DRAM MODULE M364C040(8)4BT0-C
Buffered 4Mx64 DIMM
Revision 0.1
June 1998
(4Mx16 base)
DRAM MODULE M364C040(8)4BT0-C
Revision History
Version 0.0 (Sept. 1997)
Removed two AC parameters tCACP(access time from CAS) and tAAP(access time from col. addr.) in AC CHARACTERISTICS.
Changed the parameter tCAC(access time from CAS) from 18ns to 20ns @ -5 in AC CHARACTERISTICS.
Version 0.1 (June 1998)
The 3rd generation of 64M DRAM components are applied for this module.
DRAM MODULE M364C040(8)4BT0-C
M364C040(8)4BT0-C Fast Page Mode
4M x 64 DRAM DIMM Using 4Mx16, 4K & 8K Refresh, 5V
The Samsung M364C040(8)4BT0-C is a 4Mx64bits Dynamic
RAM high density memory module. The Samsung
M364C040(8)4BT0-C consists of four CMOS 4Mx16bits
DRAMs in TSOP-II 400mil packages and two 16 bits driver IC
in TSSOP package mounted on a 168-pin glass-epoxy sub-
strate. A 0.1 or 0.22uF decoupling capacitor is mounted on the
printed circuit board for each DRAM. The M364C040(8)4BT0-
C is a Dual In-line Memory Module and is intended for mount-
ing into 168 pin edge connector sockets.
GENERAL DESCRIPTION
PD Note :PD & ID Terminals must each be pulled up through a resistor to VCC at the next higher
level assembly. PDs will be either open (NC) or driven to VSS via on-board buffer circuits.
ID Note : IDs will be either open (NC) or connected directly to VSS without a buffer.
PIN NAMES
Pins marked * are not used in this module.
Pin Names Function
A0, B0, A1 - A11 Address Input(4K ref.)
A0, B0, A1 - A12 Address Input(8K ref.)
DQ0 - DQ71 Data In/Out
W0, W2 Read/Write Enable
OE0, OE2 Output Enable
RAS0, RAS2 Row Address Strobe
CAS0 - CAS7 Column Address Strobe
VCC Power(+5V)
VSS Ground
NC No Connection
PDE Presence Detect Enable
PD1 - 8 Presence Detect
ID0 - 1 ID bit
RSVD Reserved Use
RFU Reserved for Future Use
PD & ID Table
PD : 0 for Vol of Drive IC & 1 for N.C
ID : 0 for Vss & 1 for N.C
Pin 50NS 60NS
PD1
PD2
PD3
PD4
PD5
PD6
PD7
PD8
1
1
0
1
0
0
0
1
1
1
0
1
0
1
1
1
ID0
ID1 0
00
0
PIN CONFIGURATIONS
NOTE : A12 is used for only M364C0484BT0-C (8K Ref.)
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Front
VSS
DQ0
DQ1
DQ2
DQ3
VCC
DQ4
DQ5
DQ6
DQ7
*DQ8
VSS
DQ9
DQ10
DQ11
DQ12
DQ13
VCC
DQ14
DQ15
DQ16
*DQ17
VSS
RSVD
RSVD
VCC
W0
CAS0
Pin
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
Front
CAS2
RAS0
OE0
VSS
A0
A2
A4
A6
A8
A10
A12
VCC
RFU
RFU
VSS
OE2
RAS2
CAS4
CAS6
W2
VCC
RSVD
RSVD
DQ18
DQ19
VSS
DQ20
DQ21
Pin
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
Front
DQ22
DQ23
VCC
DQ24
RFU
RFU
RFU
RFU
DQ25
*DQ26
DQ27
VSS
DQ28
DQ29
DQ30
DQ31
VCC
DQ32
DQ33
DQ34
*DQ35
VSS
PD1
PD3
PD5
PD7
ID0
VCC
Pin
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
Back
VSS
DQ36
DQ37
DQ38
DQ39
VCC
DQ40
DQ41
DQ42
DQ43
*DQ44
VSS
DQ45
DQ46
DQ47
DQ48
DQ49
VCC
DQ50
DQ51
DQ52
*DQ53
VSS
RSVD
RSVD
VCC
RFU
CAS1
Pin
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
Back
CAS3
*RAS1
RFU
VSS
A1
A3
A5
A7
A9
A11
*A13
VCC
RFU
B0
VSS
RFU
*RAS3
CAS5
CAS7
PDE
VCC
RSVD
RSVD
DQ54
DQ55
VSS
DQ56
DQ57
Pin
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
Back
DQ58
DQ59
VCC
DQ60
RFU
RFU
RFU
RFU
DQ61
*DQ62
DQ63
VSS
DQ64
DQ65
DQ66
DQ67
VCC
DQ68
DQ69
DQ70
*DQ71
VSS
PD2
PD4
PD6
PD8
ID1
VCC
PERFORMANCE RANGE
Speed tRAC tCAC tRC tPC
-C50 50ns 18ns 90ns 35ns
-C60 60ns 20ns 110ns 40ns
Part Identification
Fast Page Mode Operation
CAS-before-RAS Refresh capability
RAS-only and Hidden refresh capability
TTL compatible inputs and outputs
Single 5V±10% power supply
JEDEC standard pinout & Buffered PDpin
Buffered input except RAS and DQ
PCB : Height(1000mil), single sided component
Part number PKG Ref. CBR Ref. ROR Ref.
M364C0404BT0-C TSOPll 4K 4K/64ms
M364C0484BT0-C TSOPll 8K 4K/64ms 8K/64ms
FEATURES
DRAM MODULE M364C040(8)4BT0-C
FUNCTIONAL BLOCK DIAGRAM
Vcc
Vss
0.1 or 0.22uF Capacitor
under each DRAM To all DRAMs
A0
B0
A1-A11(A12)
W0, OE0
W2, OE2
U0-U1
U2-U3
U0-U3
U0-U1
U2-U3
RAS0
W0
OE0
A0
CAS1
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
U0
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
CAS2
CAS3
U1
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ27
DQ28
DQ29
DQ30
DQ31
DQ32
DQ33
DQ34
CAS4
CAS5
U2
DQ36
DQ37
DQ38
DQ39
DQ40
DQ41
DQ42
DQ43
DQ45
DQ46
DQ47
DQ48
DQ49
DQ50
DQ51
DQ52
CAS6
CAS7
U3
DQ54
DQ55
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ63
DQ64
DQ65
DQ66
DQ67
DQ68
DQ69
DQ70
RAS2
W2
OE2
CAS0 DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
A1-A11(A12) B0
A1-A11(A12)
LCAS
UCAS
LCAS
UCAS
LCAS
UCAS
LCAS
UCAS
Note : A12 is used for only M364C0484BT0 (8K ref.)
DRAM MODULE M364C040(8)4BT0-C
* NOTE : ICC1, ICC3, ICC4 and ICC6 are dependent on output loading and cycle rates. Specified values are obtained with the output open.
ICC is specified as an average current. In ICC1 and ICC3, address can be changed maximum once while RAS=VIL. In ICC4,
address can be changed maximum once within one Fast page mode cycle time, tPC.
ABSOLUTE MAXIMUM RATINGS *
* Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to
the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for intended
periods may affect device reliability.
Item Symbol Rating Unit
Voltage on any pin relative VSS
Voltage on VCC supply relative to VSS
Storage Temperature
Power Dissipation
Short Circuit Output Current
VIN, VOUT
VCC
Tstg
PD
IOS
-1 to +7.0
-1 to +7.0
-55 to +125
4
50
V
V
°C
W
mA
RECOMMENDED OPERATING CONDITIONS (Voltage referenced to VSS, TA = 0 to 70°C)
*1 : VCC+2.0V at pulse width20ns, which is measured at VCC.
*2 : -2.0V at pulse width20ns, which is measured at VSS.
Item Symbol Min Typ Max Unit
Supply Voltage
Ground
Input High Voltage
Input Low Voltage
VCC
VSS
VIH
VIL
4.5
0
2.4
-1.0*2
5.0
0
-
-
5.5
0
VCC*1
0.8
V
V
V
V
DC AND OPERATING CHARACTERISTICS (Recommended operating conditions unless otherwise noted)
ICC1*
ICC2
ICC3*
ICC4*
ICC5
ICC6*
I(IL)
I(OL)
VOH
VOL
Symbol Speed M364C0404BT0 M364C0484BT0 Unit
Min Max Min Max
ICC1 -50
-60 -
-480
440 -
-360
320 mA
mA
ICC2 Dont care -100 -100 mA
ICC3 -50
-60 -
-480
440 -
-360
320 mA
mA
ICC4 -50
-60 -
-280
240 -
-240
200 mA
mA
ICC5 Dont care -30 -30 mA
ICC6 -50
-60 -
-480
440 -
-360
320 mA
mA
II(L)
IO(L) Dont care -10
-5 10
5-10
-5 10
5uA
uA
VOH
VOL Dont care 2.4
--
0.4 2.4
--
0.4 V
V
: Operating Current * (RAS, CAS, Address cycling @tRC=min)
: Standby Current (RAS=CAS=W=VIH)
: RAS Only Refresh Current * (CAS=VIH, RAS cycling @tRC=min)
: Fast Page Mode Current * (RAS=VIL, CAS cycling : tPC=min)
: Standby Current (RAS=CAS=W=Vcc-0.2V)
: CAS-Before-RAS Refresh Current * (RAS and CAS cycling @tRC=min)
: Input Leakage Current (Any input 0VINVcc+0.5V, all other pins not under test=0 V)
: Output Leakage Current(Data Out is disabled, 0VVOUTVcc)
: Output High Voltage Level (IOH = -5mA)
: Output Low Voltage Level (IOL = 4.2mA)
DRAM MODULE M364C040(8)4BT0-C
CAPACITANCE (TA = 25°C, f = 1MHz)
Item Symbol Min Max Unit
Input capacitance[A0, B0, A1 - A12]
Input capacitance[W0, W2, OE0, OE2]
Input capacitance[RAS0, RAS2]
Input capacitance[CAS0 - CAS7]
Input/Output capacitance[DQ0 - 71]
CIN1
CIN2
CIN3
CIN4
CDQ
-
-
-
-
-
20
20
24
20
17
pF
pF
pF
pF
pF
Test condition : Vih/Vil=2.6/0.8V, Voh/Vol=2.4/0.4V, output loading CL=100pF
Parameter Symbol -50 -60 Unit Note
Min Max Min Max
Random read or write cycle time tRC 90 110 ns
Read-modify-write cycle time tRWC 133 155 ns
Access time from RAS tRAC 50 60 ns 3,4
Access time from CAS tCAC 18 20 ns 3,4,5,11
Access time from column address tAA 30 35 ns 3,10,11
CAS to output in Low-Z tCLZ 5 5 ns 3,11
Output buffer turn-off delay tOFF 518 520 ns 6,11
Transition time(rise and fall) tT150 150 ns 2
RAS precharge time tRP 30 40 ns
RAS pulse width tRAS 50 10K 60 10K ns
RAS hold time tRSH 18 20 ns 11
CAS hold time tCSH 45 55 ns 11
CAS pulse width tCAS 13 10K 15 10K ns
RAS to CAS delay time tRCD 18 32 18 40 ns 4,11
RAS to column address delay time tRAD 13 20 13 25 ns 10,11
CAS to RAS precharge time tCRP 10 10 ns 11
Row address set-up time tASR 5 5 ns 11
Row address hold time tRAH 8 8 ns 11
Column address set-up time tASC 0 0 ns 12
Column address hold time tCAH 10 10 ns 12
Column address to RAS lead time tRAL 30 35 ns 11
Read command set-up time tRCS 0 0 ns
Read command hold referencde to CAS tRCH 0 0 ns 8
Read command hold referenced to RAS tRRH -2 -2 ns 8,11
Write command hold time tWCH 10 10 ns
Write command pulse width tWP 10 10 ns
Write command to RAS lead time tRWL 20 20 ns 11
Write command to CAS lead time tCWL 13 15 ns 15
Data in set-up time tDS -2 -2 ns 9,11
Data in hold time tDH 15 15 ns 9,11
Refresh period tREF 64 64 ms
Write command set-up time tWCS 0 0 ns 7
CAS to W delay time tCWD 36 40 ns 7,15
Column address to W delay time tAWD 48 55 ns 7
CAS prechange to W delay time tCPWD 53 60 ns 7
AC CHARACTERISTICS (0°CTA70°C, VCC=5.0V±10%. See notes 1,2.)
DRAM MODULE M364C040(8)4BT0-C
AC CHARACTERISTICS (0°CTA70°C, VCC=5.0V±10%. See notes 1,2.)
Parameter Symbol -50 -60 Unit Note
Min Max Min Max
RAS ro W delay time tRWD 73 85 ns 7,11
CAS setup time(CAS-before-RAS refresh) tCSR 10 10 ns 11,16
CAS hold time(CAS-before-RAS refresh) tCHR 8 8 ns 11
RAS to CAS precharge time tRPC 3 3 ns 11
Access time from CAS precharge tCPA 35 40 ns 3,11
Fast page mode cycle time tPC 35 40 ns
Fast page mode read-modify-write cycle time tPRWC 76 85 ns
CAS precharge time(Fast page cycle) tCP 10 10 ns 13
RAS pulse width(Fast page cycle) tRASP 18 20 ns
RAS hold time from CAS precharge tRHCP 30 35 ns 11
W to RAS precharge time(C-B-R refresh) tWRP 50 200K 60 200K ns 11
W to RAS hold time(C-B-R refresh) tWRH 35 40 ns 11
OE access time tOEA 15 15 ns 11
OE to data delay tOED 8 8 ns 11
Output buffer turn off delay time from OE tOEZ 18 20 ns 11
OE command hold time tOEH 18 20 ns
PDE to Valid PD bit tPD 10 10 ns
PDE to PD bit Inactive tPDOFF 2727ns
Present Detect Read Cycle
DRAM MODULE M364C040(8)4BT0-C
NOTES
An initial pause of 200us is required after power-up followed
by any 8 RAS-only or CAS-before-RAS refresh cycles before
proper device operation is achieved.
Input voltage levels are Vih/Vil. VIH(min) and VIL(max) are ref-
erence levels for measuring timing of input signals. Transi-
tion times are measured between VIH(min) and VIL(max) and
are assumed to be 5ns for all inputs.
Measured with a load equivalent to 2 TTL loads and 100pF.
Operation within the tRCD(max) limit insures that tRAC(max)
can be met. tRCD(max) is specified as a reference point only.
If tRCD is greater than the specified tRCD(max) limit, then
access time is controlled exclusively by tCAC.
Assumes that tRCDtRCD(max).
This parameter defines the time at which the output achieves
the open circuit condition and is not referenced to VOH or
VOL.
tWCS, tRWD, tCWD, tAWD and tCPWD are not restrictive operat-
ing parameter. They are included in the data sheet as electri-
cal characteristics only. If tWCStWCS(min) the cycle is an
early write cycle and the data out pin will remain high imped-
ance for the duration of the cycle. If tRWDtRWD(min),
tCWDtCWD(min), tAWDtAWD(min) and tCPWDtCPWD(min).
The cycle is a read-modify-write cycle and the data out will
contain data read from the selected cell. If neither of the
above sets of conditions is satisfied, the condition of data
out(at access time) is indeterminate.
Either tRCH or tRRH must be satisfied for a read cycle.
These parameters are referenced to the CAS leading edge in
early write cycles.
Operation within the tRAD(max) limit insures that tRAC(max)
can be met. tRAD(max) is specified as reference point only. If
tRAD is greater than the specified tRAD(max) limit, then
access time is controlled by tAA.
The timing skew from the DRAM to the DIMM resulted from
the addition of buffers.
tASC, tCAH are referenced to the earlier CAS falling edge.
tCP is specified from the last CAS rising edge in the previous
cycle to the first CAS falling edge in the next cycle.
tCWD is referenced to the later CAS falling edge at word read-
modify-write cycle.
tCWL is specified from W falling edge to the earlier CAS rising
edge.
tCSR is referenced to earlier CAS falling low before RAS tran-
sition low.
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
DRAM MODULE M364C040(8)4BT0-C
tCRP
RAS VIH -
VIL -
CAS VIH -
VIL -
AVIH -
VIL -
WVIH -
VIL -
OE VIH -
VIL -
VOH -
VOL -
DQ
READ CYCLE
COLUMN
ADDRESS
ROW
ADDRESS
tRAS tRC
tCRP
tRP
tCSH
tRSHtRCD tCAS
tRAL
tRAD
tASR tRAH tASC tCAH
tAA
tOEA
tCAC
tCLZ
tRAC
OPEN DATA-OUT
tOEZ
tRRH tRCH
Dont care
Undefined
tRCS
tOFF
DRAM MODULE M364C040(8)4BT0-C
tWCS
WRITE CYCLE ( EARLY WRITE )
NOTE : DOUT = OPEN
RAS VIH -
VIL -
CAS VIH -
VIL -
AVIH -
VIL -
WVIH -
VIL -
OE VIH -
VIL -
VIH -
VIL -
DQ
COLUMN
ADDRESS
ROW
ADDRESS
tRAS tRC
tCRP
tRP
tCSH
tRSHtRCD tCAS
tRAL
tRAD
tASR tRAH tASC tCAH
tCRP
tWP
tDS tDH
tWCH
tCWL
tRWL
Dont care
DATA-IN
Undefined
DRAM MODULE M364C040(8)4BT0-C
tOED
RAS VIH -
VIL -
CAS VIH -
VIL -
AVIH -
VIL -
WVIH -
VIL -
OE VIH -
VIL -
VIH -
VIL -
DQ
COLUMN
ADDRESS
ROW
ADDRESS
tRAS tRC
tCRP
tRP
tCSH
tRSHtRCD tCAS
tRAL
tRAD
tASR tRAH tASC tCAH
tCRP
DATA-IN
tWP
Dont care
WRITE CYCLE ( OE CONTROLLED WRITE )
NOTE : DOUT = OPEN
tCWL
tRWL
tDS tDH
tOEH
Undefined
DRAM MODULE M364C040(8)4BT0-C
RAS VIH -
VIL -
CAS VIH -
VIL -
AVIH -
VIL -
WVIH -
VIL -
OE VIH -
VIL -
VI/OH -
VI/OL -
DQ
ROW
ADDR
tRAS tRWC tRP
tRSHtRCD tCAS
tCSH
tRAD
tASR tRAH tASC tCAH
tCRP
VALID
tWP
Dont care
READ - MODIFY - WRTIE CYCLE
tRWL
tCWL
tOEZ
tOEA
tOED
tAWD
tCWD
tRWD
DATA-OUT
Undefined
VALID
DATA-IN
tRAC
tAA tCAC
tCLZ
tDS tDH
COLUMN
ADDRESS
DRAM MODULE M364C040(8)4BT0-C
tRCH
tOEZ
tCLZ
RAS VIH -
VIL -
CAS VIH -
VIL -
AVIH -
VIL -
WVIH -
VIL -
OE VIH -
VIL -
VOH -
VOL -
DQ
COLUMN
ADDRESS
ROW
ADDR
tRHCP
tRASP
tCAS
tASC
tRAD
tASR tRAH
tASC
tCAH
tCRP
VALID
Dont care
FAST PAGE READ CYCLE
tOEZ
tRRH
DATA-OUT
Undefined
VALID
DATA-OUT
NOTE : DOUT = OPEN
COLUMN
ADDRESS COLUMN
ADDRESS
tRSH
tCAS
tRCD
tPC
¡ó
tCSH tCAH tASC tCAH
¡ó
¡ó
¡ó
tRCH
¡ó
tRCS tRCStRCS
tOEA
tCAC tOEA
tCAC tOEA
tCAC
VALID
DATA-OUT
tCLZ
tOFF
tAA tOFF
tAA
tCLZ tOFF
tOEZ
tRAC
tAA
¡ó
¡ó
tCP
tCAS
tRP
tCP
DRAM MODULE M364C040(8)4BT0-C
tASC
tCAH
RAS VIH -
VIL -
CAS VIH -
VIL -
AVIH -
VIL -
WVIH -
VIL -
OE VIH -
VIL -
VIH -
VIL -
DQ
COLUMN
ADDRESS
ROW
ADDR
tRHCP
tRASP
tCAS
tRAD
tASR tRAH
tASC
tCRP
VALID
Dont care
FAST PAGE WRITE CYCLE ( EARLY WRITE )
DATA-IN
Undefined
VALID
DATA-IN
tDS
NOTE : DOUT = OPEN
COLUMN
ADDRESS COLUMN
ADDRESS
tRSH
tCAS
tRCD
tPC
¡ó
tCSH tCAH tASC tCAH
¡ó
¡ó
¡ó
tWCS tWCH
tWCS
VALID
DATA-IN
¡ó
¡ó
tWP
tCWL
tWP
tWCH
tWP
tWCS tWCH
tCWL
tRWL
tCWL
tDH tDS tDH tDS tDH
¡ó
¡ó
¡ó
tRP
tCP
tCP
tCAS
tPC
DRAM MODULE M364C040(8)4BT0-C
tCAC
tASCtASC
RAS VIH -
VIL -
CAS VIH -
VIL -
AVIH -
VIL -
WVIH -
VIL -
OE VIH -
VIL -
VI/OH -
VI/OL -
DQ
ROW
ADDR
tCSH tRASP
tASR
VALID
Dont care
FAST PAGE READ - MODIFY - WRITE CYCLE
DATA-OUT
Undefined
tRCD tCP
tRAD
tCAH
tWP
tDH
COL.
ADDR COL.
ADDR
tCAS tCAS
tCRP
tCAH tRAL
tPRWC
tRCS tCWL
tCWD
tAWD
tRWD
tWP
tCWD
tAWD
tCWL
tAA
tRAC
tOEA
tCLZ
tCAC
tOEZ
tCPWD
tOED
VALID
DATA-IN VALID
DATA-OUT VALID
DATA-IN
tCLZ
tDS
tOEA
tAA tDH
tDS
tOEZ
tOED
tRWL
tRP
tRSH
tRAH
DRAM MODULE M364C040(8)4BT0-C
RAS VIH -
VIL -
CAS VIH -
VIL -
AVIH -
VIL - ROW
ADDR
tRAS tRC tRP
tASR tRAH
tCRP
Dont care
RAS - ONLY REFRESH CYCLE
Undefined
NOTE : W, OE, DIN = Dont care
DOUT = OPEN
tRPC tCRP
CAS - BEFORE - RAS REFRESH CYCLE
NOTE : OE, A = Dont care
RAS VIH -
VIL -
CAS VIH -
VIL -
tRAS tRC tRP
tWRP
tRPC
tRP
tCP
tCHR
tCSR
WVIH -
VIL -
tWRH
tOFF
tRPC
VOH -
VOL -
DQ OPEN
DRAM MODULE M364C040(8)4BT0-C
tWRH
tOFF
RAS VIH -
VIL -
CAS VIH -
VIL -
AVIH -
VIL -
WVIH -
VIL -
OE VIH -
VIL -
VOH -
VOL -
DQ
HIDDEN REFRESH CYCLE ( READ )
COLUMN
ADDRESS
ROW
ADDRESS
tRAS tRC
tCHRtRCD
tRAD
tASR tRAH tASC tCAH
tCRP
tRCS
tAA
tOEA
tCAC
tCLZ
tRAC
OPEN
tRRH
Dont care
tRSH
tOEZ
tWRP
Undefined
tRC
DATA-OUT
tRP tRP
tRAS
DRAM MODULE M364C040(8)4BT0-C
RAS VIH -
VIL -
CAS VIH -
VIL -
AVIH -
VIL -
WVIH -
VIL -
OE VIH -
VIL -
VIH -
VIL -
DQ
HIDDEN REFRESH CYCLE ( WRITE )
COLUMN
ADDRESS
ROW
ADDRESS
tRAS tRC
tCHR
tRCD
tRAD
tASR tRAH tASC tCAH
tCRP
Dont care
tRSH
DATA-IN
tWRP
tWRH
Undefined
tRC
NOTE : DOUT = OPEN
tWCH
tWP
tDH
tRPtRP tRAS
tDS
tWCS
DRAM MODULE M364C040(8)4BT0-C
CAS-BEFORE-RAS REFRESH COUNTER TEST CYCLE
RAS VIH -
VIL -
CAS VIH -
VIL -
AVIH -
VIL - COLUMN
ADDRESS
tRAS
tRSH
tCHR
tRAL
tCSR tCPT
tRP
tCAS
tASC tCAH
READ CYCLE
VOH -
VOL - DATA-OUT
DQ
tOFF
tCLZ
WRITE CYCLE
VIH -
VIL - DATA-IN
DQ
tDH
tDS
WVIH -
VIL - tWP
tCWD
tCWL
tRWL
READ-MODIFY-WRITE tAWD
VIH -
VIL -
OE
tOEA
tAA
tCAC
tDS
tDH
VALID
DATA-OUT
VI/OH -
VI/OL -
DQ
Dont care
Undefined
VIH -
VIL -
OE
tOEA tOEZ
OE VIH -
VIL -
tRCS
tCLZ tOEZ
tOED
tWRP tWRH tRRH
tRCH
tRCS tCAC
tAA
VIH -
VIL -
W
tWRP tWRH
tWCS tWCH
tCWL
VIH -
VIL -
W
tWP
tRWL
tWRP tWRH
VALID
DATA-IN
NOTE : This timing diagram is applied to all devices besides 16M DRAM 4th & 64M DRAM.
DRAM MODULE M364C040(8)4BT0-C
Dont care
Undefined
CAS - BEFORE - RAS SELF REFRESH CYCLE
NOTE : OE, A = Dont care
RAS VIH -
VIL -
CAS VIH -
VIL -
tRASS tRPS
tRPC
tWRP
tCHS
tRP
tCP
tCSR
WVIH -
VIL -
tWRH
tOFF
tRPC
OPEN
VOH -
VOL -
DQ
TEST MODE IN CYCLE
NOTE : OE, A = Dont care
RAS VIH -
VIL -
CAS VIH -
VIL -
tRAS tRC tRP
tRPC
tWTS
tRPC
tRP
tCP
tCHR
tCSR
WVIH -
VIL -
tWTH
tOFF
OPEN
VOH -
VOL -
DQ
DRAM MODULE M364C040(8)4BT0-C
Tolerances : ±.005(.13) unless otherwise specified
The used device is 4Mx16 DRAM with Fast page mode, TSOP II.
DRAM Part No. : M364C0404BT0 - K4F641611B
M364C0484BT0 - K4F661611B
PACKAGE DIMENSIONS
5.250
5.014
Units : Inches (millimeters)
R 0.079
(R 2.000)
0.250
(6.350)
1.450
(36.830) 2.150
(54.61)
0.350
0.100Min
(2.540Min)
0.700
(17.780)
.118DIA±.004
(3.000DIA±.100)
(8.890)
A B C
0.250
(6.350)
.450
(11.430) 4.550
(115.57)
0.157±0.004
(4.000±0.100)
0.054
(1.372)
(127.350)
(133.350)
1.000
(25.40)
0.118
(3.000)
0.118
(3.000)
( Back view )
( Front view )
0.050
0.039±.002
0.01Max
(0.25 Max)
(1.000±.050)
(1.270)
0.100 Min
(2.540 Min)
Detail C
0.250
(6.350)
Detail A
0.1230±.0050
(3.125±.125)
Detail B
0.079±.0040
(2.000±.100)
0.250
(6.350)
0.1230±.0050
(3.125±.125)
0.079±.0040
(2.000±.100)
0.100 Max
(2.54 Max)
0.050±0.0039
(1.270±0.10)
0.165 Min
(4.19 Min)