Board Level Heat Sinks P/N: 411616B02500 * Hole for Device Attachment * Dual Device Cooling Heat Sink * Vertical Mounting via Solderable Pins * RoHS Compliant CUSTOMIZED HEATSINKS * Specialized Plating * Specialized Body Configurations * Contact Applications Engineering 0 200 400 600 800 1000 5 80 4 60 3 40 2 20 1 o C 100 0 0 0 4 8 12 Heat Dissipated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph (858) 348-6200 Fax (858) 566-4577 E-mail: sales@comairrotron.com, Web: www.comairrotron.com 16 20 Thermal Resistance - oC/ Watt (Mounting Surface to Ambient) FEATURES & BENEFITS Air Velocity - LFM Temp Rise Above Ambient (Mounting Surface) * Devices: TO-218, TO-220 & TO-247 * Size: 25.0 x 41.6 x 38.1MM * Material: Aluminum * Type: Extruded * Finish: Black Anodized * PCB Mounting: Solderable Pins * Package: Bulk * Accessories: Hardware & Thermal Interface Material TO-218, TO-220 & TO-247 PRODUCT SPECIFICATIONS