The documentation and process conversion INCH- POUND measures necessary to comply with this revision shall be completed by 8 Sep 94. MIL-S-19500/578B 8 June 1994 SUPERSED ING MIL-S-19500/578A 19 July 1993 MILITARY SPECIFICATION SEMICONDUCTOR DEVICE, DIODE, SILICON, SWITCHING 1N6638, 1N6642, 1N6643, 1N6638U, 1N6642U, 1N6643U, AND 1N4148-1 JANTX, JANTXV, AND JANS 1N4148-1 is a nonpreferred part number and is inactive for a new design, 1N6642 is preferred. All testing of the JANS 1N4148-1 shall be in accordance with MIL-S-19500/578 1N6642 herein except for electrical parameters which shall be in accordance with MIL-S-19500/116 (see 3.4.2, 6.3, 6.3.1, and 6.3.2). This specification is approved for use by all Depart- ments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the detail requirements for diodes suitable for high stress environments where silver button construction may be inadequate (see 6.3). Three levels of product assurance are provided for each device type as specified in MIL-S-19500. 1.2 Physical dimensions. See figures 1 (similar to DO-35) and 2 (square endcap surface mount). 1.3. Maximum ratings. T, = +25C. | | | | lo Vem | | | | Types Vea | Vawm | | | Terae Tye Ter | Ren | Raec | eux { i 2 | t, = 1/1208 | or Tec L_=.375 v (pk) | vipok) | mA A_(pk) c cfu | c/w C/W 1N6638, 1N6638U 150 125 300 2.5 -65 to +175 160 50 25 1N6642, 1N6642U 100 a 300 2.5 -65 to +175 160 50 25 1N6643, 1N6643U 75 50 300 2.5 -65 to +175 160 50 25 4/ Derate at 3.0 mA/C above T, = 75C for axial lead, L = .375 inch. 2/ Derate at 4.6 mA/C above T,, = 110C for U suffix types. Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, Defense Electronics Supply Center, ATTN: DESC-ELD, 1507 Wilmington Pike, Dayton, OH 45444-5765 by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. AMSC N/A FSC 5961 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. M@@ 0000125 0035220 276 MENILSMIL-S-19500/5 788 1.6 Primary electrical characteristics. Primary electrical characteristics at T, = +25C unless otherwise specified. | | | | Ver | Ter | Taz | Ta | Tra | t, | te Cr Vea | | | Types Va = 20 V |Va = Vawm | I, = 10 mA |V, = 0 Tena Ve Ve I, I, = 10 mA | = 10 mA = 20 V |= Vawa [Ta = 150C|T, = 150C|= 50 mA | Ineo = 1 ml V_de Vide { nA de BA_de uA_de HA_de ns ns pe 1N6638, 1N6638U) 0.80 | 1.1 1/| 35 0.5 50 100 20 4.5 2.5 1N6642, 1N6642U) 1.0 1.2 2/ 25 0.5 50 100 20 5.0 5.0 1N6643, 1N6643U) 1.0 1.2 2/ 50 0.5 75 160 20 6.0 5.0 A/T, = 200 m. 2/ I, = 100 m. 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION MILITARY MIL-$-19500 - Semiconductor Devices, General Specification for. STANDARDS MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the Defense Printing Service Detachment Office, Building 40 (Customer Service), 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Associated detail specification. The individual item requirements shall be in accordance with MIL-S-19500 and as specified herein. 3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-S-19500 and as follows: Vem ee ee et tt he ee . Peak forward recovery voltage during forward recovery. EC. ww et et ee ew we ae End caps (mounting pads for U suffix devices). 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-S-19500 and on figures 1 and 2 herein. 3.3.1 Lead finish. Lead finish shalt be solderable as defined in MIL-$-19500, MIL-STD-750, and herein. Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2). M 00001eS 0035221 102 MBNILSMIL-S-19500/578B 3.3.2 Diode construction. et ee a. ALL devices shall be of metallurgically bonded, thermally matched, noncavity-double plug construction in accordance with the requirements of category I (see MIL-S-19500). b. Opaque glass is not permitted. c. The U version shall be considered structurally identical to the non-U versions except for lead attach. Endeaps shall be square. 3.4 Marking. Marking shall be in accordance with MIL-S-19500. 3.4.1 Marking for U devices. for U version devices only, all marking, except polarity, may be omitted from the body (except for 3.5), but shall be retained on the initial container. 3.4.2 Part number marking. The part marking 1N4148-1 may be used for reprocurement for three years after the date of this specification. 1N6642 part marking is preferred. 3.5 Polarity. Alternatively, the polarity of all types shall be indicated with a contrasting color band to denote the cathode end. For U suffix devices a minimum of three contrasting color dots spaced around the cathode end of the device may be used in lieu of contrasting color band. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection shall be in accordance with MIL-S-19500, and as specified herein. 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-S-19500. 4.2.1 Group E inspection. Group E inspection shall be conducted in accordance with MIL-S-19500. 4.3 Screening (JANS, JANTX, AND JANTXV levels only). Screening shall be in accordance with table II of MIL-S-19500, and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the Limits of table I herein shall not be acceptable. Screen (see Measurement table 11 of MIL-$- 19900) JANS level JANTX and JANTXV Levels 3c 61f =|Thermal impedance (see 4.3.2) Thermal impedance (see 3.4.2) 9 Tare Vere aNd Vion Not applicable 11 lars Vere Veer? 4Tq, & 100 percent Iq, and Vz, of initial value or 15 nA, whichever is greater. AV,, +0.02 V. 12 See 4.3.1 See 4.3.1 13. 2/ |Subgroup 2 and 3 of table I herein; Subgroup 2 of table I herein; Aly, $| Al, 100 percent of initial value or 100 percent of initial value or 15 nA, whichever is greater. AV5, $ 15 nA de, whichever is greater. +15 percent of initial reading. AV,, 0.02 V de. Scope Reverse scope display (see 4.5.3). display evaluation (see 4.5.3). 1/ Thermal impedance shail be performed any time after screen 3. 2/ Zeux iS not required in screen 13 if already performed. 4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: Method 1038, condition B, T, = room ambient as defined in the generat requirements of MIL-STD-750, (see 4.5); Va = rated Vawy? f = 50-60 Hz; I, = 300 mA. An alternative of I, (de) = 300 mA may be used (at T, = room ambient as defined in the general requirements of MIL-STD-750, see 4.5). 4.3.2 Thermal impedance Z,,, measurements for screening. The 2,,, measurements shall be performed in @E ooooies o035e22 049 MBNMILSMIL-S-19500/5 788 accordance with MIL-STD-750, method 3101. Test each device separately. The maximum Limit and conditions for Zoix in screening (table I! of MIL-$-19500) shall be derived statisically by each vendor by means of acutal measurements which characterize the die attach process (not to exceed the group A limit). 4.3.2.1 Thermal impedance (2,,, measurements) for initial qualification or requalification. The Za, measurements shall be performed in accordance with MIL-STD-750, method 3101. Read and record data 2,,, derived conditions (random sample of 500 devices minimum) limits shall be supplied to the qualifying activity on the qualification tot and screening prior to qualification approval. Twenty-two serialized devices shall be sent to the qualifying activity for test correlation. 4.4 Quality conformance inspection. Quality conformance inspection shall be in accordance with MIL-S-19500. 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-$-19500, and table I herein and as specified herein. Electrical measurements (end-points) and delta requirements shall be in accordance with the applicable steps of table I] herein. The following test conditions shall be used for Z,,,, group A inspection: a. I, forward heating current . . 2 se 6 ee ee ee ees 1A. b. t, heating time . 6 6 2 ee ee ee ee ee ee 10 ms. c. Iy measure current . - 2 ee ee et te ee ee ee 1 mA to 10 m. d. typ measurement delay time . 2. 6 6 ee eee ee es 70 ps maximum. The maximum Limit for Zo, under these test conditions 18 Zojximxy = 29C/W. 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in table 1Va (JANS) and table IVb (JAN, JANTX, and JANTXV) of MIL-S-19500. Electrical measurements (end-points) shall be in accordance with table I, group A, subgroup 2, except Z,,,, and as specified in table II herein. Leaded samples from the same lot may be used in Lieu of U suffix sample for life test. 4.4.2.1 Group B inspection, table [Va (JANS) of MIL-S-19500. Subgroup Method Condition B4 1037 Va = rated Vawa, Ta = room ambient as defined in the general requirements of (see 4.5) of MIL-STD-750; f = 50-60 Hz (see 4.5.1); ON time, OFF time, and I, shall be adjusted to achieve a delta lead temperature at L = 1/16" from the body of 85C, -5C, +15C: t,, = tor 2 3 minutes minimum; 2,000 cycles; I, = 300 mA dc maximum, BS 1027 Ig = 250 mA dc; Vawa = 0; f = 50-60 Hz (see 4.5.1); T, 2 +125C. B6 3101 or L = .375 inch: Rg, 2 160C/W max (see 4.5.4); Rosco # 50C/W 4081 maximum (see 4.5.4). 4.4.2.2 Group 8 inspection, table IVb (JAN, JANTX, and JANTXV) of MIL-S-19500. Leaded samples from the same lot may be used in lieu of U suffix sample for life test. B3 1027 T, = room ambient a8 defined in the general requirements of MIL-STD-750, (see 4.5); Tye = 100C to +125C for U suffix devices; V, = rated Vawa; f = 50-60 Hz (see 4.5.1); I, = 300 mA de. B6 1032 T, = +175C maximum. 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in table V of MIL-S-19500. Electrical measurements (end-points) shalt be in accordance with table I, group A, subgroup 2, except Zg,,, and as specified in table I1 herein. Leaded samples from the same lot may be used in Lieu of U suffix sample for life test. 4.4.3.1 Group C inspection, table V of MIL-S-19500. c2 2036 Tension - test condition A; weight 8 pounds; t = 15 s; Lead fatigue = condition E (not applicable to U suffix types). C 1026 1,000 hours at T, = room ambient as defined in the general requirements of Mii -STD-750, (see 4.5); Va 2 rated Vawas f = 60 Hz (see 4.5.2); 1, = 300 mA de. Me o0001e5 0035223 T65 MMILSMIL-S-19500/5788 4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables as follows. 4.5.1 Life test. These tests shall be conducted with a half-sine waveform of the specified peak voltage impressed across the diode in the reverse direction followed by a half-sine waveform of the specified average rectified current. The forward conduction angle of the rectified current shall be neither greater than 180 degrees, no less than 150 degrees. 4.5.2 Forward-recovery voltage and time. Forward recovery time shall be measured as the time interval between zero time and the point where the pulse has decreased to 110 percent of the steady-state value of V, when I, = 50 mA de. The maximum rise time of the response detector shall be 1 ns. The maximum forward recovery voltage (V,,) during the forward recovery interval shall also be measured. 4.5.3 Scope display. The reverse breakdown characteristics shall be viewed on an oscilloscope with display calibration factors of 20 uA per division and 20 V per division. Reverse current over the knee shall be at least 100 yA and less than 200 wA. Any discontinuity or dynamic instability of the trace shall be cause for rejection of that device. 4.5.4 Thermal resistance. Thermal resistance shall be measured in accordance with method 3101 or 4081 of MIL-STD-750. The reference point shall be the lead temperature at .375 inch from the body of the device, and shail be heid between +25C and +85C. The measuring current, I, shall be 1.0 mA de. Thermal resistance values shall be in accordance with paragraph 1.3 herein. 4.5.6 Pulse measurements. Conditions for pulse measurements shall be as specified in section 4 of MIL-STD-750. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shail be in accordance with MIL-S-19500. MB 0000125 0035ee4 911 MMILSTABLE I. MIL-S-19500/578B Group A_inspection. Inspection 1/ | | | MIL-STD-750 | Symbol Method Conditions Limits Min Max Unit | Subgroup _1 | Visual and mechanical | 2071 examination Subgroup 2 Thermal impedance Forward voltage 10 mA de pulsed 1N6638, 1N6642, 1N6643, Breakdown 1N6638U 1N6642U 1N6643U voltage | 1N6638, 1N6642, 1N6643, 1N6638U 1N6642U 1N6643U Reverse current | 1N6638, 1N6638U 1N6642, 1N6642U 1N6643, 1N6643U Reverse current | 1N6638, IN6638U 1N6642, 1N6642U 1N6643, 1N6643U Forward voltage | 1N6638, 1N6638U 1N6642, 1N6642U 1N6663, 1N6643U Subgroup 3 High temperature operation current | 1N6638, 1N6638U 1N6642, 1N6642U 1N6643, 1N6643U | 3101 4011 4021 4016 4016 4011 4016 See 4.3.2 t e bc LN oc = 5 ms max 100 pA method; method nono 200 mA 100 mA 100 mA = +150C method; 125 V de 75 V de 50 V de Zoux de Ver Va = 20 V de pulsed pulsed pulsed V, = 20 V de 150 100 25.0 "OO ooOom 35 25 50 500 500 500 _ a 2 a nN 50 50 C/W V de V de nA de V de See footnote at end of table. M@ 0000125 0035225 454 MEMILS | J] [te = jReverseMIL-S-19500/578B TABLE I. Group A inspection - Continued. | | | MIL-STD-750 | Limits { | Inspection 1/ Symbol Unit | Method Conditions Min Max | Subgroup 3 - Continued Reverse current 4016 |DC method Tne BA de | 1N6638, 1N6638U Va = 125 V de 100 1N6642, 1N6642U Va = 75 V de 100 1N6643, 1N6643U Va = 50 V de 160 Forward-voltage 4011 jI, = 10 mA de pulsed Veg V de t, = 5 ms max 1N6638, 1N6638U 0.65 1N6642, 1N6642U 0.80 Low-temperature T, = ~55C operation Forward voltage 4011 {Pulsed Vea V de | 1N6638, 1N6638U I, = 200 mA pulsed 1.2 1N6642, 1N6642U I, = 100 mA pulsed 1.2 1N6643, 1N6643U 1, = 100 mA pulsed 1.4 Subgroup 4 Capacitance 4001 |Vq = OV de; Vz, = 50 mV(p-p) = [Cy pF | f = 1 MHz 1N6638, 1N6638U 2.5 1N6642, 1N6642U 5.0 1N6643, 1N6643U 5.0 | Capacitance 4001 |V_ = 1.5 V de; Vy, = 50 mV(p-p) |Cr2 pF | f = 1 MHz 1N6638, 1N6638U 2.0 1N6642, 1N6642U 2.8 1N6643, 1N6643U 2.8 Reverse recovery time 4031 jCondition A t, ns | I, = Iq = 10 mA de; Ipq = 1.0 | mA de: c 2 1 nf; R 2 1000 Q; 1N6638, 1N6638U Tame) * 1-0 mA de 4.5 1N6642, 1N6642U 5.0 1N6643, 1N6643U 6.0 | See footnote at end of table. M@ 0000125 0035226 794 MMILSMIL-S-19500/578B TABLE I. Group A inspection - Continued. 1/ For sampling plan, see MIL-S-19500. @ ooooleS 00352e7 b2eO MMILS MIL-STD-750 | Limits Inspection 1/ Symbol Unit Method Conditions Min Max | | Subgroup 5 | Not applicable | Subgroup 6 | Surge current 4066 [Igy = 2.5 ACpk) ten surges at | one per minute (max) surge duration 1/100 to 1/120 s Electrical | See table II, steps 1 and 3 measurements Subgroup 7 | Forward recovery 4026 |1, = 50 mA de (see 4.5.2) Vy, 5.0 |V (pk) | voltage and time ty 20.0 |ns | | | | { |MIL-S-19500/578B TABLE II. Groups A, B, and C electrical measurements. 1/ 2/ 3/ MIL-STD-750 Limits Step Inspection Symbol Unit Method Conditions Min Max 1 |forward voltage 4011 |t, = 5 ms | ave, 4/ | +25 mV de I, = 10 mA de maximum change . pulsed 2 |Reverse current 4016 |DC method Alp, 4/ | 100 percent or Vz, = 20 V de 20 nA de which- ever is greater. 41/ The electrical measurements for table 1Va (JANS) of MIL-S-19500 are as follows: Subgroup 5, see table II herein, steps 1 and 2. 2/ The electrical measurements for table IVb (JANTX and JANTXV) of MIL-S-19500 are as follows: Subgroups 3 and 6, see table II herein, steps 1 and 2. 3/ The electrical measurements for table V of MIL-S-19500 are as follows: Subgroup 6, see table II herein, steps 1 and 2 for JANS, JANTX, and JANTXV. 4/ Devices which exceed the group A Limits for this test shall not be accepted. Me 0000125 0035226 Sb? MBNILSMIL-S-19500/578B 4H at 4 \ sec nL Dimensions Symbol Inches Millimeters Notes Min Max Min Max oB .018 .022 0.46 0.56 4 oD -056 -075 1.42 1.91 2,3 G 140 - 180 3.56 4.57 L 1.000 | 1.500 | 25.40 | 38.10 TYPES 1N6638, 1N6642, AND 1N6643 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Dimension 0 shall be measured at the largest diameter. 4. The G dimension shall include all uncontrolled areas of the device leads. FIGURE 1. Physical dimensions. @ oooobes 0035229 4T3 MMNILSMIL-S-19500/578B o yo | aN fo tN p44 \ |, NN _L U7? a A _ eh c Dimensions Symbol Inches Millimeters Min Max Min Max A 165 2195 4.19 6.95 B 019 .028 0.48 0.71 Cc -003 0.08 D -070 .085 1.78 2.16 TYPES 1N6638U, 1N6642U, AND 1N6643U AND JANS1N4148US- 1 FIGURE 2. Physical dimensions of surface mount family. M 0000125 0035230 115 MMILSMIL-S-19500/5788 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Notes. The notes specified in MIL-S-19500 are applicable to this specification. 6.2 Acquisition requirements. Acquisition documents may specify the lead finish. 6.3 Interchangeability. The 1N6642 is preferred type Cin Lieu of the 1N4148 and 1N4148-1) for high reliability, high stress application (see 1.1 and 3.3.3b) and should be used whenever available. 6.3.1 Cross reference substitution List. JANS 1N4148 will no longer be built to MIL-S-19500/116. Devices in stock are acceptable provided the date code does not exceed the date of implementation of MIL-S-19500/116J. Devices required for space flight applications are found herein. A PIN for PIN replacement table follows, and these devices are directly interchangeable: Nonpreferred PIN | Preferred PIN 1N4148-1 1N6642 CONCLUDING MATERIAL Custodians: Preparing activity: Army - ER DOLA- ES Navy - EC Air Force - 17 (Project 5961-1612) NASA - NA Review activities: Army - AR, MI, SM Navy - AS, MC Air Force - 19, 85, 99 M@ 0000125 0035231 051 MMMILS