VCCB
B1
B2
OE
VCCA
A1
A2
GND
1
2
3
4
8
7
6
5
SN74AVC2T244
www.ti.com
SCES767B –SEPTEMBER 2011–REVISED SEPTEMBER 2011
2-BIT UNDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
Check for Samples: SN74AVC2T244
1FEATURES
•Wide Operating VCC Range of 0.9 V to 3.6 V •Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
•Low Static-Power Consumption, 6-µA Max ICC •ESD Protection Exceeds JESD 22
•Output Enable Feature Allows User to Disable
Outputs to Reduce Power Consumption –5000-V Human-Body Model (A114-A)
• ±24-mA Output Drive at 3.0 V APPLICATIONS
•Ioff Supports Partial Power-Down-Mode •Handset, Smartphone, Tablet, Server
Operation
•Input Hysteresis Allows Slow Input Transition
and Better Switching Noise Immunity at Input DQE/DQM PACKAGE
(TOP VIEW)
•Maximum Data Rates
–380 Mbps (1.8-V to 3.3-V Translation)
–200 Mbps (<1.8-V to 3.3-V Translation)
–200 Mbps (Translate to 2.5 V or 1.8 V)
–150 Mbps (Translate to 1.5 V)
–100 Mbps (Translate to 1.2 V)
DESCRIPTION/ORDERING INFORMATION
This 2-bit unidirectional translator uses two separate configurable power-supply rails. The A port is designed to
track VCCA. VCCA accepts any supply voltage from 0.9 V to 3.6 V. The B port is designed to track VCCB. VCCB
accepts any supply voltage from 0.9 V to 3.6 V. This allows for low-voltage translation between 0.9-V, 1.2-V,
1.5-V, 1.8-V, 2.5-V and 3.6-V voltage nodes. For the SN74AVC2T244, when the output-enable (OE) input is
high, all outputs are placed in the high-impedance state. The SN74AVC2T244 is designed so that the OE input
circuit is referenced to VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioff
circuitry disables the outputs, preventing damaging current backflow through the device when it is powered
down.
ORDERING INFORMATION(1)
ORDERABLE
TAPACKAGE(2) TOP-SIDE MARKING
PART NUMBER
DQE –MicroQFN SN74AVC2T244DQER VA
–40°C to 85°CDQM –MicroQFN SN74AVC2T244DQMR VAH
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright ©2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74AVC2T244
SCES767B –SEPTEMBER 2011–REVISED SEPTEMBER 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DEVICE INFORMATION
PIN DESCRIPTION
PIN FUNCTION
VCCA Input Port DC Power Supply
VCCB Output Port DC Power Supply
GND Ground
An Input Port
Bn Output Port
OE Output Enable
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
DC Supply voltage, VCCA VCCB –0.5 4.6 V
DC Input voltage, VIAn–0.5 4.6 V
Control Input, VCOE –0.5 4.6 V
(Power
Voltage DC Output voltage, VO, VCCA = VCCB = 0 Bn–0.5 4.6
Down)
(Active V
Bn–0.5 4.6
Mode)
3-State Mode Bn–0.5 4.6
DC Input Diode current, IIK VI<GND –20 mA
DC Output Diode current, IOK VO<GND –50 mA
DC Output Source/Sink current, IO±50 mA
DC Supply current per supply pin, ICCA, ICCB ±100 mA
IGND DC Ground current per ground pin ±100 mA
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions"is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT
VCCA, VCCB Positive DC Supply voltage 0.9 3.6 V
VIBus input voltage GND 3.6 V
VIInput voltage GND 3.6 V
VCControl input OE GND 3.6 V
(Power Down Mode) BnGND 3.6 V
VOBus output voltage (Active Mode) BnGND VCCB V
3-State Mode BnGND 3.6 V
TAOperating free-air temperature –40 85 °C
Input transition rise or fall rate
Δt/Δv 0 10 nS
VIfrom 30% to 70% of VCC; VCC = 3.3 V ±0.3 V
2Submit Documentation Feedback Copyright ©2011, Texas Instruments Incorporated
Product Folder Link(s): SN74AVC2T244
SN74AVC2T244
www.ti.com
SCES767B –SEPTEMBER 2011–REVISED SEPTEMBER 2011
ELECTRICAL CHARACTERISTICS(1) (2)
over recommended operating free-air temperature range (unless otherwise noted)
–40°C to 85°C
PARAMETER TEST CONDITIONS VCCA (V) VCCB (V) UNIT
MIN MAX
2.7 –3.6 2.0 –
2.3 –2.7 1.6 –
Input HIGH Voltage 0.65 ×
VIH 0.9 –3.6 V
1.4 –2.3 –
(An, OE) VCCA
0.9 ×
0.9 –1.4 –
VCCA
2.7 –3.6 –0.8
2.3 –2.7 –0.7
Input LOW voltage 0.35 ×
VIL 0.9 –3.6 V
1.4 –2.3 –
(An, OE) VCCA
0.1 ×
0.9 –1.5 –VCCA
VCCB –
IOH =–100 µA; VI= VH0.9 –3.6 0.9 –3.6 –
0.2
0.75 ×
IOH =–0.5 mA; VI= VH0.9 0.9 –
VCCB
IOH =–2 mA; VI= VH1.4 1.4 1.05 –
1.65 1.65 1.25 –
IOH =–6 mA; VI= VH
VOH Output HIGH voltage V
2.3 2.3 2.0 –
2.3 2.3 1.8 –
IOH =–12 mA; VI= VH2.7 2.7 2.2 –
2.3 2.3 1.7 –
IOH =–18 mA; VI= VH3.0 3.0 2.4 –
IOH =–24 mA; VI= VH3.0 3.0 2.2 –
IOH = 100 µA; VI= VH0.9 –3.6 0.9 –3.6 –0.2
IOH = 0.5 mA; VI= VH1.1 1.1 –0.3
IOH = 2 mA; VI= VH1.4 1.4 –0.35
IOH = 6 mA; VI= VH1.65 1.65 –0.3
VOL Output LOW voltage 2.3 2.3 –0.4 V
IOH = 12 mA; VI= VH2.7 2.7 –0.4
2.3 2.3 –0.6
IOH = 18 mA; VI= VH3.0 3.0 –0.4
IOH = 24 mA; VI= VH3.0 3.0 –0.55
Input Leakage
IIVI= VCCA or GND 0.9 –3.6 0.9 –3.6 –1.0 1.5 μA
Current 0 0.9 –3.6 –1.0 1.3
Power-Off Leakage
IOFF OE = 0V μA
Current 0.9 –3.6 0 –1.0 1.5
Quiescent Supply VI= VCCA or GND;
ICCA 0.9 –3.6 0.9 –3.6 –3.0 μA
Current IO= 0
Quiescent Supply VI= VCCA or GND;
ICCB 0.9 –3.6 0.9 –3.6 –3.0 μA
Current IO= 0
ICCA + Quiescent Supply VI= VCCA or GND; 0.9 –3.6 0.9 –3.6 –6.0 μA
ICCB Current IO= 0
Increase in ICC per
Input Voltage, Other VI= VCCA –0.3 V;
ΔICCA 3.6 3.6 –5.0 μA
inputs at VCCA or VI= VCCA or GND
GND
(1) VCCO is the VCC associated with the output port.
(2) VCCI is the VCC associated with the input port.
Copyright ©2011, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): SN74AVC2T244
SN74AVC2T244
SCES767B –SEPTEMBER 2011–REVISED SEPTEMBER 2011
www.ti.com
ELECTRICAL CHARACTERISTICS(1) (2) (continued)
over recommended operating free-air temperature range (unless otherwise noted)
–40°C to 85°C
PARAMETER TEST CONDITIONS VCCA (V) VCCB (V) UNIT
MIN MAX
Increase in ICC per
Input Voltage, Other VI= VCCA –0.3 V;
ΔICCB 3.6 3.6 –5.0 μA
inputs at VCCA or VI= VCCA or GND
GND
I/O Tri-State Output
IOZ TA = 25°C, OE = 0 V 0.9 –3.6 0.9 –3.6 –1.0 1.0 μA
Leakage Current
4Submit Documentation Feedback Copyright ©2011, Texas Instruments Incorporated
Product Folder Link(s): SN74AVC2T244
SN74AVC2T244
www.ti.com
SCES767B –SEPTEMBER 2011–REVISED SEPTEMBER 2011
AC ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
Symbol Parameter VCCA (V) VCCB (V) MIN MAX UNIT
0.9 –3.6 0.9 –3.6 20
tPLH, tPHL Propagation Delay, Anto Bn1.2 –3.6 1.2 –3.6 7 nS
1.8 –3.6 1.8 –3.6 3.5
0.9 –3.6 0.9 –3.6 23
tPZH, tPZL Output Enable, OE to Bn1.2 –3.6 1.2 –3.6 6.5 nS
1.8 –3.6 1.8 –3.6 4.1
0.9 –3.6 0.9 –3.6 17
tPHZ, tPLZ Output Disable, OE to Bn1.2 –3.6 1.2 –3.6 7 nS
1.8 –3.6 1.8 –3.6 4.3
0.9 –3.6 0.9 –3.6 0.15
tOSHL, tOSLH Output to Output Skew, Time 1.2 –3.6 1.2 –3.6 0.15 nS
1.8 –3.6 1.8 –3.6 0.15
Table 1. CAPACITANCE(1)
Symbol Parameter Test Conditions TYP(2) Unit
VCCA = VCCB = 3.3 V, VI= 0 V or
CIN Control Pin Input Capacitance 3.5 pF
VCCA/B
VCCA = VCCB = 3.3 V, VI= 0 V or
CI/O I/O Pin Input capacitance 5.0 pF
VCCA/B
VCCA = VCCB = 3.3 V, VI= 0 V or
CPD Power Dissipation Capacitance 33 pF
VCCA/B, f = 10 MHz
(1) CPD is defined as the value of the IC's equivalent capacitance from which the operating current can be calculated from: ICC(operating) ≈
CPD ×VCC ×fIN ×NSW where ICC = ICCA + ICCB and NSW = total number of outputs switching.
(2) Typical values are at TA = +25°C.
Copyright ©2011, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): SN74AVC2T244
PACKAGE OPTION ADDENDUM
www.ti.com 30-Jan-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74AVC2T244DQER ACTIVE X2SON DQE 8 5000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AVC2T244DQMR ACTIVE X2SON DQM 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74AVC2T244DQER X2SON DQE 8 5000 180.0 8.4 1.17 1.67 0.73 4.0 8.0 Q1
SN74AVC2T244DQMR X2SON DQM 8 3000 180.0 8.4 1.57 2.21 0.59 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Apr-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74AVC2T244DQER X2SON DQE 8 5000 202.0 201.0 28.0
SN74AVC2T244DQMR X2SON DQM 8 3000 202.0 201.0 28.0
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Apr-2012
Pack Materials-Page 2
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