LINEAR INTEGRATED CIRCUIT CHIPS GENERAL DESCRIPTION Motorola now offers a very broad selection of linear integrated circuit chips. Among the types of circuits which compose the linear family there are: . Operational Amplifiers Voltage Regulators Comparators . Drivers and Receivers . Sense Amplifiers . D/A and A/D Converters As a general rule of thumb, all linear chips from Motorola are 100% unit probed to the D.C. parameters given in Volume 6 of the Semiconductor Data Library. Far specific information on electrical parameters which are probed contact the nearest Motorola Sales Office. mmooOmp STANDARD FEATURES FOR LINEAR INTEGRATED CIRCUIT CHIPS All linear integrated circuit chips... are 100% electrically tested to sufficient param- eter limits (min/max) to permit distinct identi- fication as either premium or industrial versions @ employ phosphorsilicate passivation which pro- tects the entire active surface area including metallization interconnects during shipping and handling : @ are 100% visually inspected to a modified cri- teria per MIL-STD-883, Method 2010, Condi- tion B @ incorporate a minimum of 4000 A gold backing to ensure positive adherence bonding GENERAL PHYSICAL CHARACTERISTICS OF LINEAR CHIPS The following characteristics represent the vast majority of all Motorola linear chips. Since an indi- vidual chip type may vary slightly, contact your local sales office for information regarding physical charac- teristics critical to a specific application. The overall size and final metallization patterns are shown in the following pages; however the geometries shown and MIC numbers listed are current at the date of print- ing. Since we are constantly striving to improve the quality, performance, and yield of our linear devices we cannot be responsible for changes at future dates. Please contact your local Motorola Sales representative for the most current information. A. Chips thickness: 8 + 1 mil B. Passivation: Phosphorsilicate C. Passivation thickness: 5kA + 1k D. Metallization: Aluminum E. Metallization thickness: 12kA + 2kA F. Back metallization: Gold, alloyed G. Bonding pad dimensions: Typical 4.0 mil x 5.0 mil H. Overall chip dimensions: See pages that follow for individual device type. Tolerance of +5 mils should be allowed. HANDLING PRECAUTIONS Although passivation on all chips provides protec- tion in shipping and handling, care should be exercised to prevent damaging the face of the chip. A vacuum pickup is most useful for this purpose; tweezers are not recommended. There are four basic requirements for handling devices in a prudent manner: 1. Store the chips in a covered or sealed container 2. Store devices in an environment of no more than 30% relative humidity 3. Process the chips in a non-inert atmosphere not exceeding 100C, or in an inert atmosphere not exceeding 400C. 4. Processing equipment should conform to the minimum standards that are normally em- ployed by semiconductor manufacturers. Motorolas engineering staff is available for consul- tation in the event of correlation or processing prob- lems encountered in the use of Motorola linear chips. For assistance, please contact your nearest Motorola sales representative. CHIP AND WAFER PACKAGING Chips Motorolas linear integrated circuit chips come Packaged to the customer in the Multi-Pak carrier. Refer to page 1-11, Figure 7. Wafers Motorolas linear integrated circuit wafers come packaged to the customer in the Wafer-Pak plastic bow. The wafer has been probed and rejects are designated by a red color dot on the die surface. Refer to page 1-8, Figure 2. HOW TO ORDER LINEAR CHIPS OR WAFERS FROM MOTOROLA 1. Remove all suffix package designators from the desired device type. (EXAMPLE: MC1741CP1 now becomes MC1741C) 2. Add a C to the prefix designator if individual chips are desired. (EXAMPLE: MC1741C now is McC1741C) Add a W to the prefix designator if a wafer is de- sired. (EXAMPLE: MC1741C now is MCW1741C) 3. When ordering chips, two options are available: a. The ~1 suffix designator will deliver to you 10 chips per Multi-Pak, up to 1000 chips. (EXAMPLE: MCC1741C-1} 5-2 mA LETTEPETTTET MTTL SSI LATTE HAITI MCC5400 Series (55 to +125C) MCC7400 Series (0 to +75C) MC5400/MC7400 Series SSI circuits comprise a family of transistor-transistor logic designed for general purpose digital applications. The family has a medium operating speed (15-30 MHz clock rate), good external noise immunity, high fan out, and the capability of driving capacitive loads of up to 600 pF. Type Wafer | Chip Mask Size 0 to 75C 55 to +125C Function Set # | (Mils) MCC7400 Mcc5400 Quad 2-Input NAND Gate 16K 43x46 MCC7400F MCC5400F Quad 2-Input NAND Gate 81L 43x50 MCC7401 McCc5401 Quad 2-Input NAND Gate (0.C.) 22K 40x44. MCC7402 MCC5402 Quad 2-Input NOR Gate 53T 43x49 MCC7403 MCC5403 Quad 2-Input NAND Gate (0.C.) 16K 43x46 MCC7404 MCC5404 Hex Inverter 1CR 48x51 MCC7405 MCC5405 Hex Inverter (O.C.) 1CR 48x51 MCC7406 MCC5406 Hex Inverter Buffer/Driver (O.C.) 2AW 47x51 MCC7407 McCC5407 Hex Buffer/Driver (O.C.) 2AW 47x51 MCC7408 MCC5408 Quad 2-Input AND Gate 23T 51x46 McCC7409 MCC5409 Quad 2-Input AND Gate (0.C.) 23T 51x46 MCC7410 MCC5410 Triple 3-Input NAND Gate 11N 46x41 MCC7410F MCC5410F Triple 3-Input NAND Gate 61N 43x44. McCC7411 MCC5411 Triple 3-Input AND Gate 85W 43x46 MCC7412 MCC5412 Triple 3-Input NAND Gate (0.C.) 11N 46x41 MCC7416 MCC5416 Hex Inverter Buffer/Driver (O.C.) 2AW 47x51 MCC7417 MCC5417 Hex Buffer/Driver 2AW 47x51 MCC7420 MCC5420 Dual 4-Input NAND Gate 51N 34x42 MCC7420F MCC5420F Dual 4-Input NAND Gate 90L 39x40 MCC7423 MCC5423 Dual 4-Input NOR Gate w/Strobe (Exp.) 5AG 41x49 MCC7425 MCC5425 Dual 4-Input NOR Gate w/Strobe 5AG 41x49: MCC7426 MCC5426 Quad 2-Input Interface NAND Gate 16K 43x46 MCC7427 MCC5427 Triple 3-Input NOR Gate 75W 46x44 MCC7430 MCC5430 8 Input NAND Gate 98L 34x35 MCC7437 MCC5437 Quad 2-Input Positive NAND Buffer 1AF 52x44 MCC7438 MCC5438 Quad 2-Input Positive NANO Buffer (O.C.) IAF 52x44 MCC7440 MCC5440 Dual 4-Input NAND Buffer 10N 41x44 MCC7440F MCC5440F Dual 4-Input NAND Buffer 12M 43x44 McCC7450 MCC5450 Exp. Dual 2 Wide 2-Input AOI Gate O3R 41x42 MCC7451 MCC5451 Dual 2 Wide 2-Input AOI Gate O3R 41x42 MCC7453 MCC5453 Exp. 4 Wide 2-Input AOI Gate 11P 38x40 MCC7454 MCC5454 4 Wide 2-Input AOI Gate 11P 38x40 MCC7460 MCC5460 Dual 4-Input Exp. for AOI Gates 90B 36x49 MCC7470 MCC5470 AND Gated J-K FF Positive Edge Triggered 12N 56x60 MCC7472 MCC5472 AND Gated J-K Master Slave FF 56C 51x60 MCC7473 MCC5473 Dual J-K Flip-Flop 91M 66x66 MCC7474 MCC5474 Dual Positive Edge Triggered FF 80V 65x62 MCC7476 MCC5476 Dual J-K Flip-Flop 86N 71x65 MCC7479 MCC5479 Dual D Positive Edge Triggered FF 80V 65x62 MCC74107 MCC54107 Dual J-K Master Slave Flip-Flop 45P 69x63 7-125 MTTL SSI MCC5400/7400 Series (continued) 43 x 49 5 4 MCC7402/MCC5402 (53T) Quad 2-Input NOR Gate PIN CONNECTIONS ) > 1 5 3 ] > 3 6 > 9 9 10 11 12 Voc = Pin 14 11 1=2+3 tpa=10nstyp Gnd = Pin 7 12 13 43 x 46 MCC7403/MCC5403 (16K) Quad 2-Input NAND Gate PIN CONNECTIONS 1 3 2 = 6 5 Don 8 10 Vec = Pin 14 12 4 10 1 42 Gnd = Pin 7 13 a 3-72 tog = 35 nstyp 48x51 MCC7404/MCC5404 (icR) Hex Inverter PIN CONNECTIONS Vec = Pin 14 Gnd =Pin 7 pd = 13 nstyo ~ No w vYYYYY + wo oO = = = a = Nh MCC7405/MCC5405 Hex Inverter (Open Collector) Vec = Pin 14 Gnd = Pin? tpg * 35 ns typ PIN CONNECTIONS a Ny uo a wo a YYYY = Q = Nn 7-127