MP1470
High-Efficiency, 2A, 16V, 500kHz
Synchronous, Step-Down Converter
In a 6-Pin TSOT 23
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The Future of Analog IC Technology
DESCRIPTION
The MP1470 is a high-frequency, synchronous,
rectified, step-down, switch-mode converter
with internal power MOSFETs. It offers a very
compact solution to achieve a 2A continuous
output current over a wide input supply range,
with excellent load and line regulation. The
MP1470 has synchronous-mode operation for
higher efficiency over the output current-load
range.
Current-mode operation provides fast transient
response and eases loop stabilization.
Protection features include over-current
protection and thermal shutdown.
The MP1470 requires a minimal number of
readily-available, standard, external
components and is available in a space-saving
6-pin TSOT23 package.
FEATURES
• Wide 4.7V-to-16V Operating Input Range
• 163m/86m Low-RDS(ON) Internal Power
MOSFETs
• Proprietary Switching-Loss–Reduction
Technique
• High-Efficiency Synchronous-Mode
Operation
• Fixed 500kHz Switching Frequency
• Internal AAM Power-Save Mode for High
Efficiency at Light Load
• Internal Soft-Start
• Over-Current Protection and Hiccup
• Thermal Shutdown
• Output Adjustable from 0.8V
• Available in a 6-pin TSOT-23 package
APPLICATIONS
• Game Consoles
• Digital Set-Top Boxes
• Flat-Panel Television and Monitors
• General Purposes
All MPS parts are lead-free and adhere to the RoHS directive. For MPS green
status, please visit MPS website under Products, Quality Assurance page.
“MPS” and “The Future of Analog IC Technology” are registered trademarks of
Monolithic Power Systems, Inc.
TYPICAL APPLICATION
VIN
R2
13k
R1
40.2k
R3
75k
IN
U1
GND
MP1470
1
4
VOUT
2
6
3
5EN FB
SW
BST
3.3V/2A
EN
GND
50
55
60
65
70
75
80
85
90
95
100
0.01 0.1 1 10
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ORDERING INFORMATION
Part Number* Package Top Marking
MP1470GJ TSOT23-6 ADJ
* For Tape & Reel, add suffix –Z (e.g. MP1470GJ–Z);
PACKAGE REFERENCE
TOP VIEW
1
2
3
6
5
4
MP1470
BST
SW
IN
GND
FB
EN
MP1470
ABSOLUTE MAXIMUM RATINGS (1)
VIN ..................................................-0.3V to 17V
VSW ......................................................................
-0.3V (-5V for <10ns) to 17V (19V for <10ns)
VBS ......................................................... VSW+6V
All Other Pins...................................–0.3V to 6V
Continuous Power Dissipation (TA = +25°C) (2)
........................................................... 1.25W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature................. -65°C to 150°C
Recommended Operating Conditions (3)
Supply Voltage VIN ...........................4.7V to 16V
Output Voltage VOUT......................0.8V to 0.9VIN
Operating Junction Temp. (TJ). -40°C to +125°C
Thermal Resistance (4) θJA θJC
TSOT-23-6............................. 100 ..... 55... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance JA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/JA. Exceeding the maximum allowable powe
r
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
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ELECTRICAL CHARACTERISTICS (5)
VIN = 12V, TA = 25°C, unless otherwise noted.
Parameter Symbol Condition Min Typ Max Units
Supply Current (Shutdown) IIN V
EN = 0V 1 A
Supply Current (Quiescent) Iq V
EN = 2V, VFB = 1V 0.83 mA
HS Switch-On Resistance HSRDS-ON V
BST-SW=5V 163 m
LS Switch-On Resistance LSRDS-ON Vcc=5V 86 m
Switch Leakage SWLKG V
EN = 0V, VSW =12V 1 A
Current Limit (5) I
LIMIT 3 3.7 A
Oscillator Frequency fSW V
FB=0.75V 400 490 580 kHz
Maximum Duty Cycle DMAX V
FB=700mV 88 92 %
Minimum On Time(5) ON_MIN 90 ns
Feedback Voltage VFB 776 800 824 mV
EN Rising Threshold VEN_RISING 1.4 1.5 1.6 V
EN Falling Threshold VEN_FALLING 1.23 1.32 1.41 V
VEN=2V 1.6 A
EN Input Current IEN
VEN=0 0 A
VIN Under-Voltage Lockout
Threshold—Rising INUVVth 3.85 4.2 4.55 V
VIN Under-Voltage Lockout
Threshold Hysteresis INUVHYS 340 mV
Soft-Start Period SS 1 ms
Thermal Shutdown(5) 150 °C
Thermal Hysteresis(5) 20 °C
Notes:
5) Guaranteed by design.
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TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 12V, VOUT = 3.3V, L = 4.9µH, TA = +25°C, unless otherwise noted.
0
1
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN = 12V, VOUT = 3.3V, L = 4.9µH, TA = +25°C, unless otherwise noted.
V
OUT
2V/div.
V
SW
5V/div.
V
IN
10V/div.
I
L
500mA/div.
V
OUT
2V/div.
V
SW
5V/div.
V
IN
10V/div.
I
L
1A/div.
V
OUT
2V/div.
V
SW
10V/div.
V
EN
2V/div.
I
L
1A/div.
V
OUT
2V/div.
V
SW
10V/div.
V
EN
2V/div.
I
L
1A/div.
V
OUT/AC
50mV/div.
V
SW
10V/div.
V
IN/AC
200mV/div.
I
L
1A/div.
V
OUT
2V/div.
V
SW
10V/div.
V
EN
2V/div.
I
L
500mA/div.
V
OUT
2V/div.
V
SW
10V/div.
V
EN
2V/div.
I
L
500mA/div.
V
OUT
2V/div.
V
SW
5V/div.
V
IN
10V/div.
I
L
1A/div.
V
OUT
2V/div.
V
SW
5V/div.
V
IN
10V/div.
I
L
200mA/div.
Startup through
Input Voltage
IOUT = 0A
Shutdown through
Input Voltage
IOUT = 0A
Startup through
Input Voltage
IOUT = 2A
Shutdown through
Input Voltage
IOUT = 2A
Startup through Enable
IOUT = 0A
Shutdown through Enable
IOUT = 0A
Startup through Enable
IOUT = 2A
Shutdown through Enable
IOUT = 2A
Input/Output Ripple
IOUT = 2A
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN = 12V, VOUT = 3.3V, L = 4.9µH, TA = +25°C, unless otherwise noted.
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PIN FUNCTIONS
Package
Pin # Name Description
1 GND
System Ground. Reference ground of the regulated output voltage: requires extra care
during PCB layout. Connect to GND with copper traces and vias.
2 SW Switch Output. Connect using a wide PCB trace.
3 IN
Supply Voltage. The MP1470 operates from a 4.7V-to-16V input rail. Requires C1 to
decouple the input rail. Connect using a wide PCB trace.
4 FB
Feedback. Connect to the tap of an external resistor divider from the output to GND to set
the output voltage. The frequency fold-back comparator lowers the oscillator frequency
when the FB voltage drops below 140mV to prevent current-limit runaway during a short
circuit fault.
5 EN
EN=HIGH to enable the MP1470. For automatic start-up, connect EN to VIN using a 100k
resistor.
6 BST
Bootstrap. Connect a capacitor and a resistor between SW and BS pins to form a floating
supply across the high-side switch driver. Use a 1µF BST capacitor.
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BLOCK DIAGRAM
47pF
1MEG
6.5V
BST
RSEN
IN
Oscillator
VCC
Regulator
Bootstrap
Regulator
Currrent Sense
Amplifer
VCC
Current Limit
Comparator
Error Amplifier
Reference
EN
FB
+
+
-
+
-
+
-
SW
GND
LS
Driver
HS
Driver
Comparator
On Time Control
Logic Control
1.2pF
500k
20k
Figure 1: Functional Block Diagram
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OPERATION
The MP1470 is a high-frequency, synchronous,
rectified, step-down, switch-mode converter
with internal power MOSFETs. It offers a very
compact solution to achieve a 2A continuous
output current over a wide input supply range,
with excellent load and line regulation.
The MP1470 operates in a fixed-frequency,
peak-current–control mode to regulate the
output voltage. An internal clock initiates the
PWM cycle to turn on the integrated high-side
power MOSFET. This MOSFET remains on
until its current reaches the value set by the
COMP voltage. When the power switch is off, it
remains off until the next clock cycle starts. If
the current in the power MOSFET does not
reach the COMP set current value within 90%
of one PWM period, the power MOSFET is
forced to turn off.
Internal Regulator
The 5V internal regulator powers most of the
internal circuits. This regulator takes VIN and
operates in the full VIN range. When VIN
exceeds 5.0V, the regulator output is in full
regulation. When VIN falls below 5.0V, the
output decreases.
Error Amplifier
The error amplifier compares the FB voltage
against the internal 0.8V reference (REF) and
outputs a current proportional to the difference
between the two. This output current charges or
discharges the internal compensation network
to form the COMP voltage, which is used to
control the power MOSFET current. The
optimized internal compensation network
minimizes the external component counts and
simplifies the control-loop design.
AAM Operation
The MP1470 has AAM (Advanced
Asynchronous Modulation) power-save mode
for light load. The AAM voltage is set at 0.5V
internally. Under the heavy load condition, the
VCOMP is higher than VAAM. When the clock goes
high, the high-side power MOSFET turns on
and remains on until VILsense reaches the value
set by the COMP voltage. The internal clock
resets every time when VCOMP is higher than
VAAM.
Under the light load condition, the value of
VCOMP is low. When VCOMP is less than VAAM and
VFB is less than VREF, VCOMP ramps up until it
exceeds VAAM. During this time, the internal
clock is blocked, thus the MP1470 skips some
pulses for PFM (Pulse Frequency Modulation)
mode and achieves the light load power save.
V
AAM
Clock
V
OUT
R1
1.2pF
47pF 500k
20k
R2
V
REF
V
FB
V
IL sense
V
COMP
HS_driver
-
+
+
-
QS
R
+
-
Figure 2: Simplified AAM Control Logic
When the load current is light, the inductor peak
current is set internally to about 380mA for
VIN=12V, VOUT=3.3V, and L=6.5H. The curve
of inductor peak current vs. inductor is shown in
Figure 3.
Inductor Peak Current
vs. Inductor
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
01234567
Figure 3: Inductor Peak Current vs. Inductor
Value
Enable
EN is a digital control pin that turns the
regulator on and off: Drive EN HIGH to turn on
the regulator, drive it LOW to turn it off. An
internal 1M resistor from EN to GND allows
EN to float to shut down the chip.
The EN pin is clamped internally using a 6.5V
series-Zener-diode as shown in Figure 4.
Connecting the EN input pin through a pullup
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resistor to the VIN voltage limits the EN input
current to less than 100A.
For example, with 12V connected to Vin,
RPULLUP (12V-6.5V) ÷100A =55k
Connecting the EN pin directly to a voltage
source without any pullup resistor requires
limiting the amplitude of the voltage source to
6V to prevent damage to the Zener diode.
EN LOGIC
EN
GND
Zener
6.5V-typ
Figure 4: 6.5V Zener Diode
Under-Voltage Lockout (UVLO)
Under-voltage lockout (UVLO) protects the chip
from operating at an insufficient supply voltage.
The MP1470 UVLO comparator monitors the
output voltage of the internal regulator, VCC.
The UVLO rising threshold is about 4.2V while
its falling threshold is consistently 3.85V.
Internal Soft-Start
Soft-start prevents the converter output voltage
from overshooting during startup. When the
chip starts, the internal circuit generates a soft-
start voltage (SS) that ramps up from 0V to
1.2V: When SS falls below the internal
reference (REF), SS overrides REF so that the
error amplifier uses SS as the reference; when
SS exceeds REF, the error amplifier resumes
using REF as its reference. The SS time is
internally set to 1ms.
Over-Current-Protection and Hiccup
The MP1470 has a cycle-by-cycle over-current
limit for when the inductor current peak value
exceeds the set current-limit threshold. First,
when the output voltage drops until FB falls
below the Under-Voltage (UV) threshold
(typically 140mV) to trigger a UV event, the
MP1470 enters hiccup mode to periodically
restart the part. This protection mode is
especially useful when the output is dead-
shorted to ground. This greatly reduces the
average short-circuit current to alleviate thermal
issues and to protect the regulator. The
MP1470 exits hiccup mode once the over-
current condition is removed.
Thermal Shutdown
Thermal shutdown prevents the chip from
operating at exceedingly high temperatures.
When the silicon die temperature exceeds
150°C, it shuts down the whole chip. When the
temperature falls below its lower threshold
(typically 130°C) the chip is enabled again.
Floating Driver and Bootstrap Charging
An external bootstrap capacitor powers the
floating power MOSFET driver. This floating
driver has its own UVLO protection, with a
rising threshold of 2.2V and a hysteresis of
150mV. VIN regulates the bootstrap capacitor
voltage internally through D1, M1, R4, C4, L1
and C2 (Figure 5). If (VIN-VSW) exceeds 5V, U2
will regulate M1 to maintain a 5V BST voltage
across C4.
U2
V
IN
U1
5V
D1
M1
R4
C4
SW L1 C2
V
OUT
Figure 5: Internal Bootstrap Charger Start-Up
and Shutdown Circuit
If both VIN and EN exceed their respective
thresholds, the chip starts. The reference block
starts first, generating stable reference voltage
and currents, and then the internal regulator is
enabled. The regulator provides a stable supply
for the remaining circuits.
Three events can shut down the chip: EN low,
VIN low, and thermal shutdown. The shutdown
procedure starts by initially blocking the
signaling path to avoid any fault triggering. The
COMP voltage and the internal supply rail are
then pulled down. The floating driver is not
subject to this shutdown command.
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APPLICATION INFORMATION
Setting the Output Voltage
The external resistor divider sets the output
voltage. The feedback resistor R1 also sets the
feedback-loop bandwidth through the internal
compensation capacitor (see the Typical
Application circuit). Choose R1 around 10k,
and R2with:
OUT
R1
R2 V1
0.8V
=
−
Use a T-type network for when VOUT is low.
FB VOUT
R1RT
R2
Figure 6: T-Type Network
Table 1 lists the recommended T-type resistors
value for common output voltages.
Table 1: Resistor Selection for Common Output
Voltages
VOUT (V) R1 (kΩ) R2 (kΩ) Rt (kΩ)
1.05 10(1%) 32.4(1%) 300(1%)
1.2 20.5(1%) 41.2(1%) 249(1%)
1.8 40.2(1%) 32.4(1%) 120(1%)
2.5 40.2(1%) 19.1(1%) 100(1%)
3.3 40.2(1%) 13(1%) 75(1%)
5 40.2(1%) 7.68(1%) 75(1%)
Selecting the Inductor
Use a 1µH-to-10µH inductor with a DC current
rating of at least 25% percent higher than the
maximum load current for most applications.
For highest efficiency, select an inductor with a
DC resistance less than 15m. For most
designs, derive the inductance value from the
following equation.
OUT IN OUT
1
IN L OSC
V(VV)
LVIf
×−
=×Δ ×
Where IL is the inductor ripple current. Choose
an inductor current approximately 30% of the
maximum load current. The maximum inductor
peak current is:
2
I
II L
LOAD)MAX(L
Δ
+=
Under light-load conditions (below 100mA), use
a larger inductor to improve efficiency.
Selecting the Input Capacitor
The input current to the step-down converter is
discontinuous, and therefore requires a
capacitor to both supply the AC current to the
step-down converter and maintain the DC input
voltage. For the best performance, use low
ESR capacitors, such as ceramic capacitors
with X5R or X7R dielectrics and small
temperature coefficients. A 22µF capacitor is
sufficient for most applications.
The input capacitor (C1) requires an adequate
ripple current rating because it absorbs the
input switching. Estimate the RMS current in
the input capacitor with:
⎟
⎟
⎠
⎞
⎜
⎜
⎝
⎛
×−×=
IN
OUT
IN
OUT
LOAD1C V
V
1
V
V
II
The worst-case condition occurs at VIN = 2VOUT,
where:
2
I
ILOAD
1C =
For simplification, choose an input capacitor
with an RMS current rating greater than half the
maximum load current.
The input capacitor can be electrolytic, tantalum,
or ceramic. Place a small, high-quality, ceramic
capacitor (0.1F) as close to the IC as possible
when using electrolytic or tantalum capacitors.
When using ceramic capacitors, make sure that
they have enough capacitance to provide
sufficient charge to prevent excessive input
voltage ripple. Estimate the input voltage ripple
caused by the capacitance with:
LOAD OUT OUT
IN IN
SIN
IV V
V1
fC1V V
⎛⎞
Δ= × ×−
⎜⎟
×⎝⎠
Selecting the Output Capacitor
The output capacitor (C2) maintains the DC
output voltage. Use ceramic, tantalum, or low-
ESR electrolytic capacitors. Use low ESR
capacitors to limit the output voltage ripple.
Estimate the output voltage ripple with:
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OUT OUT
OUT ESR
S1 IN S
VV 1
V1R
fL V 8fC2
⎛⎞
⎛⎞
Δ= ×− × +
⎜⎟
⎜⎟
×××
⎝⎠
⎝⎠
Where L1 is the inductor value and RESR is the
equivalent series resistance (ESR) of the output
capacitor.
For ceramic capacitors, the capacitance
dominates the impedance at the switching
frequency and causes most of the output
voltage ripple. For simplification, estimate the
output voltage ripple with:
OUT OUT
OUT 2
IN
S1
VV
V1
V
8f L C2
⎛⎞
=×−
⎜⎟
××× ⎝⎠
For tantalum or electrolytic capacitors, the ESR
dominates the impedance at the switching
frequency. For simplification, the output ripple
can be approximated with:
OUT OUT
OUT ESR
IN
S1
VV
V1R
fL V
⎛⎞
=×−×
⎜⎟
×⎝⎠
The characteristics of the output capacitor also
affect the stability of the regulation system. The
MP1470 can be optimized for a wide range of
capacitance and ESR values.
External Bootstrap Diode
An external bootstrap (BST) diode can enhance
the efficiency of the regulator given the
following applicable conditions:
z VOUT is 5V or 3.3V; and
z Duty cycle is high: D=
IN
OUT
V
V>65%
Connect the external BST diode from the output
of voltage regulator to the BST pin, as shown in
Figure 7
MP1470
SW
C
OUT
L5V or 3.3V
R4
External BST Diode
IN4148
BST
Figure 7: Optional External Bootstrap Diode
For most applications, use an IN4148 for the
external BST diode is IN4148, and a 1µF
capacitor for the BST capacitor.
PC BOARD LAYOUT
PCB layout is very important to achieve stable
operation. For best results, use the following
guidelines and Figure 8 as reference.
1) Keep the connection between the input
ground and GND pin as short and wide as
possible.
2) Keep the connection between the input
capacitor and IN pin as short and wide as
possible.
3) Use short and direct feedback connections.
Place the feedback resistors and compensation
components as close to the chip as possible.
4) Route SW away from sensitive analog areas
such as FB.
C1
C6
C2
L1
R1
R2 R7 R6 C5
R4
C3
R5
123
456
VIN
GND
VOUT
C2A
C3
R3
C1
C1A
C6
C2
C2A
L1
R8
R1
R2
R7
C7
R3
C3
R6 C5
R4
C4
R5
1
23
456
VIN
GND
Figure 8: Sample Board Layout
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Design Example
Below is a design example following the
application guidelines for the specifications:
Table 2: Design Example
VIN 12V
VOUT 3.3V
IO 2A
The detailed application schematics are shown
in Figures 9 through 13. The typical
performance and circuit waveforms have been
shown in the Typical Performance
Characteristics section. For more device
applications, please refer to the related
Evaluation Board Datasheets.
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TYPICAL APPLICATION CIRCUITS
25V
C1 C6
25V
GND
GND
GND GND
GND GND
GND
EN
VOUT
VIN
100k
R5
NS
R6
C4
C2A
NS
C2
NS
C3
L1
SW
NS
R3
40.2k
R1
7.68k
R2
GND
GND GND
GND
75k
R7
5V/2A
3
5
6
2
4
1
NS
C5
0R
R4
MP1470
BST
SW
IN
GND FBEN
Figure 9: 12Vin, 5V/2A
25V
C1 C6
25V
GND
GND
GND GND
GND GND
GND
EN
VOUT
VIN
100k
R5
NS
R6
C4
C2A
NS
C2
NS
C3
L1
SW
NS
R3
40.2k
R1
13k
R2
GND
GND GND
GND
75k
R7
3.3V/2A
MP1470
3
5
6
2
4
1
BST
SW
IN
GND FBEN
NS
C5
0R
R4
Figure 10: 12Vin, 3.3V/2A
25V
C1 C6
25V
GND
GND
GND GND
GND GND
GND
EN
VOUT
VIN
100k
R5
NS
R6
C4
C2A
NS
C2
NS
C3
L1
SW
NS
R3
40.2k
R1
19.1k
R2
GND
GND GND
GND
100k
R7
2.5V/2A
MP1470
3
5
6
2
4
1
BST
SW
IN
GND FB
EN
NS
C5
0R
R4
Figure 11: 12Vin, 2.5V/2A
MP1470 – SYNCHRONOUS, STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
MP1470 Rev. 1.02 www.MonolithicPower.com 15
8/27/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2013 MPS. All Rights Reserved.
25V
C1 C6
25V
GND
GND
GND GND
GND GND
GND
EN
VOUT
VIN
100k
R5
NS
R6
C4
C2A
NS
C2
NS
C3
L1
SW
NS
R3
40.2k
R1
32.4k
R2
GND
GND GND
GND
120k
R7
1.8V/2A
MP1470
3
5
6
2
4
1
BST
SW
IN
GND FBEN
NS
C5
0R
R4
Figure 12: 12Vin, 1.8V/2A
25V
C1 C6
25V
GND
GND
GND GND
GND GND
GND
EN
VOUT
VIN
100k
R5
NS
R6
C4
C2A
NS
C2
NS
C3
L1
SW
NS
R3
20.5k
R1
41.2k
R2
GND
GND GND
GND
249k
R7
1.2V/2A
MP1470
3
5
6
2
4
1
BST
SW
IN
GND FBEN
NS
C5
0R
R4
Figure 13: 12Vin, 1.2V/2A
MP1470 – SYNCHRONOUS, STEP-DOWN CONVERTER WITH INTERNAL MOSFETS
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third
party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not
assume any legal responsibility for any said applications.
MP1470 Rev. 1.02 www.MonolithicPower.com 16
8/27/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2013 MPS. All Rights Reserved.
PACKAGE INFORMATION
TSOT23-6
FRONT VI EW
NOTE:
1) ALL DIMENSIONS ARE IN MILLIMETERS.
2) PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH,
PROTRUSION OR GATE BURR.
3) PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH
OR PROTRUSION.
4) LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING)
SHALL BE 0.10 MILLIMETERS MAX.
5) DRAWING CONFORMS TO JEDEC MO-193, VARIATION AB.
6) DRAWING IS NOT TO SCALE.
7) PIN 1 IS LOWER LEFT PIN WHEN READING TOP MARK
FROM LEFT TO RIGHT, (SEE EXAMPLE TOP MARK)
TO P VI EW R ECO MMENDED L AN D PA TTERN
SEATING PLANE
SI DE V IEW
DETAIL "A"
SEE DETAIL ''A''
IAAAA
PIN 1 ID
See note 7
EXAMPLE
TOP MAR K
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Monolithic Power Systems (MPS):
MP1470GJ-P MP1470GJ-Z