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Innovative Technology
for a Connected World
TflexTM 500 Series
Thermal Gap Filler
COMPLIANT 2.8 W/mK THERMALLY CONDUCTIVE GAP FILLER
Tex™ 500 is a compliant elastomer gap ller designed to provide excellent thermal
performance while remaining cost effective. This soft interface pad conforms well with
minimal pressure, resulting in little or no stress on mating parts. Tex™ 500’s unique
silicone and ller combination has extremely low silicone extractables compared to many
other silicone interface products. Tex™ 500 meets NASA outgassing specication.
Tex™ 500 is naturally tacky, no adhesive coating is required. Tex™ 500 is electrically
insulating, stable from -50ºC to 200ºC and is certied to UL 94V0 ammability rating.
FEATURES AND BENEFITS
• Thermal conductivity 2.8 W/mK
• Highly compliant and cost effective
• Low thermal resistance even at low pressure
• Available in thicknesses from 0.020-inch (0.25mm) through
0.200-inch (5.0mm) in 0.010-inch increments
• Naturally tacky for easy assembly
• Low silicone extractables
APPLICATIONS
• Cooling components to chassis
• Telecommunication hardware
• Thermal module for notebook computer
• LED solid state lighting
• Power electronics
• Computer servers
• Graphics cards
• Gaming systems
• LCD and PDP at panel displays
• Industrial automation equipment
• Wireless infrastructure
• Fragile ASIC components
• Automotive engine control
• IT devices
• Military electronics
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermal
Innovative Technology
for a Connected World
TflexTM 500 Series
Thermal Gap Filler
THR-DS-Tex-500 0110
Any information furnished by Laird Technologies and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies
materials rests with the end user since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the tness,
merchantability, or suitability of any Laird Technologies materials or products for any specic or general uses. Laird Technologies shall not be liable for incidental or
consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies domestic terms and conditions of sale in effect from time to
time, a copy of which will be furnished upon request.damages of any kind. All Laird Technologies’ products are sold pursuant to the Laird Technologies’ domestic terms and
conditions of sale in effect from time to time, a copy of which will be furnished upon request. Document A15958-00 Rev B, 11/2009.
© 2010 All Rights Reserved. Laird Technologies is a registered trademark of Laird Technologies, Inc.
STANDARD THICKNESSES
0.020 to 0.200-inch (0.25 to 5.0mm).
0.020 to 0.030-inch (0.5 to 0.76mm) thick material come standard with fiberglass reinforcement.
0.020 through 0.200 thick material available in 0.010-inch (0.25mm) increments.
OPTIONS
Proprietary DC1 option available to eliminate tack from top side to aid in handling.
MATERIAL NAME AND THICKNESS
Tflex™ indicates Laird Technologies’ brand thermally conductive elastomeric gap filler
product. 5xxx indicates ‘500 series’ 2.8 W/mK material, and xxx indicates thickness in -mil
(0.001-inches); -DC1 designates proprietary tack eliminating option
Examples:
Tex™ 5120 = 0.120-inch thick material
Tex™ 5120-DC1 = 0.0120-inch thick material with proprietary DC1 option
TexTM 500
Preliminary TEST METHOD
Construction Filled silicone
elastomer NA
Color Light Blue Visual
Thermal Conductivity 2.8 W/mK ASTM D5470
Hardness (Shore 00) 40
(at 3 second delay) ASTM D2240
Density 3.0 g/cc Helium
Pycnometer
Standard Thickness
Range
0.020" - 0.200"
(0.5 - 5.1mm)
Thickness Tolerance ±10%
UL Flammability Rating 94 V0 UL
Temperature Range -50ºC to 200ºC NA
Volume Resistivity 10^13 ohm-cm ASTM D257
Outgassing TML 0.29% ASTM E595
Outgassing CVCM 0.04% ASTM E595
Coefcient Thermal
Expansion (CTE)
37.4 ppm/ºC
70ºC-130ºC
IPC-TM-650
2.4.24
TflexTM 500 TYPICAL PROPERTIES
Thermal Gap Filler Preliminary
0.0
0.5
1.0
1.5
2.0
0 10 20 30 40 50 60 70 80
Thermal Resistance (°C-in2/W)
Pressure (psi, 1 psi = 6.9 KPa)
Tflex 500 Thermal Resistance verse Pressure
5200
5160
5120
5100
580
560
540
520
5200
5160
5120
5100
580
560
540
520
0%
10%
20%
30%
40%
50%
60%
70%
80%
0 10 20 30 40 50 60 70 80 90 100 1 1 0
% Deflection
Pressure (psi, 1 psi = 6.9 KPa)
Tflex 500 Defection verse Pressure (ASTM D575)
Mouser Electronics
Authorized Distributor
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Laird Technologies:
A14564-01 A14950-10 A14565-01 A14950-12 A14567-01 A14568-01 A14950-14 A14570-01 A14950-16
A14571-01 A14572-01 A14950-18 A14573-01 A14556-02 A14574-01 A14950-20 A14950-02 A14557-02 A14557-
01 A14950-03 A14558-02 A14950-04 A14559-02 A14559-01 A14950-05 A14560-02 A14950-06 A14561-02
A14561-01 A14950-07 A14562-02 A14950-08 A14563-02 A14563-01 A14950-09 A14560-01 A14556-01 A14562-
01 A14558-01 A14566-01 A14569-03