S E M I C O N D U C T O R December 1996 CD74FCT153T, CD74FCT253T, CD74FCT2153T, CD74FCT2253T High-Speed CMOS Dual 4-Input Multiplexer Features Description * Advanced 0.8 micron CMOS Technology * These Devices are Pin Compatible with Bipolar FASTTM Series at a Higher Speed and Lower Power Consumption * 25 Series Resistor On All Outputs (FCT2XXX Only) * TTL Input and Output Levels * Low Ground Bounce Outputs (25 Series Only) * Extremely Low Static Power * Hysteresis on All Inputs The CD74FCT153T, CD74FCT253T, CD74FCT2153T and CD74FCT2253T are high-speed dual 4-input multiplexers. The CD74FCT153T and CD74FCT2153T have TTL outputs, while the CD74FCT253T and CD74FCT2253T have threestate outputs. The output buffers are designed with a poweroff disable allowing `live insertion' of boards when used as backplane drivers. Ordering Information TEMP. PKG. PART NUMBER RANGE (oC) PACKAGE NO. CD74FCT153TM -40 to 85 16 Ld SOIC M16.3-P CD74FCT153ATM -40 to 85 16 Ld SOIC M16.3-P CD74FCT153CTM -40 to 85 16 Ld SOIC M16.3-P CD74FCT153TNM -40 to 85 16 Ld SOIC M16.15-P CD74FCT153ATNM -40 to 85 16 Ld SOIC M16.15-P CD74FCT153CTNM -40 to 85 16 Ld SOIC M16.15-P CD74FCT153TQM -40 to 85 16 Ld QSOP M16.15A-P CD74FCT153ATQM -40 to 85 16 Ld QSOP M16.15A-P CD74FCT153CTQM -40 to 85 16 Ld QSOP M16.15A-P CD74FCT253TM -40 to 85 16 Ld SOIC M16.3-P CD74FCT253ATM -40 to 85 16 Ld SOIC M16.3-P CD74FCT253CTM -40 to 85 16 Ld SOIC M16.3-P CD74FCT253TNM -40 to 85 16 Ld SOIC M16.15-P CD74FCT253ATNM -40 to 85 16 Ld SOIC M16.15-P CD74FCT253CTNM -40 to 85 16 Ld SOIC M16.15-P CD74FCT253TQM -40 to 85 16 Ld QSOP M16.15A-P CD74FCT253ATQM -40 to 85 16 Ld QSOP M16.15A-P CD74FCT253CTQM -40 to 85 16 Ld QSOP M16.15A-P CD74FCT2153TM -40 to 85 16 Ld SOIC M16.3-P CD74FCT2153ATM -40 to 85 16 Ld SOIC M16.3-P CD74FCT2153CTM -40 to 85 16 Ld SOIC M16.3-P CD74FCT2153TNM -40 to 85 16 Ld SOIC M16.15-P CD74FCT2153ATNM -40 to 85 16 Ld SOIC M16.15-P CD74FCT2153CTNM -40 to 85 16 Ld SOIC M16.15-P CD74FCT2153TQM -40 to 85 16 Ld QSOP M16.15A-P CD74FCT2153ATQM -40 to 85 16 Ld QSOP M16.15A-P CD74FCT2153CTQM -40 to 85 16 Ld QSOP M16.15A-P CD74FCT2253TM -40 to 85 16 Ld SOIC M16.3-P CD74FCT2253ATM -40 to 85 16 Ld SOIC M16.3-P CD74FCT2253CTM -40 to 85 16 Ld SOIC M16.3-P CD74FCT2253TNM -40 to 85 16 Ld SOIC M16.15-P CD74FCT2253ATNM -40 to 85 16 Ld SOIC M16.15-P CD74FCT2253CTNM -40 to 85 16 Ld SOIC M16.15-P CD74FCT2253TQM -40 to 85 16 Ld QSOP M16.15A-P CD74FCT2253ATQM -40 to 85 16 Ld QSOP M16.15A-P CD74FCT2253CTQM -40 to 85 16 Ld QSOP M16.15A-P NOTE: When ordering, use the entire part number. Add the suffix 96 to obtain the variant in the tape and reel. The CD74FCT2153T and CD74FCT2253T devices have a built-in 25 series resistor on all outputs to reduce noise due to reflections, thus eliminating the need for an external terminating resistor. Pinout CD74FCT153T, CD74FCT253T, CD74FCT2153T, CD74FCT2253T (QSOP, SOIC) TOP VIEW EA 1 16 VCC S1 2 15 EB I3A 3 14 S0 I2A 4 13 I3B I1A 5 12 I2B I0A 6 11 I1B OA 7 10 I0B GND 8 9 OB CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. FASTTM is a trademark of Fairchild Semiconductor. 1 Copyright (c) Harris Corporation 1996 File Number 4161.2 CD74FCT153T, CD74FCT253T, CD74FCT2153T, CD74FCT2253T Functional Block Diagram EB EA S1 S0 I0A I1A I2A I3A I0B I1B I2B I3B THREE-STATE ENABLE ON CD74FCT253T ONLY OA OB TRUTH TABLE (NOTE 1) OUTPUTS INPUTS CD74FCT153, CD74FCT2153 CD74FCT253, CD74FCT2253 EA EB S1 S0 OA OB OA OB H X X X L X Z X X H X X X L X Z L L L L I0A I0B I0A I0B L L L H I1A I1B I1A I1B L L H L I2A I2B I2A I2B L L H H I3A I3B I3A I3B NOTE: 1. H = High Voltage Level L = Low Voltage Level X = Don't Care Z = High Impedance Pin Description PIN NAME DESCRIPTION I0A-I3A, I0B-I3B Data Inputs S0, S1 Select Inputs EA, EB Enable Input OA, OB Data Outputs GND Ground VCC Power 2 CD74FCT153T, CD74FCT253T, CD74FCT2153T, CD74FCT2253T Absolute Maximum Ratings Thermal Information DC Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V DC Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120mA Thermal Resistance (Typical, Note 2) JA (oC/W) 16 Lead SOIC (150 mil) Package . . . . . . . . . . . . . . 110 16 Lead SOIC (300 mil) Package . . . . . . . . . . . . . . 97 16 Lead QSOP Package . . . . . . . . . . . . . . . . . . . . . 140 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (Lead Tips Only) Operating Conditions Operating Temperature Range . . . . . . . . . . . . . . . . . . -40oC to 85oC Supply Voltage to Ground Potential Inputs and VCC Only. . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V Supply Voltage to Ground Potential Outputs and D/O Only. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 2. JA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications PARAMETERS (NOTE 3) TEST CONDITIONS SYMBOL (NOTE 4) TYP MAX UNITS 2.4 3.0 - V MIN DC ELECTRICAL SPECIFICATIONS Over the Operating Range, TA = -40oC to 85oC, VCC = 5.0V 5% Output HIGH Voltage VOH VCC = Min, VIN = VIH or VIL IOH = -15.0mA Output LOW Voltage VOL VCC = Min, VIN = VIH or VIL IOL = 48mA - 0.3 0.50 V Output LOW Voltage VOL VCC = Min, VIN = VIH or VIL IOL = 12mA (25 series) - 0.3 0.50 V Input HIGH Voltage VIH Guaranteed Logic HIGH Level 2.0 - - V Input LOW Voltage VIL Guaranteed Logic LOW Level - - 0.8 V Input HIGH Current IIH VCC = Max VIN = VCC - - 1 A IIL VCC = Max VIN = GND - - -1 A IOZH, IOZL VCC = Max VOUT = 2.7V 1 A Input LOW Current High Impedance Output Current VIK VCC = Min, IIN = -18mA Short Circuit Current IOS VCC = Max (Note 5), VOUT = GND Power Down Disable IOFF VCC = GND, VOUT = 4.5V Input Hysteresis -1 A - -0.7 -1.2 V -60 -120 - mA VOUT = 0.5V Clamp Diode Voltage - - 100 A - 200 - mV VIN = 0V - 6 10 pF VOUT = 0V - 8 12 pF VH CAPACITANCE TA = 25oC, f = 1MHz Input Capacitance (Note 6) Output Capacitance (Note 6) CIN COUT POWER SUPPLY SPECIFICATIONS ICC VCC = Max VIN = GND or VCC - 0.1 500 A Supply Current per Input at TTL HIGH ICC VCC = Max VIN = 3.4V (Note 7) - 0.5 2.0 mA Supply Current per Input per MHz (Note 8) ICCD VCC = Max, Outputs Open Other Inputs at GND One Bit Toggling 50% Duty Cycle VIN = VCC VIN = GND - 0.15 0.25 mA/ MHz Total Power Supply Current (Note 10) IC VCC = Max, Outputs Open fI = 10MHz, 50% Duty Cycle Other Inputs at GND One Bit Toggling VIN = VCC VIN = GND - 3.2 6.5 (Note 9) mA VIN = 3.4V VIN = GND - 3.5 7.5 (Note 9) mA Quiescent Power Supply Current 3 CD74FCT153T, CD74FCT253T, CD74FCT2153T, CD74FCT2253T Switching Specifications Over Operating Range PARAMETER (NOTE 11) TEST CONDITIONS SYMBOL T (NOTE 12) MIN AT MAX (NOTE 12) MIN 1.5 9.0 CT MAX (NOTE 12) MIN MAX UNIT 1.5 6.6 1.5 5.6 ns CD74FCT153T, CD74FCT2153T Propagation Delay Sn to O tPLH, tPHL CL = 50pF RL = 500 Propagation Delay In to O tPLH, tPHL 1.5 7.0 1.5 5.2 1.5 4.5 ns Propagation Delay E to O tPLH, tPHL 1.5 7.0 1.5 5.2 1.5 4.8 ns 1.5 9.0 1.5 6.6 1.5 5.6 ns CD74FCT253T, CD74FCT2253T Propagation Delay Sn to O tPLH, tPHL CL = 50pF RL = 500 Propagation Delay In to O tPLH, tPHL 1.5 7.0 1.5 5.2 1.5 4.5 ns Output Enable Time E to O tPZH, tPZL 1.5 9.0 1.5 6.0 1.5 5.0 ns Output Enable Time E to O (Note 13) tPHZ, tPLZ 1.5 7.0 1.5 6.0 1.5 5.0 ns NOTES: 3. For conditions shown as Max or Min, use appropriate value specified under Electrical Characteristics for the applicable device type. 4. Typical values are at VCC = 5.0V, 25oC ambient and maximum loading. 5. Not more than one output should be shorted at one time. Duration of the test should not exceed one second. 6. This parameter is determined by device characterization but is not production tested. 7. Per TTL driven input (VIN = 3.4V); all other inputs at VCC or GND. 8. This parameter is not directly testable, but is derived for use in Total Power Supply Calculations. 9. Values for these conditions are examples of the Icc formula. These limits are guaranteed but not tested. 10. IC = IQUIESCENT + IINPUTS + IDYNAMIC IC = ICC + ICC DHNT + ICCD (fCP/2 + fINI) ICC = Quiescent Current ICC = Power Supply Current for a TTL High Input (Vin = 3.4V) DH = Duty Cycle for TTL Inputs High NT = Number of TTL Inputs at DH ICCD = Dynamic Current Caused by an Input Transition Pair (HLH or LHL) fCP = Clock Frequency for Register Devices (Zero for Non-Register Devices) fI = Input Frequency NI = Number of Inputs at fI All currents are in milliamps and all frequencies are in megahertz. 11. See test circuit and wave forms. 12. Minimum limits are guaranteed but not tested on Propagation Delays. 13. This parameter is guaranteed but not production tested. 4 CD74FCT153T, CD74FCT253T, CD74FCT2153T, CD74FCT2253T Test Circuits and Waveforms VCC SWITCH POSITION 7.0V 500 VOUT VIN PULSE GENERATOR DUT 50pF CL RT TEST SWITCH tPLZ, tPZL Closed tPHZ, tPZH, tPLH, tPHL Open DEFINITIONS: CL = Load capacitance, includes jig and probe capacitance. RT = Termination resistance, should be equal to ZOUT of the Pulse Generator. 500 NOTE: 14. Pulse Generator for All Pulses: Rate 1.0MHz; ZOUT 50; tf, tr 2.5ns. FIGURE 1. TEST CIRCUIT ENABLE DISABLE 3V 3V SAME PHASE INPUT TRANSITION 1.5V CONTROL INPUT 0V tPLZ tPZL tPLH 3.5V OUTPUT NORMALLY LOW SWITCH CLOSED OUTPUT NORMALLY HIGH SWITCH OPEN tPHL 3.5V VOH 1.5V 0.3V tPZH 1.5V tPHZ 0.3V 1.5V VOL OUTPUT VOL tPLH VOH tPHL 3V 1.5V 0V 0V OPPOSITE PHASE INPUT TRANSITION 0V 1.5V 0V FIGURE 3. PROPAGATION DELAY FIGURE 2. ENABLE AND DISABLE TIMING 5 CD74FCT153T, CD74FCT253T, CD74FCT2153T, CD74FCT2253T Small Outline Plastic Packages (SOIC) M16.15-P N 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H INCHES E SYMBOL 1 2 3 L SEATING PLANE D A h x 45o e B A1 C 0.10(0.004) 0.25(0.010) M MIN MAX NOTES A 0.053 0.069 1.35 1.75 - 0.0040 0.0098 0.102 0.249 - B 0.013 0.020 0.330 0.508 - C 0.007 0.010 0.178 0.254 - D 0.385 0.394 9.78 10.01 1 E 0.149 0.157 3.78 3.99 2 0.050 BSC 1.27 BSC - H 0.231 0.241 5.86 6.12 h 0.0099 0.0196 0.25 0.50 - L 0.016 0.050 0.41 1.27 3 8o 0o N NOTES: MILLIMETERS MAX A1 e MIN 16 0o 16 - 4 8o Rev. 0 6/96 1. Dimension "D" does not include mold flash, protrusions or gate burrs. 2. Dimension "E" does not include interlead flash or protrusions. 3. "L" is the length of terminal for soldering to a substrate. 4. "N" is the number of terminal positions. 5. Terminal numbers are shown for reference only. 6. Controlling dimension: INCHES. Converted millimeter dimensions are not necessarily exact. 6 CD74FCT153T, CD74FCT253T, CD74FCT2153T, CD74FCT2253T Small Outline Plastic Packages (SOIC) M16.3-P N 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H INCHES E SYMBOL 1 2 3 L SEATING PLANE D A h x 45o e B A1 C 0.10(0.004) 0.25(0.010) M MIN MAX NOTES A 0.092 0.105 2.34 2.67 - 0.004 0.012 0.102 0.302 - B 0.013 0.020 0.330 0.508 - C 0.009 0.011 0.229 0.279 - D 0.397 0.413 10.08 10.49 1 E 0.291 0.299 7.39 7.59 2 0.050 BSC 1.27 BSC 0.401 0.411 h 0.010 0.029 0.254 0.737 - L 0.016 0.050 0.41 1.27 3 8o 0o 10.18 16 0o 10.44 - H N NOTES: MILLIMETERS MAX A1 e MIN 16 - 4 8o Rev. 0 5/96 1. Dimension "D" does not include mold flash, protrusions or gate burrs. 2. Dimension "E" does not include interlead flash or protrusions. 3. "L" is the length of terminal for soldering to a substrate. 4. "N" is the number of terminal positions. 5. Terminal numbers are shown for reference only. 6. Controlling dimension: INCHES. Converted millimeter dimensions are not necessarily exact. 7 CD74FCT153T, CD74FCT253T, CD74FCT2153T, CD74FCT2253T Shrink Small Outline Plastic Packages (SSOP/QSOP) M16.15A-P N INDEX AREA 16 LEAD SHRINK NARROW BODY SMALL OUTLINE PLASTIC PACKAGE H E 1 2 INCHES 3 L SEATING PLANE D A h x 45o SYMBOL MIN MAX MIN MAX NOTES A 0.053 0.069 1.35 1.75 - A1 0.007 0.011 0.178 0.279 - B 0.008 0.012 0.203 0.305 - C 0.007 0.010 0.178 0.254 - D 0.189 0.197 4.80 5.00 1 E 0.149 0.157 3.78 3.99 2 e e A1 B H C 0.025 BSC 0.228 h 0.10(0.004) L 0.17(0.007) M 1. Dimension "D" does not include mold flash, protrusions or gate burrs. 0.635 BSC 0.244 5.79 0.015 0.016 N NOTES: MILLIMETERS 6.20 - 0.38 0.050 0.41 16 0o - 1.27 3 16 8o 0o 4 8o Rev. 2 7/96 2. Dimension "E" does not include interlead flash or protrusions. 3. "L" is the length of terminal for soldering to a substrate. 4. "N" is the number of terminal positions. 5. Terminal numbers are shown for reference only. 6. Controlling dimension: INCHES. Converted millimeter dimensions are not necessarily exact. All Harris Semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Harris Semiconductor products are sold by description only. Harris Semiconductor reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Harris is believed to be accurate and reliable. However, no responsibility is assumed by Harris or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Harris or its subsidiaries. Sales Office Headquarters For general information regarding Harris Semiconductor and its products, call 1-800-4-HARRIS NORTH AMERICA Harris Semiconductor P. O. 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