HLMP-ED80 Radiometrically Tested AlInGaP II LED Lamps for Sensor-Based Applications Data Sheet Description Features Radiometrically Tested Precision Optical Performance AlInGaP II (aluminum indium gallium phosphide) LEDs offer increased sensor-based application design flexibility. High-resolution radiometric intensity bins (mW/sr) enable customers to precisely match LED lamp performance with sensor functionality. * Characterized by radiometric intensity Visible LEDs offer new styling alternatives -- light can be leveraged to develop more attractive products. In comparison to invisible infrared sources, safety concerns are significantly improved by the human autonomic pupil response and reflexive movement away from bright light. Visible LEDs further indidcate system on/off status. * 639 nmPEAK red color The AlInGaP II technology provides extremely stable light output over very long periods of time, with low power consumption. Applications These lamps are made with an advanced optical grade epoxy system offering superior high temperature and moisture resistance performance in outdoor systems. The epoxy contains both uv-a and uvb inhibitors to reduce the effects of long term exposure to direct sunlight. Please contact your Avago Technologies Representative for more information and design for manufacture advice. Application Brief I-024 Pulsed Operating Ranges for AlInGaP LEDs vs. Projected Long Term Light Output Performance and other application information is available at: www.avagotech.com/go/led_lamps. * High optical power output * Extremely long useful life * Low power consumption * Well defined spatial radiation patterns * 30 viewing angle * High operating temperature: Tjled = +130C * Superior resistance to moisture * Suitable for outdoor use * Photo sensor stimulus * Infrared emitter replacement * Solid state optical mouse sensors * Surface imaging sensors * Optical position and motion sensors * Human interface devices * Computer printer dot quality control * Battery powered systems Benefits * Radiometric LED characterization decreases system variability * Improved system reliability * Visual styling * Visible color for improved application safety * On/off indication * Suitable for a variety of sensor-based applications Device Selection Guide Part Number Minimum Radiometric Intensity (mW/Sr) at 20 mA Maximum Forward Voltage (V) at 20 mA HLMP-ED80-K0T00 7.2 2.6 HLMP-ED80-K0000 7.2 2.4 Package Dimensions 5.00 0.20 (0.197 0.008) 8.71 0.20 (0.343 0.008 1.14 0.20 (0.045 0.008) 2.35 (0.093) MAX. 31.60 MIN. (1.244) 0.70 (0.028) MAX. CATHODE LEAD 1.00 MIN. (0.039) CATHODE FLAT 0.50 0.10 SQ. TYP. (0.020 0.004) 5.80 0.20 (0.228 0.008) 2.54 0.38 (0.100 0.015) NOTE: ALL DIMENSIONS ARE IN mm (INCHES). Part Numbering System H L M P - x x x x - x x x x x Mechanical Option 00: Bulk VF Bin Selections 0: Maximum VF 2.4 V T: Maximum VF 2.6 V Maximum Intensity Bin 0: No maximum Iv bin limit Minimum Intensity Bin Refer to device selection guide Color D: 630 nm red Package E: T-1 3/4 (5 mm) round lamp Note: Please refer to AB 5337 for complete information on part numbering system. Absolute Maximum Ratings at TA = 25C DC Forward Current [1,2,3] ...................................................................................................... 50 mA Peak Pulsed Forward Current [2,3] . ......................................................................................100 mA Average Forward Current ........................................................................................................ 30 mA Reverse Voltage (IR = 100 A).......................................................................................................... 5 V LED Junction Temperature......................................................................................................... 130C Operating Temperature..........................................................................................-40C to +100C Storage Temperature...............................................................................................-40C to +100C Notes: 1. Derate linearly as shown in Figure 4. 2. For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. For more information on recommended drive conditions, please refer to HP Application Brief I-024 (5966-3087E). 3. Please contact your Avago sales representative about operating currents below 10 mA. Electrical/Optical Characteristics at TA = 25C Parameter Symbol Min. Typ. Max. Units Test Conditions Forward Voltage ED80-xx0xx VF 2.00 2.40 V IF = 20 mA ED80-xxTxx 2.35 2.60 Reverse Voltage VR 5 20 V IR = 100 A Peak Wavelength PEAK 639 nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Dominant Wavelength [1] d 630 nm Spectral Halfwidth 1/2 17 nm Wavelength Width at Spectral Distribution 1/2 Power Point at IF = 20 mA Speed of Response s 20 ns Exponential Time Constant, e-t/s Capacitance C 40 pF VF = 0, f = 1 MHz Thermal Resistance RJ-PIN 240 C/W LED Junction-to-Cathode Lead Luminous Efficacy [5] v 155 lm/W Viewing Angle [2] 2 1/2 Radiometric Intensity [3,4] Ie Emitted Luminous Power/Emitted Radiant Power at IF = 20 mA 30Deg. 7.23 50.50 mW/sr Emitted Radiant Power at IF = 20 mA Notes: 1. Dominant wavelength, ld, is derived from the CIE Chromaticity Diagram referenced to Illuminant E. 2. q1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity. 3. The radiometric intensity is measured on the mechanical axis of the lamp package. 4. The optical axis is closely aligned with the package mechanical axis. 5. The luminous intensity, Iv, in candelas, may be found from the equation Iv = Iehv, where Ie is the radiometric intensity in watts per steradian and hv is the luminous efficacy in lumens/watt. 6. For option -xxTxx, max. forward votage (Vf ) is 2.6 V. Refer to Vf bin table. 100 1.0 90 70 CURRENT - mA RELATIVE INTENSITY 80 RED 0.5 RED 60 50 40 30 20 10 0 550 600 650 WAVELENGTH - nm Figure 1. Relative Intensity vs. Peak Wavelength. 700 0 1.0 1.5 2.0 2.5 3.0 VF - FORWARD VOLTAGE - V Figure 2a. Forward Current vs. Forward Voltage for Option -xx0xx. 50 FORWARD CURRENT 40 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 50 2.0 1.5 1.0 0.5 0 3.0 IF - FORWARD CURRENT - mA RELATIVE RADIOMETRIC INTENSITY (NORMALIZED AT 20 mA) 2.5 0 FORWARD VOLTAGE - V 10 20 30 RJA = 780 C/W 20 10 0 50 Figure 3. Relative Luminous Intensity vs. Forward Current. RJA = 585 C/W 30 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE - C IF - DC FORWARD CURRENT - mA Figure 2b. Forward Current vs. Forward Voltage for Option -xxTxx. Figure 4. Maximum Forward Current vs. Ambient Temperature. Derating Based on TJMAX = 130C. Radiometric Intensity Bin Limits (mW/sr at 20 mA) 1.00 NORMALIZED RADIOMETRIC INTENSITY 40 40 0.90 0.80 0.70 Bin ID Min. Max. 0.60 K 8.5 10.2 0.50 L 10.2 12.2 0.30 M 12.2 14.7 0.20 N 14.7 17.6 P 17.6 21.2 Q 21.2 25.4 R 25.4 30.5 S 30.5 36.5 T 36.5 43.9 Bin ID Min. Max. VA 2.0 2.2 VB 2.2 2.4 VC 2.4 2.6 0.40 0.10 0 -25 -20 -15 -10 -5 0 5 10 15 20 25 ANGULAR DISPLACEMENT - DEGREES Figure 5. Representative Spatial Radiation Pattern for 30 Viewing Angle Lamps. RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25C 10 Vf Bin Table[3] 1 Tolerance for each bin limit is 0.05 V. 0.1 -40 -20 0 20 40 60 TJ - JUNCTION TEMPERATURE - C Figure 6. Relative Light Output vs Junction Temperature 80 100 Notes: 1. Tolerance for each bin will be 15%. 2. Bin categories are established for classification of products. Products may not be available in all bin categories. 3. VF bin table only available for those number with options -xxTxx. Precautions: Lead Forming: * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. * For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. * If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. Avago Technologies LED configuration Note: Electrical connection between bottom surface of LED die and the lead frame is achieved through conductive paste. Soldering and Handling: * Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. * LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron's tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59mm * ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. * Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105 C Max. - Preheat time 60 sec Max - Peak temperature 250 C Max. 260 C Max. Dwell time 3 sec Max. 5 sec Max Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. * Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. CATHODE AlInGaP Device * Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. * At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. * If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. * Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) * Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to Application Note 5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 TEMPERATURE (C) Flux: Rosin flux 200 Solder bath temperature: 245C 5C (maximum peak temperature = 250C) 150 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 100 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 50 PREHEAT 0 20 10 30 40 50 60 TIME (MINUTES) 70 80 90 100 Ammo Packs Drawing 6.35 1.30 (0.25 0.0512) 12.70 1.00 (0.50 0.0394) CATHODE 20.50 1.00 (0.807 0.039) 9.125 0.625 (0.3593 0.0246) 18.00 0.50 (0.7087 0.0197) A 12.70 0.30 (0.50 0.0118) 0.70 0.20 (0.0276 0.0079) A VIEW A-A ALL DIMENSIONS IN MILLIMETERS (INCHES). NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF. 4.00 0.20 TYP. (0.1575 0.008) Packaging Box for Ammo Packs LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARD. A + DE ANO T GO AVA OGIES N OL ECH E HOD CAT - ANODE LEAD LEAVES THE BOX FIRST. C R THE MO LAB EL NOTE: THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF. Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin) BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin "VB" only) (ii) Color bin incorporate with VF Bin BIN: 2VB VB: VF bin "VB" 2: Color bin 2 only DISCLAIMER: AVAGO'S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2009 Avago Technologies. All rights reserved. Obsoletes 5989-4366EN AV02-1523EN - January 20, 2009