© Semiconductor Components Industries, LLC, 2007
October, 2018 − Rev. 7
1Publication Order Number:
NZL5V6AXV3T1/D
NZL5V6AXV3T1 Series
ESD Protection Diode
Dual Common Anode
These dual monolithic silicon ESD protection diodes are intended for
use in voltage and ESD sensitive equipment such as computers,
printers, business machines, communication systems, medical
equipment and other applications. Their dual junction common anode
design protects two separate lines using only one package. These
devices are ideal for situations where board space is at a premium.
Specification Features:
•SC−89 Package Allows Either Two Separate Unidirectional
Configurations or a Single Bidirectional Configuration
•ESD Rating of Class N (exceeding 16 kV) per the
Human Body Model
•Meets IEC61000−4−2 Level 4
•Low Leakage < 5.0 mA
•SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics:
CASE: Void-free, Transfer-molded, Thermosetting Plastic
Epoxy Meets UL 94, V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE:
260°C Device Meets MSL 1 Requirements
SC−89
CASE 463C
STYLE 4
1
3
2
PIN 1. CATHODE
2. CATHODE
3. ANODE
Device Package Shipping†
ORDERING INFORMATION
NZL5V6AXV3T1G SC−89 3000/Tape & Reel
NZL6V8AXV3T1G SC−89
NZL7V5AXV3T1G
3000/Tape & Reel
MARKING
DIAGRAM
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
DEVICE MARKING INFORMATION
www.onsemi.com
Lx G
G
1
3
2
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
SZNZL7V5AXV3T1G SC−89
3000/Tape & ReelSZNZL6V8AXV3T1G SC−89
SZNZL5V6AXV3T1G SC−89 3000/Tape & Reel
SC−89
L = Device Code
x = Specific Device
M = Date Code
G= Pb−Free Package
(Note: Microdot may be in either location)
M
3000/Tape & Reel
3000/Tape & Reel
10000/Tape & ReelNZL6V8AXV3T3G SC−89
10000/Tape & ReelSZNZL6V8AXV3T3G SC−89
Uni−Directional Zener
IPP
IF
V
I
IR
IT
VRWM
VCVBR
VF
NZL5V6AXV3T1 Series
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2
MAXIMUM RATINGS
Rating Symbol Value Unit
Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C
Derate above 25°C
°PD°240
1.9
°mW°
mW/°C
Thermal Resistance Junction to Ambient RqJA 525 °C/W
Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C
Lead Solder Temperature − Maximum (10 Second Duration) TL260 °C
IEC61000−4−2 Contact
IEC61000−4−2 Air
ESD 10
10
kV
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. FR−5 board with minimum recommended mounting pad.
*Other voltages may be available upon request.
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3)
Symbol Parameter
VRWM Working Peak Reverse Voltage
IRMaximum Reverse Leakage Current @ VRWM
VBR Breakdown Voltage @ IT
ITTest Current
IFForward Current
VFForward Voltage @ IF
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max @ IF = 10 mA for all types)
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3)
Device
Device
Marking
VRWM
IR @
VRWM
Breakdown Voltage Surge
VBR (Note 2) (V) @ IzT
VC (V) @
IPP = 1.0
A†
VC (V) @
Max IPP†
Max IPP
(A)†
Ppk
(W)†
VmAMin Nom Max mA Typ Max Typ
NZL5V6AXV3T1 L0 3.0 5.0 5.32 5.6 5.88 5.0 7.0 10.1 4.8 50
NZL6V8AXV3T1 L2 4.5 1.0 6.46 6.8 7.14 5.0 7.9 11.9 6.7 73
NZL6V8AXV3T3 L2 4.5 1.0 6.46 6.8 7.14 5.0 7.9 11.9 6.7 73
NZL7V5AXV3T1 L3 5.0 1.0 7.12 7.5 7.88 5.0 8.8 13.5 5.7 75
2. VBR measured at pulse test current IT at an ambient temperature of 25°C.
† Surge current waveform per Figure 5.
NZL5V6AXV3T1 Series
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3
TYPICAL CHARACTERISTICS
−55 + 45
9.0
Figure 1. Typical Breakdown Voltage
versus Temperature
−5
TEMPERATURE (°C)
+ 95 + 145
8.0
7.0
6.0
5.0 −55 −5
250
Figure 2. Typical Leakage Current
versus Temperature
TEMPERATURE (°C)
+45 +95
200
150
100
50
0
BREAKDOWN VOLTAGE (VOLTS) (VBR @ IT)
IR (nA)
5V6
6V8
+ 145
5V6
6V8
7V5
Figure 3. Typical Capacitance versus Bias Voltage
(Upper curve for each part is unidirectional mode,
lower curve is bidirectional mode)
0 25 50 75 100 125 150 175
300
250
200
150
100
50
0
Figure 4. Steady State Power Derating Curve
TEMPERATURE (°C)
FR−5 BOARD
PD, POWER DISSIPATION (mW)
0
5
10
15
20
25
30
35
40
45
50
0 0.4 0.8 1.2 1.6 2.0
VOLTAGE (V)
CAPACITANCE (pF)
7V5
5V6 6V8 7V5
Figure 5. 8 x 20 ms Pulse Waveform
100
90
80
70
60
50
40
30
20
10
0020406080
t, TIME (ms)
% OF PEAK PULSE CURRENT
tP
tr
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
PEAK VALUE IRSM @ 8 ms
HALF VALUE IRSM/2 @ 20 ms
NZL5V6AXV3T1 Series
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5
TYPICAL COMMON ANODE APPLICATIONS
A dual junction common anode design in an SC−89
package protects two separate lines using only one package.
This adds flexibility and creativity to PCB design especially
when board space is at a premium. Two simplified examples
of surge protection applications are illustrated below.
KEYBOARD
TERMINAL
PRINTER
ETC.
FUNCTIONAL
DECODER
I/O
A
NZLxxxAXV3T1
GND
Figure 8. Computer Interface Protection
B
C
D
Figure 9. Microprocessor Protection
I/O
RAM ROM
CLOCK
CPU
CONTROL BUS
ADDRESS BUS
DATA BUS
GND
VGG
VDD
NZLxxxAXV3T1
NZLxxxAXV3T1
NZL5V6AXV3T1 Series
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6
PACKAGE DIMENSIONS
SC−89, 3−LEAD
CASE 463C−03
ISSUE C
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE
G
M
0.08 (0.003) X
D3 PL
J
−X−
−Y−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
4. 463C−01 OBSOLETE, NEW STANDARD 463C−02.
A
B
Y
12
3
N
2 PL
K
C
−T−SEATING
PLANE
DIM
A
MIN NOM MIN NOM
INCHES
1.50 1.60 1.70 0.059
MILLIMETERS
B0.75 0.85 0.95 0.030
C0.60 0.70 0.80 0.024
D0.23 0.28 0.33 0.009
G0.50 BSC
H0.53 REF
J0.10 0.15 0.20 0.004
K0.30 0.40 0.50 0.012
L1.10 REF
M−−− −−− 10 −−−
N−−− −−− 10 −−−
S1.50 1.60 1.70 0.059
0.063 0.067
0.034 0.040
0.028 0.031
0.011 0.013
0.020 BSC
0.021 REF
0.006 0.008
0.016 0.020
0.043 REF
−−− 10
−−− 10
0.063 0.067
MAX MAX
_
_
_
_
M
S
H
H
L
G
RECOMMENDED PATTERN
OF SOLDER PADS
SOLDERING FOOTPRINT
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