MCC ES2A THRU ES2M omponents 21201 Itasca Street Chatsworth !"# $ % !"# Features * * * * * 2 Amp Super Fast Recovery Silicon Rectifier 50 to 1000 Volts For Surface Mount Applications Extremely Low Thermal Resistance Easy Pick And Place High Temp Soldering: 250C for 10 Seconds At Terminals Superfast Recovery Times For High Efficiency Maximum Ratings * * * DO-214AC (SMAJ) (High Profile) Operating Temperature: -50C to +150C Storage Temperature: -50C to +150C Maximum Thermal Resistance; 20C/W Junction To Lead MCC Device Maximum Maximum Maximum Catalog Marking Recurrent RMS DC Number Peak Reverse Voltage Blocking Voltage Voltage ES2A ES2A 50V 35V 50V ES2B ES2B 100V 70V 100V ES2C ES2C 150V 105V 150V ES2D ES2D 200V 140V 200V ES2G ES2G 400V 280V 400V ES2J ES2J 600V 420V 600V ES2K ES2K 800V 560V 800V ES2M ES2M 1000V 700V 1000V H Cathode Band J A E D ES2A-D ES2G-K ES2M Maximum DC Reverse Current At Rated DC Blocking Voltage Maximum Reverse Recovery Time ES2A-D ES2G-K ES2M Typical Junction Capacitance IF(AV) 2.0A G DIMENSIONS TJ = 75C IFSM 50A 8.3ms, half sine VF .975V 1.35V 1.60V IFM = 2.0A; TJ = 25C* IR 5A 150A TJ = 25C TJ = 100C Trr 50ns 60ns 100ns CJ 25pF B F Electrical Characteristics @ 25C Unless Otherwise Specified Average Forward Current Peak Forward Surge Current Maximum Instantaneous Forward Voltage C DIM A B C D E F G H J INCHES MIN .078 .067 .002 --.035 .065 .205 .160 .100 MM MIN 1.98 1.70 .05 --.89 1.65 5.21 4.06 2.57 MAX .116 .089 .008 .02 .055 .096 .224 .180 .112 MAX 2.95 2.25 .20 .51 1.40 2.45 5.69 4.57 2.84 SUGGESTED SOLDER PAD LAYOUT 0.090" 0.085" IF=0.5A, IR=1.0A, Irr=0.25A Measured at 1.0MHz, VR=4.0V *Pulse test: Pulse width 200 sec, Duty cycle 2% www.mccsemi.com 0.070" NOTE MCC ES2A thru ES2M Figure 1 Typical Forward Characteristics 20 Figure 2 Forward Derating Curve 10 2.4 6 2.2 4 2.0 1.8 2 1.6 25C Amps 1.4 1 1.2 .6 Amps .4 1.0 .8 .6 .2 .4 Single Phase, Half Wave .2 60Hz Resistive or Inductive Load .1 .06 0 .04 0 25 50 75 100 125 150 C Average Forward Rectified Current - Amperesversus Ambient Temperature - C .02 .01 .2 .4 .6 .8 1.0 1.2 Volts Instantaneous Forward Current - Amperesversus Instantaneous Forward Voltage - Volts Figure 3 Junction Capacitance 100 60 40 20 pF TJ=25C 10 6 4 2 1 .1 .2 .4 1 Volts 2 4 10 20 40 100 200 Junction Capacitance - pFversus Reverse Voltage - Volts www.mccsemi.com 400 1000 MCC ES2A thru ES2M Figure 4 Peak Forward Surge Current Figure 5 New SMB Assembly 50 40 30 Amps 20 Round Lead Process 10 0 1 2 4 6 8 10 20 40 60 80 100 Cycles Peak Forward Surge Current - Amperesversus Number Of Cycles At 60Hz - Cycles Figure 6 Reverse Recovery Time Characteristic And Test Circuit Diagram 50 10 trr +0.5A 0 Pulse Generator Note 2 25Vdc 1 Notes: 1. Rise Time = 7ns max. Input impedance = 1 megohm, 22pF 2. Rise Time = 10ns max. Source impedance = 50 ohms 3. Resistors are non-inductive Oscilloscope Note 1 -0.25 -1.0 1cm Set Time Base for 20/100ns/cm www.mccsemi.com