DS26LV31T www.ti.com SNLS114C - MARCH 1999 - REVISED FEBRUARY 2013 DS26LV31T 3V Enhanced CMOS Quad Differential Line Driver Check for Samples: DS26LV31T FEATURES * 1 * 2 * * * * * * * * * * Industrial Product Meets TIA/EIA-422-B (RS422) and ITU-T V.11 Recommendation Military Product Conforms to TIA/EIA-422-B (RS-422) Interoperable with Existing 5V RS-422 Networks Industrial and Military temperature Range Guaranteed VOD of 2V min Over Operating Conditions Balanced Output Crossover for Low EMI (Typical Within 40 mV of 50% Voltage Level) Low Power Design (330 W @ 3.3V static) ESD 7 kV on Cable I/O Pins (HBM) Guaranteed AC Parameter: - Maximum Driver Skew: 2 ns - Maximum Transition Time: 10 ns Pin Compatible with DS26C31 Available in SOIC and CLGA Packaging Standard Microcircuit Drawing (SMD) 596298584 DESCRIPTION The DS26LV31T is a high-speed quad differential CMOS driver that meets the requirements of both TIA/EIA-422-B and ITU-T V.11. The CMOS DS26LV31T features low static ICC of 100 A MAX which makes it ideal for battery powered and power conscious applications. Differential outputs have the same VOD guarantee (2V) as the 5V version. The EN and EN* inputs allow active Low or active High control of the TRI-STATE outputs. The enables are common to all four drivers. Protection diodes protect all the driver inputs against electrostatic discharge. Outputs have enhanced ESD protection providing greater than 7 kV tolerance. The driver and enable inputs (DI, EN, EN*) are compatible with low voltage LVTTL and LVCMOS devices. Connection Diagram Figure 1. Dual-In-Line Package Top View See Package D (R-PDSO-G16) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1999-2013, Texas Instruments Incorporated DS26LV31T SNLS114C - MARCH 1999 - REVISED FEBRUARY 2013 www.ti.com Truth Table (1) Enables Input EN* DI DO+ L H X Z Z L L H H H L All other combinations of enable inputs (1) Outputs EN DO- L = Low logic state X = Irrelevant H = High logic state Z = TRI-STATE These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) -0.5V to +7V Supply Voltage (VCC) Enable Input Voltage (EN, EN*) -0.5V to VCC + 0.5V Driver Input Voltage (DI) -0.5V to VCC + 0.5V Clamp Diode Current 20 mA DC Output Current, per pin 150 mA Driver Output Voltage -0.5V to +7V (Power Off: DO+, DO-) Maximum Package Power Dissipation @+25C D0016A Package 1226 mW NAD0016A Package 1119 mW Derate D0016A Package 9.8 mW/C above +25C Derate NAD0016A Package 7.5 mW/C above +25C -65C to +150C Storage Temperature Range Lead Temperature Range Soldering (4 sec.) +260C ESD Ratings (HBM, 1.5 k, 100 pF) 7 kV Driver Outputs 2.5 kV Other Pins (1) (2) "Absolute Maximum Ratings" are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices should be operated at these limits. The Electrical Characteristics specifies conditions of device operation. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. Recommended Operating Conditions Min Typ Max Units 3.0 3.3 3.6 V DS26LV31T -40 +25 +85 C DS26LV31W -55 +25 +125 C 500 ns Supply Voltage (VCC) Operating Free Air Temperature Range (TA) Input Rise and Fall Time 2 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: DS26LV31T DS26LV31T www.ti.com SNLS114C - MARCH 1999 - REVISED FEBRUARY 2013 Electrical Characteristics (1) (2) Over supply voltage and operating temperature ranges, unless otherwise specified Parameter Test Conditions VOD1 Output Differential Voltage RL = (No Load) VOD2 Output Differential Voltage RL = 100 (Figure 2) VOD2 Change in Magnitude of Output Differential Voltage IO 20 mA VOD3 Output Differential Voltage VOC Common Mode Voltage VOC Change in Magnitude of Common Mode Voltage IOZ TRI-STATE Leakage Current VOUT = VCC or GND Drivers Disabled ISC Output Short Circuit Current VOUT = 0V VIN = VCC or GND (4) IOFF Output Leakage Current Pin DO+, DO- Min Typ Max Units 3.3 4 V 2 2.6 -400 7 400 mV RL = 3900 (V.11) Figure 2 and (3) 3.2 3.6 V RL = 100 (Figure 2) 1.5 2 V 6 400 mV 0.5 20 A -70 -150 mA -160 mA -400 TA = -40C to +85C -40 TA = -55C to +125C (5) -30 V VCC = 0V, VOUT = 3V or 6V 0.03 100 A VCC = 0V, VOUT = -0.25V -0.08 -100 A -200 A V TA = -40C to +85C TA = -55C to +125C VIH High Level Input Voltage DI, 2.0 VCC VIL Low Level Input Voltage EN, GND 0.8 V IIH High Level Input Current VIN = VCC 10 A IIL Low Level Input Current VIN = GND VCL Input Clamp Voltage IIN = -18 mA ICC Power Supply Current No Load, VIN (all) = VCC or GND (1) (2) (3) (4) (5) EN* -10 TA = -40C to +85C A VCC TA = -55C to +125C -1.5 V 100 A 125 A Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except differential voltages VOD1, VOD2, VOD3. All typicals are given for VCC = +3.3V, TA = +25C. This specification limit is for compliance with TIA/EIA-422-B and ITU-T V.11. Only one output shorted at a time. The output (true or complement) is configured High. This parameter does not meet the TIA/EIA-422-B specification. Switching Characteristics - Industrial (1) (2) Over supply voltage and -40C to +85C operating temperature range, unless otherwise specified Parameter tPHLD Differential Propagation Delay High to Low Test Conditions RL = 100, CL = 50 pF (Figure 3 and Figure 4) Min Typ Max Units 6 10.5 16 ns 6 tPLHD Differential Propagation Delay Low to High 11 16 ns tSKD Differential Skew (same channel) |tPHLD - tPLHD| 0.5 2.0 ns tSK1 Skew, Pin to Pin (same device) 1.0 2.0 ns tSK2 Skew, Part to Part 3.0 5.0 ns tTLH Differential Transition Time Low to High (20% to 80%) 4.2 10 ns tTHL Differential Transition Time High to Low (80% to 20%) 4.7 10 ns tPHZ Disable Time High to Z 12 20 ns tPLZ Disable Time Low to Z 9 20 ns (1) (2) (3) (3) (Figure 5 Figure 6) f = 1 MHz, tr and tf 6 ns, 10% to 90%. See TIA/EIA-422-B specifications for exact test conditions. Devices are at the same VCC and within 5C within the operating temperature range Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: DS26LV31T 3 DS26LV31T SNLS114C - MARCH 1999 - REVISED FEBRUARY 2013 www.ti.com Switching Characteristics - Industrial (1) (2) (continued) Over supply voltage and -40C to +85C operating temperature range, unless otherwise specified Parameter Test Conditions Min Typ Max Units tPZH Enable Time Z to High 22 32 ns tPZL Enable Time Z to Low 22 32 ns fmax Maximum Operating Frequency (4) (4) 32 MHz All channels switching, output duty cycle criteria is 40%/60% measured at 50%. This parameter is guaranteed by design and characterization. Switching Characteristics - Military (1) (2) Over supply voltage and -55C to +125C operating temperature range, unless otherwise specified Parameter tPHLD Differential Propagation Delay High to Low Test Conditions RL = 100, CL = 50 pF (Figure 3 Figure 4) Min Max Units 5 25 ns 5 25 ns tPLHD Differential Propagation Delay Low to High tSKD Differential Skew (same channel) |tPHLD - tPLHD| 5.0 ns tSK1 Skew, Pin to Pin (same device) 5.0 ns tPHZ Disable Time High to Z 35 ns tPLZ Disable Time Low to Z 35 ns tPZH Enable Time Z to High 40 ns tPZL Enable Time Z to Low 40 ns (1) (2) 4 (Figure 5 Figure 6) f = 1 MHz, tr and tf 6 ns, 10% to 90%. See TIA/EIA-422-B specifications for exact test conditions. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: DS26LV31T DS26LV31T www.ti.com SNLS114C - MARCH 1999 - REVISED FEBRUARY 2013 PARAMETER MEASUREMENT INFORMATION Figure 2. Differential Driver DC Test Circuit Figure 3. Differential Driver Propagation Delay and Transition Time Test Circuit A. Generator waveform for all tests unless otherwise specified: f = 1 MHz, Duty Cycle = 50% Zo = 50, tr 10 ns, tf 10. B. CL includes probe and fixture capacitance. Figure 4. Differential Driver Propagation Delay and Transition Time Waveforms Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: DS26LV31T 5 DS26LV31T SNLS114C - MARCH 1999 - REVISED FEBRUARY 2013 www.ti.com If EN is the input, then EN* = High If EN* is the input, then EN = Low Figure 5. Driver Single-Ended TRI-STATE Test Circuit Figure 6. Driver Single-Ended TRI-STATE Waveforms 6 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: DS26LV31T DS26LV31T www.ti.com SNLS114C - MARCH 1999 - REVISED FEBRUARY 2013 Typical Application Information General application guidelines and hints for differential drivers and receivers may be found in the following application notes: * AN-214 * AN-457 * AN-805 * AN-847 * AN-903 * AN-912 * AN-916 Power Decoupling Recommendations: Bypass caps must be used on power pins. High frequency ceramic (surface mount is recommended) 0.1 F in parallel with 0.01 F at the power supply pin. A 10 F or greater solid tantalum or electrolytic should be connected at the power entry point on the printed circuit board. RT is optional although highly recommended to reduce reflection. Figure 7. Typical Driver Connection Figure 8. Typical Driver Output Waveforms Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: DS26LV31T 7 DS26LV31T SNLS114C - MARCH 1999 - REVISED FEBRUARY 2013 www.ti.com REVISION HISTORY Changes from Revision B (February 2013) to Revision C * 8 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 7 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: DS26LV31T PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) DS26LV31TM/NOPB ACTIVE SOIC D 16 48 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS26LV31 TM DS26LV31TMX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS26LV31 TM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. 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Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2018 TAPE AND REEL INFORMATION *All dimensions are nominal Device DS26LV31TMX/NOPB Package Package Pins Type Drawing SOIC D 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 10.3 2.3 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2018 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS26LV31TMX/NOPB SOIC D 16 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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