MOTOROLA SEMICONDUCTOR TECHNICAL DATA Switching Diode This switching diode has the following features: SOD-123 Surface Mount Package High Breakdown Voltage Fast Speed Switching Time Available in 8 mm Tape and Reel Use MMSD914T1 to order the 7 inch/3,000 unit reel Use MMSD914T3 to order the 13 inch/10,000 unit reel Order this document by MMSD914T1/D MMSD914T1 Motorola Preferred Device 1o}q0 2 CASE 425, STYLE 1 CATHODE ANODE SOD-123 MAXIMUM RATINGS Rating Symbol Value Unit Continuous Reverse Voltage VR 100 Vde Peak Forward Current IF 200 mAdc Peak Forward Surge Current IFM(surge) 500 mA DEVICE MARKING MMSD914T1 = 5D THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation FR-5 Board (1) Pp 225 mw Ta = 25C Derate above 25C 1.8 mW Thermal Resistance Junction to Ambient Reva 556 C Total Device Dissipation Pb 300 mw Alumina Substrate (2) Ta = 25C Derate above 25C 2.4 mW Thermal Resistance Junction to Ambient Resa 417 CW Junction and Storage Temperature TJ, Tstg 55 to +150 C ELECTRICAL CHARACTERISTICS (Ta = 25C unless otherwise noted) Characteristic Symbol Min | Max Unit OFF CHARACTERISTICS Reverse Breakdown Voltage (IBR = 100 WA) V(BR) 100 _ Vv Reverse Voltage Leakage Current (VR = 20 V) IR _ 25 nA (VR =75V) 5.0 yA Forward Voltage (IF = 10 mA) VE _ 1000 mV Diode Capacitance (Vp = 0 V, f = 1.0 MHz) Cp _ 4.0 pF Reverse Recovery Time (IF = |W = 10 mA) (Figure 1) ter 4.0 ns (1) FR-5 = 1.0 x 0.75 x 0.062 in. (2) Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina. Preferred devices are Motorola recommended choices for future use and best overall value. 3/94 Motorola, Inc. 1994 mm@ 347255 0048eb0 &ec (MA) MOTOROLA820 Q VW rh +10V 2k 0.1 UF 4 t t t k 100 pH {i L >| bt 0.1 uF rT ~ 10% typ >| t> jf | >} | | | tl | | | | tor 50 Q OUTPUT 50 Q INPUT 90% PULSE SAMPLING iR(REC) = 1 mA GENERATOR OSCILLOSCOPE | Vp IR- INPUT SIGNAL OUTPUT PULSE L L (IF = IR = 10 mA; measured = = at iR(REC) = 1 mA) Notes: 1. A 2.0 kQ variable resistor adjusted for a Forward Current (IF) of 10 mA. 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. 3. tp ter Figure 1. Recovery Time Equivalent Test Circuit 10 Ta = 150C = < ; Ta = 125C ei a oc a Ss s Ta = 85C Oo of a tL c an <x oc = w Ta = 55C 2 cc hL u Fa Tp = 25C . 0.001 0.2 0.4 0.6 0.8 1 1.2 0 10 20 30 40 50 Ve, FORWARD VOLTAGE (VOLTS) Vp, REVERSE VOLTAGE (VOLTS) Figure 2. Forward Voltage Figure 3. Leakage Current 0.68 e a (0.64 oO = = Oo & 0.60 Y Oo a o a 7 (0.56 oO | | 0.52 0 2 4 6 8 Vp, REVERSE VOLTAGE (VOLTS) Figure 4, Capacitance MMSD914T1 MOTOROLA 2 @@: 6367255 00842ebl 769SURFACE MOUNT INFORMATION SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. e Always preheat the device. The delta temperature between the preheat and soldering should be 100C or less.* e When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. e The soldering temperature and time shall not exceed 260C for more than 5 seconds. e When shifting from preheating to soldering, the maximum temperature gradient shall be 5C or less. e After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. e Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating profile for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 5 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the STEP 1 STEP2 STEP3 PREHEAT VENT HEATING ZONE 1 SOAK ZONES 2&5 RAMP oy RAMP 200C - DESIRED CURVE FOR HIGH MASS ASSEMBLIES poo\ L orc y | SOLDER IS LIQUID FOR 40 TO 80 SECONDS 100C 140C (DEPENDING ON MASS OF ASSEMBLY) 100C _|_ DESIRED CURVE FOR LOW MASS ASSEMBLIES 50C _| actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177-189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. STEP 4 STEP 5 STEP 6 STEP 7 HEATING HEATING VENT COOLING ZONES 3&6 ZONES 4&7 SOAK SPIKE ~_ 205 TO 219C eC PEAK AT SOLDER JOINT 160C TIME (3 TO 7 MINUTES TOTAL, ____-1_ Tmax Figure 5. Typical Solder Heating Profile MOTOROLA Me 367255 o0aa4cbhe TS MMSD914T1 3OUTLINE DIMENSIONS 0.91 0.036 1.22 ~<_ A, >! c 0.048 hen 2.36 0.093 _ 4.19 _{ mm 0.165 inches SOD-123 Footprint K B P } oy NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI 2 Y14.5M, 1982. E | LL 2. CONTROLLING DIMENSION: INCH. J STYLE 1: PIN 1. CATHODE 2. ANODE CASE 425-04 SOD-123 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters can and do vary in different applications. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. 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ASIA PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Center, No. 2 Dai King Street, Tai Po industrial Estate, Tai Po, N.T., Hong Kong. 42948 (S) 2PHX34003F-0 PRINTED INUSA 3/94 IMPERIAL LITHO 97184 6,000 SMALL SIGNAL YBABAA MMSD914T1/D ms 367255 0088263 53) CARIOCA A A