HLMP-ED80-K0T00 - Avago Technologies

Features

• Characterized by radiometric intensity

• High optical power output

• Extremely long useful life

• Low power consumption

• Well dened spatial radiation patterns

• 639 nmPEAK red color

• 30° viewing angle

• High operating temperature: TjLED = +130°C

• Superior resistance to moisture

• Suitable for outdoor use

Applications

• Photo sensor stimulus

• Infrared emitter replacement

• Solid state optical mouse sensors

• Surface imaging sensors

• Optical position and motion sensors

• Human interface devices

• Computer printer dot quality control

• Battery powered systems

Benets

• Radiometric LED characterization decreases system

variability

• Improved system reliability

• Visual styling

• Visible color for improved application safety

• On/o indication

• Suitable for a variety of sensor-based applications

Description

Radiometrically Tested Precision Optical Performance

AlInGaP II (aluminum indium gallium phosphide) LEDs

oer increased sensor-based application design exibility.

High-resolution radiometric intensity bins (mW/sr) enable

customers to precisely match LED lamp performance with

sensor functionality.

Visible LEDs oer new styling alternatives — light can be

leveraged to develop more attractive products. In com-

parison to invisible infrared sources, safety concerns are

signicantly improved by the human autonomic pupil

response and reexive movement away from bright light.

Visible LEDs further indidcate system on/o status.

The AlInGaP II technology provides extremely stable light

output over very long periods of time, with low power

consumption.

These lamps are made with an advanced optical grade

epoxy system oering superior high temperature and

moisture resistance performance in outdoor systems. The

epoxy contains both uv-a and uv-b inhibitors to reduce the

eects of long term exposure to direct sunlight.

Please contact your Avago Technologies Representative

for more information and design for manufacture advice.

Application Brief I-024 Pulsed Operating Ranges for AlInGaP

LEDs vs. Projected Long Term Light Output Performance and

other application information is available at: www.avago-

tech.com/go/led_lamps.

HLMP-ED80

Radiometrically Tested AlInGaP II LED Lamps

for Sensor-Based Applications

Data Sheet

Minimum Radiometric Intensity Maximum Forward Voltage

Part Number (mW/Sr) at 20 mA (V) at 20 mA

HLMP-ED80-K0T00 7.2 2.6

HLMP-ED80-K0000 7.2 2.4

Device Selection Guide

Package Dimensions

2.35 (0.093)

MAX.

5.80 ± 0.20

(0.228 ± 0.008)

5.00 ± 0.20

(0.197 ± 0.008)

31.60

(1.244)

NOTE:

ALL DIMENSIONS ARE IN mm (INCHES).

MIN.

0.70 (0.028)

MAX.

1.00

(0.039) MIN.

2.54 ± 0.38

(0.100 ± 0.015)

0.50 ± 0.10

(0.020 ± 0.004) SQ. TYP.

CATHODE

LEAD

CATHODE

FLAT

8.71 ± 0.20

(0.343 ± 0.008

1.14 ± 0.20

(0.045 ± 0.008)

Part Numbering System

Mechanical Option

00: Bulk

VF Bin Selections

0: Maximum VF 2.4 V

T: Maximum VF 2.6 V

Maximum Intensity Bin

0: No maximum Iv bin limit

Minimum Intensity Bin

Refer to device selection guide

Color

D: 630 nm red

Package

E: T-1 3/4 (5 mm) round lamp

HLMP - x x x x - x x x xx

Absolute Maximum Ratings at TA = 25°C

DC Forward Current [1,2,3] ..................................................................................................... 50 mA

Peak Pulsed Forward Current [2,3] .......................................................................................100 mA

Average Forward Current ....................................................................................................... 30 mA

Reverse Voltage (IR = 100 µA) ......................................................................................................... 5 V

LED Junction Temperature ........................................................................................................130°C

Operating Temperature .........................................................................................–40°C to +100°C

Storage Temperature ..............................................................................................–40°C to +100°C

Notes:

1. Derate linearly as shown in Figure 4.

2. For long term performance with minimal light output degradation, drive currents between

10 mA and 30 mA are recommended. For more information on recommended drive condi-

tions, please refer to HP Application Brief I-024 (5966-3087E).

3. Please contact your Avago sales representative about operating currents below 10 mA.

Note: Please refer to AB 5337 for complete information on part numbering system.

Electrical/Optical Characteristics at TA = 25°C

Parameter Symbol Min. Typ. Max. Units Test Conditions

Forward Voltage

ED80-xx0xx VF 2.00 2.40 V IF = 20 mA

ED80-xxTxx 2.35 2.60

Reverse Voltage VR 5 20 V IR = 100 µA

Peak Wavelength λPEAK 639 nm Peak of Wavelength of Spectral

Distribution at IF = 20 mA

Dominant Wavelength [1] λd 630 nm

Spectral Halfwidth ∆λ1/2 17 nm Wavelength Width at Spectral

Distribution 1/2 Power Point at

IF = 20 mA

Speed of Response τs 20 ns Exponential Time Constant, e-t/τs

Capacitance C 40 pF VF = 0, f = 1 MHz

Thermal Resistance RΘJ-PIN 240 °C/W LED Junction-to-Cathode Lead

Luminous Ecacy [5] ηv 155 lm/W Emitted Luminous Power/Emitted

Radiant Power at IF = 20 mA

Viewing Angle [2] 2 θ1/2 30 Deg.

Radiometric Intensity [3,4] Ie 7.23 50.50 mW/sr Emitted Radiant Power at IF = 20 mA

Notes:

1. Dominant wavelength, ld, is derived from the CIE Chromaticity Diagram referenced to Illuminant E.

2. θ1/2 is the o-axis angle where the luminous intensity is one half the on-axis intensity.

3. The radiometric intensity is measured on the mechanical axis of the lamp package.

4. The optical axis is closely aligned with the package mechanical axis.

5. The luminous intensity, Iv, in candelas, may be found from the equation Iv = Ieηv, where Ie is the radiometric intensity in watts per steradian and ηv

is the luminous ecacy in lumens/watt.

6. For option -xxTxx, max. forward votage (Vf) is 2.6 V. Refer to Vf bin table.

Figure 1. Relative Intensity vs. Peak Wavelength. Figure 2a. Forward Current vs. Forward Voltage

for Option -xx0xx.

WAVELENGTH – nm

RELATIVE INTENSITY

550 600 650 700

1.0

0.5

RED

CURRENT – mA

1.0

VF – FORWARD VOLTAGE – V

2.5

100

1.5 2.0

3.0

RED

Figure 2b. Forward Current vs. Forward Voltage for

Option -xxTxx.

Figure 3. Relative Luminous Intensity vs. Forward

Current.

Figure 4. Maximum Forward Current vs. Ambient

Temperature. Derating Based on TJMAX = 130°C.

Figure 5. Representative Spatial Radiation Pattern for 30° Viewing Angle Lamps.

Radiometric Intensity Bin Limits

(mW/sr at 20 mA)

Bin ID Min. Max.

K 8.5 10.2

L 10.2 12.2

M 12.2 14.7

N 14.7 17.6

P 17.6 21.2

Q 21.2 25.4

R 25.4 30.5

S 30.5 36.5

T 36.5 43.9

Notes:

1. Tolerance for each bin will be ± 15%.

2. Bin categories are established for classica-

tion of products. Products may not be avail-

able in all bin categories.

3. VF bin table only available for those num-

ber with options -xxTxx.

Vf Bin Table[3]

Bin ID Min. Max.

VA 2.0 2.2

VB 2.2 2.4

VC 2.4 2.6

Tolerance for each bin limit is ±0.05 V.

FORWARD CURRENT

FORWARD VOLTAGE – V

2.5

1.5 2.0 3.0

1.00.5

RELATIVE RADIOMETRIC INTENSITY

(NORMALIZED AT 20 mA)

IF – DC FORWARD CURRENT – mA

2.0

1.5

1.0

0.5

20 50

2.5

10 30

IF – FORWARD CURRENT – mA

TA – AMBIENT TEMPERATURE – C

40 80

20 60 100

RθJA = 585 C/W

RθJA = 780 C/W

NORMALIZED RADIOMETRIC INTENSITY

1.00

ANGULAR DISPLACEMENT – DEGREES

0.80

0.60

0.50

0.70

0.20

0.10

0.30

0.40

0.90

-20 -15 -10 0 5 10 15 20 25-25 -5

0.1

-40 -20 0 20 40 60 80 100

TJ - JUNCTION TEMPERATURE - ˚C

RELATIVE LIGHT OUTPUT

(NORMALIZED AT T

= 25˚C

Figure 6. Relative Light Output vs Junction Temperature

Precautions:

Lead Forming:

• The leads of an LED lamp may be preformed or cut to

length prior to insertion and soldering on PC board.

• For better control, it is recommended to use proper

tool to precisely form and cut the leads to applicable

length rather than doing it manually.

• If manual lead cutting is necessary, cut the leads after

the soldering process. The solder connection forms a

mechanical ground which prevents mechanical stress

due to lead cutting from traveling into LED package.

This is highly recommended for hand solder operation,

as the excess lead length also acts as small heat sink.

Soldering and Handling:

• Care must be taken during PCB assembly and soldering

process to prevent damage to the LED component.

• LED component may be eectively hand soldered to

PCB. However, it is only recommended under unavoid-

able circumstances such as rework. The closest manual

soldering distance of the soldering heat source (sol-

dering iron’s tip) to the body is 1.59mm. Soldering the

LED using soldering iron tip closer than 1.59mm might

damage the LED.

Note:

1. PCB with dierent size and design (component density) will have

dierent heat mass (heat capacity). This might cause a change in

temperature experienced by the board if same wave soldering

setting is used. So, it is recommended to re-calibrate the soldering

prole again before loading a new type of PCB.

Avago Technologies LED conguration

Note: Electrical connection between bottom surface of LED die and

the lead frame is achieved through conductive paste.

1.59mm

• ESD precaution must be properly applied on the sol-

dering station and personnel to prevent ESD damage

to the LED component that is ESD sensitive. Do refer to

Avago application note AN 1142 for details. The solder-

ing iron used should have grounded tip to ensure elec-

trostatic charge is properly grounded.

• Recommended soldering condition:

Wave

Soldering [1, 2]

Manual Solder

Dipping

Pre-heat temperature 105 °C Max. -

Preheat time 60 sec Max -

Peak temperature 250 °C Max. 260 °C Max.

Dwell time 3 sec Max. 5 sec Max

Note:

1. Above conditions refers to measurement with thermocouple

mounted at the bottom of PCB.

2. It is recommended to use only bottom preheaters in order to reduce

thermal stress experienced by LED.

• Wave soldering parameters must be set and main-

tained according to the recommended temperature

and dwell time. Customer is advised to perform daily

check on the soldering prole to ensure that it is always

conforming to recommended soldering conditions.

• Any alignment xture that is being applied during

wave soldering should be loosely tted and should not

apply weight or force on LED. Non metal material is rec-

ommended as it will absorb less heat during wave sol-

dering process.

• At elevated temperature, LED is more susceptible to

mechanical stress. Therefore, PCB must allowed to cool

down to room temperature prior to handling, which in-

cludes removal of alignment xture or pallet.

• If PCB board contains both through hole (TH) LED and

other surface mount components, it is recommended

that surface mount components be soldered on the

top side of the PCB. If surface mount need to be on the

bottom side, these components should be soldered

using reow soldering prior to insertion the TH LED.

• Recommended PC board plated through holes (PTH)

size for LED component leads.

LED component

lead size Diagonal

Plated through

hole diameter

0.45 x 0.45 mm

(0.018x 0.018 inch)

0.636 mm

(0.025 inch)

0.98 to 1.08 mm

(0.039 to 0.043 inch)

0.50 x 0.50 mm

(0.020x 0.020 inch)

0.707 mm

(0.028 inch)

1.05 to 1.15 mm

(0.041 to 0.045 inch)

• Over-sizing the PTH can lead to twisted LED after clinch-

ing. On the other hand under sizing the PTH can cause

diculty inserting the TH LED.

Refer to Application Note 5334 for more information about soldering

and handling of high brightness TH LED lamps.

AlInGaP Device

CATHODE

Example of Wave Soldering Temperature Prole for TH LED

Ammo Packs Drawing

18.00 ± 0.50

(0.7087 ± 0.0197)

6.35 ± 1.30

(0.25 ± 0.0512)

12.70 ± 1.00

(0.50 ± 0.0394)

9.125 ± 0.625

(0.3593 ± 0.0246)

12.70 ± 0.30

(0.50 ± 0.0118)

CATHODE

0.70 ± 0.20

(0.0276 ± 0.0079)

20.50 ± 1.00

(0.807 ± 0.039)

A A

VIEW A–A

∅4.00 ± 0.20

(0.1575 ± 0.008) TYP.

ALL DIMENSIONS IN MILLIMETERS (INCHES).

NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.

030 40 90 100

250

200

150

100

TIME (MINUTES)

PREHEAT

TURBULENT WAVE LAMINAR WAVE

HOT AIR KNIFE

Recommended solder:

Sn63 (Leaded solder alloy)

SAC305 (Lead free solder alloy)

Flux: Rosin flux

Solder bath temperature:

245°C± 5°C (maximum peak

temperature = 250°C)

Dwell time: 1.5 sec - 3.0 sec

(maximum = 3sec)

Note: Allow for board to be

sufficiently cooled to room

temperature before exerting

TEMPERATURE (°C)

10 20 70

6050 80

mechanical force.

Packaging Box for Ammo Packs

Packaging Label

(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)

FROM LEFT SIDE OF BOX,

ADHESIVE TAPE MUST BE

FACING UPWARD.

AVAGO

TECHNOLOGIES

ANODE

MOTHERLABEL

CATHODE

–

ANODE LEAD LEAVES

THE BOX FIRST.

NOTE:

THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF.

LABEL ON

THIS SIDE

OF BOX.

(1P) Item: Part Number

(1T) Lot: Lot Number

LPN:

(9D)MFG Date: Manufacturing Date

(P) Customer Item:

(V) Vendor ID:

DeptID: Made In: Country of Origin

(Q) QTY: Quantity

CAT: Intensity Bin

BIN: Refer to below information

(9D) Date Code: Date Code

STANDARD LABEL LS0002

RoHS Compliant

e3 max temp 250C

(1P) PART #: Part Number

(1T) LOT #: Lot Number

(9D)MFG DATE: Manufacturing Date

C/O: Country of Origin

Customer P/N:

Supplier Code:

QUANTITY: Packing Quantity

CAT: Intensity Bin

BIN: Refer to below information

DATECODE: Date Code

RoHS Compliant

e3 max tem

250C

Lam

s Bab

Label

For product information and a complete list of distributors, please go to our website: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-1523EN - January 20, 2009

DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED

OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION,

MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLI-

CATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO

OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.

Acronyms and Denition:

BIN:

(i) Color bin only or VF bin only

(Applicable for part number with color bins but without

VF bin OR part number with VF bins and no color bin)

(ii) Color bin incorporated with VF Bin

(Applicable for part number that have both color bin

and VF bin)

(ii) Avago Baby Label (Only available on bulk packaging)

Example:

(i) Color bin only or VF bin only

BIN: 2 (represent color bin 2 only)

BIN: VB (represent VF bin “VB” only)

(ii) Color bin incorporate with VF Bin

BIN: 2VB

VB: VF bin “VB”

2: Color bin 2 only

(1P) Item: Part Number

(1T) Lot: Lot Number

LPN:

(9D)MFG Date: Manufacturing Date

(P) Customer Item:

(V) Vendor ID:

DeptID: Made In: Country of Origin

(Q) QTY: Quantity

CAT: Intensity Bin

BIN: Refer to below information

(9D) Date Code: Date Code

STANDARD LABEL LS0002

RoHS Compliant

e3 max temp 250C

(1P) PART #: Part Number

(1T) LOT #: Lot Number

(9D)MFG DATE: Manufacturing Date

C/O: Country of Origin

Customer P/N:

Supplier Code:

QUANTITY: Packing Quantity

CAT: Intensity Bin

BIN: Refer to below information

DATECODE: Date Code

RoHS Compliant

e3 max tem

250C

Lam

s Bab

Label