NE5534AD - ON Semiconductor - Datasheet.Directory

March, 2006 − Rev. 2

1Publication Order Number:

NE5534/D

NE5534, SA5534, SE5534,

NE5534A, SA5534A,

SE5534A

Single Low Noise

Operational Amplifier

The NE/SA/SE5534/5534A are single high-performance low noise

operational amplifiers. Compared to other operational amplifiers,

such as TL083, they show better noise performance, improved output

drive capability, and considerably higher small-signal and power

bandwidths.

This makes the devices especially suitable for application in high

quality and professional audio equipment, in instrumentation and

control circuits and telephone channel amplifiers. The op amps are

internally compensated for gain equal to, or higher than, three. The

frequency response can be optimized with an external compensation

capacitor for various applications (unity gain amplifier, capacitive

load, slew rate, low overshoot, etc.).

Features

•Small-Signal Bandwidth: 10 MHz

•Output Drive Capability: 600 W, 10 VRMS at VS = "18 V

•Input Noise Voltage: 4nVńHz

•DC Voltage Gain: 100000

•AC Voltage Gain: 6000 at 10 kHz

•Power Bandwidth: 200 kHz

•Slew Rate: 13 V/ms

•Large Supply Voltage Range: "3.0 to "20 V

•Pb−Free Packages are Available

Applications

•Audio Equipment

•Instrumentation and Control Circuits

•Telephone Channel Amplifiers

•Medical Equipment

http://onsemi.com

See detailed ordering and shipping information in the package

dimensions section on page 8 of this data sheet.

ORDERING INFORMATION

PIN CONNECTIONS

SOIC−8

D SUFFIX

CASE 751

Top View

PDIP−8

N SUFFIX

CASE 626

1BALANCE/

COMPENSATION

V+

OUTPUT

COMPENSATION

BALANCE

INVERTING INPUT

NON-INVERTING

V−

D, N Packages

See general marking information in the device marking

section on page 8 of this data sheet.

DEVICE MARKING INFORMATION

NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A

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Figure 1. Equivalent Schematic

MAXIMUM RATINGS

Rating Symbol Value Unit

Supply Voltage VS"22 V

Input Voltage VIN "V Supply V

Differential Input Voltage (Note 1) VDIFF "0.5 V

Operating Temperature Range

Tamb 0 to +70

−40 to +85

−55 to +125

°C

Storage Temperature Range Tstg −65 to +150 °C

Junction Temperature Tj150 °C

Power Dissipation at 25°C

N Package

D Package

PD1150

750

Thermal Resistance, Junction−to−Ambient

N Package

D Package

RqJA 130

158

°C/W

Output Short-Circuit Duration (Note 2) −Indefinite −

Lead Soldering Temperature (10 sec max) Tsld 230 °C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input

voltage exceeds 0.6 V. Maximum current should be limited to "10 mA.

2. Output may be shorted to ground at VS = "15 V, Tamb = 25°C. Temperature and/or supply voltages must be limited to ensure dissipation rating

is not exceeded.

NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A

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DC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = "15 V, unless otherwise noted.) (Notes 3, 4 and 5)

Characteristic Symbol Test Conditions

NE/SA5534/5534A SE5534/5534A

Unit

Min Typ Max Min Typ Max

VOS −0.5 4.0 −0.5 2.0 mV

Offset Voltage Overtemperature − − 5.0 − − 3.0 mV

DVOS/DT−5.0 − − 5.0 −mV/°C

IOS −20 300 −10 200 nA

Offset Current Overtemperature − − 400 − − 500 nA

DIOS/DT−200 − − 200 −pA/°C

IB−500 1500 −400 800 nA

Input Current Overtemperature − − 2000 − − 1500 nA

DIB/DT−5.0 − − 5.0 −nA/°C

Supply Current

Per Op Amp

ICC Overtemperature

−

4.0

−

8.0

−

4.0

−

6.5

9.0

Common Mode Input Range VCM "12 "13 −"12 "13 −V

Common Mode Rejection Ratio CMRR 70 100 −80 100 −dB

Power Supply Rejection Ratio PSRR −10 100 −10 50 mV/V

Large-Signal Voltage Gain AVOL RL ≥ 600 W,

VO = "10 V

Overtemperature

100

−

100

−

V/mV

Output Swing VOUT RL w 600 W"12 "13 −"12 "13 −V

Overtemperature "10 "12 −"10 "12 −

RL w 600 W;

VS = "18 V "15 "16 −"15 16 −

RL w 2.0 kW"13 "13.5 −"13 "13.5 −

Overtemperature "12 "12.5 −"12 "12.5 −

Input Resistance RIN 30 100 −50 100 −kW

Output Short Circuit Current ISC −38 − − 38 −mA

3. For NE5534/5534A, TMIN = 0°C, TMAX = 70°C.

4. For SA5534/5534A, TMIN = −40°C, TMAX = +85°C.

5. For SE5534/5534A, TMIN = −55°C, TMAX = +125°C.

NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A

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AC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = "15 V, unless otherwise noted.)

Characteristic Symbol Test Conditions

NE/SA5534/5534A SE5534/5534A

Unit

Min Typ Max Min Typ Max

Output Resistance ROUT AV = 30 dB

closed-loop

f = 10 kHz;

RL = 600 W;

CC = 22 pF

−0.3 − − 0.3 −W

Transient Response Voltage-follower,

VIN = 50 mV

RL = 600 W,

CC = 22 pF,

CL = 100 pF

Rise Time tR−20 − − 20 −ns

Overshoot − − 20 − − 20 −%

Transient Response VIN = 50 mV,

RL = 600 W,

CC = 47 pF,

CL = 500 pF

Rise Time tR−50 − − 50 −ns

Overshoot − − 35 − − 35 −%

Gain AVf = 10 kHz, CC = 0 −6.0 − − 6.0 −V/mV

f = 10 kHz,

CC = 22 pF

−2.2 − − 2.2 −

Gain Bandwidth Product GBW CC = 22 pF,

CL = 100 pF

−10 − − 10 −MHz

Slew Rate SR CC = 0 −13 − − 13 −V/ms

CC = 22 pF −6.0 − − 6.0 −

Power Bandwidth −VOUT = "10 V,

CC = 0 pF

−200 − − 200 −kHz

VOUT = "10 V,

CC = 22 pF

−95 − − 95 −

VOUT = "14 V,

RL = 600 W,

CC = 22 pF,

VCC = "18 V

−70 − − 70 −

ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = 15 V, unless otherwise noted.)

Characteristic Symbol Test Conditions

NE/SA/SE5534 NE/SA/SE5534A

Unit

Min Typ Max Min Typ Max

Input Noise Voltage VNOISE fO = 30 Hz

fO = 1.0 kHz

−

7.0

4.0

−

5.5

3.5

7.0

4.5

nV/√Hz

Input Noise Current INOISE fO = 30 Hz

fO = 1.0 kHz

−

2.5

0.6

−

1.5

0.4

−

pA/√Hz

Broadband Noise Figure −f = 10 Hz to

20 kHz;

RS = 5.0 kW

− − − − 0.9 −dB

Channel Separation −f = 1.0 kHz;

RS = 5.0 kW

−110 − − 110 −dB

NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A

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TYPICAL PERFORMANCE CHARACTERISTICS

GAIN (dB)

(nVńHz

Ǹ)

10 102103104105106107

120

-40

f (Hz)

04080

102103104105106107

-55 -25 0 25 50 75 100 +125 -55 -25 0 25 50 75 100 +125

1,4

1,2

0,8

0,4

01020

102

10−1

10−2

10 102103104

CC(pF)

f (Hz)

amb (oC) T

amb (oC)

TYP TYP

TYP

NEG

POS

CC =

0pF

22pF

47pF

CC = 0

CC = 22pF S

(V/ms)

(V)

Vo(p-p)

(mA)

VIN (V)

(mA)

Vp; -VN (V) Vp; -VN (V)

Figure 2. Open-Loop

Frequency Response

Figure 3. Slew Rate as a

Function of Compensation

Capacitance

GAIN (dB)

-20

103104105106107108

f (Hz)

CC = 0; RF = 10kW; RE = 100W

CC = 0; RF = 9kW; RE = 1kW

CC = 22pF; RF = 1kW; RE = ∞

Figure 4. Closed−Loop

Frequency Response

Figure 5. Large−Signal

Frequency Response

Figure 6. Output

Short−Circuit Current

Figure 7. Input Bias

Current

Figure 8. Input Common−Mode

Voltage Range

Figure 9. Supply Current

Per Op Amp

Figure 10. Input Noise

Voltage Density

TYPICAL VALUES

VS = +15V TYPICAL VALUES

VS = +15V

TYPICAL VALUES

VS = +15V VS = +15V

TYPICAL VALUES IO = 0

NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A

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TYPICAL PERFORMANCE CHARACTERISTICS

RS (W)

(pAńHz

Ǹ)

(nVńHz

Ǹ)

102

10−1

10−2

10 102103104

f (Hz)

TYP

Figure 11. Input Noise

Current Density

10 102103104105106

Figure 12. Total Input

Noise Density

01020

RS (W)

Figure 13. Broadband Input

Noise Voltage

Vn(rms)

In(rms)

106

105

104

103

102

10−1

10−2

Vn(rms)

(mV)

102

10−1

10−2

10Hz

1kHz

THERMAL NOISE

OF SOURCE

RESISTANCE

10Hz TO 20kHz

200Hz TO 4kHz

TYPICAL VALUES TYPICAL VALUES

NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A

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TEST LOAD CIRCUITS

100kW

22kW

600W

25W

100pF

V+

V-

Figure 14. Frequency Compensation and

Offset Voltage Adjustment Circuit

Figure 15. Closed-Loop Frequency Response

5534

(nVńHz

Ǹ)

(nVńHz

Ǹ)

CAL

OSC

POWER

SUPPLY

CAL

METER

+VCC -VCC

+40dB

10kW

100W

TEST BOARD

GND

1WDUT

BANDPASS

AT 1kHz

BANDPASS

AT 30Hz

Figure 16. Noise Test Block Diagram

NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A

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SA5234xN

AWL

YYWWG

PDIP−8

N SUFFIX

CASE 626

SOIC−8

D SUFFIX

CASE 751

x = Blank or A

A = Assembly Location

WL, L = Wafer Lot

YY, Y = Year

WW, W = Work Week

G or G= Pb−Free Package

MARKING DIAGRAMS

N5234

ALYWA

S5234

ALYWA

S5234

ALYW

NE5234xN

AWL

YYWWG

SE5234xN

AWL

YYWWG

ORDERING INFORMATION

Device Description Temperature Range Shipping†

NE5534AD 8−Pin Plastic Small Outline (SO−8) Package 0 to +70°C98 Units / Rail

NE5534ADG 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 0 to +70°C98 Units / Rail

NE5534ADR2 8−Pin Plastic Small Outline (SO−8) Package 0 to +70°C2500 / Tape & Reel

NE5534ADR2G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 0 to +70°C2500 / Tape & Reel

NE5534AN 8−Pin Plastic Dual In−Line Package (PDIP−8) 0 to +70°C50 Units / Rail

NE5534ANG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) 0 to +70°C50 Units / Rail

NE5534D 8−Pin Plastic Small Outline (SO−8) Package 0 to +70°C98 Units / Rail

NE5534DG 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 0 to +70°C98 Units / Rail

NE5534DR2 8−Pin Plastic Small Outline (SO−8) Package 0 to +70°C2500 / Tape & Reel

NE5534DR2G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 0 to +70°C2500 / Tape & Reel

NE5534N 8−Pin Plastic Dual In−Line Package (PDIP−8) 0 to +70°C50 Units / Rail

NE5534NG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) 0 to +70°C50 Units / Rail

SA5534AD 8−Pin Plastic Small Outline (SO−8) Package −40 to +85°C98 Units / Rail

SA5534ADG 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) −40 to +85°C98 Units / Rail

SA5534ADR2 8−Pin Plastic Small Outline (SO−8) Package −40 to +85°C2500 / Tape & Reel

SA5534ADR2G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) −40 to +85°C2500 / Tape & Reel

SA5534AN 8−Pin Plastic Dual In−Line Package (PDIP−8) −40 to +85°C50 Units / Rail

SA5534ANG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) −40 to +85°C50 Units / Rail

SA5534N 8−Pin Plastic Dual In−Line Package (PDIP−8) −40 to +85°C50 Units / Rail

SA5534NG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) −40 to +85°C50 Units / Rail

SE5534AN 8−Pin Plastic Dual In−Line Package (PDIP−8) −55 to +125°C50 Units / Rail

SE5534ANG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) −55 to +125°C50 Units / Rail

SE5534N 8−Pin Plastic Dual In−Line Package (PDIP−8) −55 to +125°C50 Units / Rail

SE5534NG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) −55 to +125°C50 Units / Rail

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A

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PACKAGE DIMENSIONS

SOIC−8 NB

CASE 751−07

ISSUE AG

SEATING

PLANE

X 45_

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

6. 751−01 THRU 751−06 ARE OBSOLETE. NEW

STANDARD IS 751−07.

0.10 (0.004)

DIM

MIN MAX MIN MAX

INCHES

4.80 5.00 0.189 0.197

MILLIMETERS

B3.80 4.00 0.150 0.157

C1.35 1.75 0.053 0.069

D0.33 0.51 0.013 0.020

G1.27 BSC 0.050 BSC

H0.10 0.25 0.004 0.010

J0.19 0.25 0.007 0.010

K0.40 1.27 0.016 0.050

M0 8 0 8

N0.25 0.50 0.010 0.020

S5.80 6.20 0.228 0.244

−X−

−Y−

0.25 (0.010)

−Z−

0.25 (0.010) ZSXS

____

1.52

0.060

7.0

0.275

0.6

0.024

1.270

0.050

4.0

0.155

ǒmm

inchesǓ

SCALE 6:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A

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PACKAGE DIMENSIONS

8−Pin Plastic Dual In−Line Package (PDIP−8)

N SUFFIX

CASE 626−05

ISSUE L

NOTES:

1. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

2. PACKAGE CONTOUR OPTIONAL (ROUND OR

SQUARE CORNERS).

3. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

NOTE 2 −A−

−B−

−T−

SEATING

PLANE

0.13 (0.005) B M

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A9.40 10.16 0.370 0.400

B6.10 6.60 0.240 0.260

C3.94 4.45 0.155 0.175

D0.38 0.51 0.015 0.020

F1.02 1.78 0.040 0.070

G2.54 BSC 0.100 BSC

H0.76 1.27 0.030 0.050

J0.20 0.30 0.008 0.012

K2.92 3.43 0.115 0.135

L7.62 BSC 0.300 BSC

M−−− 10 −−− 10

N0.76 1.01 0.030 0.040

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any

liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental

damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over

time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under

its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,

or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death

may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,

subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of

personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.

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PUBLICATION ORDERING INFORMATION

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USA/Canada

Japan: ON Semiconductor, Japan Customer Focus Center

2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051

Phone: 81−3−5773−3850

NE5534/D

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