ICX415AL Diagonal 8mm (Type 1/2) Progressive Scan CCD Solid-state Image Sensor with Square Pixel for CCIR B/W Cameras Description The ICX415AL is a diagonal 8mm (Type 1/2) interline CCD solid-state image sensor with a square pixel array suitable for CCIR black-and-white cameras. Progressive scan allows all pixel's signals to be output independently within approximately 1/50 second. This chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still images without a mechanical shutter. Square pixel makes this device suitable for image input and processing applications. High sensitivity and low dark current are achieved through the adoption of the HAD (Hole-Accumulation Diode) sensors. This chip is suitable for applications such as FA and surveillance cameras. Features * Progressive scan allows individual readout of the image signals from all pixels. * High vertical resolution (580 TV-lines) still images without a mechanical shutter * Square pixel * Horizontal drive frequency: 29.5MHz (Max.) * No voltage adjustments (reset gate and substrate bias are not adjusted.) * High resolution, high sensitivity, low dark current * Continuous variable-speed shutter * Low smear * Excellent anti-blooming characteristics 22 pin DIP (Cer-DIP) Pin 1 2 V 8 3 Pin 12 H 38 Optical black position (Top View) Device Structure * Interline CCD image sensor * Image size: Diagonal 8mm (Type 1/2) * Number of effective pixels: 782 (H) x 582 (V) approx. 460K pixels * Total number of pixels: 823 (H) x 592 (V) approx. 490K pixels * Chip size: 7.48mm (H) x 6.15mm (V) * Unit cell size: 8.3m (H) x 8.3m (V) * Optical black: Horizontal (H) direction: Front 3 pixels, rear 38 pixels Vertical (V) direction: Front 8 pixels, rear 2 pixels * Number of dummy bits: Horizontal 19 Vertical 5 * Substrate material: Silicon Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E02116C3Z ICX415AL USE RESTRICTION NOTICE (December 1, 2003 ver.) This USE RESTRICTION NOTICE ("Notice") is for customers who are considering or currently using the CCD products ("Products") set forth in this specifications book. Sony Corporation ("Sony") may, at any time, modify this Notice which will be available to you in the latest specifications book for the Products. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has its own use restriction notice on the Products, such a use restriction notice will additionally apply between you and the subsidiary or distributor. You should consult a sales representative of the subsidiary or distributor of Sony on such a use restriction notice when you consider using the Products. Use Restrictions * The Products are intended for incorporation into such general electronic equipment as office products, communication products, measurement products, and home electronics products in accordance with the terms and conditions set forth in this specifications book and otherwise notified by Sony from time to time. * You should not use the Products for critical applications which may pose a life- or injury- threatening risk or are highly likely to cause significant property damage in the event of failure of the Products. You should consult your Sony sales representative beforehand when you consider using the Products for such critical applications. In addition, you should not use the Products in weapon or military equipment. * Sony disclaims and does not assume any liability and damages arising out of misuse, improper use, modification, use of the Products for the above-mentioned critical applications, weapon and military equipment, or any deviation from the requirements set forth in this specifications book. Design for Safety * Sony is making continuous efforts to further improve the quality and reliability of the Products; however, failure of a certain percentage of the Products is inevitable. Therefore, you should take sufficient care to ensure the safe design of your products such as component redundancy, anti-conflagration features, and features to prevent mis-operation in order to avoid accidents resulting in injury or death, fire or other social damage as a result of such failure. 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You should review those terms and conditions when you consider purchasing and/or using the Products. -2- ICX415AL CGG VOUT NC GND NC V1 V2 V3 NC NC 11 10 9 8 7 6 5 4 3 2 1 Vertical register NC Block Diagram and Pin Configuration (Top View) Note) Horizontal register 20 21 22 NC 19 SUBCIR 18 CSUB 17 NC VL 16 NC RG 15 H2 14 H1 13 SUB 12 VDD Note) : Photo sensor Pin Description Pin No. Symbol Description Pin No. Symbol Description 1 NC 12 VDD Supply voltage 2 NC 13 RG Reset gate clock 3 V3 Vertical register transfer clock 14 VL Protective transistor bias 4 V2 Vertical register transfer clock 15 SUB Substrate clock 5 V1 Vertical register transfer clock 16 H1 Horizontal register transfer clock 6 NC 17 H2 Horizontal register transfer clock 7 GND 18 NC 8 NC 19 NC 9 VOUT Signal output 20 CSUB Substrate bias2 10 CGG Output amplifier gate1 21 SUBCIR Supply voltage for the substrate voltage generation 11 NC 22 NC GND 1 DC bias is applied within the CCD, so that this pin should be grounded externally through a capacitance of 1F or more. 2 DC bias is applied within the CCD, so that this pin should be grounded externally through a capacitance of 0.1F or more. -3- ICX415AL Absolute Maximum Ratings Item Ratings Unit -0.3 to +55 V VDD, VOUT, CGG, SUBCIR - GND -0.3 to +18 V VDD, VOUT, CGG, SUBCIR - SUB -55 to +10 V V1, V2, V3 - GND -15 to +20 V to +10 V Voltage difference between vertical clock input pins to +15 V Voltage difference between horizongal clock input pins to +17 V H1, H2 - V3 -16 to +16 V H1, H2 - GND -10 to +15 V H1, H2 - SUB -55 to +10 V VL - SUB -65 to +0.3 V V2, V3 - VL -0.3 to +27.5 V RG - GND -0.3 to +22.5 V V1, H1, H2, GND - VL -0.3 to +17.5 V Storage temperature -30 to +80 C Performance guarantee temperature -10 to +60 C Operating temperature -10 to +75 C Substrate clock SUB - GND Supply voltage Clock input voltage V1, V2, V3 - SUB 1 +27V (Max.) when clock width < 10s, clock duty factor < 0.1%. +16V (Max.) is guaranteed for power-on and power-off. -4- Remarks 1 ICX415AL Bias Conditions Symbol Item Min. Typ. Max. Unit 14.55 15.0 15.45 V Supply voltage VDD Protective transistor bias VL 1 Substrate clock SUB 2 Reset gate clock RG 3 Remarks 1 VL setting is the VVL voltage of the vertical transfer clock waveform, or the same voltage as the VL power supply for the V driver should be used. 2 Indications of substrate voltage setting value Set SUBCIR pin to open when applying a DC bias the substrate clock pin. Adjust the substrate voltage because the setting value of the substrate voltage is indicated on the back of image sensor by a special code when applying a DC bias the substrate clock pin. VSUB code - two characters indication Integer portion Decimal portion The integer portion of the code and the actual value correspond to each other as follows. Integer portion of code A C d E f G h J Value 5 6 7 8 9 10 11 12 [Example] "A5" VSUB = 5.5V 3 Do not apply a DC bias to the reset gate clock pins, because a DC bias is generated within the CCD. DC Characteristics Item Supply current Symbol Min. Typ. Max. Unit IDD 4.0 7.0 9.0 mA -5- Remarks ICX415AL Clock Voltage Conditions Symbol Readout clock voltage Vertical transfer clock voltage Horizontal transfer clock voltage Reset gate clock voltage Waveform Diagram Min. Typ. Max. Unit VVT 14.55 15.0 15.45 V 1 VVH02 -0.05 0 0.05 V 2 VVH1, VVH2, VVH3 -0.2 0 0.05 V 2 VVL1, VVL2, VVL3 -7.8 -7.5 -7.2 V 2 VVL = (VVL1 + VVL3)/2 (During 29.5MHz) VVL1, VVL2, VVL3 -8.0 -7.5 -7.0 V 2 VVL = (VVL1 + VVL3)/2 (During 14.75MHz) V1, V2, V3 6.8 7.5 8.05 V 2 | VVL1 - VVL3 | 0.1 V 2 VVHH 0.5 V 2 High-level coupling VVHL 0.5 V 2 High-level coupling VVLH 0.5 V 2 Low-level coupling VVLL 0.5 V 2 Low-level coupling Item Remarks VVH = VVH02 VH 4.75 5.0 5.25 V 3 VHL -0.05 0 0.05 V 3 VCR 0.8 2.5 V 3 VRG 4.5 5.0 5.5 V 4 VRGLH - VRGLL 0.8 V 4 Low-level coupling VRGL - VRGLm 0.5 V 4 Low-level coupling 23.5 V 5 Substrate clock voltage VSUB 21.5 22.5 -6- Cross-point voltage ICX415AL Clock Equivalent Circuit Constants Symbol Item Capacitance between vertical transfer clock and GND Capacitance between vertical transfer clocks Min. Typ. Max. Unit CV1 3900 pF CV2 3300 pF CV3 3300 pF CV12 2200 pF CV23 2200 pF CV31 1800 pF 47 pF Capacitance between horizontal transfer clock and GND CH1, CH2 Capacitance between horizontal transfer clocks CHH 30 pF Capacitance between reset gate clock and GND CRG 6 pF Capacitance between substrate clock and GND CSUB 390 pF R1 , R 2 27 R3 22 Vertical transfer clock ground resistor RGND 100 Horizontal transfer clock series resistor RH1, RH2 16 Reset gate clock series resistor RRG 36 Vertical transfer clock series resistor V1 R1 R2 CV12 CV1 Remarks V2 CV2 RH1 RH2 H1 H2 RGND CHH CV31 CV3 CV23 CH1 CH2 R3 V3 Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit RRG CRG Reset gate clock equivalent circuit -7- ICX415AL Drive Clock Waveform Conditions (1) Readout clock waveform VT 100% 90% M VVT M 2 10% 0% tr twh 0V tf Note) Readout clock is used by composing vertical transfer clocks V2 and V3. (2) Vertical transfer clock waveform VVH1 V1 VVHH VVH VVHL VVLH VVL01 VVL1 VVL VVLL V2 VVH02 VVH2 VVHH VVH VVHL VVLH VVL2 VVL VVLL VVH3 V3 VVHH VVH VVHL VVLH VVL03 VVL VVLL VVH = VVH02 VVL = (VVL01 + VVL03)/2 VVL3 = VVL03 -8- VV1 = VVH1 - VVL01 VV2 = VVH02 - VVL2 VV3 = VVH3 - VVL03 ICX415AL (3) Horizontal transfer clock waveform tr H1, H2 tf twh H2 90% VCR VH twl VH 2 10% H1 VHL two Cross-point voltage for the H1 rising side of the horizontal transfer clocks H1 and H2 waveforms is VCR. The overlap period for twh and twl of horizontal transfer clocks H1 and H2 is two. (4) Reset gate clock waveform RG tr twh tf VRGH RG waveform twl VRG Point A VRGLH VRGLL VRGLm VRGL VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL. VRGL = (VRGLH + VRGLL)/2 Assuming VRGH is the minimum value during the interval twh, then: VRG = VRGH - VRGL Negative overshoot level during the falling edge of RG is VRGLm. (5) Substrate clock waveform SUB 100% 90% M VSUB 10% VSUB 0% (A bias generated within the CCD) tr twh -9- M 2 tf ICX415AL Clock Switching Characteristics (Horizontal drive frequency: 29.5MHz) twh Item Symbol twl tr tf Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Readout clock VT Vertical transfer clock V1, V2, V3 Horizontal transfer clock H1 9.5 12.0 9.5 12.0 5.0 7.5 5.0 7.5 H2 9.5 12.0 9.5 12.0 5.0 7.5 5.0 7.5 2.3 2.5 Reset gate clock RG Substrate clock 0.5 15 4 SUB 0.5 7 22 2 0.7 0.8 Symbol Horizontal transfer clock H1, H2 3 0.5 two Item 250 Min. Typ. Max. 7.5 9.5 Unit Remarks ns 1 Unit Remarks s During readout ns When using CXD3400N ns tf tr - 2ns ns 0.5 s When draining charge Unit Remarks Clock Switching Characteristics (Horizontal drive frequency: 14.75MHz) twh Item Symbol twl tr tf Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Readout clock VT Vertical transfer clock V1, V2, V3 Horizontal transfer clock H1 18 23 21 26 10 17.5 10 17.5 H2 21 26 18 23 10 10 11 14 49 2 Reset gate clock RG Substrate clock SUB 4.6 5.0 0.5 0.5 15 1.4 1.6 Item Symbol Horizontal transfer clock H1, H2 15 350 2 0.4 two Min. Typ. Max. 20 24 Unit Remarks ns 1 1 The overlap period of twh and twl of horizontal transfer clocks H1 and H2 is two. - 10 - 15 s During readout ns When using CXD3400N ns tf tr - 2ns ns 0.4 s When draining charge ICX415AL Image Sensor Characteristics (Ta = 25C) Symbol Min. Typ. Max. Unit Measurement method Remarks Sensitivity S 650 820 1070 mV 1 1/25s accumulation conversion value Saturation signal Vsat 375 mV 2 Ta = 60C Smear Sm -100 -92 dB 3 Video signal shading SH 25 % 4 Zone 0 Dark signal Vdt 2 mV 5 Ta = 60C Dark signal shading Vdt 1 mV 6 Ta = 60C Lag Lag 0.5 % 7 Item Note) All image sensor characteristic data noted above is for operation in 1/50s progressive scan mode. Zone Definition of Video Signal Shading 782 (H) 6 6 2 582 (V) 2 Zone 0 Ignored region Effective pixel region Measurement System CCD signal output [A] CCD C.D.S AMP S/H Signal output [B] Note) Adjust the amplifier gain so that the gain between [A] and [B] equals 1. - 11 - ICX415AL Image sensor readout mode The diagram below shows the output methods for the following three readout modes. (1) Progressive scan mode (2) Field readout mode VOUT VOUT 1. Progressive scan mode In this mode, all pixel signals are output in non-interlace format in 1/50s. All pixel signals within the same exposure period are read out simultaneously, making this mode suitable for high resolution image capturing. 2. Field readout mode All pixels are readout, 2-line transfer is performed during H blanking period and 2 pixels are added by horizontal register. (However, guarantees only at the time of a 14.75MHz drive.) (3) Center scan mode Undesired portions (Swept by vertical register high-speed transfer) Picture center cut-out portion 3. Center scan mode This is the center scan mode using the progressive scan method. The undesired portions are swept by vertical register high-speed transfer, and the picture center portion is cut out. There are the mode (100 frames/s) which outputs 264 lines of an output line portion, and the mode (200 frames/s) which outputs 88 lines. - 12 - ICX415AL Image Sensor Characteristics Measurement Method Measurement conditions (1) In the following measurements, the substrate voltage is set to the value indicated on the device, and the device drive conditions are at the typical values of the bias and clock voltage conditions. (2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value measured at point [B] of the measurement system. (3) In the following measurements, this image sensor is operated in 1/50s progressive scan mode. Definition of standard imaging conditions (1) Standard imaging condition I: Use a pattern box (luminance: 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter and image at F8. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. (2) Standard imaging condition II: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. Sensitivity Set to standard imaging condition I. After setting the electronic shutter mode with a shutter speed of 1/250s, measure the signal voltage (Vs) at the center of the screen, and substitute the value into the following formula. S = Vs x 250 [mV] 25 2. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 10 times the intensity with the average value of the signal output, 120mV, measure the minimum value of the signal output. 3. Smear Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, first adjust the luminous intensity to 500 times the intensity with the average value of signal output, 120mV. Then after the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value (VSm [mV]) of the signal output and substitute the value into the following formula. Sm = 20 x log VSm x 1 x 1 120 500 10 [dB] (1/10V method conversion value) 4. Video signal shading Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the signal output is 120mV. Then measure the maximum (Vmax [mV]) and minimum (Vmin [mV]) values of the signal output and substitute the values into the following formula. SH = (Vmax - Vmin)/120 x 100 [%] - 13 - ICX415AL 5. Dark signal Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 6. Dark signal shading After measuring 5, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark signal output and substitute the values into the following formula. Vdt = Vdmax - Vdmin [mV] 7. Lag Adjust the signal output generated by strobe light to 120mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following formula. Lag = (Vlag/120) x 100 [%] VD V2 Light Strobe light timing Signal output 120mV Output - 14 - Vlag (lag) Drive Circuit 15V 100k 0.1 0.1 -7.5V 1/35V 14 8 13 9 12 10 11 10 11 VOUT CGG CCD OUT NC 9 4.7k 0.1 ICX415 (BOTTOM VIEW) 3.3/20V VDD 7 8 RG XV1 15 7 VL XSG2 CXD3400N 6 NC 6 5 SUB XV2 0.1 4 GND 16 3 H1 5 2 NC XSG3 2SC4250 1 H2 17 V1 4 NC 18 V2 3 NC XV3 1/10V V3 19 CSUB 2 NC XSUB SUBCIR 20 NC 1 NC - 15 - 3.3V 0.01 22 21 20 19 18 17 16 15 14 13 12 H2 0.1 2200p 3.3/16V 1M H1 RG 0.1 ICX415AL ICX415AL Spectral Sensitivity Characteristics (Excludes lens characteristics and light source characteristics) 1.0 0.9 0.8 Relative Response 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 500 600 700 Wave Length [nm] - 16 - 800 900 1000 Drive Timing Chart (Vertical Sync) Progressive Scan Mode VD "a" 7 625 1 596 582 1 2 598 7 1 2 3 4 5 6 7 8 1 2 3 625 1 598 HD V1 OUT 1 2 3 4 5 6 7 8 V3 582 1 2 - 17 - V2 ICX415AL Drive Timing Chart (Vertical Sync "a" Enlarged) Progressive Scan Mode/Center Scand Mode "a" Enlarged H1 V1 627 701 V2 - 18 - V3 16 16 16 16 16 16 74 74 16 16 16 16 16 16 ICX415AL Progressive Scan Mode 944 1 Drive Timing Chart (Horizontal Sync) 166 163 19 1 102 144 42 96 138 H1 1 1 4 CLK H2 SHP SHD - 19 - V1 1 V2 1 V3 1 SUB 1 48 1 48 16 1 48 1 32 1 57 1 32 48 1 16 23 1 16 1 6 RG ICX415AL Drive Timing Chart (Vertical Sync) Center Scan Mode 1 VD "d" "a" "b" "d" "c" "a" "b" 310 311 312 1 2 3 4 5 6 7 8 290 291 27 23 24 310 311 312 1 2 3 4 5 6 7 8 290 291 HD V1 1 422 423 160 161 OUT 1 V3 422 423 - 20 - V2 ICX415AL Drive Timing Chart (Horizontal Sync) Center Scan Mode 1 (Frame Shift) ("b") 42 144 16048 bits = 17H H1 H2 - 21 - V1 V2 V3 16 16 16 16 16 16 #1 16 16 16 16 16 16 #166 ICX415AL Drive Timing Chart (Horizontal Sync) Center Scan Mode 1 (High-speed Sweep) ("d") 42 144 18880 bits = 20H H1 H2 - 22 - V1 V2 V3 16 16 16 16 16 16 #1 16 16 16 16 16 16 #194 ICX415AL Drive Timing Chart (Vertical Sync) Center Scan Mode 2 VD "d" "a" "b" "d" "c" "a" "b" 154 155 156 1 2 3 4 5 6 7 8 123 124 36 32 33 154 155 156 1 2 3 4 5 6 7 8 123 124 HD V1 - 23 - V2 1 334 335 248 249 1 OUT 334 335 V3 ICX415AL Drive Timing Chart (Horizontal Sync) Center Scan Mode 2 (Frame Shift) ("b") 42 144 24544 bits = 26H H1 H2 - 24 - V1 V2 V3 16 16 16 16 16 16 #1 16 16 16 16 16 16 #254 ICX415AL Drive Timing Chart (Horizontal Sync) Center Scan Mode 2 (High-speed Sweep) ("d") 42 144 29264 bits = 31H H1 H2 - 25 - V1 V2 V3 16 16 16 16 16 16 #1 16 16 16 16 16 16 #299 ICX415AL Drive Timing Chart (Vertical Sync) Field Readout Mode FLD VD "b" "a" 329 330 326 313 314 13 625 1 HD V2 1 3 5 7 1 3 5 7 2 4 6 8 2 4 6 8 581 582 1 3 5 7 1 3 5 7 2 4 6 8 2 4 6 8 OUT 582 V3 581 - 26 - V1 ICX415AL Drive Timing Chart (Vertical Sync "a", "b" Enlarged) Field Readout Mode H1 "a" Enlarged V1 627 701 V2 V3 - 27 - "b" Enlarged V1 V2 V3 8 8 8 8 8 8 8 8 8 8 8 8 74 74 8 8 8 8 8 8 8 8 8 8 8 8 ICX415AL Field Readout Mode 944 1 Drive Timing Chart (Horizontal Sync) 166 163 19 1 H1 102 144 96 138 42 1 1 4 CLK H2 SHP SHD - 28 - V1 1 V2 1 V3 SUB 1 1 1 24 1 8 1 24 1 24 1 16 1 24 1 24 1 24 1 24 24 1 24 1 57 1 16 24 1 23 1 8 16 1 6 RG ICX415AL ICX415AL Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a 30W soldering iron with a ground wire and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. 3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 1000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. 4) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.) Upper ceramic Lower ceramic 39N 29N 29N 0.9Nm Low melting point glass Compressive strength Shearing strength Tensile strength Torsional stregth b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portions. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. - 29 - ICX415AL c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to other locations as a precaution. d) The notch of the package is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch of the package. e) If the leads are bent repeatedly and metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) Others a) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. c) Brown stains may be seen on the bottom or side of the package. But this does not affect the CCD characteristics. - 30 - Package Outline Unit: mm 0.7 A 9.0 22 12 12 22 V 15.24 2-R0.7 H 11 18.0 0.4 3 0.7 - 31 - 14.6 3.26 0.3 B' 0.25 1 0.55 C 15.1 0.3 11.55 3 7.55 3 ~ B ~ 0 to 9 22 pin DIP (600mil) 17.6 1 1. "A" is the center of the effective image area. 2. The two points "B"of the package are the horizontal reference. 0.46 1.27 0.3 M 4.0 0.3 0.69 (For the 1st.pin only) 0.3 1.27 The point "B"of the package is the vertical reference. 3 The bottom "C"of the package is the height reference. 4 The center of the effective image area,relative to "B"and "B'"is H V 9.0 7.55 0.15mm 5 The rotation angle of the effective image area relative to H and V is 1 6 The height from bottom "C" to the effective image area is 1.41 0.15mm Cer-DIP 7 The tilt of the effective image area relative to the bottom "C" is less than 60m LEAD TREATMENT TIN PLATING 8 The thickness of the cover glass is 0.75mm,and the refractive index is 1.5. LEAD MATERIAL 42 ALLOY 9 The notches on the bottom must not be used for reference of fixing. PACKAGE MASS 2.60g DRAWING NUMBER AS-B15-03(E) ICX415AL Sony Corporation PACKAGE MATERIAL