Features ! W NE Applications 100 % compatible with all previous generations of 1812 SMT devices Compatible with Pb and Pb-free solder reflow profiles Surface mount packaging for automated assembly Agency recognition: High Density Circuit Board Applications: Hard disk drives PC motherboards PC peripherals Point-of-sale (POS) equipment PCMCIA cards USB ports T V Rheinland MF-MSMF Series - PTC Resettable Fuses Electrical Characteristics Ihold Model V max. Volts I max. Amps MF-MSMF010 MF-MSMF014 MF-MSMF020 MF-MSMF030 MF-MSMF050 MF-MSMF075 MF-MSMF075/24 MF-MSMF110 MF-MSMF110/16 MF-MSMF125 MF-MSMF150 MF-MSMF160 MF-MSMF200 MF-MSMF250/16 MF-MSMF260 60.0 60.0 30.0 30.0 15.0 13.2 24.0 6.0 16.0 6.0 6.0 8.0 6.0 16.0 6.0 40 40 80 10 100 100 40 100 100 100 100 100 100 100 100 Itrip Resistance Amperes at 23 C Hold Trip Ohms at 23 C RMin. R1Max. 0.10 0.14 0.20 0.30 0.50 0.75 0.75 1.10 1.10 1.25 1.50 1.60 2.00 2.50 2.60 0.70 0.40 0.40 0.30 0.15 0.11 0.11 0.04 0.04 0.035 0.03 0.035 0.020 0.015 0.015 0.30 0.34 0.40 0.60 1.00 1.50 1.50 2.20 2.20 2.50 3.00 2.80 4.00 5.00 5.20 15.00 6.50 6.00 3.00 1.00 0.45 0.45 0.21 0.21 0.14 0.120 0.099 0.100 0.100 0.080 Max. Time To Trip Amperes at 23 C Seconds at 23 C 0.5 1.5 6.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 1.50 0.15 0.06 0.10 0.15 0.20 0.20 0.30 0.30 0.40 0.5 2.0 3.0 5.0 5.0 Tripped Power Dissipation Watts at 23 C Typ. 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 Environmental Characteristics Operating Temperature ......................................-40 C to +85 C Maximum Device Surface Temperature in Tripped State ................................................125 C Passive Aging......................................................+85 C, 1000 hours ....................................5 % typical resistance change Humidity Aging....................................................+85 C, 85 % R.H. 1000 hours ..................5 % typical resistance change Thermal Shock ....................................................+85 C to -40 C, 20 times ........................10 % typical resistance change Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change Condition A Test Procedures And Requirements For Model MF-MSMF Series Test Test Conditions Accept/Reject Criteria Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description Resistance ......................................In still air @ 23 C............................................................Rmin R R1max Time to Trip ....................................At specified current, Vmax, 23 C ..................................T max. time to trip (seconds) Hold Current ..................................30 min. at Ihold ..............................................................No trip Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning Solderability ....................................ANSI/J-STD-002 ............................................................95 % min. coverage UL File Number ..................................E174545 http://www.ul.com/ Follow link to Certifications, then UL File No., enter E17454 CSA File Number ................................CA110338 http://directories.csa-international.org/ Under "Certification Record" and "File Number" enter 110338-0-000 (Model MF-MSMF110 is CSA approved) TUV Certificate Number......................R 02057213 http://www.tuvdotcom.com/ Follow link to "other certificates", enter File No. 2057213 (Model MF-MSMF110 is TUV approved) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Additional Features Standard 4532 mm (1812 mils) footprint Symmetrical design Patents pending MF-MSMF Series - PTC Resettable Fuses Product Dimensions A Model Min. 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) MF-MSMF010 MF-MSMF014 MF-MSMF020 MF-MSMF030 MF-MSMF050 MF-MSMF075 MF-MSMF075/24 MF-MSMF110 MF-MSMF110/16 MF-MSMF125 MF-MSMF150 MF-MSMF160 MF-MSMF200 MF-MSMF250/16 MF-MSMF260 B Max. 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) Min. 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) C Max. 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) Packaging: MF-MSMF010 through MF-MSMF030 = 1500 pcs. per reel. MF-MSMF050 through MF-MSMF200 & MF-MSMF260 = 2000 pcs. per reel. MF-MSMF250/16 = 1000 pcs. per reel. Top and Bottom View A Side View Recommended Pad Layout C 1.5 0.05 (.059 .002) 2.7 0.1 (.106 .004) D Min. 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) Max. 1.10 (0.043) 1.10 (0.043) 1.10 (0.043) 1.10 (0.043) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.75 (0.030) 0.75 (0.030) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 2.00 (0.078) 0.85 (0.033) UNIT = 1.5 0.05 (.059 .002) Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. Optional Sn finish: Meets ANSI/J-STD-002 Category 3. D Recommended Storage: 40 C max./70 % RH max. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MM (INCHES) Terminal material: Electroless Ni under immersion Au 3.2 0.1 (0.126 .004) B Min. 0.70 (0.028) 0.70 (0.028) 0.70 (0.028) 0.70 (0.028) 0.55 (0.015) 0.55 (0.015) 0.55 (0.015) 0.45 (0.018) 0.45 (0.018) 0.55 (0.015) 0.55 (0.015) 0.55 (0.015) 0.55 (0.015) 1.00 (0.039) 0.48 (0.019) MF-MSMF Series - PTC Resettable Fuses How to Order Typical Time to Trip at 23 C 100 MF - MSMF 075/24 T - 2 Multifuse(R) Product Designator MF-MSMF200 MF-MSMF010 Series MSMF = 4532 mm (1812 mils) Surface Mount Component Time to Trip (Seconds) 10 Hold Current, Ihold 010-260 (0.10 Amps - 2.60 Amps) MF-MSMF030 Higher Voltage Option __ = Standard Voltage /16 = 16 Volt Rated /24 = 24 Volt Rated 1 Optional Terminal Finish __ = Standard Au Finish T = Optional Sn Finish 0.1 MF-MSMF260 MF-MSMF250/16 Packaging Packaged per EIA 481-1 -2 = Tape and Reel MF-MSMF160 0.01 MF-MSMF150 MF-MSMF125 MF-MSMF110 MF-MSMF075 MF-MSMF110/16 MF-MSMF014 MF-MSMF020 MF-MSMF075/24 MF-MSMF050 0.001 1 0.1 10 Typical Part Marking Represents total content. Layout may vary. 100 113G Fault Current (Amps) The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. MANUFACTURER'S TRADEMARK DATE CODE: WEEK 1 AND 2 OF 2003 = 3A WEEK 51 AND 52 OF 2003 = 3Z PART IDENTIFICATION EXAMPLES: MF-MSMF050 = 50 MF-MSMF075 = 75 MF-MSMF110 = 11 MF-MSMF150 = 15 Solder Reflow Recommendations 300 Preheating Soldering Cooling Temperature (C) 250 200 150 100 50 0 160-220 10-20 120 Time (seconds) Notes: * MF-MSMF models cannot be wave soldered. * If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. * Compatible with Pb and Pb-free solder reflow profiles. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MF-MSMF Series - PTC Resettable Fuses Thermal Derating Chart - Ihold / Itrip (Amps) Ambient Operating Temperature Model MF-MSMF010 MF-MSMF014 MF-MSMF020 MF-MSMF030 MF-MSMF050 MF-MSMF075 MF-MSMF075/24 MF-MSMF110 MF-MSMF110/16 MF-MSMF125 MF-MSMF150 MF-MSMF160 MF-MSMF200 MF-MSMF250/16 MF-MSMF260 -40 C 0.16 / 0.32 0.23 / 0.52 0.29 / 0.58 0.44 / 0.88 0.77 / 1.54 1.15 / 2.30 1.15 / 2.30 1.59 / 3.18 1.59 / 3.18 1.80 / 3.61 2.17 / 4.34 2.30 / 5.00 3.08 / 5.40 3.9 / 7.8 4.00 / 7.98 -20 C 0.14 / 0.28 0.19 / 0.45 0.26 / 0.52 0.39 / 0.78 0.68 / 1.36 1.01 / 2.02 1.01 / 2.02 1.43 / 2.86 1.43 / 2.86 1.63 / 3.25 1.95 / 3.90 2.20 / 4.40 2.71 / 4.74 3.42 / 6.84 3.52 / 7.01 0 C 0.12 / 0.24 0.17 / 0.40 0.23 / 0.46 0.35 / 0.70 0.59 / 1.18 0.88 / 1.76 0.88 / 1.76 1.26 / 2.52 1.26 / 2.52 1.43 / 2.86 1.72 / 3.44 1.90 / 3.80 2.35 / 4.11 2.96 / 5.92 3.06 / 6.09 23 C 0.11 / 0.22 0.14 / 0.34 0.20 / 0.40 0.30 / 0.60 0.50 / 1.00 0.75 / 1.50 0.75 / 1.50 1.10 / 2.20 1.10 / 2.20 1.25 / 2.50 1.50 / 3.00 1.60 / 2.80 2.00 / 3.50 2.50 / 5.00 2.60 / 5.15 40 C 0.08 / 0.16 0.12 / 0.29 0.17 / 0.34 0.26 / 0.52 0.44 / 0.88 0.65 / 1.30 0.65 / 1.30 0.95 / 1.90 0.95 / 1.90 1.08 / 2.16 1.30 / 2.59 1.45 / 2.90 1.80 / 3.15 2.24 / 4.48 2.34 / 4.64 50 C 0.07 / 0.14 0.10 / 0.25 0.15 / 0.30 0.23 / 0.46 0.40 / 0.80 0.60 / 1.20 0.60 / 1.20 0.87 / 1.74 0.87 / 1.74 0.99 / 1.98 1.18 / 2.37 1.30 / 2.60 1.60 / 2.80 1.98 / 3.96 2.08 / 4.13 Circuit Protection Division Asia-Pacific: Tel: +886-2 2562-4117 Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 Fax: +41-41 768 5510 North America: Tel: +1-909 781-5500 Fax: +1-909 781-5700 Tel: +1-951 781-5500 (after 7/17/04) Fax: +1-951 781-5700 (after 7/17/04) www.bourns.com MF-MSMF SERIES, REV. D, 05/04 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 60 C 0.06 / 0.12 0.09 / 0.23 0.14 / 0.28 0.21 / 0.42 0.37 / 0.74 0.55 / 1.10 0.55 / 1.10 0.80 / 1.60 0.80 / 1.60 0.91 / 1.82 1.09 / 2.18 1.15 / 2.30 1.50 / 2.63 1.85 / 3.70 1.95 / 3.87 70 C 0.05 / 0.10 0.08 / 0.21 0.12 / 0.24 0.18 / 0.36 0.33 / 0.66 0.49 / 0.98 0.49 / 0.98 0.71 / 1.42 0.71 / 1.42 0.81 / 1.62 0.97 / 1.94 1.03 / 2.06 1.40 / 2.40 1.29 / 2.58 1.39 / 2.74 85 C 0.03 / 0.06 0.06 / 0.16 0.10 / 0.20 0.15 / 0.30 0.29 / 0.58 0.43 / 0.86 0.43 / 0.86 0.60 / 1.20 0.60 / 1.20 0.68 / 1.36 0.82 / 1.64 0.91 / 1.82 1.25 / 2.10 0.94 / 1.88 1.04 / 2.05 MF-MSMF Series Tape and Reel Specifications MF-MSMF010 - MF-MSMF030 per EIA-481-1 MF-MSMF050 - MF-MSMF260 per EIA 481-1 MF-MSMF250/16 per EIA 481-1 W 12.0 0.30 (0.472 0.012) 12.0 0.30 (0.472 0.012) 12.0 0.30 (0.472 0.012) P0 4.0 0.10 (0.157 0.004) 4.0 0.10 (0.157 0.004) 4.0 0.10 (0.157 0.004) P1 P2 8.0 0.10 (0.315 0.004) 2.0 0.05 (0.079 0.002) 8.0 0.10 (0.315 0.004) 2.0 0.05 (0.079 0.002) 8.0 0.10 (0.315 0.004) 2.0 0.05 (0.079 0.002) A0 3.58 0.10 (0.141 0.004) 3.66 0.15 (0.144 0.006) 3.43 0.10 (0.135 0.004) B0 4.93 0.10 (0.194 0.004) 4.98 0.10 (0.196 0.004) 4.83 0.10 (0.190 0.004) 5.9 (0.232) 1.5 + 0.10/-0.00 (0.059 + 0.004/-0) 5.5 0.05 (0.217 0.002) 1.75 0.10 (0.069 0.004) 5.9 (0.232) 1.5 + 0.10/-0.00 (0.059 + 0.004/-0) 5.5 0.05 (0.217 0.002) 1.75 0.10 (0.069 0.004) 5.9 (0.232) 1.5 + 0.10/-0.00 (0.059 + 0.004/-0) 5.5 0.05 (0.217 0.002) 1.75 0.10 (0.069 0.004) 10.25 (0.404) 0.6 (0.024) 0.1 (0.004) 10.25 (0.404) 0.6 (0.024) 0.1 (0.004) 10.25 (0.404) 0.6 (0.024) 0.1 (0.004) 1.30 0.10 (0.051 0.004) 0.95 0.10 (0.037 0.004) 1.70 0.10 (0.067 0.004) 390 (15.35) 160 (6.30) 390 (15.35) 160 (6.30) 390 (15.35) 160 (6.30) 185 (7.28) 50 (1.97) 185 (7.28) 50 (1.97) 185 (7.28) 50 (1.97) 12.4 + 2.0/-0.0 (0.488 + 0.079/-0.0) 18.4 (0.724) 12.4 + 2.0/-0.0 (0.488 + 0.079/-0.0) 18.4 (0.724) 12.4 + 2.0/-0.0 (0.488 + 0.079/-0.0) 18.4 (0.724) Tape Dimensions B1 max. D0 F E1 E2 min. T max. T1 max. K0 Leader min. Trailer min. Reel Dimensions A max. N min. W1 W2 max. UNIT = P0 T D0 P2 MM (INCHES) E1 W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 P1 A0 W1(MEASURED AT HUB) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.