19-3266; Rev 0; 4/04 +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators Features 100Mbps Guaranteed Data Rate Bidirectional Level Translation MAX13013 (Single) MAX13014 (Dual) MAX3023 (Quad) Unidirectional Level Translation MAX13015/MAX13016/MAX13017 (Dual) MAX3024-MAX3028 (Quad) VL Operation Down to +1.2V Ultra-Low 0.1A Supply Current When Disabled Low-Quiescent Current (0.1A) UCSP, SC70, SOT23, and TSSOP Packages The MAX13013-MAX13017/MAX3023-MAX3028 single-/ dual-/quad-level translators provide the level shifting necessary to allow 100Mbps data transfer in a multivoltage system. Externally applied voltages, VCC and VL, set the logic levels on either side of the device. Logic signals present on the VL side of the device appear as a higher voltage logic signal on the VCC side of the device, and vice-versa. The MAX13013 single-, the MAX13014-MAX13017 dual-, and the MAX3023-MAX3028 (UCSPTM package) quad-level translators feature an enable (EN) input. The MAX3023-MAX3028 (TSSOP package) quad-level translators feature EN and EN inputs. When disabled, each device places all inputs/outputs on both sides in tri-state and reduces the VCC supply current to 0.03A, and the VL supply current to 0.1A. These devices operate at a guaranteed 100Mbps data rate for VL > 1.8V. The MAX13013-MAX13017/MAX3023-MAX3028 accept a +1.65V to +3.6V VCC voltage and a +1.2V to (VCC 0.4V) VL voltage, making them ideal for data transfer between low-voltage ASICs/programmable logic devices (PLDs) and higher voltage systems. The MAX13013 is available in 3 x 2 UCSP and 6-pin SC70 packages. The MAX13014-MAX13017 are available in 3 x 3 UCSP and 8-pin SOT23 packages. The MAX3023-MAX3028 are available in 4 x 3 UCSP and 14-pin TSSOP packages. All devices operate over the extended -40C to +85C temperature range. Pin Configurations TOP VIEW VCC 1 GND 2 6 MAX13013 5 1 2 3 VCC I/O VCC1 GND A EN VL MAX13013 B I/O VCC1 3 4 VL I/O VL1 I/O VL1 EN 3 x 2 UCSP TOP VIEW (BUMPS ON BOTTOM OF DIE) SC70 Typical Operating Circuit Applications +1.8V +3.3V 0.1F 0.1F CMOS Logic-Level Translation Low-Voltage ASIC Level Translation +1.8V SYSTEM CONTROLLER Cell Phones SPITM, MICROWIRETM Level Translation Portable POS Systems Portable Communication Devices VL VCC +3.3V SYSTEM MAX13014 CLK I/O VL1 I/O VCC1 CLK DATA I/O VL2 I/O VCC2 DATA GND GND GND GPS Telecommunications Equipment Ordering Information/Selector Guide PART MAX13013EXT TEMP RANGE PINPACKAGE PACKAGE CODE -40C to +85C 6 SC70 -- MICROWIRE is a trademark of National Semiconductor Corp. SPI is a trademark of Motorola, Inc. UCSP is a trademark of Maxim Integrated Products, Inc. TOP MARK ACD NUMBER OF NUMBER OF VL VCC VCC VL TRANSLATORS TRANSLATORS 1 1 EN EN -- Pin Configurations continued at end of data sheet. Ordering Information/Selector Guide continued at end of data sheet. ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com. 1 MAX13013-MAX13017/MAX3023-MAX3028 General Description MAX13013-MAX13017/MAX3023-MAX3028 +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators ABSOLUTE MAXIMUM RATINGS All voltages are referenced to GND. VCC ...........................................................................-0.3V to +4V VL...........................................................................................-0.3V to +4V I/O VCC_......................................................-0.3V to (VCC + 0.3V) I/O VL_ ...........................................................-0.3V to (VL + 0.3V) EN, EN...........................................................-0.3V to (VL + 0.3V) Short-Circuit Duration I/O VL_, I/O VCC_ to GND ....................................................Continuous Continuous Power Dissipation (TA = +70C) 6-Pin SC70 (derate 3.1mW/C above +70C) ..............245mW 6-Bump UCSP (derate 3.9mW/C above +70C).........308mW 8-Bump UCSP (derate 4.7mW/C above +70C).........379mW 8-Pin SOT23 (derate 9.1mW/C above +70C)............727mW 12-Bump UCSP (derate 6.5mW/C above +70C) ...518.8mW 14-Pin TSSOP (derate 9.1mW/C above +70C) .........727mW Operating Temperature Range ...........................-40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range ............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VCC = +1.65V to +3.6V, VL = +1.2V to (VCC - 0.4V), EN = VL, EN = open (MAX3023-MAX3028 TSSOP package only), CIOVL 15pF, CIOVCC 40pF, TA = TMIN to TMAX. Typical values are at TA = +25C.) (Notes 1, 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY VL Supply Range VCC Supply Range Supply Current from VCC Supply Current from VL VCC Tri-state Output-Mode Supply Current VL VCC IQVCC IQVL ITS-VCC VL Tri-state Output-Mode Supply Current (MAX13013-MAX13017) ITS-VL VL Tri-state Output-Mode Supply Current (MAX3023-MAX3028 TSSOP Package Only) ITS-VL I/O Tri-state Output-Mode Leakage Current 2 1.2 VCC - 0.4 1.65 I/O VCC_ = 0, I/O VL_ = 0 or I/O VCC_ = VCC, I/O VL_ = VL I/O VCC_ = 0, I/O VL_ = 0 or I/O VCC_ = VCC, I/O VL_ = VL I/O VCC_ = 0, I/O VL_ = 0 or I/O VCC_ = VCC, I/O VLare_ = VL, VL < VCC - 0.2V V 3.60 V 0.1 1 A 0.2 2 A 10 100 TA = +25C, EN = 0 0.03 1 TA = +25C, EN = 0 0.1 0.2 TA = +25C, EN = 0, VL = VCC - 0.2V 1 2 TA = +25C, EN = 0 50 70 TA = +25C, EN = 0, VL = VCC - 0.2V 55 74 A A A TA = +25C, EN = 0 TA = +25C, EN = 0, VL = VCC - 0.2V _______________________________________________________________________________________ 0.15 20 A +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators (VCC = +1.65V to +3.6V, VL = +1.2V to (VCC - 0.4V), EN = VL, EN = open (MAX3023-MAX3028 TSSOP package only), CIOVL 15pF, CIOVCC 40pF, TA = TMIN to TMAX. Typical values are at TA = +25C.) (Notes 1, 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS LOGIC-LEVEL THRESHOLDS I/O VL_ Input-Voltage High VIHL I/O VL_ Input-Voltage Low VILL 2/3 x VL V 1/3 x VL Pullup Resistance on I/O VL_ 120 Pulldown Resistance on I/O VL_ I/O VCC_ Input-Voltage High VIHC I/O VCC_ Input-Voltage Low VILC V 75 2/3 x VCC V 1/3 x VCC V Pullup Resistance on I/O VCC_ 2.5 k Pulldown Resistance on I/O VCC_ 2.5 k 2/3 x VL V EN, EN Input-Voltage High VIH EN, EN Input-Voltage Low VIL EN Input Current MAX13013-MAX13017 -5 Pullup Resistance on EN MAX3023-MAX3028 46 Pulldown Resistance on EN MAX3023-MAX3028, TSSOP package only 46 I/O VL_ Output-Voltage High VOHL I/O VL source current = 20A I/O VL_ Output-Voltage Low VOLL I/O VL sink current = 20A I/O VCC_ Output-Voltage High VOHC I/O VCC source current = 20A I/O VCC_ Output-Voltage Low VOLC I/O VCC sink current = 20A 1/3 x VL V +5 A 62 81 k 62 81 k 2/3 x VL V 1/3 x VL 2/3 x VCC V V 1/3 x VCC V _______________________________________________________________________________________ 3 MAX13013-MAX13017/MAX3023-MAX3028 ELECTRICAL CHARACTERISTICS (continued) MAX13013-MAX13017/MAX3023-MAX3028 +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators TIMING CHARACTERISTICS (VCC = +1.65V to +3.6V, VL = +1.2V to (VCC - 0.4V), EN = VL, EN = open (MAX3023-MAX3028 TSSOP package only), CIOVL 15pF, CIOVCC 40pF, TA = TMIN to TMAX. Typical values are at TA = +25C.) (Notes 1, 2) PARAMETER I/O VCC_ Rise Time I/O VCC_ Fall Time SYMBOL tRVCC tFVCC CONDITIONS MIN TYP 2.5 CIOVCC = 20pF, Figure 1 3 CIOVCC = 40pF, Figure 1 4 CIOVCC = 15pF, Figure 1 2.5 CIOVCC = 20pF, Figure 1 3 CIOVCC = 40pF, Figure 1 I/O VL_ Rise Time tRVL CIOVL = 15pF, Figure 2 I/O VL_ Fall Time tFVL CIOVL = 15pF, Figure 2 I/O VL_ One-Shot Output Impedance Propagation Delay, Driving I/O VCC_ UNITS ns ns 4 I/O VCC_ One-Shot Output Impedance Propagation Delay, Driving I/O VL_ MAX CIOVCC = 15pF, Figure 1 I/OVL-VCC CIOVCC = 15pF, Figure 1 I/OVCC-VL CIOVL = 15pF, Figure 2 18.5 2.5 ns 2.5 ns 12.5 6.5 ns 6 ns 4 ns Part-to-Part Skew (Note 3) tPPSKEW CIOVCC = 15pF, CIOVL = 15pF, VCC = 2.5V, VL = 1.8V Propagation Delay from I/O VL_ to I/O VCC_ after Enable tEN-VCC CIOVCC = 15pF, Figure 3 1000 ns Propagation Delay from I/O VCC_ to I/O VL_ after Enable tEN-VL CIOVL = 15pF, Figure 4 1000 ns Maximum Data Rate CIOVCC = 15pF, CIOVL = 15pF, VL > 1.8V 100 CIOVCC = 15pF, CIOVL = 15pF, VL > 1.2V 80 Mbps Note 1: VL must be less than or equal to VCC - 0.4V during normal operation. However, VL can be greater than VCC during startup and shutdown conditions. Note 2: All units are 100% production tested at TA = +25C. Limits over the operating temperature range are guaranteed by design and not production tested. Note 3: Not production tested. Guaranteed by design. 4 _______________________________________________________________________________________ +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators VL SUPPLY CURRENT vs. SUPPLY VOLTAGE 0.6 0.4 0.2 DRIVING I/O VL_ VL = 1.2V CIOVCC = 15pF 2.5 3.0 3.5 2.0 2.5 3.0 3.5 4.0 2.0 2.5 3.0 3.5 VCC SUPPLY VOLTAGE (V) VCC SUPPLY CURRENT vs. SUPPLY VOLTAGE VL SUPPLY CURRENT vs. TEMPERATURE VCC SUPPLY CURRENT vs. TEMPERATURE DRIVING I/O VL_ VL = 1.2V CIOVCC = 15pF 3.2 2.8 2.4 0 2.5 3.0 3.5 4.0 14 13 12 11 DRIVING I/O VCC_ CIOVL = 15pF 10 2.0 2.0 DRIVING I/O VCC_ CIOVL = 15pF 15 -40 -15 10 35 60 -40 85 -15 10 35 60 VCC SUPPLY VOLTAGE (V) TEMPERATURE (C) TEMPERATURE (C) VL SUPPLY CURRENT vs. CAPACITIVE LOAD ON I/O VCC_ VCC SUPPLY CURRENT vs. CAPACITIVE LOAD ON I/O VCC_ RISE/FALL TIME vs. CAPACITIVE LOAD ON I/O VCC_ 0.4 0.2 19 16 tRISE 0.9 0.6 tFALL DRIVING I/O VL_ DRIVING I/O VL_ DRIVING I/O VL_ 0 10 10 1.2 0.3 13 0 20 30 CAPACITIVE LOAD (pF) 40 85 MAX13013 toc09 22 RISE/FALL TIME (ns) 0.6 1.5 MAX13013 toc08 0.8 25 VCC SUPPLY CURRENT (mA) MAX13013 toc07 1.0 4.0 MAX13013 toc06 3.6 16 VCC SUPPLY CURRENT (mA) VL SUPPLY CURRENT (mA) 10 MAX13013 toc05 4.0 MAX13013 toc04 15 0 DRIVING I/O VL_ VL = 1.8V CIOVCC = 15pF VCC SUPPLY VOLTAGE (V) 20 1.5 10 VCC SUPPLY VOLTAGE (V) 25 5 15 0 1.5 4.0 20 5 0 2.0 VCC SUPPLY CURRENT (mA) 0.3 0.1 0 VL SUPPLY CURRENT (mA) 0.4 25 MAX13013 toc03 0.5 DRIVING I/O VL_ VL = 1.8V CIOVCC = 15pF 0.2 MAX13013 toc02 0.8 0.6 VL SUPPLY CURRENT (mA) MAX13013 toc01 VL SUPPLY CURRENT (mA) 1.0 VCC SUPPLY CURRENT vs. SUPPLY VOLTAGE VCC SUPPLY CURRENT (mA) VL SUPPLY CURRENT vs. SUPPLY VOLTAGE 0 10 20 30 CAPACITIVE LOAD (pF) 40 0 10 20 30 40 CAPACITIVE LOAD (pF) _______________________________________________________________________________________ 5 MAX13013-MAX13017/MAX3023-MAX3028 Typical Operating Characteristics (Data rate = 100Mbps, VCC = 3.3V, VL = 1.8V, TA = +25C, unless otherwise noted.) Typical Operating Characteristics (continued) (Data rate = 100Mbps, VCC = 3.3V, VL = 1.8V, TA = +25C, unless otherwise noted.) PROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O VCC_ RISE/FALL TIME (ns) 0.8 0.6 tFALL 0.4 DRIVING I/O VL_ tPLH 4 3 2 1 0.2 0 4 3 tPLH 2 1 tPHL 0 5 DRIVING I/O VCC_ tPHL DRIVING I/O VCC_ 0 5 10 20 15 MAX13013 toc12 1.0 5 MAX13013 toc11 tRISE PROPAGATION DELAY (ns) MAX13013 toc10 1.2 PROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O VL_ PROPAGATION DELAY (ns) RISE/FALL TIME vs. CAPACITIVE LOAD ON I/O VL_ 0 0 10 20 40 30 0 5 10 20 15 CAPACITIVE LOAD (pF) CAPACITIVE LOAD (pF) CAPACITIVE LOAD (pF) tEN-VCC vs. TEMPERATURE (CIOVCC = 15pF) tEN-VL vs. TEMPERATURE (CIOVL = 15pF) TYPICAL I/O VL_ DRIVING (CIOVCC = 40pF) MAX13013 toc14 230 MAX13013 toc15 100 MAX13013 toc13 250 80 2V/div 210 tEN-VL (ns) tEN-VCC (ns) MAX13013-MAX13017/MAX3023-MAX3028 +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators 190 170 60 40 2V/div 20 150 0 -40 -15 10 35 60 85 -40 -15 10 35 85 TEMPERATURE (C) TYPICAL I/O VCC_ DRIVING (CIOVL = 15pF) TYPICAL I/O VL_ DRIVING (VCC = 1.65V, VL = 1.2V, CIOVCC = 40pF) MAX13013 toc16 TYPICAL I/O VCC_ DRIVING (VCC = 1.65V, VL = 1.2V, CIOVL = 15pF) MAX13013 toc18 1V/div 1V/div 1V/div 2V/div 4ns/div 4ns/div MAX13013 toc17 2V/div 6 60 TEMPERATURE (C) 4ns/div _______________________________________________________________________________________ 1V/div 4ns/div +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators PIN MAX3023 TSSOP 4x3 UCSP 1 2 MAX13013 MAX13014 NAME FUNCTION SC70 3x2 UCSP SOT23 3x3 UCSP A1 4 B2 7 A2 I/O VL1 Input/Output 1, Referenced to VL B2 -- -- 6 A3 I/O VL2 Input/Output 2, Referenced to VL 3 A2 5 B1 8 A1 VL 4 -- -- -- -- -- N.C. 5 B3 -- -- -- -- I/O VL3 Input/Output 3, Referenced to VL 6 A3 -- -- -- -- I/O VL4 Input/Output 4, Referenced to VL 7 A4 6 B3 5 B1 EN Active-High Enable Input. If EN is pulled low, all inputs/outputs are in tristate. Drive EN high (VL) for normal operation. 8 -- -- -- -- -- EN Active-Low Enable Input. If EN is pulled high (VL), all inputs/ outputs are in tri-state. Drive EN low for normal operation (MAX3023 TSSOP package only). 9 B4 -- -- -- -- I/O VCC4 Input/Output 4, Referenced to VCC 10 C4 -- -- -- -- I/O VCC3 Input/Output 3, Referenced to VCC 11 C3 2 A3 4 B3 GND Ground 12 C2 1 A1 1 C1 VCC VCC Input Voltage, +1.65V VCC +3.6V. Bypass VCC to GND with a 0.1F capacitor. 13 C1 -- -- 3 C3 I/O VCC2 Input/Output 2, Referenced to VCC 14 B1 3 A2 2 C2 I/O VCC1 Input/Output 1, Referenced to VCC VL Input Voltage, +1.2V VL VCC - 0.4V. Bypass VL to GND with a 0.1F capacitor. No Connection Pin Description--MAX13015/MAX13016/MAX13017/ MAX3024-MAX3028 (Unidirectional Devices) NAME VCC VL GND FUNCTION (Note 4) VCC Input Voltage, +1.65V VCC +3.6V. Bypass VCC to GND with a 0.1F capacitor. VL Input Voltage, +1.2V VL VCC - 0.4V. Bypass VL to GND with a 0.1F capacitor. Ground EN Active-High Enable Input. If EN is pulled low, all inputs/outputs are in tri-state. Drive EN high (VL) for normal operation. EN Active-Low Enable Input (MAX3024-MAX3028 TSSOP Package Only). If EN is pulled high (VL), all inputs/outputs are in tri-state. Drive EN low for normal operation. I VL1-I VL4 Inputs Referenced to VL, Numbers 1 to 4 O VL1-O VL4 Outputs Referenced to VL, Numbers 1 to 4 I VCC1-I VCC4 Inputs Referenced to VCC, Numbers 1 to 4 O VCC1-O VCC4 Outputs Referenced to VCC, Numbers 1 to 4 Note 4: For specific pin numbers, see the Pin Configurations for more information. _______________________________________________________________________________________ 7 MAX13013-MAX13017/MAX3023-MAX3028 Pin Description--MAX13013/MAX13014/ MAX3023 (Bidirectional Devices) MAX13013-MAX13017/MAX3023-MAX3028 +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators Test Circuits/Timing Diagrams tRISE/FALL 3ns I/O VL_ VL VCC 90% 50% MAX13013 10% EN I/OVL-VCC I/OVL-VCC I/O VCC_ I/O VL_ CIOVCC I/O VCC_ 90% 50% SOURCE 10% tRVCC tFVCC Figure 1. Driving I/O VL_ Test Circuit and Timing tRISE/FALL 3ns I/O VCC_ VL VCC 90% 50% MAX13013 10% EN I/OVCC-VL I/OVCC-VL I/O VCC_ I/O VL_ CIOVL_ I/O VL_ SOURCE 90% 50% 10% tFVL Figure 2. Driving I/O VCC_ Test Circuit and Timing 8 _______________________________________________________________________________________ tRVL +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators VL EN EN MAX13013 t'EN-VCC 0 I/O VCC_ SOURCE I/O VL_ VL I/O VL_ 0 1M VL CIOVCC VCC I/O VCC_ VCC / 2 0 VCC VL EN EN 1M MAX13013 t"EN-VCC 0 SOURCE I/O VL_ VL I/O VL_ I/O VCC_ 0 CIOVCC VCC I/O VCC_ VCC / 2 0 tEN-VCC IS WHICH EVER IS LARGER BETWEEN t'EN-VCC AND t"EN-VCC. Figure 3. Propagation Delay from I/O VL_ to I/O VCC_ After EN VL EN EN MAX13013 SOURCE I/O VCC_ I/O VL_ t'EN-VL 0 VCC I/O VCC_ 0 VCC CIOVL 100k VL I/O VL_ VL / 2 VL EN VL SOURCE 0 EN MAX13013 t"EN-VL 100k I/O VCC_ 0 VCC I/O VCC_ I/O VL_ 0 CIOVL VL I/O VL_ VL / 2 0 tEN-VCC IS WHICH EVER IS LARGER BETWEEN t'EN-VCC AND t"EN-VCC. Figure 4. Propagation Delay from I/O VCC_ to I/O VL_ After EN _______________________________________________________________________________________ 9 MAX13013-MAX13017/MAX3023-MAX3028 Test Circuits/Timing Diagrams (continued) MAX13013-MAX13017/MAX3023-MAX3028 +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators Detailed Description The MAX13013-MAX13017/MAX3023-MAX3028 logiclevel translators provide the level shifting necessary to allow 100Mbps data transfer in a multivoltage system. Externally applied voltages, VCC and VL, set the logic levels on either side of the device. Logic signals present on the VL side of the device appear as a highervoltage logic signal on the VCC side of the device, and vice-versa. The MAX13013/MAX13014/MAX3023 bidirectional level translators allow data translation in either direction (V L V CC ) on any single data line. The MAX13015/MAX13016/MAX13017/MAX3024-MAX3028 unidirectional level translators, level shift data in one direction (VL VCC or VCCVL) on any single data line. The MAX13013-MAX13017/MAX3023-MAX3028 accept VL from +1.2V to (VCC - 0.4V) and operate with VCC from +1.65V to +3.6V, making them ideal for data transfer between low-voltage ASICs/PLDs and higher voltage systems. When in tri-state mode, the MAX13013-MAX13017/ MAX3023-MAX3028 reduce the VCC supply current to 0.03A, and the V L supply current to 0.1A. These devices operate at a guaranteed data rate of 100Mbps for VL > 1.8V. During power-supply sequencing, when VCC is floating and V L is powering up, up to 40mA current can be sourced to each load on the VL side, without the device latching up. The maximum data rate depends heavily on the load capacitance (see the Typical Operating Characteristics Rise/Fall Time graph), output impedance of the driver, and the operating voltage range (Table 1). Input Driver Requirements The MAX13013-MAX13017/MAX3023-MAX3028 architecture is based on a one-shot accelerator output stage (see Figure 5). Accelerator output stages are in tri-state mode except when there is a transition on any of the translators on the input side, either I/O VL_ or I/O VCC_. A short pulse is then generated during which the accelerator output stages become active and charge/discharge the capacitances at the I/Os. Due to the architecture, both sides become active during the oneshot pulse. This can lead to some current feeding into the external source that is driving the translator. However, this behavior simply helps to speed up the transition on the driven side. Table 1. Data Rate Level Translation For proper operation, ensure that +1.65V VCC +3.6V, and +1.2V V L V CC - 0.4V. During power-up sequencing, VL VCC does not damage the device. VL (V) GUARANTEED DATA RATE (Mbps) VL < 1.8 80 VL 1.8 100 VL VCC I/O VL_ TO I/O VCC_ PATH P ONE-SHOT 4k I/O VL I/O VCC N ONE-SHOT P ONE-SHOT 150 N ONE-SHOT I/O VCC_ TO I/O VL_ PATH Figure 5. Simplified Functional Diagram (One I/O Line) 10 ______________________________________________________________________________________ +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators Output Load Requirements The MAX13013-MAX13017/MAX3023-MAX3028 I/O are designed to drive CMOS inputs. Do not load the I/O lines with a resistive load less than 25k. Also, do not place an RC circuit at the input of these devices to slow down the edges. If a slower rise/fall time is required, refer to the MAX3000E/MAX3001E logic-level-translators data sheet. For I 2 CTM level translation, refer to the MAX3372EMAX3379E/MAX3390E-MAX3393E data sheet. Enable Inputs The MAX13013 single-, the MAX13014-MAX13017 dualand the MAX3023-MAX3028 (UCSP package) quad-level translators feature an EN input. The MAX3023-MAX3028 (TSSOP package) quad-level translators feature both EN and EN inputs (see Table 2 for operating mode). Note that the MAX3023-MAX3028 (TSSOP package) have internal pullup and pulldown circuitry on EN and EN, respectively. If left unconnected, EN is pulled up to VL and EN is pulled down to GND. IIN Table 2. MAX3023-MAX3028 (TSSOP Package) Operating Mode EN EN 0 0 Both I/O VL_ and I/O VCC_ are in tri-state. VL 0 Normal operation. 0 VL Both I/O VL_ and I/O VCC_ are in tri-state. VL VL Both I/O VL_ and I/O VCC_ are in tri-state. OPERATING MODE Applications Information Power-Supply Decoupling To reduce ripple and the chance of introducing data errors, bypass VL and V CC to ground with a 0.1F ceramic capacitor. Place all capacitors as close to the power-supply inputs as possible. Unidirectional vs. Bidirectional Level Translator The MAX13013/MAX13014/MAX3023 bidirectional translators can operate as a unidirectional device to translate signals without inversion. The MAX13015/ MAX13016/MAX13017/MAX3024-MAX3028 unidirectional level translators, level shift data in one direction (VL VCC or VCCVL) on any single data line (see the Ordering Information). These devices provide the smallest solution (UCSP package) for unidirectional level translation without inversion. UCSP Applications Information VTH_IN / RIN* 0 VIN For the latest application details on UCSP construction, dimensions, tape carrier information, PC board techniques, bump-pad layout, and recommended reflow temperature profiles, as well as the latest information on reliability testing results, go to Maxim's web site at www.maxim-ic.com/ucsp to find the Application Note: UCSP--A Wafer-Level Chip-Scale Package. VTH_IN VS WHERE VS = VCC OR VL -(VS - VTH_IN) / RIN* *RIN = 4k WHEN DRIVING VL SIDE; RIN = 150 WHEN DRIVING VCC SIDE. Figure 6. Typical IIN vs. VIN I2C is a trademark of Philips Corp. Purchase of I2C components from Maxim Integrated Products, Inc. or one of its sublicensed Associated Companies, conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. ______________________________________________________________________________________ 11 MAX13013-MAX13017/MAX3023-MAX3028 For proper operation, the driver has to meet the following conditions: less than 25 output impedance and greater than 20mA peak output current capability. Figure 6 shows a graph of typical input current versus input voltage. +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators MAX13013-MAX13017/MAX3023-MAX3028 Pin Configurations (continued) 1 2 3 VL I/O VL1 I/O VL2 TOP VIEW VCC 1 8 VL I/O VCC1 2 7 I/O VL1 I/O VCC2 3 6 I/O VL2 GND 4 5 EN A B MAX13014 GND EN C MAX13014 VCC I/O VCC1 I/O VCC2 SOT23 UCSP (BUMPS ON BOTTOM OF DIE) VCC 1 8 VL O VCC1 2 7 I VL1 O VCC2 3 6 I VL2 GND 4 5 EN 1 2 3 VL I VL1 I VL2 A B MAX13015 GND EN C MAX13015 VCC O VCC1 O VCC2 SOT23 UCSP (BUMPS ON BOTTOM OF DIE) VCC 1 8 VL I VCC1 2 7 O VL1 3 6 I VL2 GND 4 5 EN O VCC2 1 2 3 VL I VL2 O VL1 A B MAX13016 GND EN C MAX13016 VCC I VCC1 O VCC2 SOT23 UCSP (BUMPS ON BOTTOM OF DIE) VCC 1 8 VL I VCC1 2 7 O VL1 I VCC2 3 6 O VL2 GND 4 5 EN MAX13017 1 2 3 VL O VL1 O VL2 A B MAX13017 GND EN C VCC I VCC1 I VCC2 SOT23 UCSP (BUMPS ON BOTTOM OF DIE) 12 ______________________________________________________________________________________ +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators 1 2 3 4 I/O VL1 VL I/O VL4 EN I/O VCC1 I/O VL2 I/O VL3 I/O VCC4 I/O VCC2 VCC GND I/O VCC3 TOP VIEW I/O VL1 1 14 I/O VCC1 I/O VL2 2 13 I/O VCC2 VL 3 N.C. 4 MAX3023 A 12 VCC MAX3023 B 11 GND I/O VL3 5 10 I/O VCC3 I/O VL4 6 9 I/O VCC4 EN 7 8 EN C UCSP (BUMPS ON BOTTOM OF DIE) TSSOP I VL1 1 14 O VCC1 I VL2 2 13 O VCC2 VL 3 N.C. 4 MAX3024 I V L4 6 9 O VCC4 EN 7 8 EN O VL1 1 3 N.C. 4 4 I VL1 VL I VL4 EN O VCC1 I VL2 I VL3 O VCC4 O VCC2 VCC GND O VCC3 A C UCSP (BUMPS ON BOTTOM OF DIE) TSSOP VL 3 B 11 GND 10 O VCC3 2 2 12 VCC MAX3024 I VL3 5 I VL2 1 14 I VCC1 13 O VCC2 MAX3025 1 2 3 4 O VL1 VL I VL4 EN I VCC1 I VL2 I VL3 O VCC4 O VCC2 VCC GND O VCC3 A 12 VCC MAX3025 11 GND I VL3 5 10 O VCC3 I VL4 6 9 O VCC4 EN 7 8 EN TSSOP B C UCSP (BUMPS ON BOTTOM OF DIE) ______________________________________________________________________________________ 13 MAX13013-MAX13017/MAX3023-MAX3028 Pin Configurations (continued) +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators MAX13013-MAX13017/MAX3023-MAX3028 Pin Configurations (continued) TOP VIEW O VL1 1 14 I VCC1 O VL2 2 13 I VCC2 VL 3 N.C. 4 MAX3026 4 O VL1 VL I VL4 EN I VCC1 O VL2 I VL3 O VCC4 I VCC2 VCC GND O VCC3 A I V L4 6 9 O VCC4 EN 7 8 EN C UCSP (BUMPS ON BOTTOM OF DIE) TSSOP O VL1 1 14 I VCC1 O VL2 2 13 I VCC2 VL 3 12 VCC MAX3027 O VL3 5 MAX3027 1 2 3 4 O VL1 VL I VL4 EN I VCC1 O VL2 O VL3 O VCC4 I VCC2 VCC GND I VCC3 A B 11 GND 10 I VCC3 I V L4 6 9 O VCC4 EN 7 8 EN C UCSP (BUMPS ON BOTTOM OF DIE) TSSOP O VL1 1 14 I VCC1 O VL2 2 13 I VCC2 VL 3 12 VCC MAX3028 11 GND O VL3 5 10 I VCC3 O V L4 6 9 I VCC4 EN 7 8 EN TSSOP 14 3 B 11 GND 10 O VCC3 N.C. 4 2 12 VCC MAX3026 I VL3 5 N.C. 4 1 MAX3028 1 2 3 4 O VL1 VL O VL4 EN I VCC1 O VL2 O VL3 I VCC4 I VCC2 VCC GND I VCC3 A B C UCSP (BUMPS ON BOTTOM OF DIE) ______________________________________________________________________________________ +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators NUMBER OF NUMBER OF VL VCC VCC VL TRANSLATORS TRANSLATORS PART TEMP RANGE PINPACKAGE PACKAGE CODE TOP MARK MAX13013EBT-T -40C to +85C 3 x 2 UCSP-6 B6-1 ADF 1 MAX13014EKA -40C to +85C 8 SOT23 -- AEKB MAX13014EBL-T* -40C to +85C 3 x 3 UCSP-9 B9-2 AEN MAX13015EKA* -40C to +85C 8 SOT23 -- MAX13015EBL-T* -40C to +85C 3 x 3 UCSP-9 MAX13016EKA* -40C to +85C 8 SOT23 MAX13016EBL-T* -40C to +85C 3 x 3 UCSP-9 MAX13017EKA* -40C to +85C MAX13017EBL-T* -40C to +85C MAX3023EUD -40C to +85C MAX3023EBC-T* MAX3024EUD* EN EN 1 -- 2 2 -- 2 2 -- AEKC 2 0 -- B9-2 AEO 2 0 -- -- AEKD 1 1 -- B9-2 AEP 1 1 -- 8 SOT23 -- AEKE 0 2 -- 3 x 3 UCSP-9 B9-2 AEQ 0 2 -- 14 TSSOP -- -- 4 4 -40C to +85C 4 x 3 UCSP-12 B12-1 ABW 4 4 -- -40C to +85C 14 TSSOP -- -- 4 0 MAX3024EBC-T* -40C to +85C 4 x 3 UCSP-12 B12-1 ABX 4 0 -- MAX3025EUD* -40C to +85C 14 TSSOP -- -- 3 1 MAX3025EBC-T* -40C to +85C 4 x 3 UCSP-12 B12-1 ABY 3 1 -- MAX3026EUD* -40C to +85C 14 TSSOP -- -- 2 2 MAX3026EBC-T* -40C to +85C 4 x 3 UCSP-12 B12-1 ABZ 2 2 -- MAX3027EUD* -40C to +85C 14 TSSOP -- -- 1 3 MAX3027EBC-T* -40C to +85C 4 x 3 UCSP-12 B12-1 ACA 1 3 -- MAX3028EUD* -40C to +85C 14 TSSOP MAX3028EBC-T* -40C to +85C 4 x 3 UCSP-12 *Future product--contact factory for availability. -- -- 0 4 B12-1 ACB 0 4 -- Chip Information TRANSISTOR COUNT: MAX13013: 261 MAX13014-MAX13017: 444 MAX3023-MAX3028: 791 PROCESS: BiCMOS ______________________________________________________________________________________ 15 MAX13013-MAX13017/MAX3023-MAX3028 Ordering Information/Selector Guide (continued) Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) SC70, 6L.EPS MAX13013-MAX13017/MAX3023-MAX3028 +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators 16 ______________________________________________________________________________________ +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators 6L, UCSP.EPS PACKAGE OUTLINE, 3x2 UCSP 21-0097 G 1 1 ______________________________________________________________________________________ 17 MAX13013-MAX13017/MAX3023-MAX3028 Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) SEE DETAIL "A" b CL CL E MIN MAX A A1 A2 0.90 0.00 0.90 1.45 0.15 1.30 b 0.28 0.45 C D E 0.09 2.80 2.60 0.20 3.00 3.00 SYMBOL e CL E1 E1 1.50 L 0.30 L2 e PIN 1 I.D. DOT (SEE NOTE 6) SOT23, 8L .EPS MAX13013-MAX13017/MAX3023-MAX3028 +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators 1.75 0.60 0.25 BSC. 0.65 BSC. 1.95 REF. 0 8 e1 0 e1 D C CL L2 A A2 GAUGE PLANE A1 SEATING PLANE C 0 L NOTE: 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. FOOT LENGTH MEASURED FROM LEAD TIP TO UPPER RADIUS OF HEEL OF THE LEAD PARALLEL TO SEATING PLANE C. 3. PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH & METAL BURR. 4. PACKAGE OUTLINE INCLUSIVE OF SOLDER PLATING. DETAIL "A" 5. COPLANARITY 4 MILS. MAX. 6. PIN 1 I.D. DOT IS 0.3 MM y MIN. LOCATED ABOVE PIN 1. 7. SOLDER THICKNESS MEASURED AT FLAT SECTION OF LEAD BETWEEN 0.08mm AND 0.15mm FROM LEAD TIP. 8. MEETS JEDEC MO178. PROPRIETARY INFORMATION TITLE: PACKAGE OUTLINE, SOT-23, 8L BODY APPROVAL DOCUMENT CONTROL NO. 21-0078 18 ______________________________________________________________________________________ REV. D 1 1 +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators 9LUCSP, 3x3.EPS PACKAGE OUTLINE, 3x3 UCSP 21-0093 I 1 1 ______________________________________________________________________________________ 19 MAX13013-MAX13017/MAX3023-MAX3028 Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) TSSOP4.40mm.EPS MAX13013-MAX13017/MAX3023-MAX3028 +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators 20 ______________________________________________________________________________________ +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators 12L, UCSP 4x3.EPS PACKAGE OUTLINE, 4x3 UCSP 21-0104 F 1 1 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 21 (c) 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products. MAX13013-MAX13017/MAX3023-MAX3028 Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)