128
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Horizontal
Type
Vertical
Type
SPED3/4/5
Smooth and linear operation feeling
3.8mm-travel Push-push Type
SPED53※
Japan Export
1
Poles
Non shorting
Changeover
timing
For PC board
−
−
Terminal type
1,12 0280
960240
2,500500
Minimum order unit （pcs.）
Alternate
Operation
SPED420200
SPED310200
Product No.
2
3
1
Drawing
No.
Product Line
PC board
With wire
Connector
Mounting
method
3.8
Total travel
（mm）
※ If the lead wire length and color are not specified, length (terminal ① and ② : 125mm, common terminal: 45mm), color
can be specified from black, white, and light green freely. Please consult us for modification.
Note
SPED3 SPED4 SPED5
■Typical Specifications
Items Specifications
Rating （Resistive load）
2A 14.5V DC
Contact resistance
（Initial / After operating life）
100mΩ max. / 100mΩ max.
Operating force
4.17±0.74N
Operating life （With load）
30,000 cycles （2A 14.5V DC）
Circuit configuration
1-pole, 2-position
Refer to P.130 for soldering conditions.
Product No. Number of packages （pcs.）
Export package measurements
（mm）
1 case /
Japan
1 case / export packing
SPED310200 500 2,500
400×270×290
SPED53
240 960
Bulk
Product No. Number of packages （pcs.）
Export package measurements
（mm）
1 case /
Japan
1 case / export packing
SPED420200 280 1,12 0 555×375×223
Packing Specifications
Tray
129
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Horizontal
Type
Vertical
Type
2.7
2.89
13%0.38
18
6.2
4-1
14
ø9.7
ø11.3
16.12
14.27
13.17
16.97
1.2
8.5
4.6
0.8
（Mechanical and Electrical）
Turnover point
Full stroke point
Reset point
ø5.7
16.2
4.06
4.06
3-1.5
Terminal No.C
Terminal No.2
Terminal No.1
3.5
3.4
A
SPED3/4/5／3.8mm-travel Push-push Type
Style
12
C
Circuit Diagram
（Viewed from direction A）
Unit:mm
Factory setting for contact points can be either 1 or 2.
Note
No. Reference dimension of connection terminal
（T=0.5 〜 0.65mm）
5〜8
4
1.6
4
（2）
3-ø1.91 hole
4.06
2-ø3.56 hole
13.28
4.06
(t=1.6)
10.11
PC board mounting hole dimensions
（Viewed from the direction A）
1
2
3
Dimensions
Wire length
Strip length
2
C
1
8
ø5.5 ø4.6
ø10
18.2
6.2 8-1
13.5
ø11.15
ø9.7
10.35
8.5
7.4
4.8
20.7
1.2
11.2
0.8
（Mechanical and Electrical）
Turnover point
Full stroke point
Reset point
5.5
ø4.7
ø3.8
1.2
2.6
A
110
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Horizontal
Type
Vertical
Type
Series Vertical
SPEF SPED2 SPED3 SPED4 SPED5
Photo
Dimensions
（mm）
W
9.4 14 13 . 5
D
916 . 8 18 18 . 2
H
6.9 18 . 3 13 . 2 13 .1 14 . 3
Travel （mm）
1. 5 — — — —
Total travel （mm）
2.7 4.5 3.8
Number of poles
11
21
Operating
temperature range
−40℃ to ＋85℃ −40℃ to ＋95℃
Automotive use
●●●●●●
Life cycle
Rating （max.）
（Resistive load）
1A 14.5 V D C 2 A 14.5 V D C
Rating （min.）
（Resistive load）
50μA 3V DC ————
Durability
Operating life
without load
——————
Operating life with load
（at max. rated load）
30,000 cycles 100mΩ max.
Electrical
performance
Initial contact
resistance
10 0mΩ m a x .
Insulation
resistance
3 MΩ min . 10 0 V D C 3MΩ min. 500V DC
Voltage proof
10 0 V A C f o r 1m inu te
Mechanical
performance
Terminal
strength
—————
Wire strength 30N
Actuator
strength
Operating
direction
90N 98N 90N 98N
Pulling
direction
30N — — — —
Environmental
performance
Cold
−40℃ 96h
Dry heat
85℃ 96h
85℃ 96h (Connector type)
105℃ 192h (Dip type)
10 5 ℃ 192 h
Damp heat
40℃, 90 to 95%RH 96h
Page
12 4 12 6 12 8
Push Switches Soldering Conditions ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 130
Push Switches Cautions ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 131
Note
● Indicates applicability to all products in the series.
List of Varieties
Push Switches
130
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Horizontal
Type
Vertical
Type
Soldering time
SPEH
Series
Series
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface).
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
300
200
100
A max.
B
E
D
Time (s)
C
Pre-heating
F max.
Room
temperature
Temperature (˚C )
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's
temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc.
The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
Notes
260
Series（Reflow type）
230 40 18 0 15 0 12 0
SPEJ
SPEF
A（℃）
3s max. B（℃） C（s） D（℃） E（℃） F（s）
10 ±1s
Soldering temperature Duration of immersion
Preheating temperature
Preheating time
SPPJ2, SPPH1, SPED2, SPED4, SPEF
SPUJ, SPPH4
SPUN
SPPJ3 10 0℃ ma x . 60s max. 260±5℃ 5 ±1s
10 0℃ ma x . 60s max. 260±5℃ 10 ±1s
—260±5℃ 5 ±1s
—260±5℃
Items Dip soldering
Reference for Dip Soldering
(For PC board terminal types)
3 0 0 ±10 ℃
SPUJ 3 +1/ 0 s
350℃ max.
SPEH
SPEF
SPEJ
SPED2, SPED4
SPPJ3, SPPJ2, SPUN, SPPH4, SPPH1 3 5 0 ±10 ℃ 3 +1/ 0 s
3 5 0 ±10 ℃ 3±0.5s
3 5 0 ±10 ℃ 4s max.
350±5℃ 3s max.
3s max.
Soldering temperature
Reference for Hand Soldering
For PC board 端子タイプに適用
Push Switches / Soldering Conditions
