XC7WH14DC,125 - NXP Semiconductors

1. General description

The XC7WH14 is a high-speed Si-gate CMOS de vice. This device provides three

inverting buffers with Schmitt trigger action. This device is capable of transforming slowly

changing input signals into sharply defined, jitter-free output signals.

2. Features and benefits

Symmetrical output impedance

High noise immunity

ESD protection:

HBM JESD22-A114F exceeds 2000 V

MM JESD22-A115 -A ex ce eds 20 0 V

CDM JESD22-C101D ex ceeds 1000 V

Low power dissipation

Balanced propagation delays

Multiple package options

Specified from 40 Cto+85C and 40 Cto+125C

3. Applications

Wave and pulse shaper for highly noisy environment

Astable multivibrator

Monostable multivibrator

4. Ordering information

XC7WH14

Triple inverting Schmitt trigger

Rev. 4 — 3 November 2011 Product data sheet

Table 1. Ordering information

Type number Package

Temp erature range Name Description Version

XC7WH14DP 40 C to +125 C TSSOP8 plastic thin shrink small outline package; 8 leads;

body width 3 mm; lead length 0.5 mm SOT505-2

XC7WH14DC 40 C to +125 C VSSOP8 plastic very thin shrink small outline p ackage; 8 leads;

body width 2.3 mm SOT765-1

XC7WH14GT 40 C to +125 C XSON8 plastic extremely thin small outline package; no leads;

8 terminals; body 1 1.95 0.5 mm SOT833-1

XC7WH14GD 40 C to +125 C XSON8U plastic extremely thin small outline package; no leads;

8 terminals; UTLP based; body 3  2  0.5 mm SOT996-2

Product data sheet Rev. 4 — 3 November 2011 2 of 18

NXP Semiconductors XC7WH14

Triple inverting Schmitt trigger

5. Marking

[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.

6. Functional diagram

7. Pinning information

7.1 Pinning

Table 2. Mark ing codes

Type number Marking code[1]

XC7WH14DP f14

XC7WH14DC f14

XC7WH14GT f14

XC7WH14GD f14

Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram

(one Schmitt trigger)

001aah728

1A 1Y

3Y 3A

2A 2Y

001aah729

mna025

Fig 4. Pin configuration SOT505-2 and SOT765-1 Fig 5. Pin configuration SOT833-1

XC7WH14

1A VCC

3Y 1Y

2A 3A

GND 2Y

001aak065

XC7WH14

GND

001aam631

Transparent top view

Product data sheet Rev. 4 — 3 November 2011 3 of 18

NXP Semiconductors XC7WH14

Triple inverting Schmitt trigger

7.2 Pin description

8. Functional description

[1] H = HIGH voltage level; L = LOW voltage level

Fig 6. Pin configu ration SOT996-2

001aak066

XC7WH14

Transparent top view

GND

VCC

Table 3. Pin description

Symbol Pin Description

1A, 2A, 3A 1, 3, 6 data input

GND 4 ground (0 V)

1Y, 2Y, 3Y 7, 5, 2 data output

VCC 8 supply voltage

Table 4. Function table [1]

Input nA Output nY

Product data sheet Rev. 4 — 3 November 2011 4 of 18

NXP Semiconductors XC7WH14

Triple inverting Schmitt trigger

9. Limiting values

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

[2] For TSSOP8 package: above 55 C the value of Ptot derates linearly at 2.5 mW/K.

For VSSOP8 package: above 110 C the value of Ptot derates linearly at 8 mW/K.

For XSON8 and XSON8U package: above 118 C the value of Ptot derates linearly with 7.8 mW/K.

10. Recommended operating conditions

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VCC supply voltage 0.5 +7.0 V

VIinput voltage 0.5 +7.0 V

IIK input clamping current VI < 0.5 V 20 - mA

IOK output clamping current VO < 0.5 V or VO>V

CC +0.5V [1] -20 mA

IOoutput current 0.5 V < VO <V

CC +0.5V - 25 mA

ICC supply current - 75 mA

IGND ground current 75 - mA

Tstg storage temperature 65 +150 C

Ptot total power dissipation Tamb = 40 C to +125 C[2] - 250 mW

Table 6. Recommended operating con ditions

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Typ Max Unit

VCC supply voltage 2.0 5.0 5.5 V

VIinput voltage 0 - 5.5 V

VOoutput voltage 0 - VCC V

Tamb ambient temperature 40 +25 +125 C

Product data sheet Rev. 4 — 3 November 2011 5 of 18

NXP Semiconductors XC7WH14

Triple inverting Schmitt trigger

11. Static characteristics

Table 7. Static characteristics

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions 25 C40 C to +85 C40 C to +125 CUnit

Min Typ Max Min Max Min Max

VOH HIGH-level

output voltage VI= VT+ or VT

IO= 50 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V

IO= 50 A; VCC = 3.0 V 2.9 3.0 - 2.9 - 2.9 - V

IO= 50 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V

IO= 4.0 mA; VCC = 3.0 V 2.58 - - 2.48 - 2.40 - V

IO= 8.0 mA; VCC = 4.5 V 3.94 - - 3.8 - 3.70 - V

VOL LOW-level

output voltage VI= VT+ or VT

IO= 50 A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V

IO= 50 A; VCC = 3.0 V - 0 0.1 - 0.1 - 0.1 V

IO= 50 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V

IO= 4.0 mA; VCC = 3.0 V - - 0.36 - 0.44 - 0.55 V

IO= 8.0 mA; VCC = 4.5 V - - 0.36 - 0.44 - 0.55 V

IIinput leakage

current VI= 5.5 V or GND;

VCC =0Vto5.5V - - 0.1 - 1.0 - 2.0 A

ICC supply current VI=V

CC or GND; IO = 0 A;

VCC = 5.5 V - - 1.0 - 10 - 40 A

CIinput

capacitance - 1.5 10 - 10 - 10 pF

Product data sheet Rev. 4 — 3 November 2011 6 of 18

NXP Semiconductors XC7WH14

Triple inverting Schmitt trigger

11.1 Transfer characteristics

12. Dynamic characteristics

[1] tpd is the same as tPLH and tPHL.

[2] Typical values are measured at VCC = 3.3 V.

[3] Typical values are measured at VCC = 5.0 V.

[4] CPD is used to determine the dynamic power dissipation PD(W).

PD=C

PD VCC2fi+(CLVCC2fo) where:

fi= input frequency in MHz;

fo= output frequency in MHz;

CL= output load capacitance in pF;

VCC = supply voltage in V;

(CLVCC2fo) = sum of the outputs.

Table 8. Tran sfer characteristics

At recommended operating conditions; voltages are referenced to GND (ground = 0 V). See Figure 9 and Figure 10.

Symbol Parameter Conditions 25 C40 C to +85 C40 C to +125 CUnit

Min Typ Max Min Max Min Max

VT+ positive-going

threshold

voltage

VCC = 3.0 V - - 2.2 - 2.2 - 2.2 V

VCC = 4.5 V - - 3.15 - 3.15 - 3.15 V

VCC = 5.5 V - - 3.85 - 3.85 - 3.85 V

VTnegative-going

threshold

voltage

VCC = 3.0 V 0.9 - - 0.9 - 0.9 - V

VCC = 4.5 V 1.35 - - 1.35 - 1.35 - V

VCC = 5.5 V 1.65 - - 1.65 - 1.65 - V

VHhysteresis

voltage VCC = 3.0 V 0.3 - 1.2 0.3 1.2 0.25 1.2 V

VCC = 4.5 V 0.4 - 1.4 0.4 1.4 0.35 1.4 V

VCC = 5.5 V 0.5 - 1.6 0.5 1.6 0.45 1.6 V

Table 9. Dynamic characteristics

GND = 0 V; for test circuit see Figure 8.

Symbol Parameter Conditions 25 C40 C to +85 C40 C to +125 CUnit

Min Typ Max Min Max Min Max

tpd propagation

delay nA to nY; see Figure 7 [1]

VCC = 3.0 V to 3.6 V [2]

CL= 15 pF - 4.2 12.8 1.0 1 5.0 1.0 16.5 ns

CL= 50 pF - 6.0 16.3 1.0 1 8.5 1.0 20.5 ns

VCC = 4.5 V to 5.5 V [3]

CL= 15 pF - 3.2 8.6 1.0 10.0 1.0 11.0 ns

CL= 50 pF - 4.6 10.6 1.0 1 2.0 1.0 13.5 ns

CPD power

dissipation

capacitance

per buffer;

CL=50pF;f

i=1 MHz;

VI=GNDtoV

[4] -10- - - - - pF

Product data sheet Rev. 4 — 3 November 2011 7 of 18

NXP Semiconductors XC7WH14

Triple inverting Schmitt trigger

13. Waveforms

Measurement points are given in Table 10.

Fig 7. The input (nA) to output (nY) propagation delays

mna033

A input

Y output

tPHL tPLH

Table 10 . Measurement points

Type number Input Output

VIVMVM

XC7WH14 GND to VCC 0.5  VCC 0.5  VCC

Test data is given in Table 11.

Definitions for test circuit:

CL = Load capacitance including jig and probe capacitance.

RT = Termination resistance should be equal to output impedance Zo of the pulse generator.

Fig 8. Test circuit for measuring switching times

mna101

RTCL

PULSE

GENERATOR DUT

Table 11. Test da ta

Type Input Load Test

VItr, tfCL

XC7WH14 VCC 3.0ns 15pF, 50pF t

PLH, tPHL

Product data sheet Rev. 4 — 3 November 2011 8 of 18

NXP Semiconductors XC7WH14

Triple inverting Schmitt trigger

13.1 Transfer characteristic waveforms

Fig 9. Transfer charac te ris t ic Fig 10. The definition s of VT+, V T an d VH

mna026

T−

T+

mna027

VIVH

VT+

VT−

VCC = 3.0 V. VCC = 4.5 V.

Fig 11. Typica l transfer characteristics Fig 12. Typical tra nsfer characteristics

001 3

1.5

0.5

mna401

2VI (V)

ICC

(mA)

VI (V)

ICC

(mA)

mna402

1234

Product data sheet Rev. 4 — 3 November 2011 9 of 18

NXP Semiconductors XC7WH14

Triple inverting Schmitt trigger

14. Application information

The slow input rise and fall times cause additional power dissipation, which can be

calculated using the following formula:

Padd =f

i(trICC(AV) +t

fICC(AV))VCC where:

Padd = additional power dissipation (W);

fi= input frequency (MHz);

tr= input rise time (ns); 10 % to 90 %;

tf= input fall time (ns); 90 % to 10 %;

ICC(AV) = average additional supply current (A).

ICC(AV) differs with positive or negative input transitions, as shown in Figure 14.

For XC7WH14 used in relaxation oscillator circuit, see Figure 15.

Note to the application information:

1. All values given are typical unless otherwise specified.

VCC = 5.5 V.

Fig 13. Typical transfer characteristics

02 6

mna403

4VI (V)

ICC

(mA)

Product data sheet Rev. 4 — 3 November 2011 10 of 18

NXP Semiconductors XC7WH14

Triple inverting Schmitt trigger

Linear change of VI between 0.1VCC to 0.9VCC

Fig 14. Average additional ICC

mna036

0 2.0 4.0 6.0

VCC (V)

200

150

100

ΔICC(AV)

(μA)

positive-going

edge

negative-going

edge

Fig 15. Relaxation oscillator using the XC7WH14

mna035

---1

0.55 RC

------------------------

=

Product data sheet Rev. 4 — 3 November 2011 11 of 18

NXP Semiconductors XC7WH14

Triple inverting Schmitt trigger

15. Package outline

Fig 16. Package outline SOT505-2 (TSSOP8)

UNIT A1

max. A2A3bpLHELpwyv

ceD(1) E(1) Z(1) θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.15

0.00 0.95

0.75 0.38

0.22 0.18

0.08 3.1

2.9 3.1

2.9 0.65 4.1

3.9 0.70

0.35 8°

0°

0.13 0.10.20.5

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

0.47

0.33

SOT505-2 - - - 02-01-16

0.25

A2A1

(A3)

detail X

vMA

2.5 5 mm0

scale

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2

1.1

pin 1 index

Product data sheet Rev. 4 — 3 November 2011 12 of 18

NXP Semiconductors XC7WH14

Triple inverting Schmitt trigger

Fig 17. Package outline SOT765-1 (VSSOP8)

UNIT A1

max. A2A3bpLHELpwyv

ceD(1) E(2) Z(1) θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.15

0.00 0.85

0.60 0.27

0.17 0.23

0.08 2.1

1.9 2.4

2.2 0.5 3.2

3.0 0.4

0.1 8°

0°

0.13 0.10.20.4

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.40

0.15

0.21

0.19

SOT765-1 MO-187 02-06-07

0.12

A2A1

(A3)

detail X

vMA

2.5 5 mm0

scale

VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1

pin 1 index

Product data sheet Rev. 4 — 3 November 2011 13 of 18

NXP Semiconductors XC7WH14

Triple inverting Schmitt trigger

Fig 18. Package outline SOT833-1 (XSON8)

terminal 1

index area

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT833-1 - - -

MO-252

- - -

SOT833-1

07-11-14

07-12-07

DIMENSIONS (mm are the original dimensions)

XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm

e1e1

0 1 2 mm

scale

Notes

1. Including plating thickness.

2. Can be visible in some manufacturing processes.

UNIT

mm 0.25

0.17 2.0

1.9 0.35

0.27

max b E

1.05

0.95

Dee

0.40

0.32

0.50.6

A(1)

max

0.5 0.04

8×

(2)

4×

(2)

Product data sheet Rev. 4 — 3 November 2011 14 of 18

NXP Semiconductors XC7WH14

Triple inverting Schmitt trigger

Fig 19. Package outline SOT996-2 (XSON8U)

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT996-2 - - -- - -

SOT996-2

07-12-18

07-12-21

UNIT A

max

mm 0.5 0.05

0.00 0.35

0.15 3.1

2.9 0.5 1.5 0.5

0.3 0.6

0.4 0.1 0.05

DIMENSIONS (mm are the original dimensions)

XSON8U: plastic extremely thin small outline package; no leads;

8 terminals; UTLP based; body 3 x 2 x 0.5 mm

0 1 2 mm

scale

b D

2.1

1.9

E e e1L L1

0.15

0.05

L2v w

0.05

y y1

0.1

eAC B

vMCw M

terminal 1

index area

B A

detail X

AA1

Product data sheet Rev. 4 — 3 November 2011 15 of 18

NXP Semiconductors XC7WH14

Triple inverting Schmitt trigger

16. Abbreviations

17. Revision history

Table 12. Abbreviations

Acronym Description

CDM Charged Device Mo del

CMOS Complementary Metal-Oxide Semiconductor

DUT Device Under Test

ESD ElectroStatic Discharge

HBM Human Body Model

MM Machine Model

Table 13. Revision history

Document ID Release date Data sheet status Change notice Supersedes

XC7WH14 v.4 20111103 Product data sheet - XC7WH14 v. 3

Modifications: •Legal pages updated

XC7WH14 v.3 20101118 Product data sheet - XC7WH14 v.2

XC7WH14 v.2 20101021 Product data sheet - XC7WH14 v.1

XC7WH14 v.1 20090907 Product data sheet - -

Product data sheet Rev. 4 — 3 November 2011 16 of 18

NXP Semiconductors XC7WH14

Triple inverting Schmitt trigger

18. Legal information

18.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

18.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

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Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short dat a sheet, the

full data sheet shall pre vail.

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data sheet shall define the specification of the product as agreed between

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Applications — Applications that are described herein for any of these

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representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

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accepts no liability for any assistance with applications or customer product

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the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress rating s only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

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products are sold subject to the general terms and conditions of commercial

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Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the obj ective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 4 — 3 November 2011 17 of 18

NXP Semiconductors XC7WH14

Triple inverting Schmitt trigger

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neither qua lified nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

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In the event that customer uses the product for design-in and use in

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liability, damages or failed product claims resulting from custome r design and

use of the product for automotive applications beyond NXP Semiconductors’

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18.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

19. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors XC7WH14

Triple inverting Schmitt trigger

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 3 November 2011

Document identifier: XC7WH14

Please be aware that important notices concerning this document and the product(s)

described herei n, have been included in section ‘Legal information’.

20. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 1

5 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Functional description . . . . . . . . . . . . . . . . . . . 3

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

10 Recommended operating conditions. . . . . . . . 4

11 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5

11.1 Transfer characteristics . . . . . . . . . . . . . . . . . . 6

12 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6

13 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

13.1 Transfer characteristic waveforms . . . . . . . . . . 8

14 Application information. . . . . . . . . . . . . . . . . . . 9

15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11

16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15

17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15

18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16

18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16

18.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

18.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16

18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17

19 Contact information. . . . . . . . . . . . . . . . . . . . . 17

20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18