PC900V0NSZXF
Series
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC900V)
2. Approved by VDE, DIN EN60747-5-2(∗) (as an
option), file No. 40008189 (as model No. PC900V)
3. Package resin : UL flammability grade (94V-0)
(∗)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Features
■ Agency approvals/Compliance
1. Programmable controllers
2. PC peripherals
3. Electronic musical instruments
■ Applications
Digital Output, Normal OFF
Operation DIP 6 pin ∗OPIC
Photocoupler
1. 6 pin DIP package
2. Double transfer mold package
(Ideal for Flow Soldering)
3. Normal OFF operation, open collector output
4. TTL and LSTTL compatible output
5. Operating supply voltage (VCC : 3 to 15 V)
6. Isolation voltage (Viso(rms) : 5.0 kV)
7. Lead-free and RoHS directive compliant
■ Description
PC900V0NSZXF Series contains an IRED optically
coupled to an OPIC chip.
It is packaged in a 6 pin DIP, available in SMT
gullwing lead-form and Wide SMT gullwing lead-form
option.
Input-output isolation voltage(rms) is 5.0kV.
1Sheet No.: D2-A05302EN
Date Jun. 30. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC900V0NSZXF Series
∗
"OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
■ Internal Connection Diagram
1
2
3
4
5
6
Anode
Cathode
NC
VCC
VO
GND
6 5 4
1 2 3
Voltage
regulator Amp
2
Sheet No.: D2-A05302EN
■ Outline Dimensions (Unit : mm)
1. Through-Hole [ex. PC900V0NSZXF] 2.
Through-Hole (VDE option) [ex. PC900V0YSZXF]
7.12±0.5
θ
θ
θ : 0 to 13˚
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2
1.2±0.3
1 2 3
6 5 4
0.5TYP.
2.9±0.5
0.5±0.1
2.54±0.25
3.25±0.5
3.5±0.5
PC900V
SHARP
mark
"S"
Date code
Anode
mark
7.12±0.5
θ
θ
θ : 0 to 13˚
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2
1.2±0.3
1 2 3
6 5 4
0.5TYP.
2.9±0.5
0.5±0.1
2.54±0.25
3.25±0.5
3.5±0.5
VDE Identification mark
PC900V
Anode
mark Date code
SHARP
mark
"S"
4
3. SMT Gullwing Lead-Form [ex. PC900V0NIPXF] 4.
SMT Gullwing Lead-Form (VDE option) [ex. PC900V0YIPXF]
PC900V0NSZXF Series
7.12±0.5
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2 1.2±0.3
2.54±0.25
3.5±0.5
0.35±0.25
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
0.26±0.1
1 2 3
6 5 4
PC900V
SHARP
mark
"S"
Date code
Anode
mark
7.12±0.5
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2 1.2±0.3
2.54±0.25
3.5±0.5
0.35±0.25
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
0.26±0.1
1 2 3
6 5 4
PC900V
Anode
mark Date code
SHARP
mark
"S"
VDE Identification mark
4
Product mass : approx. 0.35gProduct mass : approx. 0.35g
Product mass : approx. 0.36gProduct mass : approx. 0.36g
3
Sheet No.: D2-A05302EN
(Unit : mm)
5. Wide SMT Gullwing Lead-Form
[ex. PC900V0NUPXF]
6. Wide SMT Gullwing Lead-Form (VDE option)
[ex. PC900V0YUPXF]
PC900V0NSZXF Series
7.12±0.5
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2 1.2±0.3
2.54±0.25
0.75±0.25 0.75±0.25
10.16±0.5
3.5±0.5
0.25±0.25
0.26±0.1
12.0MAX.
PC900V
SHARP
mark
"S"
Date code
Anode
mark
PC900V
7.12±0.5 7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2 1.2±0.3
2.54±0.25
0.75±0.25 0.75±0.25
10.16±0.5
3.5±0.5
0.25±0.25
0.26±0.1
Anode
mark Date code
SHARP
mark
"S"
12.0MAX.
4
VDE Identification mark
Product mass : approx. 0.35gProduct mass : approx. 0.35g
Plating material : SnCu (Cu : TYP. 2%)
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
1st digit
Year of production
4
repeats in a 20 year cycle
Sheet No.: D2-A05302EN
PC900V0NSZXF Series
Country of origin
Japan
Rank mark
There is no rank mark indicator.
Sheet No.: D2-A05302EN
■ Electro-optical Characteristics
Parameter Conditions
Forward voltage
Reverse current
Terminal capacitance
Low level output voltage
Transfer characteristics
Response time
High level supply current
"High→Low" input
threshold current
"Low→High" input
threshold current
Isolation voltage
Hysteresis
*4
*5
*6
"Low→High" propagation delay time
"High→Low" propagation delay time
Rise time
Fall time
MIN.
0.7
3
−
−
−
−
−
−
5×1010
−
0.4
0.3
−
−
−
−
TYP.
1.0
1.1
−
−
30
0.2
1.0
−
−
0.7
0.8
1.1
1×1011
0.05
0.1
1
2
MAX.
1.4
10
250
15
0.4
5.0
2.0
4.0
−
−
0.9
3
6
0.5
0.5
−
Unit
V
µA
pF
V
V
mA
mA
mA
−
Ω
µs
Symbol
VF
IR
Ct
VCC
ICCL
ICCH
IFHL
tf
IFLH
IFLH/IFHL
RISO
tPHL
tPLH
tr
IF=0.3mA
IF=4mA
Ta=25˚C, VR=3V
Ta=25˚C, V=0, f=1kHz
Ta=25˚C, VCC=5V, RL=280Ω
Operating Supply voltage −
IOL=16mA, VCC=5V, IF=4mA
VCC=5V, IF=0
Ta=25˚C, VCC=5V, IF=4mA
RL=280Ω
VCC=5V, RL=280Ω
Ta=25˚C, VCC=5V, RL=280Ω
Ta=25˚C, DC500V, 40 to 60%RH
VCC=5V, RL=280Ω
VCC=5V, RL=280Ω
(Unless otherwise specified Ta=0 to +70˚C)
*4 IFHL represents forward current when output goes from high to low.
*5 IFLH represents forward current when output goes from low to high.
*6 Hysteresis stands for IFLH/IFHL.
High level output current −
0.5
−100
−
µA
VOL
VO=VCC=15V, IF=0
Low level supply current −2.5 5.0 mA
IOH
VCC=5V, IF=4mA
InputOutput
■ Absolute Maximum Ratings (Ta=25˚C)
Parameter Symbol Unit
Forward current mA
*1
Peak forward current
A
Power dissipation
mW
Supply voltage V
High level output voltage
V
Low level output current
mA
mW
mW
Total power dissipation
Operating temperature
Storage temperature
˚C
Isolation voltage
˚C
*2
*3 Soldering temperature
IF
IFM
P
VCC
VOH
IOL
PO
Ptot
Viso (rms)
Topr
Tstg
Tsol ˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1minute, f=60Hz
*3 For 10s
Rating
50
1
Reverse voltage
Power dissipation
VVR6
70
16
16
50
150
170
−25 to +85
−40 to +125
260
5.0 kV
Input
Output
5
PC900V0NSZXF Series
Sheet No.: D2-A05302EN
■ Model Line-up
PC900V0NSZXF PC900V0YSZXF
−−−−−− Approved
PC900V0NUPXF PC900V0YUPXF
Lead Form
Package
Model No.
DIN
EN60747-5-2
Sleeve
Through-Hole
50pcs/sleeve
Taping
50pcs/sleeve
SMT Gullwing Wide SMT Gullwing
−−−−−− Approved
PC900V0NIZXF PC900V0NIPXF
−−−−−−
PC900V0YIZXF
Approved −−−−−−
PC900V0YIPXF
Approved
6
Please contact a local SHARP sales representative to inquire about production status.
PC900V0NSZXF Series
Sheet No.: D2-A05302EN
7
PC900V0NSZXF Series
Fig.1 Test Circuit for Response Time
5V
1.5V
Amp
tr=tf=0.01µs
ZO=50ΩVIN
47Ω0.1µF
VO
280Ω
VIN
tPHL tPLH
VOH
90%
10%
tr
VOL
50%
VO
Voltage
regulator
tf
10
20
60
50
40
30
0
0−25 25 50 75 10085
Ambient temperature Ta (˚C)
Forward current IF (mA)
50˚C
25˚C
0˚C
0
1
10
100
0.5 1.0 1.5 2.0 2.5 3.0
−25˚C
Forward voltage VF (V)
Forward current I
F
(mA)
Ta=75˚C
0
−25
100
025507585 100
50
150
200
170
Ambient temperature Ta (˚C)
Power dissipation PO, Ptot (mW)
Ptot
PO
Fig.3 Power Dissipation vs. Ambient
Temperature
Fig.5 Relative Input Threshold Current vs.
Supply Voltage
Fig.4 Forward Current vs. Forward Voltage
Fig.2 Forward Current vs. Ambient
Temperature
0.2
0.4
0.6
1.4
51001520
1.2
1.0
0.8
Supply voltage VCC (V)
Relative input threshold current IFHL, IFLH
Ta=25˚C
IFHL=1 at VCC=5V
IFHL
IFLH
Sheet No.: D2-A05302EN
8
PC900V0NSZXF Series
Fig.7 Low Level Output Voltage vs. Low
Level Output Current
Fig.6 Relative Input Threshold Current vs.
Ambient Temperature
Fig.9 Supply Current vs. Supply Voltage
Fig.11
Rise Time, Fall Time vs. Load
Resistance
Fig.10
Propagation Delay Time vs. Forward
Current
Fig.8 Low Level Output Voltage vs. Ambient
Temperature
0
1
2
9
517113
5
4
3
6
7
8
11 15793
25˚C
85˚C
25˚C
85˚C
Supply voltage VCC (V)
Supply current ICC (mA)
Ta= −25˚C
Ta= −25˚C
ICCL{
ICCH{
0.2
0.4
Relative input threshold current IFHL, IFLH
0.6
0.8
1.6
0255075−25 100
1.4
1.2
1
Ambient temperature Ta (˚C)
IFHL=1 at Ta=25˚C
IFLH
IFHL
VCC=5V
0.01
1
0.1
1
10 100
Low level output current IOL (mA)
Low level output voltage VOL (V)
VCC=5V
Ta=25˚C
0.2
0.3
0.5
0−25 25 50 100
0.1
0
0.4
75
16mA
5mA
Low level output voltage VOL (V)
Ambient temperature Ta (˚C)
VCC=5V IOL=30mA
0
0.1
0.1
0.2
0.3
0.4
0.5
110
Load resistance RL (kΩ)
tf
tr
Rise time, fall time tr, tf (µs)
VCC=5V
IF=4mA
Ta=25˚C
0
1
2
3
4
5
10 20 30 40 60050
Forward current IF (mA)
Propagation delay time tPHL, tPLH (µs)
VCC=5V
RL=280Ω
Ta=25˚C
tPLH
tPHL
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A05302EN
9
PC900V0NSZXF Series
■ Design Considerations
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute
design.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
● Notes about static electricity
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01µF or more between VCC and GND near the device.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Design guide
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
Please decide the input current which become 2 times of MAX. IFHL.
Sheet No.: D2-A05302EN
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
10
PC900V0NSZXF Series
● Recommended Foot Print (reference)
2.542.54
1.7
2.2
8.5
2.542.54
1.7
2.2
10.5
SMT Gullwing Lead-form Wide SMT Gullwing Lead-form
(Unit : mm)
Sheet No.: D2-A05302EN
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
11
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC900V0NSZXF Series
Sheet No.: D2-A05302EN
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
● Presence of ODC
12
PC900V0NSZXF Series
Sheet No.: D2-A05302EN
13
12.0
6.7
5.8
10.8
520
±2
(Unit : mm)
PC900V0NSZXF Series
■ Package specification
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
Sheet No.: D2-A05302EN
14
● Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
EI
DJ
B
H
H
A
C
G
5˚
MAX.
Dimensions List (Unit:mm)
A
16.0±0.3
B
7.5±0.1
C
1.75±0.1
D
12.0±0.1
E
2.0±0.1
H
10.4±0.1
I
0.4±0.05
J
4.2±0.1
K
7.8±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
17.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 1 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC900V0NSZXF Series
Sheet No.: D2-A05302EN
15
PC900V0NSZXF Series
2. Wide SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
Dimensions List
A
24.0±0.3
B
11.5±0.1
C
1.75±0.1
D
12.0±0.1
E
2.0±0.1
H
12.2±0.1
I
0.4±0.05
J
4.1±0.1
K
7.6±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
(Unit : mm)
J
GI
EC
B
A
H
H
5˚MAX.
F D
K
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
25.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 1 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
16
Sheet No.: D2-A05302EN
■ Important Notices
PC900V0NSZXF Series
[E225]
