FQB34N20TMAM002 - FAIRCHILD SEMICONDUCTOR

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July 2012

FPF3003 • Rev. 1.0.0

FPF3003 — IntelliMAX™ Full Functional Input Power Path Management Switch for Dual-Battery Portable Systems

FPF3003

IntelliMAX™ Full Functional Input Power Path

Management Switch for Dual-Battery Portable System

Features

 2.3V to 5.5V Input Voltage Operating Range

 Low RON between Battery and Load

Maximum 50m at VIN = 4.2V

 Low RON between Charger and Battery

Maximum 125m at VIN = 4.2V

 Maximum DC Current for Load Switch: 2.5A

 Maximum DC Current for Charge Switch: 1.5A

 Slew Rate Controlled to 30µs Nominal Rise Time

 Seamless Break-Before-Make Transition

 Quiescent Current: 30µA Typical

 Thermal Shutdown

 Reverse Current Blocking (RCB) between Battery A

and Battery B

 RESET Timer Delay: 7s Typical

 ESD Protected:

- Human Body Model: >2.5kV

- Charged Device Model: >1.5kV

- IEC 61000-4-2 Air Discharge: >15kV

- IEC 61000-4-2 Contact Discharge: >8kV

 1.6mm X 1.6mm, 16-Bump, 0.4mm Pitch, WLCSP

Applications

 Dual-Battery Cell phone

 Dual-Battery Portable Equipment

Description

The FPF3003 is a single-chip solution for dual-battery

power-path switching, including integrated P-channel

switches and analog control features. The input voltage

range operates from 2.3V to 5.5V. The device selects

one of two batteries to provide power to the system,

enabling one battery to be charged by the external

battery charger.

The FPF3003 has battery voltage monitoring to

determine if the battery is under voltage. Special driver

and digital circuitry allows the device to switch quickly

between battery A and battery B, which allows hot

swapping of battery packs. Maximum current from

battery to load per channel is limited to a constant 2.5A

and internal thermal shutdown circuits protect the part

during fault conditions.

The FPF3003 is available in a 1.6mm x 1.6mm,

16-bump, Wafer-Level Chip-Scale Package (WLCSP).

Ordering Information

Part Number Top Mark

(Charger-Battery)

Max. RON at 4.2VIN

(Battery-Load)

Max. RON at 4.2VIN

Typical

tR Package

FPF3003UCX QW 125m 50m 30µs

16-Bump, 0.4mm Pitch,

1.6mm x 1.6mm WLCSP

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Typical Application Diagram

Figure 1. Typical Application

Functional Block Diagram

Figure 2. Functional Block Diagram

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Pin Configuration

Figure 3. Pin Assignments (Top View) Figure 4. Pin Assignments (Bottom View)

Pin Description

Pin # Name Description

A1 LOBAT

Low Battery A Voltage Input. Connect to the resistive divider to set the trip level for chip-on

moment. If LOBAT is less than 0.8V, VOUT is connected to BATB.

A2 CHGIN

Charging Input. Charging path input.

A3, A4 BATA Supply Input. Battery A voltage input.

B1 STAT

Battery Selector Status. Open-drain output. HIGH (Hi-Z) means battery A connects to

VOUT. LOW means battery B connects to VOUT.

B2 BATBID

Battery B Indicator. Connect this pin with the ID pin at the battery pack of BATB. HIGH

means battery B absent; LOW means battery B present.

B3,B4 VOUT

Switch Output. Connect to system load.

C1 ADPIN

Adapter Input. 5V input for battery charger.

C2 BATAID

Battery A Indicator. Connect this pin with the ID pin at the battery pack of BATA. HIGH

means battery A absent; LOW means battery A present.

C3,C4 BATB

Supply Input. Battery B voltage input.

D1 GND

Ground

D2 RESETB

Reset Input. Active LOW. Both system path switches are disconnected from system load.

D3 BATSEL

Battery Selection Input. HIGH means to switch battery B to VOUT; LOW means to switch

battery A to VOUT.

D4 CHGSEL

Charge Selection Input. HIGH means to charge battery B: LOW means to charge battery A.

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Absolute Maximum Ratings

Stresses exceeding the Absolute Maximum Ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Symbol Parameters Min. Max. Unit

VIN All Pins To GND -0.3 6.0 V

ISW Maximum Continuous Switch Current to Load 2.5 A

Maximum Continuous Switch Current to Charger 1.5 A

PD Power Dissipation at TA = 25°C 1.7 W

TSTG Operating and Storage Junction Temperature -65 150 °C

JA Thermal Resistance, Junction to Ambient

(1in. Square Pad of 2oz. Copper) 72(1) °C/W

ESD Electrostatic Discharge

Capability

Human Body Model, JESD22-A114 2.5

Charged Device Model, JESD22-C101 1.5

Air Discharge (BATA, BATB, ADPIN to

GND), IEC61000-4-2 System Level 15.0

Contact Discharge (BATA, BATB, ADPIN

to GND), IEC61000-4-2 System Level 8.0

Note:

1. Measured using 2S2P JEDEC std. PCB.

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not

recommend exceeding them or designing to Absolute Maximum Ratings.

Symbol Parameters Min. Max. Unit

VIN ADPIN 4.6 5.5 V

BATA, BATB 2.3 5.5 V

TA Ambient Operating Temperature -40 85 °C

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Electrical Characteristics

ADPIN=4.6 to 5.5V, VBATA=VBATB=2.3 to 5.5V, TA=-40 to 85°C unless otherwise noted. Typical values are at

ADPIN=5V, CHGIN=VBATA=VBATB=4.2V, RESETB=HIGH, and TA=25°C.

Symbol Parameters Condition Min. Typ. Max. Unit

Static Characteristics

VADPIN Adapter Input

Voltage 4.6 5.5 V

VADPIN_TH ADPIN Threshold ADPIN Rising 4.5 V

ADPIN Falling 4.2

VBATA,

VBATB Battery Input Voltage 2.3 5.5 V

IQ Quiescent Current IOUT=0mA 30 A

RON

On Resistance to

Load Switch, BATA

or BATB to VOUT

VBATA=VBATB=5.5V, IOUT=300mA,TA=25°C(2) 34

m

VBATA=VBATB=4.2V, IOUT=300mA, TA=25°C 38 50

VBATA=VBATB=3.7V, IOUT=300mA,TA=25°C 43 55

VBATA=VBATB=2.3V, IOUT=300mA, TA=25°C(2) 62

On Resistance to

Charger Switch,

CHGIN to BATA

VBATA=VBATB=5.5V, ICHG=200mA, TA=25°C(2) 66

VBATA=VBATB=4.2V, ICHG=200mA, TA=25°C 73 90

VBATA=VBATB=3.7V, ICHG=200mA, TA=25°C 80 95

VBATA=VBATB=2.3V, ICHG=200mA, TA=25°C(2) 101

On Resistance to

Charger Switch,

CHGIN to BATB

VBATA=VBATB=5.5V, ICHG=200mA, TA=25°C(2) 92

VBATA=VBATB=4.2V, ICHG=200mA, TA=25°C 99 125

VBATA=VBATB=3.7V, ICHG=200mA, TA=25°C 105 130

VBATA=VBATB=2.3V, ICHG=200mA, TA=25°C(2) 128

VIH Input Logic HIGH

Voltage

VBATA=VBATB=2.3V – 5.5V, CHGSEL,

BATSEL 0.90

VBATA=VBATB=2.3V – 5.5V, RESETB 1.15

VBATA=VBATB=2.3V – 5.5V, BATAID, BATBID 1.70

VIL Input Logic LOW

Voltage

VBATA=VBATB=2.3V – 5.5V, CHGSEL,

BATSEL 0.6

VBATA=VBATB=2.3V – 5.5V, RESETB 0.8

VBATA=VBATB=2.3V – 5.5V, BATAID, BATBID 0.9

VSTAT_LO STAT Logic LOW

Voltage ISINK=1mA 0.3 V

VLOBAT LOBAT Threshold VBATA=VBATB=2.3V – 5.5V 0.8 V

tLOBAT LOBAT De-Glitch

Time VBATA=VBATB=2.3V – 5.5V 1.3 ms

TSD Thermal Shutdown

Shutdown Threshold 150

°C Return from Shutdown 140

Hysteresis 10

VDROOP_OUT

Output Voltage

Droop while Battery

Switching

VBATA=4.2V, VBATB=4.2V, Switching from

VBATA  VBATB, RL=100, COUT=10F 100 mV

Continued on the following page…

FPF3003 • Rev. 1.0.0 6

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Electrical Characteristics

ADPIN=4.6 to 5.5V, VBATA=VBATB=2.3 to 5.5V, TA=-40 to 85°C unless otherwise noted. Typical values are at

ADPIN=5V, CHGIN=VBATA=VBATB=4.2V, RESETB=HIGH, and TA=25°C.

Symbol Parameters Condition Min. Typ. Max. Unit

Reverse Current Blocking between VBATA and VBATB

VT_RCB RCB Protection Trip

Point VOUT – VBATA or VBATB 20 mV

VR_RCB RCB Protection

Release Trip Point VBATA or VBATB -VOUT 30 mV

Hysteresis 50 mV

Dynamic Characteristics: See Definitions Below

tR V

OUT Rise Time(2,3,4) VBATA=VBATB=4.2V, RL=100, TA=25°C,

CL=10F, BATAID=HIGH to LOW,

BATBID=HIGH

30 µs

tDON Turn-On Delay(2,3,4) 5 µs

tON Turn-On Time(2,3,4) 35

tF V

OUT Fall Time(2,3,5) VBATA=VBATB=4.2V, RL=100, TA=25°C,

CL=10f, BATAID=LOW to HIGH,

BATBID=HIGH

2.5 ms

tDOFF Turn-Off Delay(2,3,5) 0.1 ms

tOFF Turn-Off Time(2,3,5) 2.6 ms

tDSEL Selection Delay(2,3)

VBATA=VBATB=4.2V, RL=100, TA=25°C,

CL=10F, CHGSEL or BATSEL=LOW to

HIGH

1 ms

tDRST RESET Timer

Delay(2,3)

VBATA=VBATB=4.2V, RL=100,TA=25°C,

CL=10F, RESETB=Floating to LOW

7 s

Notes:

2. This parameter is guaranteed by design and characterization; not production tested.

3. tDON/tDOFF/tR/tF is defined in Figure 5.

4. tON=tR + tDON.

5. tOFF=tF + tDOFF.

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Timing Diagram

Figure 5. ON/OFF Behavior (VBATA=4.2V)

Figure 6. Battery-to-System Path Selection Behavior by BATSEL (VBATA=VBATB=4.2V)

Figure 7. Charging Path Selection Behavior by CHGSEL

(ADPIN=5V, CHGIN=4.2V, VBATA=VBATB=Floating with 1µF)

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Timing Diagrams (Continued)

Figure 8. Transition from VBATA to VBATB Behavior by LOBAT (VBATA=VBATB=4.2V)

Figure 9. System Reset Behavior by RESETB (VBATA=VBATB=4.2V)

FPF3003 • Rev. 1.0.0 9

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Typical Characteristics

Figure 10. ADPIN vs. Temperature Figure 11. Supply Current vs. Temperature

Figure 12. Supply Current vs. Supply Voltage Figure 13. RON (VBATA or VBATB to VOUT)

vs. Temperature

Figure 14. RON (VBATA or VBATB to VOUT)

vs. Supply Voltage

Figure 15. RON (CHGIN to VBATA) vs. Temperature

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Typical Characteristics

Figure 16. RON (CHGIN to VBATA) vs. Supply Voltage Figure 17. RON (CHGIN to VBATB) vs. Temperature

Figure 18. RON (CHGIN to VBATB) vs. Supply Voltage Figure 19. CHGSEL vs. Temperature

Figure 20. CHGSEL vs. ADPIN Voltage Figure 21. BATSEL vs. Temperature

FPF3003 • Rev. 1.0.0 11

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Typical Characteristics

Figure 22. BATSEL vs. Supply Voltage Figure 23. LOBAT vs. Temperature

Figure 24. STAT LOW vs. Temperature Figure 25. RCB (VBATA and VOUT) vs. Temperature

Figure 26. RCB (VBATB and VOUT) vs. Temperature Figure 27. Turn-On Response

(VBATA=4.2V, COUT=10µF, RL=100Ω)

FPF3003 • Rev. 1.0.0 12

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Typical Characteristics

Figure 28. Turn-Off Response

(VBATA=4.2V, COUT=10µF, RL=100Ω)

Figure 29. Battery Selection by BATSEL = HIGH 

LOW (VBATA=4V, VBATB=4.2V, COUT=100µF, RL=100Ω)

Figure 30. Battery Selection by BATSEL = LOW 

HIGH (VBATA=4V, VBATB=4.2V, COUT=10µF, RL=100Ω)

Figure 31. Charge Path Selection by CHGSEL = HIGH

 LOW (VCHGIN=4V, VBATA=VBATB=Floating with 1µF)

Figure 32. Charge Path Selection by CHGSEL = HIGH

 LOW (VCHGIN=4V, BATA=BATB=Floating with 1µF)

Figure 33. Battery Selection by LOBAT=HIGH 

LOW (VBATA=3.8V, VBATB=4.2V, COUT=100µF, RL=100Ω)

FPF3003 • Rev. 1.0.0 13

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Typical Characteristics

Figure 34. System Reset by RESETB: HIGH LOW (

BATA=

BATB=4.2V, COUT=100µF, RL=100Ω)

FPF3003 • Rev. 1.0.0 14

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Operation and Application Information

The FPF3003 is a low-RON, P-channel-based, input-

source-selection power management switch for dual-

battery systems. The FPF3003 input operating range is

from 2.3V to 5.5V on BATA and BATB, while ADPIN has

a range of 4.6V to 5.5V.

The FPF3003 controls the charging path from the

charger to the battery with up to 1.5A and the

discharging path from the battery to system load with up

to 2.5A. The system or PMIC selects one of two

batteries to provide power and enables one of the

batteries to be charged by the external battery charger.

The FPF3003 has 30µs slew-rate control to reduce

inrush current when engaged and thermal shutdown

protection for reliable system operation.

The internal circuit is powered from the highest voltage

source among BATA, BATB, and ADPIN.

Battery Presence Detection

The FPF3003 monitors whether or not a battery is

present via the BATAID and BATBID pins. If any of

these pins are LOW; FPF3003 recognizes the battery is

present. Each pin is connected with an internal LDO

output, so no pull-up resistor is required.

Output Capacitor

During battery source transition, voltage droop depends

on output capacitance and load current condition.

Advanced break-before-make operation minimizes the

droop with minimum capacitance. At least 10µF is a

good starting value in design.

Primary Battery Under-Voltage Set

FPF3003 monitors the primary battery of BATA for

under-voltage condition. Once under-voltage condition

is confirmed, the system power source changes from

BATA to valid BATB automatically.

The under-voltage threshold level can be programmed

with 0.8V of LOBAT and R divider (R1 and R2) as:

1

2 =_

0.8 −1 (1)

where BATA_LO = Low BATA threshold to set.

If 3.4V of BATA is desired, R1/R2=3.25. If R2 is chosen

1M, R1 is 3.25M. Higher R2 is recommended to

reduce leakage current from BATA.

Figure 35. BATA Under-Voltage Level Setting

LOBAT has a 1.3ms of deglitch time to ensure BATA is

in true under-voltage rather than transient battery

voltage drop during GSM transmission operation.

Battery Selection

The load path can be controlled by the BATSEL pin.

When BATSEL is LOW, the system is powered from

BATA. When BATSEL is HIGH, BATB powers the system.

Figure 36 is state diagram showing how the power path

from battery to system is determined.

Power On

from ADPIN, BATA, or BATB

RESETB = HIGH VOUT Floating

Either BATAID or

BATBID = HIGH

Both BATAID and

BATBID = LOW

LOBAT > 0.8V

BATSEL = LOW

Switch to BATA

Switch to BATB

Switch to the present battery

Figure 36. Power Path from Battery to System

The open-drain STAT pin is used to determine which

battery powers the system. STAT becomes LOW if

BATB is connected to the system. STAT is HIGH (HI-Z)

if BATA is connected.

FPF3003 • Rev. 1.0.0 15

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Battery Charging Path Selection

The charging path can be controlled by the CHGSEL

pin. When CHGSEL is LOW, BATA can be charged

from the charger. When CHGSEL is HIGH, BATB can

be charged from the charger.

Figure 37. Battery Charging Path

System RESET

The RESETB pin allows the system to be turned off

without detaching the battery pack. It has typical 7s

delay to avoid transient abnormal signal.

Board Layout

For best performance, all power traces (BATA, BATB,

CHGIN, ADPIN, and VOUT) should be as short as

possible to minimize the parasitic electrical effects and

the case-to-ambient thermal impedance. The output

capacitor should be placed close to the device to

minimize parasitic trace inductance.

FPF3003 • Rev. 1.0.0 16

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Packaging Information

Figure 38. 1.6mmx1.6mm WLCSP, 16-Bumps 0.4mm Pitch

Product-Specific Dimensions

Product D E X Y

FPF3003UCX 1560m ±30m 1560m ±30m 180m 180m

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the mo st recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the

warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.

BOTTOM VIEW

SIDE VIEWS

TOP VIEW

RECOMMENDED LAND PATTERN

BALL A1

INDEX AREA

1234

SEATING

PLANE

16X

0.005 CAB

(NSMD PAD TYPE)

Ø0.260±0.02

0.40

(X) ±0.018

(Y) ±0.018

0.625

0.547

0.06 C

0.05 CE

0.378±0.018

0.208±0.021

NOTES:

A. NO JEDEC REGISTRATION APPLIES.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCE

PER ASME Y14.5M, 1994.

D. DATUM C IS DEFINED BY THE SPHERICAL

CROWNS OF THE BALLS.

E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS

±39 MICRONS (547-625 MICRONS).

F. FOR DIMENSIONS D, E, X, AND Y SEE

PRODUCT DATASHEET.

G. DRAWING FILNAME: MKT-UC016AArev2.

0.03 C

0.40

(Ø0.20)

Cu Pad

(Ø0.30) Solder

Mask Opening

FPF3003 • Rev. 1.0.0 17

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ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,

regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer

application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not

designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification

in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized

application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and

expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such

claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This

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