SN74LVC2G53 SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH 2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER www.ti.com SCES324M - JULY 2001 - REVISED FEBRUARY 2007 FEATURES * * * * * * Available in the Texas Instruments NanoFreeTM Package 1.65-V to 5.5-V VCC Operation High On-Off Output Voltage Ratio High Degree of Linearity High Speed, Typically 0.5 ns (VCC = 3 V, CL = 50 pF) Low On-State Resistance, Typically 96.5 (VCC = 4.5 V) Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 - 2000-V Human-Body Model (A114-A) - 200-V Machine Model (A115-A) - 1000-V Charged-Device Model (C101) * * DCT PACKAGE (TOP VIEW) DCU PACKAGE (TOP VIEW) COM 1 8 VCC INH 2 7 Y1 GND 3 6 Y2 GND 4 5 A COM INH GND GND 1 8 2 7 3 6 4 5 YZP PACKAGE (BOTTOM VIEW) VCC Y1 Y2 A GND GND INH COM 4 5 3 6 2 7 1 8 A Y2 Y1 VCC See mechanical drawings for dimensions. DESCRIPTION/ORDERING INFORMATION This dual analog multiplexer/demultiplexer is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC2G53 can handle both analog and digital signals. The device permits signals with amplitudes of up to 5.5 V (peak) to be transmitted in either direction. NanoFreeTM package technology is a major breakthrough in IC packaging concepts, using the die as the package. Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. ORDERING INFORMATION PACKAGE (1) TA -40C to 85C (2) TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC2G53YZPR _ _ _C4_ SSOP - DCT Reel of 3000 SN74LVC2G53DCTR C53_ _ _ Reel of 3000 SN74LVC2G53DCUR Reel of 250 SN74LVC2G53DCUT VSSOP - DCU (1) ORDERABLE PART NUMBER C53_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2001-2007, Texas Instruments Incorporated SN74LVC2G53 SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH 2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER www.ti.com SCES324M - JULY 2001 - REVISED FEBRUARY 2007 FUNCTION TABLE CONTROL INPUTS ON CHANNEL INH A L L L H Y2 H X None Y1 LOGIC DIAGRAM (POSITIVE LOGIC) A 5 SW SW INH 7 6 1 2 Y1 Y2 COM NOTE A: For simplicity, the test conditions shown in Figures 1 through 4 and 6 through 10 are for the demultiplexer configuration. Signals can be passed from COM to Y1 (Y2) or from Y1 (Y2) to COM. SIMPLIFIED SCHEMATIC, EACH SWITCH (SW) COM 2 Y Submit Documentation Feedback SN74LVC2G53 SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH 2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER www.ti.com SCES324M - JULY 2001 - REVISED FEBRUARY 2007 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range (2) -0.5 6.5 V VI Input voltage range (2) (3) -0.5 6.5 V -0.5 VCC + 0.5 range (2) (3) (4) UNIT VO Switch I/O voltage IIK Control input clamp current VI < 0 -50 mA II/OK I/O port diode current VI/O < 0 or VI/O > VCC 50 mA IT On-state switch current VI/O = 0 to VCC 50 mA 100 mA Continuous current through VCC or GND JA Package thermal impedance (5) Tstg (1) (2) (3) (4) (5) DCT package 220 DCU package 227 YZP package 102 Storage temperature range -65 V C/W C 150 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground, unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. This value is limited to 5.5 V maximum. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) MIN VCC Supply voltage VI/O I/O port voltage VCC = 1.65 V to 1.95 V VIH High-level input voltage, control input Low-level input voltage, control input VI 5.5 V 0 VCC V VCC x 0.65 VCC = 2.3 V to 2.7 V VCC x 0.7 VCC = 3 V to 3.6 V VCC x 0.7 VCC = 4.5 V to 5.5 V VCC x 0.7 t/v Input transition rise/fall time TA Operating free-air temperature VCC x 0.35 VCC x 0.3 VCC = 3 V to 3.6 V VCC x 0.3 VCC = 4.5 V to 5.5 V VCC x 0.3 0 5.5 VCC = 1.65 V to 1.95 V 20 VCC = 2.3 V to 2.7 V 20 VCC = 3 V to 3.6 V 10 VCC = 4.5 V to 5.5 V (1) V VCC = 2.3 V to 2.7 V Control input voltage UNIT 1.65 VCC = 1.65 V to 1.95 V VIL MAX V V ns/V 10 -40 85 C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback 3 SN74LVC2G53 SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH 2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER www.ti.com SCES324M - JULY 2001 - REVISED FEBRUARY 2007 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER ron TEST CONDITIONS VI = VCC or GND, VINH = VIL (see Figure 1 and Figure 2) On-state switch resistance ron(p) VI = VCC to GND, VINH = VIL (see Figure 1 and Figure 2) Peak on-state resistance Difference of on-state resistance between switches ron VI = VCC to GND, VC = VIH (see Figure 1 and Figure 2) VCC MIN TYP (1) MAX IS = 4 mA 1.65 V 13 30 IS = 8 mA 2.3 V 10 20 IS = 24 mA 3V 8.5 17 IS = 32 mA 4.5 V 6.5 13 IS = 4 mA 1.65 V 86.5 120 IS = 8 mA 2.3 V 23 30 IS = 24 mA 3V 13 20 IS = 32 mA 4.5 V 8 15 IS = 4 mA 1.65 V 7 IS = 8 mA 2.3 V 5 IS = 24 mA 3V 3 IS = 32 mA 4.5 V 2 1 UNIT IS(off) Off-state switch leakage current VI = VCC and VO = GND or VI = GND and VO = VCC, VINH = VIH (see Figure 3) 5.5 V IS(on) On-state switch leakage current VI = VCC or GND, VINH = VIL, VO = Open (see Figure 4) 5.5 V II Control input current VC = VCC or GND 5.5 V ICC Supply current VC = VCC or GND 5.5 V 1 A ICC Supply-current change VC = VCC - 0.6 V 5.5 V 500 A Cic Control input capacitance Cio(off) Switch input/output capacitance Cio(on) Switch input/output capacitance (1) 0.1 (1) 1 0.1 (1) 1 0.1 (1) 5V Y 3.5 A pF 10 5V A pF 6.5 5V COM A 19.5 pF TA = 25C Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 5) PARAMETER tpd (1) ten ten (2) tdis (3) (2) (3) 4 TO (OUTPUT) COM or Y Y or COM INH COM or Y A COM or Y (2) tdis (3) (1) FROM (INPUT) VCC = 1.8 V 0.15 V MIN VCC = 2.5 V 0.2 V MAX MIN 2 MAX VCC = 3.3 V 0.3 V MIN 1.2 MAX VCC = 5 V 0.5 V MIN 0.8 UNIT MAX 0.6 3.3 9 2.5 6.1 2.2 5.4 1.8 4.5 3.2 10.9 2.3 8.3 2.3 8.1 1.6 8 2.9 10.3 2.1 7.2 1.9 5.8 1.3 5.4 2.1 9.4 1.4 7.9 1.1 7.2 1 5 ns ns ns tPLH and tPHL are the same as tpd. The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). tPZL and tPZH are the same as ten. tPLZ and tPHZ are the same as tdis. Submit Documentation Feedback SN74LVC2G53 SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH 2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER www.ti.com SCES324M - JULY 2001 - REVISED FEBRUARY 2007 Analog Switch Characteristics TA = 25C PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS VCC CL = 50 pF, RL = 600 , fin = sine wave (see Figure 6) Frequency response (switch on) COM or Y Y or COM CL = 5 pF, RL = 50 , fin = sine wave (see Figure 6) CL = 50 pF, RL = 600 , fin = 1 MHz (sine wave) (see Figure 7) Crosstalk (1) (between switches) COM or Y Y or COM CL = 5 pF, RL = 50 , fin = 1 MHz (sine wave) (see Figure 7) Crosstalk (control input to signal output) INH CL = 50 pF, RL = 600 , fin = 1 MHz (square wave) (see Figure 8) COM or Y CL = 50 pF, RL = 600 , fin = 1 MHz (sine wave) (see Figure 9) Feedthrough attenuation (switch off) COM or Y Y or COM CL = 5 pF, RL = 50 , fin = 1 MHz (sine wave) (see Figure 9) CL = 50 pF, RL = 10 k, fin = 1 kHz (sine wave) (see Figure 10) Sine-wave distortion COM or Y Y or COM CL = 50 pF, RL = 10 k, fin = 10 kHz (sine wave) (see Figure 10) (1) TYP 1.65 V 35 2.3 V 120 3V 190 4.5 V 215 1.65 V >300 2.3 V >300 3V >300 4.5 V >300 1.65 V -58 2.3 V -58 3V -58 4.5 V -58 1.65 V -42 2.3 V -42 3V -42 4.5 V -42 1.65 V 35 2.3 V 50 3V 70 4.5 V 100 1.65 V -60 2.3 V -60 3V -60 4.5 V -60 1.65 V -50 2.3 V -50 3V -50 4.5 V -50 1.65 V 0.1 2.3 V 0.025 3V 0.015 4.5 V 0.01 1.65 V 0.15 2.3 V 0.025 3V 0.015 4.5 V 0.01 UNIT MHz dB mV dB % Adjust fin voltage to obtain 0 dBm at input. Operating Characteristics TA = 25C PARAMETER Cpd Power dissipation capacitance TEST CONDITIONS CL = 50 pF, f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V TYP TYP TYP TYP 9 10 10 12 Submit Documentation Feedback UNIT pF 5 SN74LVC2G53 SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH 2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER www.ti.com SCES324M - JULY 2001 - REVISED FEBRUARY 2007 PARAMETER MEASUREMENT INFORMATION VCC VCC A VIL or VIH VA INH VIL Y2 GND r on + V VI - VO Figure 1. On-State Resistance Test Circuit 100 VCC = 1.65 V VCC = 2.3 V r on - VIH 2 IS VCC = 3.0 V 10 VCC = 4.5 V 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 VI - V Figure 2. Typical ron as a Function of Input Voltage (VI) for VI = 0 to VCC 6 2 VO (On) 0.5 VIL S COM 1 0.0 VA 1 1 Y1 VINH VI = VCC or GND S Submit Documentation Feedback VI * VO W IS SN74LVC2G53 SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH 2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER www.ti.com SCES324M - JULY 2001 - REVISED FEBRUARY 2007 PARAMETER MEASUREMENT INFORMATION VCC A VIL or VIH VA INH VIH S VA 1 VIL 2 VIH 1 Y1 S VINH VO COM A VI VCC Y2 (Off) 2 GND Condition 1: VI = GND, VO = VCC Condition 2: VI = VCC, VO = GND Figure 3. Off-State Switch Leakage-Current Test Circuit VCC VA INH VIL VI VCC A VIL or VIH Y1 VA 1 VIL 2 VIH 1 S VINH A S VO COM Y2 2 VO = Open VI = VCC or GND (On) GND Figure 4. On-State Switch Leakage-Current Test Circuit Submit Documentation Feedback 7 SN74LVC2G53 SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH 2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER www.ti.com SCES324M - JULY 2001 - REVISED FEBRUARY 2007 PARAMETER MEASUREMENT INFORMATION From Output Under Test CL (see Note A) VLOAD S1 RL Open TEST GND tPLH/tPHL tPLZ/tPZL tPHZ/tPZH RL S1 Open VLOAD GND LOAD CIRCUIT INPUTS VCC 1.8 V 0.15 V 2.5 V 0.2 V 3.3 V 0.3 V 5 V 0.5 V VI tr/tf VCC VCC VCC VCC 2 ns 2 ns 2.5 ns 2.5 ns VM VLOAD CL RL VD VCC/2 VCC/2 VCC/2 VCC/2 2 VCC 2 VCC 2 VCC 2 VCC 30 pF 30 pF 50 pF 50 pF 1kW 500 W 500 W 500 W 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPHL tPLH VOH VM Output VM VOL VM VM VM 0V tPLZ tPZL VLOAD/2 VM VM VOL Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + VD VOL tPHZ TPZH VOH Output Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPHL VI Output Control VM VOH - VD VOH 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 Mhz, ZO = 50 W D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 5. Load Circuit and Voltage Waveforms 8 Submit Documentation Feedback SN74LVC2G53 SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH 2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER www.ti.com SCES324M - JULY 2001 - REVISED FEBRUARY 2007 PARAMETER MEASUREMENT INFORMATION VCC VIL or VIH VIL 0.1 F VCC A VA INH Y1 S VA 1 VIL 2 VIH 1 S VINH VO COM Y2 2 RL fin (On) 50 CL GND VCC/2 RL/CL: 600 /50 pF RL/CL: 50 /5 pF Figure 6. Frequency Response (Switch On) VIL or VIH A VCC VA TEST CONDITION VIL 20log10(VO2/VI) VCC VIH 20log10(VO1/VI) VA Y1 VIL 0.1 F INH VO1 RL 600 VINH CL 50 pF COM VCC/2 Rin 600 fin 50 Y2 VO2 GND RL 600 CL 50 pF VCC/2 Figure 7. Crosstalk (Between Switches) Submit Documentation Feedback 9 SN74LVC2G53 SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH 2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER www.ti.com SCES324M - JULY 2001 - REVISED FEBRUARY 2007 PARAMETER MEASUREMENT INFORMATION VCC VCC A VIL or VIH VA INH Y1 S VA 1 VIL 2 VIH 1 S VINH VO Y2 50 COM (On) 2 RL 600 CL 50 pF GND VCC/2 Rin 600 VCC/2 Figure 8. Crosstalk (Control Input, Switch Output) VCC VCC A VIL or VIH S VA 1 VIL 2 VIH VA INH VIL Y1 1 S VINH 0.1 F VO COM Y2 2 RL fin 50 RL (Off) GND VCC/2 VCC/2 RL/CL: 600 /50 pF RL/CL: 50 /5 pF Figure 9. Feedthrough (Switch Off) 10 Submit Documentation Feedback CL SN74LVC2G53 SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH 2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER www.ti.com SCES324M - JULY 2001 - REVISED FEBRUARY 2007 PARAMETER MEASUREMENT INFORMATION VCC VCC A VIL or VIH VA VIL 10 F INH Y1 VIL 2 VIH 10 F S VO Y2 (On) 600 VA 1 1 VINH COM fin S 2 RL 10 k CL 50 pF GND VCC/2 VCC = 1.65 V, VI = 1.4 VP-P VCC = 2.30 V, VI = 2.0 VP-P VCC = 3.00 V, VI = 2.5 VP-P VCC = 4.50 V, VI = 4.0 VP-P Figure 10. Sine-Wave Distortion Submit Documentation Feedback 11 PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) SN74LVC2G53DCTR ACTIVE SM8 DCT 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C53 Z SN74LVC2G53DCTRE4 ACTIVE SM8 DCT 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C53 Z SN74LVC2G53DCTRG4 ACTIVE SM8 DCT 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C53 Z SN74LVC2G53DCUR ACTIVE US8 DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 (53 ~ C53R) CZ SN74LVC2G53DCURE4 ACTIVE US8 DCU 8 TBD Call TI Call TI -40 to 85 SN74LVC2G53DCURG4 ACTIVE US8 DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C53R SN74LVC2G53DCUT ACTIVE US8 DCU 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (53 ~ C53R) CZ SN74LVC2G53DCUTE4 ACTIVE US8 DCU 8 TBD Call TI Call TI -40 to 85 SN74LVC2G53DCUTG4 ACTIVE US8 DCU 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC2G53YZPR ACTIVE DSBGA YZP 8 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM C53R -40 to 85 (C47 ~ C4N) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 1-Nov-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LVC2G53DCUR US8 DCU 8 3000 180.0 9.0 2.05 3.3 1.0 4.0 8.0 Q3 SN74LVC2G53DCURG4 US8 DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 SN74LVC2G53DCUTG4 US8 DCU 8 250 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 SN74LVC2G53YZPR DSBGA YZP 8 3000 178.0 9.2 1.02 2.02 0.63 4.0 8.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 1-Nov-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LVC2G53DCUR US8 DCU 8 3000 182.0 182.0 20.0 SN74LVC2G53DCURG4 US8 DCU 8 3000 202.0 201.0 28.0 SN74LVC2G53DCUTG4 US8 DCU 8 250 202.0 201.0 28.0 SN74LVC2G53YZPR DSBGA YZP 8 3000 220.0 220.0 35.0 Pack Materials-Page 2 MECHANICAL DATA MPDS049B - MAY 1999 - REVISED OCTOBER 2002 DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE 0,30 0,15 0,65 8 0,13 M 5 0,15 NOM CCCCC CCCCC CCCCC CCCCC 2,90 2,70 4,25 3,75 Gage Plane PIN 1 INDEX AREA 1 0,25 4 0 - 8 3,15 2,75 0,60 0,20 1,30 MAX Seating Plane 0,10 0,10 0,00 NOTES: A. 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