRAIGHT LEAD
BULK PACK
3
MC34064, MC33064, NCV33064
http://onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Power Input Supply Voltage Vin 1.0 to 10 V
Reset Output Voltage VO10 V
Reset Output Sink Current (Note 2) ISink Internally
Limited
mA
Clamp Diode Forward Current, Reset to Input Pin (Note 2) IF100 mA
Power Dissipation and Thermal Characteristics
P Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, JunctiontoAir
D Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, JunctiontoAir
DM Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, JunctiontoAir
PD
RqJA
PD
RqJA
PD
RqJA
625
200
625
200
520
240
mW
°C/W
mW
°C/W
mW
°C/W
Operating Junction Temperature TJ+150 °C
Operating Ambient Temperature
MC34064
MC33064
NCV33064
TA0 to +70
40 to +85
40 to +125
°C
Storage Temperature Range Tstg 65 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. ESD data available upon request.
ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA is the operating ambient temperature range
that applies [Notes 3 and 4] unless otherwise noted.)
Characteristics Symbol Min Typ Max Unit
COMPARATOR
Threshold Voltage
High State Output (Vin Increasing)
Low State Output (Vin Decreasing)
Hysteresis
VIH
VIL
VH
4.5
4.5
0.01
4.61
4.59
0.02
4.7
4.7
0.05
V
RESET OUTPUT
Output Sink Saturation
(Vin = 4.0 V, ISink = 8.0 mA)
(Vin = 4.0 V, ISink = 2.0 mA)
(Vin = 1.0 V, ISink = 0.1 mA)
VOL
0.46
0.15
1.0
0.4
0.1
V
Output Sink Current (Vin, Reset = 4.0 V) ISink 10 27 60 mA
Output Off-State Leakage (Vin, Reset = 5.0 V) IOH 0.02 0.5 mA
Clamp Diode Forward Voltage, Reset to Input Pin (IF = 10 mA) VF0.6 0.9 1.2 V
TOTAL DEVICE
Operating Input Voltage Range Vin 1.0 to 6.5 V
Quiescent Input Current (Vin = 5.0 V) Iin 390 500 mA
2. Maximum package power dissipation limits must be observed.
3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
4. Tlow =0°C for MC34064 Thigh = +70°C for MC34064
40°C for MC33064 +85°C for MC33064
40°C for NCV33064 +125°C for NCV33064
5. NCV prefix is for automotive and other applications requiring site and change control.
MC34064, MC33064, NCV33064
http://onsemi.com
3
VO, OUTPUT VOLTAGE (V)
VO, OUTPUT VOLTAGE (V)
Figure 2. Reset Output Voltage versus
Input Voltage
Figure 3. Reset Output Voltage versus
Input Voltage
Figure 4. Comparator Threshold Voltage
versus Temperature
Figure 5. Input Current versus Input Voltage
Figure 6. Reset Output Saturation versus
Sink Current
Figure 7. Reset Delay Time
Vin, INPUT VOLTAGE (V)
10
8.0
6.0
4.0
2.0
00 2.0 4.0 6.0 8.0 10
RL = 10 k to Vin
TA = 25°C
Vin, INPUT VOLTAGE (V)
5.0
4.0
3.0
2.0
1.0
04.560 4.580 4.600 4.620 4.640
RL = 10 k to Vin
TA = 25°C
TA, AMBIENT TEMPERATURE (°C)
th, THRESHOLD VOLTAGE (V)
4.630
4.620
4.610
4.600
4.590
4.580
4.570-55 -25 0 25 50 75 100 125
V
RL = 10 k to Vin
Upper Threshold
High State Output
Lower Threshold
Low State Output
Vin, INPUT VOLTAGE (V)
in, INPUT CURRENT (mA)
1.0
0.8
0.6
0.4
0.2
00 2.0 4.0 6.0 8.0 10
I
TA = +25°C
-40°C
TA = +25°C
+85°C-40°C
VOL, OUTPUT SATURATION (V)
ISink, SINK CURRENT (mA)
2.0
1.5
1.0
0.5
0010203040
Vin = 4.0 V
TA = 85°C
TA = 25°C
TA = -40°C
90%
5.0 V -
4.0 V -
10%
+85°C
Reset
Vin
5.0V
4.0V
REF
10k
200 ns/DIV
Reset
Vin
Vin = 5.0 V to 4.0 V
RL = 10 k
TA = 25°C
MC34064, MC33064, NCV33064
http://onsemi.com
4
Figure 8. Clamp Diode Forward Current versus Voltage
Figure 9. Low Voltage Microprocessor Reset
Figure 10. Low Voltage Microprocessor Reset with Additional Hysteresis
80
60
40
20
00 0.4 0.8 1.2 1.6
VF, FORWARD VOLTAGE (V)
, FORWARD CURRENT (mA)
F
I
Vin = 0 V
TA = 25°C
A time delayed reset can be accomplished with the
addition of CDLY
. For systems with extremely fast
power supply rise times (<500 ns) it is recommended
that the RCDLY time constant be greater than 5.0 ms.
Vth(MPU) is the microprocessor reset input threshold.
tDLY = RCDLY In
1
1 - Vth(MPU)
Power
Supply
+
-
Input R
Reset
CDLY
Microprocessor
Circuit
1.2 Vref
GND
-
+
Power
Supply
+
-
Input RL
Reset
Microprocessor
Circuit
1.2Vref
GND
-
+VH 4.6 RH+ 0.02
DVth(lower) 340 RH x 10-6
Where:RH 150 W
Where:RL 1.5 W, 10 kW
Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been
simplified and does not account for the change of input current Iin as VCC crosses the comparator threshold
(Figure 4). An increase of the lower threshold DVth(lower) will be observed due to Iin which is typically 340 mA at
4.59V. The equations are accurate to ±10% with RH less than 150 W and RL between 1.5 kW and 10 kW.
Iin
RH
Vin
RL
TEST DATA
VH
(mV)
DVth
(mV)
RH
(W)
RL
(kW)
20
51
40
81
71
112
100
164
190
327
276
480
0
3.4
6.8
6.8
10
10
16
16
34
34
51
51
0
10
20
20
30
30
47
47
100
100
150
150
0
1.5
4.7
1.5
2.7
1.5
2.7
1.5
2.7
1.5
2.7
1.5
Figure 11. Voltage Monitor Figure 12. Solar Powered Battery Charger
Figure 13. Low Power Switching Regulator
Figure 14. MOSFET Low Voltage Gate Drive Protection
Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above
circuit. When the input signal is below the 4.6 V threshold of the MC34064, its output grounds the gate of the L2
MOSFET.
270
4.6V
VCC
RL
MTP3055EL
Input
Reset
GND
-
+
1.2Vref
Input
GND
-
+
1.2Vref
Power
Supply
+
-
1.0k
Input
Reset
GND
-
+
1.2Vref
+
-
Solar
Cells
Input
Reset
GND
-
+
1.2Vref
Vin = 11.5
to 14.5V
470
+
MPSW51A
25mH
VO = 5.0 V
IO = 50 mA
470 +
68022 +
1N5819
1.2k
330 1N756
4.7k
Reset
MC34064, MC33064, NCV33064
http://onsemi.com
5
Test Conditions Results
Line Regulation Vin = 11.5 V to 14.5 V, IO = 50 mA 35 mV
Load Regulation Vin = 12.6 V, IO = 0 mA to 50 mA 12 mV
Output Ripple Vin = 12.6 V, IO = 50 mA 60 mVpp
Efficiency Vin = 12.6 V, IO = 50 mA 77%
MC34064, MC33064, NCV33064
http://onsemi.com
6
ORDERING INFORMATION
Device Operating Temperature Range Package Shipping
MC34064D005
TA = 0°C to +70°C
SOIC898 Units / Rail
MC34064D5G SOIC8
(PbFree)
MC34064D5R2 SOIC82500 Units/ Tape & Reel
MC34064D5R2G SOIC8
(PbFree)
MC34064DM5R2 Micro8 4000 Units / Tape & Reel
MC34064DM5R2G Micro8
(PbFree)
MC34064P005 TO92 2000 Units / Bag
MC34064P5G TO92
(PbFree)
MC34064P5RA TO92 2000 Units / Tape & Reel
MC34064P5RAG TO92
(PbFree)
MC34064P5RP TO92 2000 Units / Ammo Pack
MC34064P5RPG TO92
(PbFree)
MC34064P5RM TO92
MC34064P5RMG TO92
(PbFree)
MC34064SN5T1 TSOP53000 Units / Tape & Reel
MC34064SN5T1G TSOP5
(PbFree)
MC33064D005
TA = 40°C to +85°C
SOIC898 Units / Rail
MC33064D5G SOIC8
(PbFree)
MC33064D5R2 SOIC82500 Units / Tape & Reel
MC33064D5R2G SOIC8
(PbFree)
MC33064DM5R2 Micro8 4000 Units / Tape & Reel
MC33064DM5R2G Micro8
(PbFree)
MC33064P005 TO92 2000 Units / Bag
MC33064P5G TO92
(PbFree)
MC33064P5RA TO92 2000 Units / Tape & Reel
MC33064P5RAG TO92
(PbFree)
MC33064P5RP TO92 2000 Units / Ammo Pack
MC33064P5RPG TO92
(PbFree)
MC33064SN5T1 TSOP53000 Units / Tape & Reel
MC33064SN5T1G TSOP5
(PbFree)
For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV33064: Tlow = 40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and
change control.
MC34064, MC33064, NCV33064
http://onsemi.com
7
ORDERING INFORMATION
Device Shipping
PackageOperating Temperature Range
NCV33064D5R2*
TA = 40°C to +125°C
SOIC82500 Units / Tape & Reel
NCV33064D5R2G* SOIC8
(PbFree)
NCV33064P5RA* TO92 2000 Units / Tape & Reel
NCV33064P5RAG* TO92
(PbFree)
NCV33064P5RP* TO92 2000 Units / Ammo Pack
NCV33064P5RPG* TO92
(PbFree)
NCV33064DM5R2* Micro8 4000 Units / Tape & Reel
NCV33064DM5R2G* Micro8
(PbFree)
For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV33064: Tlow = 40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and
change control.
V3064
ALYW5
G
SOIC8
D SUFFIX
CASE 751
x = 3 or 4
y = C or I
A = Assembly Location
L = Wafer Lot
Y = Year
W, WW = Work Week
G=PbFree Package
MARKING DIAGRAMS
Micro8
DM SUFFIX
CASE 846A
1
8
TO92
P SUFFIX
CASE 29
123
TSOP5
SN SUFFIX
CASE 483
1
5
SRB AYW G
G
MC3x0
64P5
ALYWW G
G
123
NCV30
64P5
ALYWW G
G
(Note: Microdot may be in either location)
1
5
SSN AYW G
G
MC34064 MC33064
1
8
3x064
ALYW5
G
1
8
Ly50
AYW G
G
1
8
VI50
AYW G
G
MC34064, MC33064, NCV33064
http://onsemi.com
8
PACKAGE DIMENSIONS
SOIC8
D SUFFIX
CASE 75107
ISSUE AJ
SEATING
PLANE
1
4
58
N
J
X 45 _
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 75101 THRU 75106 ARE OBSOLETE. NEW
STANDARD IS 75107.
A
BS
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
X
Y
G
M
Y
M
0.25 (0.010)
Z
Y
M
0.25 (0.010) ZSXS
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒmm
inchesǓ
SCALE 6:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC34064, MC33064, NCV33064
http://onsemi.com
9
PACKAGE DIMENSIONS
Micro8
DM SUFFIX
CASE 846A02
ISSUE G
S
B
M
0.08 (0.003) A S
T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
b
e
PIN 1 ID
8 PL
0.038 (0.0015)
T
SEATING
PLANE
A
A1 cL
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8X 8X
6X ǒmm
inchesǓ
SCALE 8:1
1.04
0.041
0.38
0.015
5.28
0.208
4.24
0.167
3.20
0.126
0.65
0.0256
DIM
A
MIN NOM MAX MIN
MILLIMETERS
−− −− 1.10 −−
INCHES
A1 0.05 0.08 0.15 0.002
b0.25 0.33 0.40 0.010
c0.13 0.18 0.23 0.005
D2.90 3.00 3.10 0.114
E2.90 3.00 3.10 0.114
e0.65 BSC
L0.40 0.55 0.70 0.016
−− 0.043
0.003 0.006
0.013 0.016
0.007 0.009
0.118 0.122
0.118 0.122
0.026 BSC
0.021 0.028
NOM MAX
4.75 4.90 5.05 0.187 0.193 0.199
HE
HE
DD
E
MC34064, MC33064, NCV33064
http://onsemi.com
10
PACKAGE DIMENSIONS
TSOP5
SN SUFFIX
CASE 48302
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM MIN MAX
MILLIMETERS
A3.00 BSC
B1.50 BSC
C0.90 1.10
D0.25 0.50
G0.95 BSC
H0.01 0.10
J0.10 0.26
K0.20 0.60
L1.25 1.55
M0 10
S2.50 3.00
123
54 S
A
G
L
B
D
H
C
J
__
0.7
0.028
1.0
0.039
ǒmm
inchesǓ
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.20
5X
CAB
T0.10
2X
2X T0.20
NOTE 5
T
SEATING
PLANE
0.05
K
M
DETAIL Z
DETAIL Z
MC34064, MC33064, NCV33064
http://onsemi.com
11
PACKAGE DIMENSIONS
TO92 (TO226)
P SUFFIX
CASE 2911
ISSUE AM
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
R
A
P
J
L
B
K
G
H
SECTION XX
C
V
D
N
N
XX
SEATING
PLANE DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.175 0.205 4.45 5.20
B0.170 0.210 4.32 5.33
C0.125 0.165 3.18 4.19
D0.016 0.021 0.407 0.533
G0.045 0.055 1.15 1.39
H0.095 0.105 2.42 2.66
J0.015 0.020 0.39 0.50
K0.500 --- 12.70 ---
L0.250 --- 6.35 ---
N0.080 0.105 2.04 2.66
P--- 0.100 --- 2.54
R0.115 --- 2.93 ---
V0.135 --- 3.43 ---
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND
DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P
AND BEYOND DIMENSION K MINIMUM.
RA
P
J
B
K
G
SECTION XX
C
V
D
N
XX
SEATING
PLANE DIM MIN MAX
MILLIMETERS
A4.45 5.20
B4.32 5.33
C3.18 4.19
D0.40 0.54
G2.40 2.80
J0.39 0.50
K12.70 ---
N2.04 2.66
P1.50 4.00
R2.93 ---
V3.43 ---
1
T
STRAIGHT LEAD
BULK PACK
BENT LEAD
TAPE & REEL
AMMO PACK
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
MC34064/D
Micro8 is a trademark of International Rectifier.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81357733850
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative