HFA-0001 1105 UCT PROD A1100, HFA E T E L t F OBSO cements: H rt Center a o la p p p c e u s ed R ical S ersil.com/t mend Techn t Recom ontact our ww.in w r o or c RSIL E T N -I 1-888 (R) September 1998 File Number 2916.3 Ultra High Slew RateOperational Amplifier Features The HFA-0001 is an all bipolar op amp featuring high slew rate (1000V/s), and high unity gain bandwidth (350MHz). These features combined with fast settling time (25ns) make this product very useful in high speed data acquisition systems as well as RF, video, and pulse amplifier designs. Other outstanding characteristics include low bias currents (15A), low offset current (18A), and low offset voltage (6mV). * Unity Gain Bandwidth. . . . . . . . . . . . . . . . . . . . . . 350MHz * Full Power Bandwidth . . . . . . . . . . . . . . . . . . . . . . 53MHz * High Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . 1000V/s * High Output Drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA * Monolithic Construction Applications The HFA-0001 offers high performance at low cost. It can replace hybrids and RF transistor amplifiers, simplifying designs while providing increased reliability due to monolithic construction. To enhance the ease of design, the HFA-0001 has a 50 20% resistor connected from the output of the op amp to a separate pin. This can be used when driving 50 strip line, microstrip, or coax cable. * RF/IF Processors * Video Amplifiers * High Speed Cable Drivers * Pulse Amplifiers * High Speed Communications * Fast Data Acquisition Systems Part Number Information PART NUMBER TEMPERATURE RANGE PACKAGE HFA1-0001-5 0oC to +75oC 14 Lead Ceramic Sidebraze DIP HFA1-0001-9 -40oC to +85oC 14 Lead Ceramic Sidebraze DIP HFA3-0001-5 0oC to +75oC 8 Lead Plastic DIP HFA3-0001-9 -40oC to +85oC 8 Lead Plastic DIP HFA9P0001-5 0oC to +75oC 16 Lead Widebody SOIC Pinouts HFA-0001 (PDIP) TOP VIEW NC 1 8 -IN 2 +IN 3 V- 4 HFA-0001 (CDIP) TOP VIEW + RSENSE NC 1 HFA-0001 (300 MIL SOIC) TOP VIEW 14 NC NC 1 16 NC NC 2 15 NC NC 3 14 RSENSE 7 V+ NC 2 13 NC 6 OUT NC 3 12 RSENSE 5 NC 1 -IN 4 +IN 5 11 V+ + -IN 4 +IN 5 13 V+ + 12 OUT 10 OUT V- 6 9 NC NC 7 8 NC V- 6 11 NC NC 7 10 NC NC 8 9 NC CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright (c) Intersil Americas Inc. 2002. All Rights Reserved HFA-0001 Absolute Maximum Ratings (Note 1) Operating Conditions Supply Voltage (Between V+ and V- Terminals) . . . . . . . . . . . . .12V Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5V Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4V Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60mA Junction Temperature (Note 9) . . . . . . . . . . . . . . . . . . . . . . .+175oC Junction Temperature (Plastic Package) . . . . . . . . . . . . . . . .+150oC Lead Temperature (Soldering 10 Sec.) . . . . . . . . . . . . . . . . .+300oC Operating Temperature Range HFA-0001-9 . . . . . . . . . . . . . . . . . . . . . . . . . .-40oC TA +85oC HFA-0001-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC TA +75oC Storage Temperature Range . . . . . . . . . . . . . .-65oC TA +150oC CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Specifications V+ = +5V, V- = -5V, Unless Otherwise Specified HFA-0001-9 PARAMETER HFA-0001-5 TEMP MIN TYP MAX MIN TYP MAX UNITS +25oC - 6 15 - 6 30 mV High - 4.5 20 - 4.5 30 mV Low - 12.5 45 - 12.5 35 mV High - 50 - - 50 - V/oC Low - 100 - - 100 - V/oC +25oC - 15 50 - 15 100 A Full - 20 50 - 20 100 A +25oC - 18 25 - 18 50 A Full - 22 50 - 22 50 A Common Mode Range +25oC 3 - - 3 - - V Differential Input Resistance +25oC - 10 - - 10 - k Input Capacitance +25oC - 2 - - 2 - pF 0.1Hz to 10Hz +25oC - 3.5 - - 3.5 - Vrms 10Hz to 1MHz +25oC - 6.7 - - 6.7 - Vrms fO = 10Hz +25oC - 640 - - 640 - nV/Hz fO = 100Hz +25oC - 170 - - 170 - nV/Hz fO = 100kHz +25oC - 6 - - 6 - nV/Hz fO = 10Hz +25oC - 2.35 - - 2.35 - nA/Hz fO = 100Hz +25oC - 0.57 - - 0.57 - nA/Hz fO = 1000Hz +25oC - 0.16 - - 0.16 - nA/Hz +25oC 150 200 - 150 200 - V/V High 150 170 - 100 170 - V/V Low 150 220 - 150 220 - V/V +25oC 45 47 - 42 47 - dB High 40 45 - 40 45 - dB Low 42 48 - dB INPUT CHARACTERISTICS Offset Voltage Average Offset Voltage Drift Bias Current Offset Current Input Noise Voltage Input Noise Voltage Input Noise Current TRANSFER CHARACTERISTICS Large Signal Voltage Gain (Note 2) Common Mode Rejection Ratio (Note 3) 45 48 - Unity Gain Bandwidth +25oC - 350 - - 350 - MHz Minimum Stable Gain Full 1 - - 1 - - V/V +25oC - 3.5 - - 3.5 - V OUTPUT CHARACTERISTICS Output Voltage Swing RL = 100 2 HFA-0001 Electrical Specifications V+ = +5V, V- = -5V, Unless Otherwise Specified (Continued) HFA-0001-9 PARAMETER HFA-0001-5 TEMP MIN TYP MAX MIN TYP MAX UNITS +25oC 3.5 3.7 - 3.5 3.7 - V High 3.0 3.6 - 3.0 3.6 - V Low 3.5 3.7 - 3.5 3.7 - V Full Power Bandwidth (Note 5) +25oC - 53 - - 53 - MHz Output Resistance, Open Loop +25oC - 3 - - 3 - Full 30 50 - 30 50 - mA Rise Time (Note 4, 6) +25oC - 480 - - 480 - ps Slew Rate (Note 4, 7) RL = 1k +25oC - 1000 - - 1000 - V/s RL = 100 +25oC - 875 - - 875 - V/s 0.1% +25oC - 25 - - 25 - ns +25oC - 36 - - 36 - % Full - 65 75 - 65 75 mA +25oC 40 42 - 37 42 - dB High 35 41 - 35 41 - dB Low 40 42 - 37 42 - dB RL = 1k Output Current TRANSIENT RESPONSE Settling Time (3V Step) Overshoot (Note 4, 6) POWER SUPPLY CHARACTERISTICS Supply Current Power Supply Rejection Ratio (Note 8) NOTES: 1. Absolute Maximum Ratings are limiting values applied individually beyond which the serviceability of the circuit may be impaired. Functional operation under any of these conditions is not necessarily implied. 2. VOUT = 0 to 2V, R L = 1k. 3. VCM = 2V. 4. RL = 100. SlewRate 5. Full Power Bandwidth is calculated by equation: FPBW = ----------------------------- , V = 3.0V . PEAK 2V PEAK 6. VOUT = 200mV, AV = +1. 7. VOUT = 3V, AV = +1. 8. VS = 4V to 6V. 9. See Thermal Constants in `Applications Information' text. Maximum power dissipation, including output load, must be designed to maintain the junction temperature below +175oC for hermetic packages, and below +150oC for plastic packages. Schematic Diagram Die Characteristics V+ RSENSE -IN +IN VOUT V- 3 Thermal Constants (oC/W) HFA1-0001-5/-9 HFA3-0001-5 HFA9P-0001-5/-9 JA 75 98 96 JC 13 36 27 HFA-0001 Test Circuits VIN + VOUT 50 1k VIN + 50 20pF 50 VOUT 100 50 FIGURE 1. LARGE SIGNAL RESPONSE TEST CIRCUIT FIGURE 2. SMALL SIGNAL RESPONSE TEST CIRCUIT LARGE SIGNAL RESPONSE VOUT = 0V to 3V Vertical Scale: 1V/Div. Horizontal Scale: 2ns/Div. SMALL SIGNAL RESPONSE VOUT = 0mV to 200mV Vertical Scale: 100mV/Div. Horizontal Scale: 2ns/Div. VIN VIN VOUT VOUT NOTE: Initial Step In Output Is Due To Fixture Feedthrough PROPAGATION DELAY Vertical Scale: 500mV/Div. Horizontal Scale: 2ns/Div. AV = +1, R L = 100, VOUT = 0V to 3V VSETTLE 1k 1k 100 VIN 100 VOUT + FIGURE 3. SETTLING TIME SCHEMATIC 4 NOTE: Test Fixture Delay of 450ps is Included HFA-0001 Typical Performance Curves VS = 5V, TA = +25oC, Unless Otherwise Specified 50 VIN VOUT 50 GAIN 20 0 180 135 PHASE 90 45 RL = 100 0 1G 10 0 GAIN -10 -20 180 PHASE 135 90 45 AV = +1, RL = 100, R F = 50 0 FREQUENCY (Hz) 10M 100M FREQUENCY (Hz) FIGURE 4. OPEN LOOP GAIN AND PHASE vs FREQUENCY FIGURE 5. CLOSED LOOP GAIN vs FREQUENCY 100K 10M VIN VOUT 50 10 100M 100 -10 -20 180 135 90 45 0 1G PHASE MARGIN (DEGREES) 0 1M 1G 30 100 20 GAIN (dB) 20 GAIN (dB) 1M 1M VIN 10 VOUT 50 0 900 100 100 -10 180 135 90 AV = +10 RL = 100 FIGURE 6. CLOSED LOOP GAIN vs FREQUENCY FIGURE 7. CLOSED LOOP GAIN vs FREQUENCY 100M 80 700 600 1M 0 1G FREQUENCY (Hz) 100M 100K 45 10M FREQUENCY (Hz) 10M PHASE MARGIN (DEGREES) 10 PHASE MARGIN (DEGREES) 20 100 50 PHASE MARGIN (DEGREES) 30 GAIN (dB) GAIN (dB) 40 AV = +1, RL = 100 VOUT = 0mV to 200mV 70 CMRR (dB) RISE TIME (ps) 60 500 400 300 50 40 30 20 200 100 -60 10 -40 -20 0 20 40 60 80 100 TEMPERATURE (oC) FIGURE 8. RISE TIME vs TEMPERATURE 5 120 0 100K 1M 10M 100M FREQUENCY (Hz) FIGURE 9. CMRR vs FREQUENCY 1G HFA-0001 VS = 5V, TA = +25oC, Unless Otherwise Specified (Continued) 80 25 70 20 60 15 OFFSET VOLTAGE (mV) PSRR (dB) Typical Performance Curves 50 40 -PSRR 30 +PSRR 20 10 10 5 0 -5 -10 -15 0 100K 1M 10M FREQUENCY (Hz) 100M -20 -60 1G -40 -20 0 20 40 60 80 100 120 TEMPERATURE (oC) FIGURE 10. PSRR vs FREQUENCY FIGURE 11. OFFSET VOLTAGE vs TEMPERATURE (3 REPRESENTATIVE UNITS) 20 40 15 OFFSET CURRENT (A) BIAS CURRENT (A) 30 20 10 0 10 5 0 -5 -10 -15 -10 -20 -20 -60 -40 -20 0 20 40 60 80 100 -25 -60 120 -40 -20 0 60 80 100 120 4.6 4.4 4.2 4.0 -VOUT 3.8 3.6 +VOUT 3.4 3.2 3.0 2.8 2.6 2.4 2.2 60 80 100 TEMPERATURE (oC) FIGURE 14. OPEN LOOP GAIN vs TEMPERATURE 6 40 FIGURE 13. OFFSET CURRENT vs TEMPERATURE (3 REPRESENTATIVE UNITS) OUTPUT VOLTAGE (V) OPEN LOOP GAIN (V/V) FIGURE 12. BIAS CURRENT vs TEMPERATURE (3 REPRESENTATIVE UNITS) 300 280 260 -AVOL 240 220 200 +AVOL 180 160 140 120 100 80 60 40 20 RL = 1k, VOUT = 0V to 2V 0 -60 -40 -20 0 20 40 20 TEMPERATURE (oC) TEMPERATURE (oC) 120 2.0 -60 RL = 1k -40 -20 0 20 40 60 80 100 120 TEMPERATURE (oC) FIGURE 15. OUTPUT VOLTAGE SWING vs TEMPERATURE HFA-0001 Typical Performance Curves VS = 5V, TA = +25oC, Unless Otherwise Specified (Continued) 60 1200 1100 AV = +1, RL = 100 VOUT = 3V 58 56 52 -SLEW RATE CMRR (dB) SLEW RATE (V/s) 54 1000 900 +SLEW RATE 800 -CMRR 50 48 46 +CMRR 44 42 700 40 38 600 36 500 -60 -40 -20 0 20 40 60 80 100 34 -60 120 -40 -20 FIGURE 16. SLEW RATE vs TEMPERATURE 90 SUPPLY CURRENT (mA) PSRR (dB) 60 80 100 120 60 -PSRR 60 50 40 +PSRR 30 20 50 40 30 20 10 10 0 -40 -20 0 20 40 60 80 100 120 0 1 TEMPERATURE (oC) 2 3 4 5 SUPPLY VOLTAGE (V) FIGURE 18. PSRR vs TEMPERATURE FIGURE 19. SUPPLY CURRENT vs SUPPLY VOLTAGE 70 5.0 PEAK OUTPUT VOLTAGE SWING (V) 68 66 SUPPLY CURRENT (mA) 40 70 VS = 4V TO 6V 70 64 62 60 58 56 54 52 50 48 46 44 -60 20 FIGURE 17. CMRR vs TEMPERATURE 80 0 -60 0 TEMPERATURE (oC) TEMPERATURE (oC) -40 -20 0 20 40 60 80 100 120 TEMPERATURE (oC) FIGURE 20. SUPPLY CURRENT vs TEMPERATURE 7 4.5 AV = +1, R L = 100 THD < 1% 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 1M 10M 100M 1G FREQUENCY (Hz) FIGURE 21. MAXIMUM OUTPUT VOLTAGE SWING vs FREQUENCY HFA-0001 Typical Performance Curves VS = 5V, TA = +25oC, Unless Otherwise Specified (Continued) 240 5.0 200 OPEN LOOP GAIN (V/V) 4.0 3.5 3.0 2.5 2.0 1.5 140 120 100 0.5 60 100 1K LOAD RESISTANCE () 40 10 10K 8 7 7 6 6 5 5 4 4 NOISE CURRENT 3 3 2 2 NOISE VOLTAGE 1 1 0 10 100 1K 10K 0 100K 100 1K LOAD RESISTANCE () 10K FIGURE 23. OPEN LOOP GAIN vs LOAD RESISTANCE NOISE VOLTAGE (nV/Hz) 8 NOISE CURRENT (nA/Hz) FIGURE 22. OUTPUT VOLTAGE SWING vs LOAD RESISTANCE -AVOL +AVOL 160 80 0 10 NOISE VOLTAGE (V/Hz) 180 1.0 1 VOUT = 2V 220 600 600 500 500 400 400 300 300 200 100 0 100 NOISE CURRENT NOISE VOLTAGE 200 100 0 100K FREQUENCY (Hz) 1K 10K FREQUENCY (Hz) FIGURE 24. INPUT NOISE vs FREQUENCY FIGURE 25. INPUT NOISE vs FREQUENCY FIGURE 26. INPUT VOLTAGE NOISE 0.1Hz to 10Hz AV = 50, Noise Voltage = 1.605Vrms (RTI) Noise Voltage = 10.12VP-P FIGURE 27. INPUT NOISE VOLTAGE 10Hz to 1MHz AV = 50, Noise Voltage = 5.36Vrms (RTI) Noise Voltage = 29.88VP-P 8 NOISE CURRENT (pA/Hz) PEAK OUTPUT VOLTAGE SWING (V) 4.5 AV = +1, fO = 50kHz THD < 1% HFA-0001 Applications Information This 50 resistor can be used as the series resistor instead of an external resistor. Offset Adjustment When applications require the offset voltage to be as low as possible, the figure below shows two possible schemes for adjusting offset voltage. For a voltage follower application, use the circuit in Figure 29 without R2 and with RI shorted. R1 should be 1M to 10M. The adjustment resistors will cause only a very small gain error. RF +5V VIN RI + 50kK R1 100k VOUT R2 100 VIN 50 COAX CABLE 50 + 50 VOUT 50 RF FIGURE 30. PC board traces can be made to look like a 50 or 75 transmission line, called microstrip. Microstrip is a PC board trace with a ground plane directly beneath, on the opposite side of the board, as shown in Figure 31. SIGNAL TRACE -5V w t R 2 Adjustment Range V ------- R 1 h ER FIGURE 28. INVERTING GAIN DIELECTRIC (PC BOARD) GROUND PLANE VIN +V R1 100k + - FIGURE 31. VOUT RI 50k RF R2 100 When manufacturing pc boards, the trace width can be calculated based on a number of variables. The following equation is reasonably accurate for calculating the proper trace width for a 50 transmission line. -V Z R 2 Adjustment Range V ------- R 1 RF Gain 1 + -------------------- R I + R 2 FIGURE 29. NON-INVERTING GAIN PC Board Layout Guidelines When designing with the HFA-0001, good high frequency (RF) techniques should be used when making a PC board. A massive ground plane should be used to maintain a low impedance ground. Proper shielding and use of short interconnection leads are also very important. To achieve maximum high frequency performance, the use of low impedance transmission lines with impedance matching is recommended: 50 lines are common in communications and 75 lines in video systems. Impedance matching is important to minimize reflected energy therefore minimizing transmitted signal distortion. This is accomplished by using a series matching resistor (50 or 75), matched transmission line (50 or 75), and a matched terminating resistor, as shown in Figure 30. Note that there will be a 6dB loss from input to output.The HFA0001 has an integral 50 20% resistor connected to the op amps output with the other end of the resistor pinned out. 9 O 5.98h 87 = ------------------------------ ln --------------------- 0.8w + t E + 1.41 R Power supply decoupling is essential for high frequency op amps. A 0.01F high quality ceramic capacitor at each supply pin in parallel with a 1F tantalum capacitor will provide excellent decoupling as shown in Figure 32. V+ 1.0F 0.01F + 0.01F 1.0F V- FIGURE 32. POWER SUPPLY DECOUPLING HFA-0001 Thermal Management V+ C R C + C R C The HFA-0001 can sink and source a large amount of current making it very useful in many applications. Care must be taken not to exceed the power handling capability of the part to insure proper performance and maintain high reliability. The following graph shows the maximum power handling capability of the HFA-0001 without exceeding the maximum allowable junction temperature of +175oC. The curves also show the improved power handling capability when heatsinks are used based on AVVID heatsink #5801B for the 8 lead Plastic DIP and IERC heatsink #PEP50AB for the 14 lead Sidebraze DIP. These curves are based on natural convection. Forced air will greatly improve the power dissipation capabilities of a heatsink. V- Chip capacitors produce the best results due to ease of placement next to the op amp and they have negligible lead inductance. If leaded capacitors are used, the leads should be kept as short as possible to minimize lead inductance. Figures 32 and 33 illustrate two different decoupling schemes. Figure 33 improves the PSRR because the resistor and capacitors create low pass filters. Note that the supply current will create a voltage drop across the resistor. Saturation Recovery When an op amp is over driven output devices can saturate and sometimes take a long time to recover. By clamping the input to safe levels, output saturation can be avoided. If output saturation cannot be avoided, the recovery time from 25% over-drive is 20ns and 30ns from 50% over-drive. 10 POWER DISSIPATION (W) FIGURE 33. IMPROVED DECOUPLING/CURRENT LIMITING 3.0 2.8 B 2.6 2.4 A 2.2 2.0 1.8 D 1.6 1.4 C 1.2 1.0 0.8 0.6 A: 8 LEAD PLASTIC DIP WITH HEATSINK B: 14 LEAD SIDEBRAZE DIP WITH HEATSINK 0.4 C: 8 LEAD PLASTIC DIP ONLY 0.2 D: 14 LEAD SIDEBRAZE DIP ONLY 0 20 40 60 80 100 AMBIENT TEMPERATURE (oC) FIGURE 34. 120