Philips Semiconductors Product Specification Revision 3.0
Contactless Chip Card Module Specification – MOA2
Page 2 of 15 Public
Contents
1 GENERAL INFORMATION ..................................................................................................3
1.1 Definition of a Chip Card Module...................................................................................................................... 3
1.2 Use of the Chip Card Module............................................................................................................................. 3
2 SPECIFICATIONS..............................................................................................................4
2.1 Chip .................................................................................................................................................................... 4
2.2 Dimensions ......................................................................................................................................................... 4
2.3 Materials ............................................................................................................................................................. 5
2.4 Operating- and Processing Temperature............................................................................................................. 5
2.5 Package Drawing................................................................................................................................................ 6
2.6 Splicing Specification......................................................................................................................................... 7
2.7 Leader/Trailer Specification ............................................................................................................................... 8
3 PACKING .........................................................................................................................9
4 QUALITY........................................................................................................................10
4.1 Qualification and Reliability............................................................................................................................. 10
4.2 Lot Acceptance Testing .................................................................................................................................... 10
4.3 Complaint Procedure ........................................................................................................................................ 10
4.4 Product-/Process-Change Notification ............................................................................................................. 11
5 SECURITY......................................................................................................................12
6 DEFINITIONS..................................................................................................................13
7 LIFE SUPPORT APPLICATIONS ........................................................................................14