TVS Diode Arrays (SPATM Family of Products) General Purpose ESD Protection - SP1003 Series SP1003 Series - 30pF 30kV Unidirectional Discrete TVS RoHS Pb GREEN Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at 30kV (contact discharge, IEC 61000-4-2) without performance degradation. Additionally, each diode can safely dissipate 7A of 8/20s surge current (IEC61000-4-5) with very low clamping voltages. Features t&4% *&$ 30kV contact, 30kV air Pinout t&'5 *&$ " (5/50ns) 1 1 t-JHIUOJOH *&$ 7A (8/20s) t'JUTTPMEFSGPPUQSJOUPG industry standard 0402 (1005) devices t-PXMFBLBHFDVSSFOUPG 100nA (MAX) at 5V 2 2 SOD723 t5JOZ40%40% (JEDEC MO-236) package saves board space SOD882 Applications Functional Block Diagram 1 t.PCJMFQIPOFT t%JHJUBMDBNFSBT t4NBSUQIPOFT t1PSUBCMFNFEJDBMEFWJDFT t1%"T t1PSUBCMFOBWJHBUJPO devices Application Example 2 Outside World Low - speed port I/O port Controller B1 B2 B3 B4 (4) SP1003-01 Signal Ground Shield Ground Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. (c)2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 35 Revision: March 20, 2012 SP1003 Series SP1003 Description TVS Diode Arrays (SPATM Family of Products) General Purpose ESD Protection - SP1003 Series Absolute Maximum Ratings Symbol Thermal Information Parameter Value Units IPP Peak Pulse Current (tp=8/20s) 7.0 A Parameter Storage Temperature Range TOP Operating Temperature -40 to 85 C TSTOR Storage Temperature -60 to 150 C Rating -65 to 150 Units C Maximum Junction Temperature 150 C Maximum Lead Temperature (Soldering 20-40s) 260 C CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25C) Parameter Forward Voltage Drop Reverse Voltage Drop Symbol Test Conditions VF IF = 10mA VR IR=1mA Reverse Standoff Voltage VRWM IR1A Reverse Leakage Current ILEAK Clamp Voltage1 RDYN ESD Withstand Voltage1 VESD Diode Capacitance1 6.0 Typ Max Units 0.8 1.2 V 7.8 VR=5V VC Dynamic Resistance Min 8.5 V 5.0 V 100 nA Ipp=6A tp=8/20s 11.4 V Ipp=7A tp=8/20s 12.0 V (VC2 - VC1) / (IPP2 - IPP1) 0.6 IEC61000-4-2 (Contact Discharge) 30 kV IEC61000-4-2 (Air Discharge) 30 kV Reverse Bias=0V 30 pF CD Note: 1 Parameter is guaranteed by design and/or device characterization. Capacitance vs. Reverse Bias Pulse Waveform 110% 40.0 100% 35.0 90% 80% Percent of IPP Capacitance (pF) 30.0 25.0 20.0 15.0 70% 60% 50% 40% 30% 10.0 20% 5.0 10% 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0% 5.0 0.0 5.0 10.0 15.0 25.0 30.0 Leakage vs. Temperature Clamping Voltage vs. IPP 14.0 35.0 12.0 30.0 Leakage Current (nA) Clamp Voltage (VC) 20.0 Time (s) DC Bias (V) 10.0 8.0 6.0 4.0 2.0 25.0 20.0 15.0 10.0 5.0 0.0 1 2 3 4 5 6 0.0 7 0 Peak Pulse Current-IPP (A) SP1003 Series 10 20 30 40 50 Temperature (C) 36 Revision: March 20, 2012 (c)2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPATM Family of Products) General Purpose ESD Protection - SP1003 Series Soldering Parameters Pb - Free assembly tP Pre Heat - Temperature Min (Ts(min)) 150C - Temperature Max (Ts(max)) 200C - Time (min to max) (ts) 60 - 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3C/second max TS(max) to TL - Ramp-up Rate 3C/second max Reflow Temperature TP Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS - Temperature (TL) (Liquidus) 217C - Temperature (tL) 60 - 150 seconds 25 time to peak temperature Peak Temperature (TP) 260+0/-5 C Time within 5C of actual peak Temperature (tp) 20 - 40 seconds Ramp-down Rate 6C/second max Time 25C to peak Temperature (TP) 8 minutes Max. Do not exceed 260C Time Package Dimensions -- SOD723 SOD723 D 0.45 [0.018] Symbol b E 1.10 [0.043] HE 0.50 [0.020] A Recommended Solder Pad Layout Millimeters (Inches) c L Millimeters Inches Min Max Min Max A 0.46 0.65 0.018 0.026 b 0.23 0.35 0.009 0.014 c 0.08 0.13 0.003 0.005 D 0.90 1.10 0.035 0.043 E 0.58 0.64 0.023 0.025 HE 1.37 1.47 0.054 0.058 L 0.15 0.25 0.006 0.010 Package Dimensions -- SOD882 D L1 b L Package e E JEDEC Symbol L1 PIN 1 ID 0.65 A1 1.05 0.65 Inches Min Max Min Max 0.40 0.50 0.016 0.02 A1 0.00 0.05 0.000 0.002 D 0.55 0.65 0.022 0.026 E 0.95 1.05 0.037 0.041 b 0.40 0.60 0.016 0.024 e L 0.25 MO-236 Millimeters A L b Recommended Solder Pad Layout A SOD882 0.65 TYP 0.15 0.35 0.026 TYP 0.006 0.014 0.4 Tol:+/-0.01mm (c)2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 37 Revision: March 20, 2012 SP1003 Series SP1003 Reflow Condition TVS Diode Arrays (SPATM Family of Products) General Purpose ESD Protection - SP1003 Series Product Characteristics Part Numbering System SP 1003 - 01 * T G Silicon Protection Array (SPATM) Family of TVS Diode Arrays G= Green T= Tape & Reel Series Package D: SOD723 E: SOD882 Number of Channels -01 = 1 Channel Product ID C Cathode Identifier Product ID Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Ordering Information SOD882 C Pre-Plated Frame or Matte Tin Lead Material Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Part Marking System SOD723 Lead Plating Part Number Package Marking Min. Order Qty. SP1003-01DTG SOD723 C 8000 SP1003-01ETG SOD882 C 3000 Cathode Identifier Embossed Carrier Tape & Reel Specification -- SOD723 PO P2 Symbol t User Feeding Direction D OD1 P BO B1 F W E O AO A1 Min Max E 1.65 1.85 0.064 0.072 F 3.40 3.60 0.134 0.142 D1 0.45 0.55 0.017 0.021 D 1.50 -- 0.060 -- PO 3.90 4.10 0.153 0.161 40.0+/- 0.20 1.570+/-0.010 W 7.90 8.20 0.311 P2/P 1.90 2.10 0.074 0.082 AO 0.60 0.80 0.024 0.032 1.81 0.063 A1 KO Inches Max 10PO Pin 1 Location Millimetres Min BO 0.33 REF 1.61 B1 0.322 0.010 REF 1.10 REF 0.071 0.040 REF KO 0.54 0.78 0.021 0.031 t -- 0.21 -- 0.008 Embossed Carrier Tape & Reel Specification -- SOD882 Symbol A User Feeding Direction Pin 1 Location SP1003 Series 38 Revision: March 20, 2012 Millimetres Inches Min Max Min Max 0.65 0.70 0.026 0.028 0.047 B 1.10 1.20 0.043 C 0.50 0.60 0.020 0.024 dO 1.40 1.60 0.055 0.063 E 1.65 1.85 0.065 0.073 F 3.40 3.60 0.134 0.142 P0 3.90 4.10 0.154 0.161 P 1.90 2.10 0.075 0.083 P1 1.90 2.10 0.075 0.083 W 7.90 8.10 0.311 0.319 (c)2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.