TLP292-4(GB,E(T - TOSHIBA - Datasheet.Directory

DMN6075S

Document number: DS37023 Rev. 6 - 2

1 of 7

www.diodes.com

May 2018

DMN6075S

ADVANCE INFO R MA T I O N

60V N-CHANNEL ENHANCEMENT MODE MOSFET

Summary

BVDSS

RDS(ON) Max

ID Max

TA = +25°C

60V

85mGS = 10V

2.5A

120mGS = 4.5V

2.0A

Description

This new generation MOSFET is designed to minimize the on-state

resistance (RDS(ON)) and yet maintain superior switching performance,

making it ideal for high efficiency power management applications.

Applications

 DC-DC Converters

 Power Management Functions

 Backlighting

Features and Benefits

 N MOSFET

 Low On-Resistance

 Low Input Capacitance

 Fast Switching Speed

 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

 Halogen and Antimony Free. “Green” Device (Note 3)

 Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

 Case: SOT23

 Case Material: ;

UL Flammability Classification Rating 94V-0

 Moisture Sensitivity: Level 1 per J-STD-020

 Terminal Connections: See Diagram Below

 Terminals: Finish - Matte Tin Annealed over Copper Leadframe.

Solderable per MIL-STD-202, Method 208

 Weight: 0.008 grams (Approximate)

Ordering Information (Note 4)

Product

Reel Size (inches)

Tape Width (mm)

Quantity per Reel

DMN6075S-7

7

8

3,000

DMN6075S-13

13

8

10,000

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.

2. See https://www.diodes.com/quality/lead-- and Antimony-free, "Green"

and Lead-free.

3. Halogen- and Antimony-900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and

<1000ppm antimony compounds.

4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.

Marking Information

Date Code Key

Year

2014

~

2017

2018

2019

2020

2021

2022

2023

2024

2025

Code

B

~

E

F

G

H

I

J

K

L

M

Month

Jan

Feb

Mar

Apr

May

Jun

Jul

Aug

Sep

Oct

Nov

Dec

Code

1

2

3

4

5

6

7

8

9

O

N

D

SOT23

Top View

Pin Configuration

D

GS

D

S

G

Top View

SOT23

S67 = Product Type Marking Code

YM = Date Code Marking

Y  = Year (ex: F = 2018)

M = Month (ex: 9 = September)

e3

S67

YM

DMN6075S

Document number: DS37023 Rev. 6 - 2

2 of 7

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May 2018

DMN6075S

ADVANCE INFO R MA T I O N

Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

VDSS

60

V

Gate-Source Voltage

VGSS

±20

V

Continuous Drain Current (Note 5) VGS = 10V

Steady

State

TA = +25°C

TA = +70°C

ID

2.0

1.5

A

Continuous Drain Current (Note 6) VGS = 10V

Steady

State

TA = +25°C

TA = +70°C

ID

2.5

2.0

A

Maximum Body Diode Forward Current (Note 5)

IS

2.0

A

Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)

IDM

12

A

Thermal Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Total Power Dissipation (Note 5)

TA = +25°C

PD

0.8

W

TA = +70°C

0.5

Thermal Resistance, Junction to Ambient (Note 5)

Steady State

RJA

157

°C/W

Total Power Dissipation (Note 6)

TA = +25°C

PD

1.15

W

TA = +70°C

0.7

Thermal Resistance, Junction to Ambient (Note 6)

Steady State

RJA

110

°C/W

Operating and Storage Temperature Range

TJ, TSTG

-55 to +150

°C

Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 7)

Drain-Source Breakdown Voltage

BVDSS

60



V

VGS = 0V, ID 

Zero Gate Voltage Drain Current TJ = +25°C

IDSS



1.0

µA

VDS = 60V, VGS = 0V

Gate-Source Leakage

IGSS



±100

nA

VGS = ±16V, VDS = 0V

ON CHARACTERISTICS (Note 7)

Gate Threshold Voltage

VGS(TH)

1



3

V

VDS = VGS, ID = 250

Static Drain-Source On-Resistance

RDS(ON)



69

85

m

VGS = 10V, ID = 3.2A

75

120

VGS = 4.5V, ID = 2.8A

Diode Forward Voltage

VSD



1.2

V

VGS = 0V, IS = 2.5A

DYNAMIC CHARACTERISTICS (Note 8)

Input Capacitance

Ciss



606



pF

VDS = 20V, VGS = 0V,

f = 1.0MHz

Output Capacitance

Coss



32.6



pF

Reverse Transfer Capacitance

Crss



24.6



pF

Gate Resistance

Rg



1.5





VDS = 0V, VGS = 0V, f = 1MHz

Total Gate Charge (VGS = 10V)

Qg



12.3



nC

VDS = 30V, ID = 3A

Total Gate Charge (VGS = 4.5V)

Qg



5.6



nC

Gate-Source Charge

Qgs



1.7



nC

Gate-Drain Charge

Qgd



1.9



nC

Turn-On Delay Time

tD(ON)



3.5



ns

VGS = 10V, VDS = 30V,

Rg = 20, RL = 50

Turn-On Rise Time

tR



4.1



ns

Turn-Off Delay Time

tD(OFF)



35



ns

Turn-Off Fall Time

tF



11



ns

Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.

6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1-inch square copper plate.

7. Short duration pulse test used to minimize self-heating effect.

8. Guaranteed by design. Not subject to product testing.

DMN6075S

Document number: DS37023 Rev. 6 - 2

3 of 7

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DMN6075S

ADVANCE INFO R MA T I O N

V , DRAIN-SOURCE VOLTAGE (V)

Figure 1 Typical Output Characteristics

DS

I , DRAIN CURRENT (A)

D

0.0

3.0

6.0

9.0

12.0

15.0

0 1 2 3 4 5

V = 2.5V

GS

V = 3.0V

GS

V = 3.5V

GS

V = 4.0V

GS

V = 10V

GS

V =5.0V

GS

I , DRAIN-SOURCE CURRENT (A)

D

Figure 3 Typical On-Resistance vs.

Drain Current and Gate Voltage

R , DRAIN-SOURCE ON-RESISTANCE ( )

DS(ON) 

0

0.03

0.06

0.09

0.12

0.15

0 3 6 9 12 15

V = 4.5V

GS

V = 10V

GS

V , GATE-SOURCE VOLTAGE (V)

GS

Figure 4 Typical Transfer Characteristics

R , DRAIN-SOURCE ON-RESISTANCE ( )

DS(ON) 

0.04

0.06

0.08

0.1

0.12

0.14

0.16

0.18

0.2

2 4 6 8 10 12 14 16 18 20

I = 3.2A

D

I = 2.8A

D

T , JUNCTION TEMPERATURE ( C)

Figure 6 On-Resistance Variation with Temperature

J

R , DRAIN-SOURCE

ON-RESISTANCE (NORMALIZED)

DS(ON)

0.4

0.8

1.2

1.6

2

2.4

-50 -25 0 25 50 75 100 125 150

V = 4.5V

I = 3A

GS

D

V = V

I = 5A

GS

D

10

I , DRAIN CURRENT (A)

D

Figure 5 Typical On-Resistance vs.

Drain Current and Temperature

R

,

D

R

A

I

N

-

S

O

U

R

C

E

O

N

-

R

E

S

I

S

T

A

N

C

E

(

)

D

S

(

O

N

)



0

0.05

0.1

0.15

0.2

T = -55°C

A

T = 25°C

A

T = 85°C

A

T = 125°C

A

T = 150°C

A

V = 10V

GS

RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()

V , GATE-SOURCE VOLTAGE (V)

GS

Figure 2 Typical Transfer Characteristics

I

,

D

R

A

I

N

C

U

R

E

N

T

(

A

)

D

0

2

4

6

8

10

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

V = 5.0V

DS

T = 150°C

A

T = 125°C

A

T = 85°C

A

T = 25°C

A

T = -55°C

A

ID, DRAIN CURRENT (A)

DMN6075S

Document number: DS37023 Rev. 6 - 2

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DMN6075S

ADVANCE INFO R MA T I O N

T , JUNCTION TEMPERATURE ( C)

Figure 7 On-Resistance Variation with Temperature

J

R , DRAIN-SOURCE ON-RESISTANCE ( )

DS(ON) 

0

0.02

0.04

0.06

0.08

0.1

0.12

0.14

0.16

0.18

0.2

-50 -25 0 25 50 75 100 125 150

V = 4.5V

I = 3A

GS

D

V = V

I = 5A

GS

D

10

V , DRAIN-SOURCE VOLTAGE (V)

DS

Figure 10 Typical Junction Capacitance

C , JUNCTION CAPACITANCE (pF)

T

1

10

100

1000

10000

010 20 30 40

f = 1MHz

Ciss

Coss

Crss

Q (nC)

g, TOTAL GATE CHARGE

Figure 11 Gate Charge

V GATE THRESHOLD VOLTAGE (V)

GS

0

1

2

3

4

5

6

7

8

9

10

0 2 4 6 8 10 12 14

V = 30V

I = A

DS

D

3

V , DRAIN-SOURCE VOLTAGE (V)

Figure 12 SOA, Safe Operation Area

DS

I

,

D

R

A

I

N

C

U

R

E

N

T

(

A

)

D

DC

P = 10s

W

P = 1s

W

P = 100ms

W

P = 10ms

W

P = 1ms

W

P = 100µs

W

0.001

0.01

0.1

1

10

100

0.1

1

10

100

R

Limited

DS(ON)

T = 150°C

T = 25°C

V = 10V

Single Pulse

J(MAX)

A

GS

DUT on 1 * MRP Board

ID, DRAIN CURRENT (A)

VGS, GATE SOURCE VOLTAGE (V)

V , SOURCE-DRAIN VOLTAGE (V)

SD

Figure 9 Diode Forward Voltage vs. Current

I

,

S

O

U

R

C

E

C

U

R

E

N

T

(

A

)

S

T = 150°C

A

0

2

4

6

8

10

0

0.3

0.6

0.9

1.2

1.5

T =125°C

A

T =85°C

A

T = 25°C

A

T = -55°C

A

IS, SOURCE CURRENT (A)

T , JUNCTION TEMPERATURE (°C )

Figure 8 Gate Threshold Variation vs. Junction Temperature

J



V

,

G

A

T

E

T

H

R

E

S

H

O

L

D

V

O

L

T

A

G

E

(

V

)

G

S

(

t

h

)

0.5

1

1.5

2

2.5

-50

-25

0

25

50

75

100

125

150

I = 1mA

D

I = 250µA

D

VGS(TH), GATE THRESHOLD VOLTAGE (V)

DMN6075S

Document number: DS37023 Rev. 6 - 2

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DMN6075S

ADVANCE INFO R MA T I O N

t1, PULSE DURATION TIME (sec)

Figure 13 Transient Thermal Resistance

r

(

t

)

,

T

R

A

N

S

I

E

N

T

H

E

R

M

A

L

R

E

S

I

S

T

A

N

C

E

0.001

0.01

0.1

1

0.00001

0.0001

0.001

0.01

0.1

1

10

100

1000

RJA

(t) = r(t) * RJA

RJA

= 152°C/W

Duty Cycle, D = t1/ t2

Single Pulse

D = 0.005

D = 0.01

D = 0.02

D = 0.05

D = 0.1

D = 0.3

D = 0.5

D = 0.7

D = 0.9

r(t), TRANSIENT THERMAL RESISTANCE

DMN6075S

Document number: DS37023 Rev. 6 - 2

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DMN6075S

ADVANCE INFO R MA T I O N

Package Outline Dimensions

Please see http://www.diodes.com/package-outlines.html for the latest version.

SOT23

Dim

Min

Max

Typ

A

0.37

0.51

0.40

B

1.20

1.40

1.30

C

2.30

2.50

2.40

D

0.89

1.03

0.915

F

0.45

0.60

0.535

G

1.78

2.05

1.83

H

2.80

3.00

2.90

J

0.013

0.10

0.05

K

0.890

1.00

0.975

K1

0.903

1.10

1.025

L

0.45

0.61

0.55

L1

0.25

0.55

0.40

M

0.085

0.150

0.110

a

0°

8°

--

All Dimensions in mm

Suggested Pad Layout

Please see http://www.diodes.com/package-outlines.html for the latest version.

SOT23

Dimensions

Value (in mm)

C

2.0

X

0.8

X1

1.35

Y

0.9

Y1

2.9

J

K1 K

L1

GAUGE PLANE

0.25

H

L

M

All 7°

A

CB

D

G

F

a

X

Y

Y1 C

X1

DMN6075S

Document number: DS37023 Rev. 6 - 2

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DMN6075S

ADVANCE INFO R MA T I O N

IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,

INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE

(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes

without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the

application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or

trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume

all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated

website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.

Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and

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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings

noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the

final and determinative format released by Diodes Incorporated.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express

written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any

use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related

information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its

representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

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