C2220X102JBRAC - KEMET Electronics Corporation

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Overview

KEMET’s High Voltage with Flexible Termination (HV FT-CAP)

surface mount MLCCs in X7R dielectric address the primary

failure mode of MLCCs– ex cracks, which are typically the

result of excessive tensile and shear stresses produced

during board exure and thermal cycling. Featuring several

of the highest CV (capacitance/voltage) values available in

the industry, these devices utilize a pliable and conductive

silver epoxy between the base metal and nickel barrier layers

of the termination system. The addition of this epoxy layer

inhibits the transfer of board stress to the rigid ceramic body,

therefore mitigating ex cracks which can result in low IR or

short circuit failures. Although exible termination technology

does not eliminate the potential for mechanical damage that

may propagate during extreme environmental and handling

conditions, it does provide superior ex performance over

standard termination systems.

The HV FT-CAP offers low leakage current, exhibits low ESR

at high frequencies and nds conventional use as snubbers

or lters in applications such as switching power supplies

and lighting ballasts. Their exceptional performance at high

frequencies has made them a preferred choice of design

engineers worldwide. In addition to their use in power supplies,

these capacitors are widely used in industries related to

automotive(hybrid), telecommunications, medical, military,

aerospace, semiconductors and test/diagnostic equipment.

Combined with the stability of an X7R dielectric and designed to

accommodate all capacitance requirements, these ex-robust

devices are RoHS Compliant, offer up to 5 mm of ex-bend

capability and exhibits a predictable change in capacitance with

respect to time and voltage. Capacitance change with reference to

ambient temperature is limited to ±15% from -55°C to +125°C.

Automotive Grade is available for applications requiring proven,

reliable performance in harsh environments. Whether under-hood

or in-cabin, these capacitors are designed for mission and safety

critical automotive circuits. Stricter testing protocol and inspection

criteria have been established for automotive grade products

in recognition of potentially harsh environmental conditions.

KEMET automotive grade series capacitors meet the demanding

Automotive Electronics Council's AEC–Q200 qualication

requirements.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP)

X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Ordering Information

C1210 X154 K C R A C TU

Ceramic Case Size

(L" x W")

Specication/

Series

Capacitance

Code (pF)

Capacitance

Tolerance Voltage Dielectric Failure Rate/

Design Termination Finish1Packaging/Grade

(C-Spec)2

0805

1206

1210

1808

1812

1825

2220

2225

X = Flexible

Termination

2 Signicant

Digits + Number

of Zeros

J = ±5%

K = ±10%

M = ±20%

C = 500 V

B = 630 V

D = 1,000 V

F = 1,500 V

G = 2,000 V

Z = 2,500 V

H = 3,000 V

R = X7R A = N/A C = 100% Matte Sn

L = SnPb (5% min)

Blank = Bulk

TU = 7" Reel

Unmarked

TM = 7" Reel Marked

AUTO = Automotive

Grade 7" Reel

Unmarked

1 Additional termination nish options may be available. Contact KEMET for details.

1, 2 SnPb termination nish option is not available on Automotive Grade product.

2 Additional reeling or packaging options may be available. Contact KEMET for details.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Dimensions – Millimeters (Inches)

Ceramic Surface Mount

EIA

Size

Code

Metric

Size

Code

Length

Width

Thickness

Bandwidth

Separation

Minimum

Mounting

Technique

0805 2012 2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)

See Table 2 for

Thickness

0.50 (0.02) ± 0.25 (.010) 0.75 (.030) Solder Wave or

Solder Reow

1206 3216 3.30 (.130) ± 0.40 (.016) 1.60 (.063) ± 0.20 (.008) 0.60 (.024) ± 0.25 (.010)

N/A

1210 3225 3.30 (.130) ± 0.40 (.016) 2.50 (.098) ± 0.20 (.008) 0.60 (.024) ± 0.25 (.010)

Solder Reow Only

1808 4520 4.70 (.185) ± 0.50 (.020) 2.00 (.079) ± 0.20 (.008) 0.70 (.028) ± 0.35 (.014)

1812 4532 4.50 (.178) ± 0.40 (.016) 3.20 (.126) ± 0.30 (.012) 0.70 (.028) ± 0.35 (.014)

1825 4564 4.60 (.181) ± 0.40 (.016) 6.40 (.252) ± 0.40 (.016) 0.70 (.028) ± 0.35 (.014)

2220 5650 5.90 (.232) ± 0.75 (.030) 5.00 (.197) ± 0.40 (.016) 0.70 (.028) ± 0.35 (.014)

2225 5664 5.90 (.232) ± 0.75 (.030) 6.40 (.248) ± 0.40 (.016) 0.70 (.028) ± 0.35 (.014)

Benets

• -55°C to +125°C operating temperature range

• Industry-leading CV values

• Superior ex performance (up to 5 mm)

• Exceptional performance at high frequencies

• Pb-Free and RoHS Compliant

• EIA 0805, 1206, 1210, 1808, 1812, 1825, 2220, and

2225 case sizes

• DC voltage ratings of 500 V, 630 V, 1 KV, 1.5 KV, 2 KV,

2.5 KV, and 3 KV

• Capacitance offerings ranging from 130 pF to 0.33 μF

• Available capacitance tolerances of ±5%, ±10% or ±20%

• Low ESR and ESL

• Non-polar device, minimizing installation concerns

• Commercial and Automotive (AEC–Q200) Grades available

• 100% pure matte tin-plated termination nish allowing for

excellent solderability

• SnPb plated termination nish option available upon request (5%

minimum)

Applications

Typical applications include switch mode power supplies (input lters, resonators, tank circuits, snubber circuits, output lters), high

voltage coupling and DC blocking, lighting ballasts, voltage multiplier circuits, DC/DC converters and coupling capacitors in Ćuk

converters. Markets include power supply, LCD uorescent backlight ballasts, HID lighting, telecom equipment, industrial and medical

equipment/control, LAN/WAN interface, analog and digital modems, and automotive (electric and hybrid vehicles, charging stations and

lighting) applications.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Application Note

X7R dielectric is not recommended for AC line ltering or pulse applications.

Qualication/Certication

Commercial Grade products are subject to internal qualication. Details regarding test methods and conditions are referenced in

Table 4, Performance & Reliability.

Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test

methods and conditions are referenced in document AEC–Q200, Stress Test Qualication for Passive Components. For additional

information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.

Environmental Compliance

Pb-Free and RoHS Compliant (excluding SnPb termination nish option).

Electrical Parameters/Characteristics

Item Parameters/Characteristics

Operating Temperature Range -55°C to +125°C

Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) ±15%

Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0%

Dielectric Withstanding Voltage

150% of rated voltage for voltage rating of < 1,000 V

120% of rated voltage for voltage rating of ≥ 1,000 V

(5 ±1 seconds and charge/discharge not exceeding 50 mA)

Dissipation Factor (DF) Maximum Limit @ 25ºC

2.5%

Insulation Resistance (IR) Limit @ 25°C

See Insulation Resistance Limit Table

(500 VDC applied for 120 ±5 seconds @ 25°C)

Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.

To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Capacitance and dissipation factor (DF) measured under the following conditions:

1 kHz ± 50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF

120 Hz ± 10 Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON."

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Dielectric Rated DC

Voltage

Capacitance

Value

Dissipation

Factor (%)

Capacitance

Shift

Insulation

Resistance

X7R

> 25

All

3.0

±20% 10% of Initial Limit16/25 5.0

< 16 7.5

Insulation Resistance Limit Table (X7R Dielectric)

EIA Case Size

1,000 Megohm

Microfarads or 100 GΩ

100 Megohm

Microfarads or 10 GΩ

0805 < 0.0039 µF ≥ 0.0039 µF

1206 < 0.012 µF ≥ 0.012 µF

1210 < 0.033 µF ≥ 0.033 µF

1808 < 0.018 µF ≥ 0.018 µF

1812 < 0.027 µF ≥ 0.027 µF

≥ 1825 All All

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall (0805 – 1812 Case Sizes)

Capacitance Cap

Code

Series C0805 C1206 C1210 C1808 C1812

Voltage Code C B D C B D F G C B D F G C B D F G Z H C B D F G Z H

Voltage DC

500

630

1000

500

630

1000

1500

2000

500

630

1000

1500

2000

500

630

1000

1500

2000

2500

3000

500

630

1000

1500

2000

2500

3000

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

120 pF 121 J K M GG GG GG GG GG GG

130 pF 131 J K M DG DG DG LB LB LB LB LB LB LB

150 pF 151 J K M DG DG DG LB LB LB LB LB LB LB

180 pF 181 J K M DG DG DG LB LB LB LB LB LB LB

220 pF 221 J K M DG DG DG EG EG EG EG EG LB LB LB LB LB LB LB GK GK GK GK GK GK GK

270 pF 271 J K M DG DG DG EG EG EG EG EG LC LC LC LC LC LC LC GK GK GK GK GK GK GK

330 pF 331 J K M DG DG DG EG EG EG EG EG LC LC LC LC LC LC LC GK GK GK GK GK GK GK

390 pF 391 J K M DG DG DG EG EG EG EG EG LB LB LB LB LB LB LC GK GK GK GK GK GK GK

470 pF 471 J K M DG DG DG EF EF EF EF EG LB LB LB LB LB LB LC GK GK GK GK GK GK GK

560 pF 561 J K M DG DG DG EF EF EF EF EG FL FL FL FL FL LB LB LB LB LB LB LC GH GH GH GH GH GK GK

680 pF 681 J K M DG DG DG EF EF EF EF EG FL FL FL FL FL LA LA LA LA LB LC LC GH GH GH GH GH GK GK

820 pF 821 J K M DG DG DG EF EF EF EF EG FL FL FL FL FL LA LA LA LA LB LC LC GH GH GH GH GH GK GK

1,000 pF 102 J K M DG DG DG EF EF EF EF EG FL FL FL FL FL LA LA LA LA LB LC LC GH GH GH GH GH GK GK

1,200 pF 122 J K M DG DG DG EF EF EF EG EG FL FL FL FL FM LB LB LB LB LC LA GH GH GH GH GH GK GK

1,500 pF 152 J K M DG DG DG EF EF EF EG EG FL FL FL FL FM LB LB LB LB LC LB GH GH GH GH GH GK

1,800 pF 182 J K M DG DG DG EF EF EF EG EG FL FL FL FL FM LB LB LB LB LC LC GH GH GH GH GH GK

2,000 pF 202 J K M DG DG DG EF EF EF EG EG FL FL FL FL FM LA LA LA LB LC LC GH GH GH GH GH GK

2,200 pF 222 J K M DG DG DG EF EF EF EG EG FL FL FL FL FM LA LA LA LB LC LC GH GH GH GH GH GK

2,700 pF 272 J K M DG DG DG EF EF EF EG FL FL FL FL FM LA LA LA LB LC GH GH GH GH GK GM

3,300 pF 332 J K M DG DG DG EF EF EF EG FL FL FL FL FM LA LA LA LB LA GH GH GH GH GK GM

3,900 pF 392 J K M DG DG DG EF EF EF EG FL FL FL FL FK LA LA LA LB LB GH GH GH GH GK GO

4,700 pF 472 J K M DG DG DG EF EF EF EG FL FL FL FL FK LA LA LA LB LC GH GH GH GH GH GO

5,600 pF 562 J K M DG DG EF EF EF EF FL FL FL FM FK LA LB LB LC GH GH GH GK GK

6,800 pF 682 J K M DG DG EG EG EG EF FL FL FL FM FS LA LB LB LC GH GH GH GK GM

8,200 pF 822 J K M DG DG EG EG EG EF FL FL FL FK LA LB LB LC GH GH GH GK GM

10,000 pF 103 J K M DG EG EG EG EG FL FL FL FK LA LB LB LC GH GH GH GK GO

12,000 pF 123 J K M DG EG EJ EJ FL FL FL FK LA LC LC LB GH GK GK GK

15,000 pF 153 J K M EG EJ EJ FL FL FL FL LA LC LC LC GH GK GK GH

18,000 pF 183 J K M EJ EJ EJ FL FL FL FM LA LE LE GH GK GK GM

22,000 pF 223 J K M EJ EJ EJ FL FM FM FM LA LE LE GH GK GK GM

27,000 pF 273 J K M EJ EJ FM FK FK FK LA LA LA GH GB GB GO

33,000 pF 333 J K M EJ EJ FM FG FH FS LC LA LA GH GB GB GO

39,000 pF 393 J K M EJ FK FG FH FS LC LA LA GH GB GB

47,000 pF 473 J K M EJ FK FH FK LC LA LB GH GB GC

56,000 pF 563 J K M EJ FG FH FK LC LA LB GH GB GE

62,000 pF 623 J K M EJ FG FK FS LA LA LC GK GB GE

68,000 pF 683 J K M EJ FG FK FS LA LA LC GE GE GE

82,000 pF 823 J K M FH FK LA LC GB GE GK

0.10 µF 104 J K M FK FS LA LC GB GH GJ

0.12 µF 124 J K M FK LA GE GK

0.15 µF 154 J K M FK LB GE GN

0.18 µF 184 J K M GF

0.22 µF 224 J K M GJ

0.27 µF 274 J K M GL

0.33 µF 334 J K M GS

Capacitance Cap

Code

Voltage DC

500

630

1000

500

630

1000

1500

2000

500

630

1000

1500

2000

500

630

1000

1500

2000

2500

3000

500

630

1000

1500

2000

2500

3000

Voltage Code C B D C B D F G C B D F G C B D F G Z H C B D F G Z H

Series C0805 C1206 C1210 C1808 C1812

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within

the same form factor (conguration and dimensions).

Roll Over for

Order Info.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Table 1B – Capacitance Range/Selection Waterfall (1825 – 2225 Case Sizes)

Capacitance Cap

Code

Series C1825 C2220 C2225

Voltage Code C B D F G Z H C B D F G Z H C B D F G Z H

Voltage DC

500

630

1000

1500

2000

2500

3000

500

630

1000

1500

2000

2500

3000

500

630

1000

1500

2000

2500

3000

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

470 pF 471 J K M HG HG HG HG HG HG HG JP JP JP JP JP JP JP

560 pF 561 J K M HG HG HG HG HG HG HG JP JP JP JP JP JP JP

680 pF 681 J K M HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

820 pF 821 J K M HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

1,000 pF 102 J K M HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

1,200 pF 122 J K M HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

1,500 pF 152 J K M HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

1,800 pF 182 J K M HE HE HE HE HE HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

2,000 pF 202 J K M HE HE HE HE HE HG HG JE JE JE JE JE JP JP KF KF KF KF KF KF KF

2,200 pF 222 J K M HE HE HE HE HE HG HG JE JE JE JE JE JP JP KF KF KF KF KF KF KF

2,700 pF 272 J K M HE HE HE HE HE HG HG JE JE JE JE JE JP JP KE KE KE KE KE KF

3,300 pF 332 J K M HE HE HE HE HE HG HG JE JE JE JE JE JP JP KE KE KE KE KE KF

3,900 pF 392 J K M HE HE HE HE HE JE JE JE JE JE JP JP KE KE KE KE KE KF

4,700 pF 472 J K M HE HE HE HE HE JE JE JE JE JP KE KE KE KE KE KF

5,600 pF 562 J K M HE HE HE HE HE JE JE JE JE JP KE KE KE KE KE KF

6,800 pF 682 J K M HE HE HE HE HE JE JE JE JE JP KE KE KE KE KF

8,200 pF 822 J K M HE HE HE HE HE JE JE JE JE JP KE KE KE KE KF

10,000 pF 103 J K M HE HE HE HE JE JE JE JE KE KE KE KE KF

12,000 pF 123 J K M HE HE HE HG JE JP JP JP KE KE KE KE KF

15,000 pF 153 J K M HE HE HE HG JE JP JP JP KE KE KE KE

18,000 pF 183 J K M HE HE HE HG JE JP JP JP KE KE KE KE

22,000 pF 223 J K M HE HG HG HG JE JP JP JP KE KF KF KF

27,000 pF 273 J K M HE HG HG HG JE JP JP JP KE KF KF KF

33,000 pF 333 J K M HE HG HG JE JP JP JP KE KF KF KF

39,000 pF 393 J K M HE HG HG JE JP JP KE KF KF KF

47,000 pF 473 J K M HE HG HG JE JP JP KE KF KF KF

56,000 pF 563 J K M HE JE KE KF KF

62,000 pF 623 J K M HG JE KF KF KF

68,000 pF 683 J K M HG JE KE KF KF

82,000 pF 823 J K M HG JE KE

0.10 µF 104 J K M HG JE KE

0.12 µF 124 J K M HG JE KE

0.15 µF 154 J K M HG JP KF

0.18 µF 184 J K M HG JP KF

0.22 µF 224 J K M HG KF

Capacitance Cap

Code

Voltage DC

500

630

1000

1500

2000

2500

3000

500

630

1000

1500

2000

2500

3000

500

630

1000

1500

2000

2500

3000

Voltage Code C B D F G Z H C B D F G Z H C B D F G Z H

Series C1825 C2220 C2225

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within

the same form factor (conguration and dimensions).

Roll Over for

Order Info.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Table 2 – Chip Thickness/Packaging Quantities

Thickness

Code

Case

Size

Thickness ±

Range (mm)

Paper Quantity Plastic Quantity

7" Reel 13" Reel 7" Reel 13" Reel

0805

1.25 ± 0.15

2,500

10,000

1206

1.20 ± 0.15

2,500

10,000

1206

1.60 ± 0.15

2,000

8,000

1206

1.70 ± 0.20

2,000

8,000

1210

1.25 ± 0.15

2,500

10,000

1210

1.40 ± 0.15

2,000

8,000

1210

1.55 ± 0.15

2,000

8,000

1210

1.70 ± 0.20

2,000

8,000

1210

2.10 ± 0.20

2,000

8,000

1808

1.00 ± 0.10

2,500

10,000

1808

1.40 ± 0.15

1,000

4,000

1808

1.60 ± 0.15

1,000

4,000

1808

2.00 ± 0.15

1,000

4,000

1812

1.00 ± 0.10

1,000

4,000

1812

1.30 ± 0.10

1,000

4,000

1812

1.40 ± 0.15

1,000

4,000

1812

1.50 ± 0.10

1,000

4,000

1812

1.60 ± 0.20

1,000

4,000

1812

1.70 ± 0.15

1,000

4,000

1812

1.70 ± 0.20

1,000

4,000

1812

1.90 ± 0.20

500

2,000

1812

2.10 ± 0.20

500

2,000

1825

1.40 ± 0.15

1,000

4,000

1825

1.60 ± 0.20

1,000

4,000

2220

1.40 ± 0.15

1,000

4,000

2220

1.60 ± 0.20

1,000

4,000

2225

1.40 ± 0.15

1,000

4,000

2225

1.60 ± 0.20

1,000

4,000

Thickness

Code

Case

Size

Thickness ±

Range (mm)

7" Reel 13" Reel 7" Reel 13" Reel

Paper Quantity Plastic Quantity

Package quantity based on nished chip thickness specications.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351

EIA

Size

Code

Metric

Size

Code

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.80 0.95 1.35 2.80 1.70

1206 3216 1.60 1.65 1.90 5.90 2.90 1.50 1.45 1.80 5.00 2.30 1.40 1.25 1.70 4.30 2.00

1210 3225 1.60 1.65 2.80 5.90 3.80 1.50 1.45 2.70 5.00 3.20 1.40 1.25 2.60 4.30 2.90

1808 4520 2.25 1.85 2.30 7.40 3.30 2.15 1.65 2.20 6.50 2.70 2.05 1.45 2.10 5.80 2.40

1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70

1825 4564 2.15 1.80 6.90 7.10 7.9 0 2.05 1.60 6.80 6.20 7.30 1.95 1.40 6.70 5.50 7.0 0

2220 5650 2.85 2.10 5.50 8.80 6.50 2.75 1.90 5.40 7.90 5.90 2.65 1.70 5.30 7. 20 5.60

2225 5664 2.85 2.10 6.90 8.80 7.9 0 2.75 1.90 6.80 7.9 0 7.3 0 2.65 1.70 6.70 7. 20 7.0 0

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reow solder

processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualication

testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reow only

Recommended Soldering Prole:

• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD–020

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress Reference Test or Inspection Method

Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds.

Board Flex JIS–C–6429

Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.

Flexible termination system – 3.0 mm (minimum).

Solderability J–STD–002

Magnication 50 X. Conditions:

a) Method B, 4 hours @ 155°C, dry heat @ 235°C

b) Method B @ 215°C category 3

c) Method D, category 3 @ 260°C

Temperature Cycling JESD22 Method JA–104 1,000 cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.

Biased Humidity MIL–STD–202 Method 103

Load Humidity: 1,000 hours 85°C/85% RH and 200 VDC maximum. Add 100 K ohm resistor.

Measurement at 24 hours +/- 2 hours after test conclusion.

Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at

24 hours +/- 2 hours after test conclusion.

Moisture Resistance MIL–STD–202 Method 106

t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours +/- 2 hours

after test conclusion.

Thermal Shock MIL–STD–202 Method 107

-55°C/+125°C. Note: Number of cycles required – 300. Maximum transfer time – 20 seconds. Dwell

time – 15 minutes. Air – Air.

High Temperature Life MIL–STD–202 Method 108 1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with rated voltage applied.

Storage Life MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.

Vibration MIL–STD–202 Method 204

5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure

points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"

from any secure point. Test from 10 – 2,000 Hz

Mechanical Shock MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.

Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may

increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%

relative humidity. Temperature uctuations should be minimized to avoid condensation on the parts and atmospheres should be free of

chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of

receipt.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Construction

Reference Item Material

Termination

System

Finish 100% Matte Sn SnPb (5% min)

BBarrier Layer Ni

CEpoxy Layer Ag

DBase Metal Cu

EInner Electrode Ni

FDielectric Material BaTiO

Note: Image is exaggerated in order to clearly identify all components of construction.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Capacitor Marking (Optional):

These surface mount multilayer ceramic capacitors are

normally supplied unmarked. If required, they can be marked

as an extra cost option. Marking is available on most KEMET

devices but must be requested using the correct ordering

code identi er(s). If this option is requested, two sides of the

ceramic body will be laser marked with a “K” to identify KEMET,

followed by two characters (per EIA–198 - see table below) to

identify the capacitance value. EIA 0603 case size devices are

limited to the “K” character only.

Laser marking option is not available on:

• C0G, Ultra Stable X8R and Y5V dielectric devices

• EIA 0402 case size devices

• EIA 0603 case size devices with Flexible Termination option.

• KPS Commercial and Automotive Grade stacked devices.

Marking appears in legible contrast. Illustrated below is an

example of an MLCC with laser marking of “KA8”, which

designates a KEMET device with rated capacitance of 100 µF.

Orientation of marking is vendor optional.

KA8

Capacitance (pF) For Various Alpha/Numeral Identi ers

Alpha

Character

Numeral

Capacitance (pF)

0.1

1 0

100

1,000

10,000

100,000

1,000,000

10,000,000

100,000,000

0.11

1.1

110

1,10 0

11,000

110,000

1,100,000

11,000,000

110,000,000

C 0.12 1 2 12 120 1,200 12,000 120,000 1,200,000 12,000,000 120,000,000

0.13

1 3

130

1,300

13,000

130,000

1,300,000

13,000,000

130,000,000

0.15

1 5

150

1,500

15,000

150,000

1,500,000

15,000,000

150,000,000

0.16

1 6

160

1,600

16,000

160,000

1,600,000

16,000,000

160,000,000

0.18

1 8

180

1,800

18,000

180,000

1,800,000

18,000,000

180,000,000

H 0.2 2 0 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000

0.22

2 2

220

2,200

22,000

220,000

2,200,000

22,000,000

220,000,000

0.24

2.4

240

2,400

24,000

240,000

2,400,000

24,000,000

240,000,000

0.27

2.7

270

2,700

27,000

270,000

2,700,000

27,000,000

270,000,000

0.3

3 0

300

3,000

30,000

300,000

3,000,000

30,000,000

300,000,000

N 0.33 3 3 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000

0.36

3 6

360

3,600

36,000

360,000

3,600,000

36,000,000

360,000,000

0.39

3 9

390

3,900

39,000

390,000

3,900,000

39,000,000

390,000,000

0.43

4 3

430

4,300

43,000

430,000

4,300,000

43,000,000

430,000,000

0.47

4.7

470

4,700

47,000

470,000

4,700,000

47,000,000

470,000,000

T 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000

0.56

5 6

560

5,600

56,000

560,000

5,600,000

56,000,000

560,000,000

0.62

6 2

620

6,200

62,000

620,000

6,200,000

62,000,000

620,000,000

0.68

6 8

680

6,800

68,000

680,000

6,800,000

68,000,000

680,000,000

0.75

7 5

750

7,500

75,000

750,000

7,500,000

75,000,000

750,000,000

Y 0.82 8 2 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000

0.91

9.1

910

9,100

91,000

910,000

9,100,000

91,000,000

910,000,000

0.25

2 5

250

2,500

25,000

250,000

2,500,000

25,000,000

250,000,000

0.35

3 5

350

3,500

35,000

350,000

3,500,000

35,000,000

350,000,000

0.4

4 0

400

4,000

40,000

400,000

4,000,000

40,000,000

400,000,000

e 0.45 4 5 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000

0.5

5 0

500

5,000

50,000

500,000

5,000,000

50,000,000

500,000,000

0.6

6 0

600

6,000

60,000

600,000

6,000,000

60,000,000

600,000,000

0.7

7 0

700

7,000

70,000

700,000

7,000,000

70,000,000

700,000,000

0.8

8 0

800

8,000

80,000

800,000

8,000,000

80,000,000

800,000,000

y 0.9 9 0 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA

Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on

reeling quantities for commercial chips.

8 mm, 12 mm

or 16 mm Carrier Tape

178 mm (7.00")

330 mm (13.00")

Anti-Static Reel

Embossed Plastic* or

Punched Paper Carrier.

Embossment or Punched Cavity

Anti-Static Cover Tape

(.10 mm (.004") Maximum Thickness)

Chip and KPS Orientation in Pocket

(except 1825 Commercial, and 1825 and 2225 Military)

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

KEMET

Bar Code Label

Sprocket Holes

Table 5 – Carrier Tape Con guration – Embossed Plastic & Punched Paper (mm)

EIA Case Size Tape Size (W)* Pitch (P

01005 – 0402 8 2

0603 – 1210 8 4

1805 – 1808 12 4

≥ 1812 12 8

KPS 1210 12 8

KPS 1812 & 2220 16 12

Array 0508 & 0612 8 4

*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.

*Refer to Tables 6 & 7 for tolerance speci cations.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

Center Lines of Cavity

User Direction of Unreeling

Cover Tape

is for tape feeder reference only,

including draft concentric about B

ØD

ØDo

Embossment

For cavity size,

see Note 1 Table 4

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size D0

Minimum

Note 1

E1P0 P2

R Reference

Note 2

Minimum

Note 3

Maximum

8 mm

1.5 +0.10/-0.0

(0.059 +0.004/-0.0)

1.0

(0.039)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

25.0

(0.984)

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12 mm 1.5

(0.059)

(1.181)

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size Pitch

Maximum

Note 4

Minimum

F P1

Maximum

A0,B0 & K0

8 mm Single (4 mm)

4.35

(0.171)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

4.0 ±0.10

(0.157 ±0.004)

2.5

(0.098)

8.3

(0.327)

Note 512 mm

Single (4 mm) &

Double (8 mm)

8.2

(0.323)

10.25

(0.404)

5.5 ±0.05

(0.217 ±0.002)

8.0 ±0.10

(0.315 ±0.004)

4.6

(0.181)

12.3

(0.484)

16 mm Triple (12 mm)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05

(0.138 ±0.002)

12.0 ±0.10

(0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and

hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B1 dimension is a reference dimension for tape feeder clearance only.

5. The cavity de ned by A0, B0 and K0 shall surround the component with suf cient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).

(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

User Direction of Unreeling

Top Cover Tape

Center Lines of Cavity

ØDo Po

Cavity Size,

See

Note 1, Table 7

Bottom Cover Tape

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size D0E1P0P2T1 Maximum G Minimum

R Reference

Note 2

8 mm 1.5 +0.10 -0.0

(0.059 +0.004 -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

0.10

(0.004) Maximum

0.75

(0.030)

(0.984)

Variable Dimensions — Millimeters (Inches)

Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0

8 mm Half (2 mm) 6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

2.0 ±0.05

(0.079 ±0.002)

1.1

(0.098)

8.3

(0.327)

Note 1

8 mm Single (4 mm)

4.0 ±0.10

(0.157 ±0.004)

8.3

(0.327)

1. The cavity de ned by A0, B0 and T shall surround the component with suf cient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width Peel Strength

8 mm 0.1 to 1.0 Newton (10 to 100 gf)

12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf)

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°

from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Tape Maximum

Width (mm) Rotation (°

8,12 20

16 – 200 10 Tape Maximum

Width (mm) Rotation ( °

8,12 20

16 – 56 10

72 – 200 5

Typical Pocket Centerline

Typical Component Centerline

Figure 4 – Maximum Lateral Movement

0.5 mm maximum

8 mm & 12 mm Tape

1.0 mm maximum

16 mm Tape

Figure 5 – Bending Radius

Bending

Radius

Embossed

Carrier

Punched

Carrier

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Figure 6 – Reel Dimensions

AD(See Note)

Full Radius,

See Note

B(see Note)

Access Hole at

Slot Location

(Ø 40 mm minimum)

If present,

tape slot in core

for tape start:

2.5 mm minimum width x

10.0 mm minimum depth

W3(Includes

flange distortion

at outer edge)

W2(Measured at hub)

W1(Measured at hub)

(Arbor hole

diameter)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size A B Minimum CD Minimum

8 mm 178 ±0.20

(7.008 ±0.008)

330 ±0.20

(13.000 ±0.008)

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12 mm

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size N Minimum W

Maximum W

8 mm

(1.969)

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

14.4

(0.567)

Shall accommodate tape width

without interference

12 mm

12.4 +2.0/-0.0

(0.488 +0.078/-0.0)

18.4

(0.724)

16 mm

16.4 +2.0/-0.0

(0.646 +0.078/-0.0)

22.4

(0.882)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Figure 7 – Tape Leader & Trailer Dimensions

Trailer

160 mm Minimum

Carrier Tape

END START

Round Sprocket Holes

Elongated Sprocket Holes

(32 mm tape and wider)

Top Cover Tape

Punched Carrier

8 mm & 12 mm only

Embossed Carrier

Components

100 mm

Minimum Leader

400 mm Minimum

Figure 8 – Maximum Camber

Carrier Tape

Round Sprocket Holes

1 mm Maximum, either direction

Straight Edge

250 mm

Elongated sprocket holes

(32 mm & wider tapes)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

KEMET Corporation

World Headquarters

2835 KEMET Way

Simpsonville, SC 29681

Mailing Address:

P.O. Box 5928

Greenville, SC 29606

www.kemet.com

Tel: 864-963-6300

Fax: 864-963-6521

Corporate Of ces

Fort Lauderdale, FL

Tel: 954-766-2800

North America

Southeast

Lake Mary, FL

Tel: 407-855-8886

Northeast

Wilmington, MA

Tel: 978-658-1663

Central

Novi, MI

Tel: 248-994-1030

West

Milpitas, CA

Tel: 408-433-9950

Mexico

Guadalajara, Jalisco

Tel: 52-33-3123-2141

Europe

Southern Europe

Paris, France

Tel: 33-1-4646-1006

Sasso Marconi, Italy

Tel: 39-051-939111

Central Europe

Landsberg, Germany

Tel: 49-8191-3350800

Kamen, Germany

Tel: 49-2307-438110

Northern Europe

Bishop’s Stortford, United Kingdom

Tel: 44-1279-460122

Espoo, Finland

Tel: 358-9-5406-5000

Asia

Northeast Asia

Hong Kong

Tel: 852-2305-1168

Shenzhen, China

Tel: 86-755-2518-1306

Beijing, China

Tel: 86-10-5829-1711

Shanghai, China

Tel: 86-21-6447-0707

Taipei, Taiwan

Tel: 886-2-27528585

Southeast Asia

Singapore

Tel: 65-6586-1900

Penang, Malaysia

Tel: 60-4-6430200

Bangalore, India

Tel: 91-806-53-76817

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Other KEMET Resources

Tools

Resource Location

Con gure A Part: CapEdge http://capacitoredge.kemet.com

SPICE & FIT Software http://www.kemet.com/spice

Search Our FAQs: KnowledgeEdge http://www.kemet.com/keask

Electrolytic LifeCalculator http://www.kemet.com:8080/elc

Product Information

Resource Location

Products http://www.kemet.com/products

Technical Resources (Including Soldering Techniques) http://www.kemet.com/technicalpapers

RoHS Statement http://www.kemet.com/rohs

Quality Documents http://www.kemet.com/qualitydocuments

Product Request

Resource Location

Sample Request http://www.kemet.com/sample

Engineering Kit Request http://www.kemet.com/kits

Contact

Resource Location

Website www.kemet.com

Investor Relations http://www.kemet.com/ir

Call Us 1-877-MyKEMET

Twitter http://twitter.com/kemetcapacitors

Disclaimer

All product speci cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and

verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are

not intended to constitute – and KEMET speci cally disclaims – any warranty concerning suitability for a speci c customer application or use. The Information is intended for use only

by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise

provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still

occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective

circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not

be required.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Digitally signed by Jeannette Calvo

DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corp., ou=Marketing

Communications, cn=Jeannette Calvo, email=jeannettecalvo@kemet.com

Date: 2013.06.07 16:07:32 -04'00'