TB6612FNG(O,C,8,EL"" - TOSHIBA - Datasheet.Directory

TB6612FNG

2012-11-01 1

Toshiba Bi-CD Integrated Circuit Silicon Monolithic

TB6612FNG

Driver IC for Dual DC motor

TB6612FNG is a driver IC for DC motor with output transistor in

LD MOS structure with low ON-resistor. Two input signals, IN1

and IN2, can choose one of four modes such as CW, CCW, short

brake, and stop mode.

Features

• Power supply voltage: VM = 15 V(Max)

• Output current: IOUT = 1.2 A(ave)/3.2 A (peak)

• Output low ON resistor: 0.5Ω (upper+lower Typ. @ VM ≥ 5 V)

• Standby (Power save) system

• CW/CCW/short brake/stop function modes

• Built-in thermal shutdown circuit and low voltage detecting circuit

• Small faced package(SSOP24: 0.65 mm Lead pitch)

* This product has a MOS structure and is sensitive to electrostatic discharge. When handling this product,

ensure that the environment is protected against electrostatic discharge by using an earth strap, a conductive

mat and an ionizer. Ensure also that the ambient temperature and relative humidity are maintained at

reasonable levels.

Weight: 0.14 g (typ.)

TB6612FNG

2012-11-01 2

Block Diagram

Pin Functions

No. Pin Name I/O Function

1 AO1

2 AO1 O ch A output 1

3 PGND1

4 PGND1 ― Power GND 1

5 AO2

6 AO2 O ch A output 2

7 BO2

8 BO2 O ch B output 2

9 PGND2

10 PGND2 ― Power GND 2

11 BO1

12 BO1 O ch B output 1

13 VM2

14 VM3 ― Motor supply

15 PWMB I ch B PWM input/200 kΩ pull-down at internal

16 BIN2 I ch B input 2/200 kΩ pull-down at internal

17 BIN1 I ch B input 1/200 kΩ pull-down at internal

18 GND ― Small signal GND

19 STBY I “L” = standby/200 kΩ pull-down at internal

20 Vcc ― Small signal supply

21 AIN1 I ch A input 1/200 kΩ pull-down at internal

22 AIN2 I ch A input 2/200 kΩ pull-down at internal

23 PWMA I ch A PWM input/200 kΩ pull-down at internal

24 VM1 ― Motor supply

TB6612FNG

2012-11-01 3

Absolute Maximum Ratings (Ta = 25°C)

Operating Range (Ta = -20 to 85°C)

Characteristics Symbol Rating Unit Remarks

VM 15

Supply voltage

VCC 6

Input voltage VIN -0.2 to 6 V IN1,IN2,STBY,PWM pins

Output voltage VOUT 15 V O1,O2 pins

IOUT 1.2 Per 1 ch

2 tw = 20 ms Continuous pulse, Duty ≤ 20%

Output current IOUT (peak)

3.2

tw = 10 ms Single pulse

0.78 IC only

0.89 50 mm × 50 mm t = 1.6 mm Cu ≥ 40% in PCB mounting

Power dissipation PD

1.36

76.2 mm × 114.3 mm t = 1.6 mm Cu ≥ 30% in PCB

monting

Operating temperature Topr -20 to 85 °C

Storage temperature Tstg -55 to 150 °C

Characteristics Symbol Min Typ. Max Unit Remarks

VCC 2.7 3 5.5 V

Supply voltage VM 2.5 5 13.5 V

― ― 1.0 VM ≥ 4.5 V

Output current (H-SW) IOUT ― ― 0.4 A 4.5 V > VM ≥ 2.5 V

Without PWM Operation

Switching frequency fPWM ― ― 100 kHz

入力端子; IN1,IN2,PWM,STBY

Vcc

GND

Input

Internal

circuit

200kΩ

出力端子; O1,O2

PGND

O1 O2

Input pin: Output pin: O1, O2

O1 O2

TB6612FNG

2012-11-01 4

H-SW Control Function

Input Output

IN1 IN2 PWM STBY OUT1 OUT2 Mode

H H H/L H L L Short brake

H H L H CCW

L H

L H L L Short brake

H H H L CW

H L

L H L L Short brake

L L H H OFF

(High impedance) Stop

H/L H/L H/L L OFF

(High impedance) Standby

H-SW Operating Description

・To prevent penetrating current, dead time t2 and t4 is provided in switching to each mode in the IC.

VM VM VM

GND

<ON>

GND

<OFF>

GND

GND

<OFF>

<ON>

OUT2

OUT1 OUT1 OUT1

OUT1 OUT1

OUT2 OUT2

GND

OUT1

Voltage wave

TB6612FNG

2012-11-01 5

Electrical Characteristics (unless otherwise specified, Ta = 25°C, Vcc = 3 V, VM = 5 V)

Characteristics Symbol Test Condition Min Typ. Max Unit

ICC(3 V) STBY = Vcc = 3 V, VM = 5 V ― 1.1 1.8

ICC(5.5 V) STBY = Vcc = 5.5 V, VM = 5 V ― 1.5 2.2

ICC(STB) ― ― 1

Supply current

IM(STB) STBY = 0 V ― ― 1 μA

VIH Vcc×0.7 ― Vcc+0.2

Control input voltage VIL ― -0.2 ― Vcc×0.3 V

IIH V

IN = 3 V 5 15 25

Control input current IIL V

IN = 0 V ― ― 1 μA

VIH(STB) Vcc×0.7 ― Vcc+0.2

Standby input voltage VIL(STB) ― -0.2 ― Vcc×0.3 V

IIH(STB) V

IN = 3 V 5 15 25

Standby input current IIL(STB) V

IN = 0 V ― ― 1 μA

Vsat(U+L)1 I

O = 1 A, Vcc = VM = 5 V ― 0.5 0.7

Output saturating voltage

Vsat(U+L)2 I

O = 0.3 A, Vcc = VM = 5 V ― 0.15 0.21

IL(U) VM = VOUT = 15 V ― ― 1

Output leakage current IL(L) VM = 15 V, VOUT = 0 V -1 ― ― μA

VF(U) ― 1 1.1

Regenerative diode VF VF(L) IF = 1A ― 1 1.1 V

Low voltage detecting

voltage UVLD ― 1.9 ―

Recovering voltage UVLC

(Design target only)

― 2.2 ―

tr ― 24 ―

tf (Design target only） ― 41 ―

H to L ― 50 ―

Response speed Dead

time L to H

Penetration protect time

(Design target only) ― 230 ―

Thermal shutdown circuit

operating temperature TSD ― 175 ―

Thermal shutdown

hysteresis ∆TSD

(Design target only)

― 20 ―

°C

TB6612FNG

2012-11-01 6

Target characteristics

PD - Ta

0.00

0.50

1.00

1.50

0 50 100 150

Ta (℃)

(w)

①

②

①IC単体θj-a=160℃/W

②基板実装時

PCB面積 50×50×1.6mm

Cu箔面積≧40%

③基板実装時

PCB面積 76.2×114.3×1.6mm

Cu箔面積≧30%

③

①IC only θj – a = 160°C/W

②In boarding

PCB area 50 mm×50 mm×1.6 mm

Cu area ≥ 40%

③In boarding

PCB area 76.2 mm×114.3 mm×1.6 mm

Cu area ≥ 30%

Power dissipation PD

PD - Ta

Ta = 25°C, IC only

1 ch driving

2 ch driving

Iout - Duty

0.0

0.5

1.0

1.5

2.0

2.5

0% 20% 40% 60% 80% 100%

Duty

(A)

2ch動作時

1ch動作時

Ta=25℃,IC単体

Output current IOUT

IOUT - Duty

Dual-channel operation

Single-channel operation

Ta = 25°C, IC only

TB6612FNG

2012-11-01 7

Typical Application Diagram

Note: Condensers for noise absorption (C1, C2, C3, and C4) should be connected as close as possible to the IC.

+4.5V

～13.5V

10uF

0.1uF

MCU

STBY

AIN1

AIN2

PWMA

H-SW

Driver

TSD

Vcc

GND

AO1

VM1

Control

Logic

PGND1

BIN1

BIN2

PWMB

Control

Logic

STBY

UVLO

PGND1

AO1

AO2

H-SW

Driver

BO1

VM2

PGND2

BO1

BO2

VM3

+2.7V

～5.5V

10uF

0.1uF

+2.7 V

to 5.5 V

+4.5 V

to 13.5 V

TB6612FNG

2012-11-01 8

Package Dimennsions

Weght: 0.14 g (typ)

Detail of a terminal

TB6612FNG

2012-11-01 9

Notes on Contents

1. Block Diagrams

Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified

for explanatory purposes.

2. Equivalent Circuits

The equivalent circuit diagrams may be simplified or some parts of them may be omitted for

explanatory purposes.

3. Timing Charts

Timing charts may be simplified for explanatory purposes.

4. Application Circuits

The application circuits shown in this document are provided for reference purposes only. Thorough

evaluation is required, especially at the mass production design stage.

Toshiba does not grant any license to any industrial property rights by providing these examples of

application circuits.

5. Test Circuits

Components in the test circuits are used only to obtain and confirm the device characteristics. These

components and circuits are not guaranteed to prevent malfunction or failure from occurring in the

application equipment.

IC Usage Considerations

Notes on handling of ICs

[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be

exceeded, even for a moment. Do not exceed any of these ratings.

Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result

injury by explosion or combustion.

[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in

case of over current and/or IC failure. The IC will fully break down when used under conditions that

exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal

pulse noise occurs from the wiring or load, causing a large current to continuously flow and the

breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case

of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location,

are required.

[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into

the design to prevent device malfunction or breakdown caused by the current resulting from the

inrush current at power ON or the negative current resulting from the back electromotive force at

power OFF. IC breakdown may cause injury, smoke or ignition.

Use a stable power supply with ICs with built-in protection functions. If the power supply is

unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause

injury, smoke or ignition.

[4] Do not insert devices in the wrong orientation or incorrectly.

Make sure that the positive and negative terminals of power supplies are connected properly.

Otherwise, the current or power consumption may exceed the absolute maximum rating, and

exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result

injury by explosion or combustion.

In addition, do not use any device that is applied the current with inserting in the wrong orientation

or incorrectly even just one time.

TB6612FNG

2012-11-01 10

Points to remember on handling of ICs

(1) Thermal Shutdown Circuit

Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal

shutdown circuits operate against the over temperature, clear the heat generation status

immediately.

Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings

can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.

(2) Heat Radiation Design

In using an IC with large current flow such as power amp, regulator or driver, please design the

device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at

any time and condition. These ICs generate heat even during normal use. An inadequate IC heat

radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown.

In addition, please design the device taking into considerate the effect of IC heat radiation with

peripheral components.

(3) Back-EMF

When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to

the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power

supply is small, the device’s motor power supply and output pins might be exposed to conditions

beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into

consideration in system design.

TB6612FNG

2012-11-01 11

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively "Product") without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the

Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of

all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes

for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the

instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their

own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such

design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,

diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating

parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR

APPLICATIONS.

• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH

MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without

limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for

automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,

safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE

PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your

TOSHIBA sales representative.

• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to

any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY

WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO

SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS

FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without

limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile

technology products (mass destruction weapons). Product and related software and technology may be controlled under the

applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the

U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited

except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES

OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.