LM25066I, LM25066IA
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SNVS824C JUNE 2012REVISED MARCH 2013
Intel Node Manager Compliant System Power Management and Protection IC with PMBus
Check for Samples: LM25066I,LM25066IA
1FEATURES DESCRIPTION
While the LM25066I/A is functionally similar to the
2 Fully Node Manager 2.0 and 2.5 Compliant with LM25066/A, the LM25066I/A is fully compliant to Intel
I2C/SMBus interface and PMBus™ compliant Node Manager 2.0, 2.5 and adds the READ_EIN
command structure energy accumulator feature. The LM25066I/A
Input voltage range: 2.9V to 17V combines a high-performance hot-swap controller
with a PMBus 1.2compliant SMBus/I2C interface to
Programmable 25mV or 46mV current limit accurately measure, control and protect the electrical
threshold operating conditions of critical systems. The
Read_EIN accurately measures true input LM25066I/A continuously supplies real-time power,
power via simultaneous sampling voltage, current, temperature, and fault data to the
Configurable circuit breaker protection for system management host via the SMBus interface.
hard shorts The LM25066I/A control block includes a unique hot-
Configurable under- and over-voltage lockouts swap architecture that provides current and power
with hysteresis limiting to protect sensitive circuitry even during the
most stressful conditions. A fast-acting circuit breaker
Real time monitoring of VIN, VOUT, IIN, PIN, VAUX prevents damage in the event of a short circuit on the
with 12-bit resolution and 1 kHz sampling rate output. The input under-voltage, over-voltage
Current measurement accuracy: ±1% hysteresis, insertion delay time and fault detection
(LM25066IA) and Power measurement time are all configurable. A temperature monitoring
accuracy: ±2.0% (LM25066IA) over temperature block on the LM25066I/A interfaces with a low-cost
Averaging of VIN, IIN, PIN, and VOUT over external diode for continuous temperature
assessment of the external MOSFET or other thermal
programmable interval ranging from 0.001 to 4 sensitive components. The POWER GOOD output
seconds provides a fast alert when the input and/or output
Programmable WARN and FAULT thresholds voltages are outside their programmed range.
with SMBA notification Accurate power readings are accomplished by using
Blackbox capture of telemetry measurements the READ_EIN command. A black box
and device status triggered by WARN or (Telemetry/Fault Snapshot) function captures and
stores telemetry data and device status in the event
FAULT condition of a warning or a fault.
24-lead WQFN package
APPLICATIONS
Server backplane systems
Basestation power distribution systems
Solid state circuit breaker (eFuse)
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2012–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
5x4 mm WQFN 24L
1
24
GATE
OUT
PGD
TIMER
ADR2
ADR1
VAUX
SCL
SMBA
VREF
DIODE
PWR
SENSE
VIN
UVLO/EN
OVLO
GND
ADR0
SDA
VDD
FB
RETRY
CL
CB
Exposed
Pad
OUT
UVLO/EN
VIN GATE DIODE
ADR2
ADR1
ADR0
VDD
N/C
FB
OVLO
SDA
SCL
PGD
N/C
SENSE
VDD
SMBus
Interface
SMBA
CL
CB
RETRY
VAUX
VDD VREF TIMER PWR
GND
LM25066I/A Auxillary ADC Input
(0V - 1.16V)
UVLO/EN
R1
R2
R3
R4
R5
Q2
VOUT
CLOAD
RS
VIN
CVDD CVREF RPWR
CT
CIN DZQ1
RPG
OUT
LM25066I, LM25066IA
SNVS824C JUNE 2012REVISED MARCH 2013
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Typical Application Schematic
Connection Diagram
Solder exposed pad to ground.
Top View
WQFN-24
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Pin Descriptions
Pin Name Description Applications Information
No.
Pad Exposed Exposed pad of WQFN No internal electrical connection. Solder to the ground plane to reduce thermal resistance.
Pad package
1 ADR2 SMBUS address line 2 3 - state address line. Should be connected to GND, VDD, or left floating.
2 ADR1 SMBUS address line 1 3 - state address line. Should be connected to GND, VDD, or left floating.
3 ADR0 SMBUS address line 0 3 - state address line. Should be connected to GND, VDD, or left floating.
4 VDD Internal sub-regulator Internally sub-regulated 4.5V bias supply. Connect a 1 µF capacitor on this pin to ground
output for bypassing.
5 CL Current limit range Connect this pin to GND to set the nominal over-current threshold at 25mV. Connecting
CL to VDD will set the over-current threshold to be 46mV.
6 CB Circuit breaker range This pin sets the circuit breaker protection point in relation to the over-current trip point.
When connected to GND, this pin will set the circuit breaker point to be 1.8 times the
over-current threshold. Connecting this pin to VDD sets the circuit breaker trip point to be
3.6 times the over-current threshold.
7 FB Power Good feedback An external resistor divider from OUT sets the output voltage at which the PGD pin
switches. The threshold at the pin is 1.167V. An internal 24 µA current source provides
hysteresis.
8 RETRY Fault retry input This pin configures the power up fault retry behavior. When this pin is grounded, the
device will continually try to engage power during a fault. If the pin is connected to VDD,
the device will latch off during a fault.
9 TIMER Timing capacitor An external capacitor connected to this pin sets the insertion time delay, fault timeout
period and restart timing.
10 PWR Power limit set An external resistor connected to this pin, in conjunction with the current sense resistor
(RS), sets the maximum power dissipation allowed in the external series pass MOSFET.
11 PGD Power Good indicator An open drain output. This output is high when the voltage at the FB pin is above 1.167V
and the input supply is within its under-voltage and over-voltage thresholds. Connect via a
pullup resistor to the output rail (external MOSFET source) or any other voltage to be
monitored.
12 OUT Output feedback Connect to the output rail (external MOSFET source). Internally used to determine the
MOSFET VDS voltage for power limiting, and to monitor the output voltage.
13 GATE Gate drive output Connect to the external MOSFET's gate.
14 SENSE Current sense input The voltage across the current sense resistor (RS) is measured from VIN to this pin. If the
voltage across RSreaches over-current threshold, the load current is limited and the fault
timer activates.
15 VIN Positive supply input A small ceramic bypass capacitor close to this pin is recommended to suppress transients
which occur when the load current is switched off.
16 UVLO/EN Under-voltage lockout An external resistor divider from the system input voltage sets the under-voltage turn-on
threshold. An internal 23 µA current source provides hysteresis. The enable threshold at
the pin is 1.16V. This pin can also be used for remote shutdown control.
17 OVLO Over-voltage lockout An external resistor divider from the system input voltage sets the over-voltage turn-off
threshold. An internal 23 µA current source provides hysteresis. The disable threshold at
the pin is 1.16V.
18 GND Circuit ground
19 SDA SMBus data pin Data pin for SMBus.
20 SCL SMBus clock Clock pin for SMBus.
21 SMBA SMBus alert line Alert pin for SMBus, active low.
22 VREF Internal Reference Internally generated precision 2.73V reference used for analog to digital conversion.
Connect a 1 µF capacitor on this pin to ground for bypassing.
23 DIODE External diode Connect this to a diode-configured NPN transistor for temperature monitoring.
24 VAUX Auxiliary voltage input Auxiliary pin allows voltage telemetry from an external source. Full scale input of 1.16V.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Absolute Maximum Ratings(1)
VIN, SENSE to GND (2) -0.3V to 24V
GATE, FB, UVLO/EN, OVLO, PGD to GND (2) -0.3V to 20V
Out to GND -1 to 20V
SCL, SDA, SMBA, CL, CB, ADR0, ADR1, ADR2, VDD, VAUX, DIODE, RETRY to GND -0.3V to 6V
VIN to SENSE -0.3V to +0.3V
ESD Rating, Human Body Model(3) 2kV
Storage Temperature -65°C to +150°C
Junction Temperature +150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional.
(2) The GATE pin voltage is typically 7.5V above VIN when the LM25066I/A is enabled. Therefore, the Absolute Maximum Rating of 24V for
VIN and SENSE apply only when the LM25066I/A is disabled or for a momentary surge to that voltage since the Absolute Maximum
Rating for the GATE pin is 20V.
(3) The human body model is a 100 pF capacitor discharged through a 1.5 kresistor into each pin.
Operating Ratings
VIN, SENSE, OUT voltage 2.9V to 17V
VDD 2.9V to 5.5V
Junction Temperature 40°C to +125°C
Electrical Characteristics
Limits in standard type are for TJ= 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C
to +85°C unless otherwise stated. Minimum and Maximum limits are specified through test, design, or statistical correlation.
Typical values represent the most likely parametric norm at TJ= 25°C, and are provided for reference purposes only. Unless
otherwise stated the following conditions apply: VIN = 12V. See (1) and
Symbol Parameter Conditions Min Typ Max Unit
Input (VIN Pin)
IIN-EN Input Current, enabled UVLO = 2V and OVLO = 0.7V 5.8 8mA
POR Power On Reset threshold at VIN VIN increasing 2.6 2.8 V
PORHYS POREN Hysteresis VIN decreasing 150 mV
VDD Regulator (VDD pin)
VDD IVDD = 5mA, VIN = 12V 4.3 4.5 4.7 V
IVDD = 5mA, VIN = 4.5V 3.5 3.9 4.3 V
VDDILIM VDD Current Limit 25 45 mA
UVLO/EN, OVLO Pins
UVLOTH UVLO threshold VUVLO Falling 1.147 1.16 1.173 V
UVLOHYS UVLO hysteresis current UVLO = 1V 18 23 28 µA
UVLODEL UVLO delay Delay to GATE high 8 µs
Delay to GATE low 20
UVLOBIAS UVLO bias current UVLO = 3V 1µA
OVLOTH OVLO threshold VOVLO rising 1.141 1.16 1.185 V
OVLOHYS OVLO hysteresis current OVLO = 1V -28 -23 -18 µA
OVLODEL OVLO delay Delay to GATE high 19 µs
Delay to GATE low 9
OVLOBIAS OVLO bias current OVLO = 1V 1µA
Power Good (PGD pin)
PGDVOL Output low voltage ISINK = 2 mA 25 60 mV
PGDIOH Off leakage current VPGD = 17V 1µA
PGDDELAY Power Good Delay VFB to VPG 115 ns
(1) Current out of a pin is indicated as a negative value.
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Electrical Characteristics (continued)
Limits in standard type are for TJ= 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C
to +85°C unless otherwise stated. Minimum and Maximum limits are specified through test, design, or statistical correlation.
Typical values represent the most likely parametric norm at TJ= 25°C, and are provided for reference purposes only. Unless
otherwise stated the following conditions apply: VIN = 12V. See (1) and
Symbol Parameter Conditions Min Typ Max Unit
FB Pin
FBTH FB Threshold VFB rising 1.141 1.167 1.19 V
FBHYS FB Hysteresis Current -31 -24 -18 µA
FBLEAK Off Leakage Current VFB = 1V 1µA
Power Limit (PWR Pin)
PWRLIM Power limit sense voltage (VIN-SENSE) SENSE-OUT = 12V, RPWR = 25 k912.5 15 mV
IPWR PWR pin current VPWR = 2.5V -10 µA
RSAT(PWR) PWR pin impedance when disabled UVLO = 0.7V 180
Gate Control (GATE Pin)
IGATE Source current Normal operation -28 -22 -16 µA
Fault Sink current UVLO = 1V 1.5 22.5 mA
POR Circuit Breaker sink current VIN - SENSE = 150 mV or VIN < RPOR,105 190 275 mA
VGATE = 5V
VGATE Gate output voltage in normal operation GATE voltage with respect to ground 17 18.8 20.3 V
OUT Pin
IOUT-EN OUT bias current, enabled OUT = VIN, normal operation 16 µA
IOUT-DIS OUT bias current, disabled (2) Disabled, OUT = 0V, SENSE = VIN -12 µA
Current Limit
VCL Threshold voltage CL = GND 22.5 25 27.5 mV
CL = GND, TJ= 10°C to 85°C 23 25 27
CL = VDD 41 46 52
tCL Response time VIN-SENSE stepped from 0 mV to 80 mV 1.2 µs
ISENSE SENSE input current Enabled, SENSE = OUT 33 µA
Disabled, OUT = 0V 46
Enabled, OUT = 0V 45
Circuit Breaker
VCB Threshold voltage x 1.8 VIN - SENSE, CL = GND, CB = GND 35 45 55 mV
CB:CL Ratio CB = GND 1.6 1.8 2
VCB Threshold voltage x 3.6 VIN - SENSE, CL = GND, CB = VDD 70 90 110 mV
CB:CL Ratio CB = VDD 3.1 3.6 4
tCB Response time VIN - SENSE stepped from 0 mV to 150 0.6 1.2 µs
mV, time to GATE low, no load
Timer (TIMER pin)
VTMRH Upper threshold 1.54 1.7 1.85 V
VTMRL Lower threshold Restart cycles 0.85 1.0 1.07 V
End of 8th cycle 0.3 V
Re-enable threshold 0.3 V
ITIMER Insertion time current TIMER pin = 2V -8 -5.5 -3 µA
Sink current, end of insertion time 1.4 1.9 2.4 mA
Fault detection current -120 -90 -60 µA
Fault sink current 2.8 µA
DCFAULT Fault Restart Duty Cycle 0.67 %
tFAULT_DELAY Fault to GATE low delay TIMER pin reaches the upper threshold 17 µs
(2) OUT bias current (disabled) due to leakage current through an internal 0.9 Mresistance from SENSE to VOUT.
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Electrical Characteristics (continued)
Limits in standard type are for TJ= 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C
to +85°C unless otherwise stated. Minimum and Maximum limits are specified through test, design, or statistical correlation.
Typical values represent the most likely parametric norm at TJ= 25°C, and are provided for reference purposes only. Unless
otherwise stated the following conditions apply: VIN = 12V. See (1) and
Symbol Parameter Conditions Min Typ Max Unit
Internal Reference
VREF Reference Voltage 2.703 2.73 2.757 V
ADC and MUX
Resolution 12 Bits
INL Integral Non-Linearity ADC only +/-1 LSB
tAQUIRE Acquisition + Conversion Time Any channel 100 µs
tRR Acquisition Round Robin Time Cycle all channels 1 ms
IINFSR Current input full scale range CL = GND 30.2 mV
CL = VDD 60.4 mV
IINLSB Current input LSB CL = GND 7.32 µV
CL = VDD 14.64 µV
VAUXFSR VAUX input full scale range 1.16 V
VAUXLSB VAUX input LSB 283.2 µV
VINFSR Input voltage full scale range 18.7 V
VINLSB Input voltage LSB 4.54 mV
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SNVS824C JUNE 2012REVISED MARCH 2013
Electrical Characteristics (continued)
Limits in standard type are for TJ= 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C
to +85°C unless otherwise stated. Minimum and Maximum limits are specified through test, design, or statistical correlation.
Typical values represent the most likely parametric norm at TJ= 25°C, and are provided for reference purposes only. Unless
otherwise stated the following conditions apply: VIN = 12V. See (1) and
Symbol Parameter Conditions Min Typ Max Unit
Telemetry Accuracy LM25066IA
IINACC Input Current Accuracy VIN SENSE = 25mV, CL = GND -1 +1 %
TJ= 10°C to 85°C
VIN SENSE = 25mV, CL = GND -1.2 +1
VIN SENSE = 50mV, CL = VDD -1.8 +1.8
VIN- SENSE= 5mV, CL= GND -5 +5
TJ= 10°C to 85°C
VACC VAUX, VIN, VOUT Accuracy VIN, VOUT = 12V -1 +1 %
VAUX = 1V
TJ= 10°C to 85°C
VIN, VOUT = 12V -1 +1.2
VAUX = 1V
PINACC Input Power Accuracy VIN = 12V, VIN SENSE = 25mV, -2.0 +2.0 %
CL = GND
Telemetry Accuracy LM25066I
IINACC Input Current Accuracy VIN SENSE = 25mV, CL = GND -2.7 +2.4 %
VIN SENSE = 25mV, CL = GND -2.4 +2.4
TJ= 10°C to 85°C
VACC VAUX, VIN, VOUT Accuracy VIN, VOUT = 12V -1.6 +1.4 %
VAUX = 1V
VIN, VOUT = 12V -1.4 +1.4
VAUX = 1V
TJ= 10°C to 85°C
PINACC Input Power Accuracy VIN = 12V, VIN SENSE = 25mV, -3.0 +3.0 %
CL = GND
Remote Diode Temperature Sensor
TACC Temperature Accuracy Using Local TA= 10°C to 85°C 2 10 °C
Diode
Remote Diode Resolution 9 bits
IDIODE External Diode Current Source High level 250 300 µA
Low level 9.4 µA
Diode Current Ratio 26
PMBus Pin Thresholds (SMBA, SDA, SCL)
VIL Data, Clock Input Low Voltage 0.8 V
VIH Data, Clock Input High Voltage 2.1 5.5 V
VOL Data Output Low Voltage IPULLUP = 4mA 0 0.4 V
ILEAK Input Leakage Current SDA, SMBA, SCL = 5V 1µA
CL Pin Capacitance SDA, SCL 5 pF
Configuration Pin Thresholds (CB, CL, RETRY)
VIH Threshold Voltage 3V
ILEAK Input Leakage Current CL, CB, RETRY = 5V 1mA
Thermal (3)
θJA Junction to Ambient 42.3 °C/W
θJC Junction to Case 9.5 °C/W
(3) Junction-to-ambient thermal resistance is highly application and board layout dependent. Specified thermal resistance values for the
package specified is based on a 4-layer, 4"x3", 2/1/1/2 oz. Cu board as per JEDEC standards is used.
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-60 -40 -20 0 20 40 60 80 100120140
-18
-16
-14
-12
-10
-8
-6
-4
-2
OUTPUT PIN CURRNET (DISABLED) (A)
TEMPERATURE (°C)
VIN = 17V
VIN = 2.9V
VIN = 12V
-60 -40 -20 0 20 40 60 80 100120140
6
8
10
12
14
16
18
20
GATE PIN VOLTAGE (V)
TEMPERATURE (°C)
VIN = 17V
VIN = 9V
VIN = 5V
VIN = 12V
VIN = 2.9V
-40 -20 0 20 40 60 80 100 120
34
36
38
40
42
44
46
48
50
52
SENSE PIN CURRENT (DISABLED) (A)
TEMPERATURE (°C)
VIN = 17V
VIN = 12V
VIN = 2.9V
-60 -40 -20 0 20 40 60 80 100120140
4
8
12
16
20
24
28
OUTPUT PIN CURRENT (ENABLED) (A)
TEMPERATURE (°C)
VIN = 17V
VIN = 12V
VIN = 2.9V
-60 -40 -20 0 20 40 60 80 100120140
30
34
38
42
46
50
54
SENSE PIN CURRENT (ENABLED) (A)
TEMPERATURE (°C)
VIN = 17V
VIN = 12V
VIN = 2.9V
-40 -20 0 20 40 60 80 100 120 140
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VIN INPUT CURRENT (mA)
TEMPERATURE (°C)
VIN = 17V
VIN = 12V
VIN = 3V
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SNVS824C JUNE 2012REVISED MARCH 2013
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Typical Performance Characteristics
Unless otherwise specified the following conditions apply: TJ= 25°C, VIN = 12V. All graphs show junction temperature.
VIN Pin Current SENSE Pin Current (Enabled)
Figure 1. Figure 2.
SENSE Pin Current (Disabled) OUT Pin Current (Enabled)
Figure 3. Figure 4.
OUT Pin Current (Disabled) GATE Pin Voltage
Figure 5. Figure 6.
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-60 -40 -20 0 20 40 60 80 100120140
23.0
23.2
23.4
23.6
23.8
24.0
UVLO HYSTERESIS CURRENT (A)
TEMPERATURE (°C)
-60-40 -20 0 20 40 60 80 100120140
1.162
1.163
1.164
1.165
1.166
1.167
1.168
1.169
1.170
1.171
1.172
FB THRESHOLD (V)
TEMPERATURE (°C)
-60 -40 -20 0 20 40 60 80 100120140
18
22
26
30
34
38
42
PGD LOW VOLTAGE (mV)
TEMPERATURE (°C)
PGD Sink Current = 2mA
-60 -40 -20 0 20 40 60 80 100120140
1.15
1.16
1.17
UVLO THRESHOLD (V)
TEMPERATURE (°C)
VIN = 2.9 to 12V
VIN = 17V
-40 -20 0 20 40 60 80 100 120 140
14
15
16
17
18
19
20
21
22
23
GATE PIN SOURCE CURRENT (A)
TEMPERATURE (°C)
VIN = 5V TO 17V
VIN = 2.9V
-40 -20 0 20 40 60 80 100 120 140
0
4
8
12
16
20
24
POWER LIMIT THRESHOLD (mV)
TEMPERATURE (°C)
RPWR=50K; CL = VDD
RPWR=25K; CL = GND
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Typical Performance Characteristics (continued)
Unless otherwise specified the following conditions apply: TJ= 25°C, VIN = 12V. All graphs show junction temperature.
GATE Pin Source Current Power Limit Threshold
Figure 7. Figure 8.
PGD Low Voltage UVLO Threshold
Figure 9. Figure 10.
UVLO Hysteresis Current FB Threshold
Figure 11. Figure 12.
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-60 -40 -20 0 20 40 60 80 100120140
40
60
80
100
120
140
160
180
200
CIRCUIT BREAKER THRESHOLD (mV)
TEMPERATURE (°C)
CL = GND, CB = GND
CL = GND, CB = VDD
CL = VDD, CB = VDD
-60 -40 -20 0 20 40 60 80 100120140
40
41
42
43
44
45
46
47
48
49
50
CURRENT LIMIT THRESHOLD (mV)
TEMPERATURE (°C)
VIN = 2.9V
VIN = 5V to 17V
-60-40-20 0 20 40 60 80 100120140
-26.0
-25.5
-25.0
-24.5
-24.0
-23.5
-23.0
FB HYSTERESIS (A)
TEMPERATURE (°C)
-60 -40 -20 0 20 40 60 80 100120140
23.0
23.5
24.0
24.5
25.0
25.5
26.0
26.5
27.0
CURRENT LIMIT THRESHOLD (mV)
TEMPERATURE (°C)
VIN = 2.9V
VIN = 5V to 17V
-60 -40 -20 0 20 40 60 80 100120140
1.162
1.163
1.164
1.165
1.166
1.167
OVLO THRESHOLD (V)
TEMPERATURE (°C)
VIN = 2.9V
VIN = 17V
VIN = 12V
-60 -40 -20 0 20 40 60 80 100120140
-30
-28
-26
-24
-22
-20
-18
-16
OVLO HYSTERESIS CURRENT (A)
TEMPERATURE (°C)
VIN = 12V to 17V
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Typical Performance Characteristics (continued)
Unless otherwise specified the following conditions apply: TJ= 25°C, VIN = 12V. All graphs show junction temperature.
OVLO Threshold OVLO Hysteresis
Figure 13. Figure 14.
FB Pin Hysteresis Current Limit Threshold
Figure 15. Figure 16.
Current Limit Threshold Circuit Breaker Threshold (CL = VDD)
Figure 17. Figure 18.
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40 ms/DIV
GATE
VIN
UVLO = 2.9V
hyst = 0.2V
OVLO = 15.2V
hyst = 1.2V 5V/DIV
400 ms/DIV
TIMER
VIN
GATE
VOUT
RETRY PERIOD = 1.10s
10V/DIV
10V/DIV
10V/DIV
1V/DIV
1 ms/DIV
TIMER
ILOAD
GATE
VOUT
2.5A/DIV
10V/DIV
10V/DIV
1V/DIV
-60 -40 -20 0 20 40 60 80 100120140
2.70
2.71
2.72
2.73
2.74
2.75
VREF (V)
TEMPERATURE (°C)
100 ms/DIV
TIMER
VIN
GATE
VOUT
INSERTION DELAY = 140 ms
10V/DIV
10V/DIV
10V/DIV
1V/DIV
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Typical Performance Characteristics (continued)
Unless otherwise specified the following conditions apply: TJ= 25°C, VIN = 12V. All graphs show junction temperature.
Reference Voltage Startup (Insertion Delay)
Figure 19. Figure 20.
Startup (Short circuit VOUT) Startup (5A Load)
Figure 21. Figure 22.
Startup (UVLO, OVLO) Startup (PGOOD)
Figure 23. Figure 24.
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-15 -5 5 15 25 35 45 55 65 75 85
-0.5
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
0.4
0.5
IIN ERROR ( % OF FSR)
TEMPERATURE ( °C)
-15 -5 5 15 25 35 45 55 65 75 85
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
PIN ERROR (% OF FSR)
TEMPERATURE (°C)
TIMER
ILOAD
VOUT
RETRY PERIOD = 1.1s
25A/DIV
10V/DIV
1V/DIV
400 ms/DIV
TIMER
ILOAD
GATE
VOUT
25A/DIV
10V/DIV
10V/DIV
1V/DIV
100 ms/DIV
TIMER
ILOAD
GATE
VOUT
TIMEOUT PERIOD
= 8.3 ms
25A/DIV
10V/DIV
10V/DIV
1V/DIV
>50A
4 ms/DIV
TIMER
ILOAD
GATE
VOUT
50A/DIV
10V/DIV
10V/DIV
1V/DIV
> 90A Triggers
Circuit Breaker
1 ms/DIV
LM25066I, LM25066IA
SNVS824C JUNE 2012REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics (continued)
Unless otherwise specified the following conditions apply: TJ= 25°C, VIN = 12V. All graphs show junction temperature.
Current Limit Event (CL = GND) Circuit Breaker Event (CL = CB = GND)
Figure 25. Figure 26.
Retry Event (Retry = GND) Latch Off (Retry = VDD)
Figure 27. Figure 28.
IIN Measurement Accuracy PIN Measurement Accuracy
(VIN - SENSE = 25 mV) (VIN - SENSE = 25 mV)
Figure 29. Figure 30.
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Product Folder Links: LM25066I LM25066IA
ID
VIN
SENSE
OUT
PWR
GATE
22 A
10A
1.16V
1.16V
OVLO
UVLO/EN
23 A
5.5 A
Insertion
Timer 90 A
Fault
Timer
2.8 A
Fault
Discharge
1.72V
1.0V
TIMER
Current Limit
Threshold
Charge
Pump
VDS
23 A
TIMER AND GATE
LOGIC CONTROL
GND
Power Limit
Threshold
2 mA
Gate
Control 18.8V
1 M
1.9 mA
End
Insertion
Time
0.3V
LM25066I/A
Current Limit/
Power Limit
Control
2.6V
VIN
POR
25 mV
190
mA
1/16
S/H
1/16
VAUX
12bit
ADC
AMUX
SMBUS
INTERFACE
DIODE
ADR0
ADR1
ADR2
SCL
SDA
SMBA
ADDRESS
DECODER
TELEMETRY
STATE
MACHINE
Gain = 2.3V/V
CL
CB
RETRY
Diode
Temp
Sense
SnapShot
VDD
REG
VDD 1.167V UV
OV
VREF
PGD
FB
REF
GEN
24 A
MEASUREMENT/
AVERAGING
FAULT REGISTERS
2.5V
VDD
LM25066I, LM25066IA
www.ti.com
SNVS824C JUNE 2012REVISED MARCH 2013
BLOCK DIAGRAM
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Product Folder Links: LM25066I LM25066IA
OUT
UVLO/EN
VIN GATE DIODE
ADR2
ADR1
ADR0
VDD
N/C
FB
OVLO
SDA
SCL
PGD
N/C
SENSE
VDD
SMBus
Interface
SMBA
CL
CB
RETRY
VAUX
VDD VREF TIMER PWR
GND
LM25066I/A Auxillary ADC Input
(0V - 1.16V)
UVLO/EN
R1
R2
R3
R4
R5
Q2
VOUT
CLOAD
RS
VIN
CVDD CVREF RPWR
CT
CIN DZQ1
RPG
OUT
LM25066I, LM25066IA
SNVS824C JUNE 2012REVISED MARCH 2013
www.ti.com
FUNCTIONAL DESCRIPTION
The inline protection functionality of the LM25066I/A is designed to control the in-rush current to the load upon
insertion of a circuit card into a live backplane or other “hot” power source, thereby limiting the voltage sag on the
backplane’s supply voltage and the dV/dt of the voltage applied to the load. Effects on other circuits in the
system are minimized, preventing possible unintended resets. A controlled shutdown when the circuit card is
removed can also be implemented using the LM25066I/A.
In addition to a programmable current limit, the LM25066I/A monitors and limits the maximum power dissipation
in the series pass device to maintain operation within the device Safe Operating Area (SOA). Either current
limiting or power limiting for an extended period of time results in the shutdown of the series pass device. In this
event, the LM25066I/A can latch off or repetitively retry based on the hardware setting of the RETRY pin. Once
started, the number of retries can be set to none, 1, 2, 4, 8, 16, or infinite. The circuit breaker function quickly
switches off the series pass device upon detection of a severe over-current condition. Programmable under-
voltage lockout (UVLO) and over-voltage lockout (OVLO) circuits shut down the LM25066I/A when the system
input voltage is outside the desired operating range.
The telemetry capability of the LM25066I/A provides intelligent monitoring of the input voltage, output voltage,
input current, input power, temperature, and an auxiliary input. The LM25066I/A also provides a peak capture of
the input power and programmable hardware averaging of the input voltage, current, power, and output voltage.
Warning thresholds which trigger the SMBA pin may be programmed for input and output voltage, current, power
and temperature via the PMBus interface. Additionally, the LM25066I/A is capable of detecting damage to the
external MOSFET, Q1.
Figure 31. Typical Application Circuit
Power Up Sequence
The VIN operating range of the LM25066I/A is +2.9V to +17V, with transient capability to +24V. Referring to
Figure 31 and Figure 32, as the voltage at VIN initially increases, the external N-channel MOSFET (Q1) is held
off by an internal 190 mA pulldown current at the GATE pin. The strong pulldown current at the GATE pin
prevents an inadvertent turn-on as the MOSFET’s gate-to-drain (Miller) capacitance is charged. Additionally, the
TIMER pin is initially held at ground. When the VIN voltage reaches the POR threshold, the insertion time begins.
During the insertion time, the capacitor at the TIMER pin (CT) is charged by a 5.5 µA current source and Q1is
held off by a 2 mA pulldown current at the GATE pin regardless of the input voltage. The insertion time delay
allows ringing and transients at VIN to settle before Q1is enabled. The insertion time ends when the TIMER pin
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Product Folder Links: LM25066I LM25066IA